CN104124605A - Cooling device of high-power solid laser - Google Patents
Cooling device of high-power solid laser Download PDFInfo
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- CN104124605A CN104124605A CN201410312039.7A CN201410312039A CN104124605A CN 104124605 A CN104124605 A CN 104124605A CN 201410312039 A CN201410312039 A CN 201410312039A CN 104124605 A CN104124605 A CN 104124605A
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Abstract
The invention discloses a cooling device of a high-power solid laser. The cooling device of the high-power solid laser comprises a heat sink, a shunting type heat pipe and a cooling fan, wherein one side of the heat sink is in firm contact with gain medium of the high-power solid laser, and the other side of the heat sink is provided with a groove matched with the evaporation section of the shunting type heat pipe in shape; when the shunting type heat pipe is inserted in the groove of the heat sink, the condensing section of the shunting type heat pipe is located in the air, and the cooling fan accelerates the cooling of the condensing section. The cooling device of the high-power solid laser is capable of effectively lowering the gain medium temperature, reducing the thermal stress deformation of the gain medium due to uneven temperature and improving the laser beam quality and output power. The cooling device of the high-power solid laser overcomes the problems of water leakage, large volume, complex pipeline and the like which may be caused by the cooling mode of the prior art.
Description
Technical field
The present invention relates to laser technique field, relate in particular to a kind of heat abstractor of high power solid state laser.
Background technology
The advantages such as high power solid state laser has that efficiency is high, good beam quality, volume are little, compact conformation, are having important application aspect industry, scientific research and national security.
In solid state laser input gross energy, only have small part to be converted to Laser output, all the other overwhelming majority convert the used heat of gain media to.Solid state laser in the course of the work, because pump light field distribution is inhomogeneous and external refrigeration is inhomogeneous, in the inhomogeneous temperature field of the inner formation of gain media, thereby generation thermal stress, and cause the optical characteristics of crystal to change a lot, and then causing stress birfringence, thermal lensing effect and fevering sodium effect, even fracture, has had a strong impact on stability, laser output power, output beam quality, electro-optical efficiency and the laser life-span of laser resonant cavity.Along with laser power level improves constantly and plant bulk miniaturization day by day, how in the confined space, to eliminate in time the used heat that power dissipation transforms, carrying out effective cooling and the temperature control of gain media, is the key issue that high-power all-solid-state laser must solve.
Present stage, the type of cooling that extensively adopts of solid state laser was for providing deionized water that temperature is lower cooling to realize the convection current of gain media by refrigeration plant, which is simple and easy to manipulation, leaks and takies the problems such as volume is large, pipeline is complicated, refrigerating capacity increases day by day with solid state laser power does not mate but exist.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of heat abstractor of high power solid state laser is provided, overcome in prior art that radiating mode may cause leak, volume is large and pipeline is complicated problem.
The technical solution used in the present invention is, the heat abstractor of described high power solid state laser, comprise: heat sink, shunting heat pipe and cooling fan, wherein, a heat sink side and the gain media close contact of high power solid state laser, heat sink opposite side is provided with the groove identical with shunting heat pipe evaporator section shape;
In the time that shunting heat pipe inserts in heat sink described groove, the condensation segment of shunting heat pipe is arranged in air, and is accelerated the heat radiation of described condensation segment by cooling fan.
Further, described heat abstractor, also comprises: phase-change microcapsule plate;
Described heat sink opposite side is also provided with cavity, places phase-change microcapsule plate for mating;
In phase-change microcapsule plate, be provided with the hole of passing for shunting heat pipe, the material of composition phase-change microcapsule plate is closely around shunting heat pipe.
Further, the material of composition phase-change microcapsule plate, comprise: the conductive coefficient of phase-change microcapsule, binding agent and doping is at the material granule of 200～6000W/ (mK), and the CONCENTRATION DISTRIBUTION of described doping and the heat of described gain media distribute and adapt.
Further, described heat sink opposite side is provided with end cap, for fixing described shunting heat pipe and prevent that phase-change microcapsule from breaking and cause liquid to overflow from heat sink.
Further, described shunting heat pipe, comprising: built-in pipe and Puncture Tube, built-in pipe and Puncture Tube are the hollow pipe of an end opening, other end sealing, wherein, blind end one side of built-in pipe is the evaporation section as shunting heat pipe, is provided with several liquid backflow holes near built-in pipe evaporation section; Blind end one side of Puncture Tube is as the condensation segment of shunting heat pipe, and built-in pipe part more than evaporation section is inserted in Puncture Tube through the openend of Puncture Tube; The openend of Puncture Tube is fixed by welding in the outside wall surface of built-in pipe; Shunting inside heat pipe vacuumizes and injects periodic duty medium, enter Puncture Tube when being arranged in after the working media of built-in pipe blind end is evaporated to built-in pipe openend, flow down along Puncture Tube internal face through the cooling liquid that is condensed into, then be back to the blind end of built-in pipe by the liquid backflow hole on built-in pipe.
Further, working media is the liquid between 60 DEG C～100 DEG C through the water of purified treatment or other boiling points;
On built-in pipe internal face in described Puncture Tube internal face, liquid backflow hole and below liquid backflow hole, be equipped with liquid-sucking core.
Further, described liquid-sucking core comprises: woven wire liquid-sucking core or metallic particles sintered wicks.
Further, when the shunting heat pipe in described heat abstractor is while being multiple, each shunting heat pipe is arranged with order or staggered mode be distributed in heat sink in.
Further, the evaporation section of shunting heat pipe scribbles heat-conducting silicone grease with the heat sink place that contacts.
Further, the mode that a heat sink side is welded by low contact heat resistance and the gain media close contact of high power solid state laser.
Adopt technique scheme, the heat abstractor of solid state laser of the present invention, at least has following advantages:
1) capacity of heat transmission that shunting heat pipe is higher can pass to gain media rapidly heat sink heat and take in external environment, and the heat not distributed is in time absorbed by phase-change microcapsule;
2) the phase-change microcapsule characteristic that temperature remains unchanged in phase transition process is conducive to gain media self temperature and keeps even; In phase-change microcapsule flat board, the high thermal conductivity coefficient material granule of uneven distribution can be accelerated the heat transmission at the concentrated position of thermal source in gain media simultaneously, further improves the temperature homogeneity of gain media self;
3) in shunting heat pipe, the backflow that Puncture Tube is condensate liquid provides independent passage, has reduced the resistance that built-in pipe steam inside rises, and has improved the heat transfer efficiency of built-in pipe; Vacuumize the laying of processing and liquid-sucking core simultaneously, can make this shunting heat pipe installation site unrestricted.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the heat abstractor of the high power solid state laser of first embodiment of the invention;
Fig. 2 is the heat sink cross-sectional view of first embodiment of the invention;
Fig. 3 is the cross-sectional view of the shunting heat pipe of first embodiment of the invention.
Embodiment
Technological means and effect of taking for reaching predetermined object for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the present invention is described in detail as after.
First embodiment of the invention, a kind of heat abstractor of solid state laser, as shown in Figure 1, comprises following part: heat sink 2, shunting heat pipe 3, phase-change microcapsule plate 4 and cooling fan 5, wherein, heat sink 2 can be that copper is heat sink.Gain media 1 close contact of the mode that a side of heat sink 2 is welded by low contact heat resistance and high power solid state laser, the mode of this low contact heat resistance welding can be the mode of steaming indium etc.
As shown in Figure 2, heat sink 2 opposite side is provided with end cap 6, the groove 7 identical with shunting heat pipe 3 evaporation section shapes and places phase-change microcapsule plate cavity 8 for mating.End cap 6 is for fixing shunting heat pipe 3 and prevent that phase-change microcapsule from breaking and cause liquid to overflow from heat sink.
In phase-change microcapsule plate 4, be provided with the hole of passing for shunting heat pipe 3, the material of composition phase-change microcapsule plate 4 is closely around shunting heat pipe 3.
In the time that shunting heat pipe 3 inserts in the described groove on heat sink 2 through phase-change microcapsule plate 4, the condensation segment of shunting heat pipe 3 is arranged in air, and is accelerated the heat radiation of described condensation segment by cooling fan 5.
Concrete, the material of composition phase-change microcapsule plate 4, comprise: the conductive coefficient of phase-change microcapsule, binding agent and doping is at the material granule of 200～6000W/ (mK), and the CONCENTRATION DISTRIBUTION of described doping and the heat of described gain media distribute and adapt.This material granule can be the high thermal conductivity coefficient materials such as copper powder or diamond, Graphene, carbon nano-tube.Conventionally the two ends temperature of the gain media 1 of solid state laser is higher, and medium temperature is lower, therefore, the concentration of the material granule of phase-change microcapsule plate 4 doping around near the shunting heat pipe 3 being arranged in gain media 1 two ends can be improved, and the concentration of the material granule that is arranged near phase-change microcapsule plate 4 doping around of the middle shunting heat pipe 3 of gain media 1 is reduced, so that in each shunting heat pipe 3 direction side by side, be the temperature equilibrium as early as possible of gain media 1.
As shown in Figure 2, shunting heat pipe 3 comprises: built-in pipe 30 and Puncture Tube 31, and built-in pipe 30 and Puncture Tube 31 are the hollow pipe of an end opening, other end sealing, wherein, between built-in pipe 30 and Puncture Tube, form back cavity 32, blind end one side of built-in pipe 30 is as the evaporation section of shunting heat pipe; Blind end one side of Puncture Tube 31 is as the condensation segment of shunting heat pipe, and built-in pipe 31 part more than evaporation section is inserted in Puncture Tube 31 through the openend of Puncture Tube 31; Near built-in pipe 30 evaporation sections, be provided with several liquid backflow holes 33; Puncture Tube 31 openends are fixed by welding in built-in pipe 30 outside wall surface, and shunting heat pipe 3 inside vacuumize and inject periodic duty medium, and this working media can be for the water through purified treatment or other boiling points be between the liquid of 60 DEG C～100 DEG C.
Enter Puncture Tube 31 when being arranged in after the working media of built-in pipe 30 blind ends is evaporated to built-in pipe 30 openends, flow down along Puncture Tube 31 internal faces through the cooling liquid that is condensed into, then be back to the blind end of built-in pipe 30 by the liquid backflow hole 33 on built-in pipe 30.
Preferably, on built-in pipe 30 internal faces of in the internal face of Puncture Tube 31, liquid backflow hole 33 and liquid backflow hole below 33, be equipped with liquid-sucking core.This liquid-sucking core can be selected: woven wire liquid-sucking core or metallic particles sintered wicks.
Preferably, when the shunting heat pipe in described heat abstractor is while being multiple, each shunting heat pipe is arranged with order or staggered mode be distributed in heat sink in.
Preferably, the evaporation section of shunting heat pipe and heat sink side contiguously can scribble heat-conducting silicone grease, for reducing contact heat resistance.
In the present embodiment, as shown in Figure 1, the gain media 1 of high power solid state laser, between two duplicate described heat abstractors, ensures the uniformity of gain media two sides heat radiation.Phase-change microcapsule plate 4 is filled in heat sink 2 cavity, shunting heat pipe 3 runs through phase-change microcapsule plate 4, its evaporation ends is nested in heat sink 2 one end that contact with gain media 1, condensation segment is arranged in air, and at condensation segment, cooling fan 5 is set, rely on Forced Air Convection heat exchange that the heat of condensation segment is taken away.In the high power solid state laser course of work, heat in gain media 1 is transmitted in heat sink 2 by Diffusion Welding layer, be embedded in working media in the built-in pipe 30 of heat sink 2 inside and evaporation occur or boiling absorbs heat at evaporation ends, steam enters into Puncture Tube 31 behind axial arrival built-in pipe 30 tops of built-in pipe 30, and be condensed into liquid state in Puncture Tube 31 blind end regions, the capillary force that the woven wire liquid-sucking core that condensate liquid dependence Puncture Tube 31 internal faces adhere to or metallic particles sintered wicks provide, make to be condensed into liquid working media and be back to again Puncture Tube 31 bottoms, and entered the evaporation section of built-in pipe 30 by liquid backflow hole 33, liquid-sucking core on the evaporation section internal face of built-in pipe 30 makes condensate liquid be uniformly distributed in evaporation section simultaneously, and circulate next time, so circulation just can realize the heater members generation heat of shunting heat pipe 3 bottoms is transmitted to shunting heat pipe 3 tops, and by fin and the fan of condensation segment, dissipation of heat is arrived to the external world, avoids heat to pile up at heating position.
When undergoing phase transition, phase-change microcapsule 4 can absorb larger latent heat, further reduce the temperature of gain media 1, in phase-change microcapsule 4, the even high thermal conductivity coefficient solid particle of density unevenness of doping can be accelerated the heat transmission at the concentrated position of gain media 1 internal heat, the heat of adjusting himself distributes, and improves the temperature homogeneity of gain media 1.In the art, phase-change material belongs to the category of energy and material, and it can absorb or emit a large amount of thermal properties of diving in the time that states of matter changes makes it day by day come into one's own in the application aspect industrial energy saving and new forms of energy.Meanwhile, the characteristic that when its states of matter changes, temperature remains unchanged also provides the temperature control scheme of a kind of high reliability and applicability for the temperature control of the solid state laser of periodic duty.Phase-change microcapsule is as the existing novel phase-change material of one, before and after phase transformation, all can maintain original form, the metallic particles that can add high thermal conductivity coefficient simultaneously in the process that is made into phase-change microcapsule plate makes up the less defect of the conductive coefficient of phase-change material own, thereby has broad application prospects.
Second embodiment of the invention, a kind of heat abstractor of high power solid state laser, described heat abstractor and first embodiment of the present embodiment are roughly the same, difference is only, the described heat abstractor of the present embodiment comprises following part: heat sink, shunting heat pipe and cooling fan, and do not comprise phase-change microcapsule plate.
Wherein, a heat sink side and the gain media close contact of high power solid state laser, heat sink opposite side is provided with the groove identical with shunting heat pipe evaporator section shape;
In the time that shunting heat pipe inserts in heat sink described groove, the condensation segment of shunting heat pipe is arranged in air, and is accelerated the heat radiation of described condensation segment by cooling fan.
The present embodiment can carry out high efficiency cooling to high power solid state laser by the design of shunting heat pipe, but owing to not introducing phase-change microcapsule plate, so be just not so good as the first embodiment for the balanced effect that realizes of heat sink middle heat.
Adopt technique scheme, the heat abstractor of high power solid state laser of the present invention, at least has following advantages:
1) capacity of heat transmission that shunting heat pipe is higher can pass to gain media rapidly heat sink heat and take in external environment, and the heat not distributed is in time absorbed by phase-change microcapsule;
2) the phase-change microcapsule characteristic that temperature remains unchanged in phase transition process is conducive to gain media self temperature and keeps even; In phase-change microcapsule flat board, the high thermal conductivity coefficient material granule of uneven distribution can be accelerated the heat transmission at the concentrated position of thermal source in gain media simultaneously, further improves the temperature homogeneity of gain media self;
3) in shunting heat pipe, the backflow that Puncture Tube is condensate liquid provides independent passage, has reduced the resistance that built-in pipe steam inside rises, and has improved the heat transfer efficiency of built-in pipe; Vacuumize the laying of processing and liquid-sucking core simultaneously, can make this shunting heat pipe installation site unrestricted.
4) can effectively reduce gain media temperature, reduce the thermal stress deformation that gain media causes because of non-uniform temperature, improve laser beam quality and power output.
By the explanation of embodiment, should be able to more deeply and concrete understanding for technological means and effect of reaching predetermined object and taking the present invention, but appended diagram be only to provide with reference to the use of explanation, be not used for the present invention to be limited.
Claims (10)
1. the heat abstractor of a high power solid state laser, it is characterized in that, heat sink, shunting heat pipe and cooling fan, wherein, a heat sink side and the gain media close contact of described solid state laser, heat sink opposite side is provided with the groove identical with shunting heat pipe evaporator section shape;
In the time that shunting heat pipe inserts in heat sink described groove, the condensation segment of shunting heat pipe is arranged in air, and is accelerated the heat radiation of described condensation segment by cooling fan.
2. the heat abstractor of high power solid state laser according to claim 1, is characterized in that, described heat abstractor, also comprises: phase-change microcapsule plate;
Described heat sink opposite side is also provided with cavity, places phase-change microcapsule plate for mating;
In phase-change microcapsule plate, be provided with the hole of passing for shunting heat pipe, the material of composition phase-change microcapsule plate is closely around shunting heat pipe.
3. the heat abstractor of high power solid state laser according to claim 2, it is characterized in that, the material of composition phase-change microcapsule plate, comprise: the conductive coefficient of phase-change microcapsule, binding agent and doping is at the material granule of 200～6000W/ (mK), and the CONCENTRATION DISTRIBUTION of described doping and the heat of described gain media distribute and adapt.
4. the heat abstractor of high power solid state laser according to claim 3, is characterized in that, described heat sink opposite side is provided with end cap, for fixing described shunting heat pipe and prevent that phase-change microcapsule from breaking and cause liquid to overflow from heat sink.
5. the heat abstractor of high power solid state laser according to claim 1, it is characterized in that, described shunting heat pipe, comprise: built-in pipe and Puncture Tube, built-in pipe and Puncture Tube are the hollow pipe of an end opening, other end sealing, wherein, blind end one side of built-in pipe is the evaporation section as shunting heat pipe, is provided with several liquid backflow holes near built-in pipe evaporation section; Blind end one side of Puncture Tube is as the condensation segment of shunting heat pipe, and built-in pipe part more than evaporation section is inserted in Puncture Tube through the openend of Puncture Tube; The openend of Puncture Tube is fixed by welding in the outside wall surface of built-in pipe; Shunting inside heat pipe vacuumizes and injects periodic duty medium, enter Puncture Tube when being arranged in after the working media of built-in pipe blind end is evaporated to built-in pipe openend, flow down along Puncture Tube internal face through the cooling liquid that is condensed into, then be back to the blind end of built-in pipe by the liquid backflow hole on built-in pipe.
6. the heat abstractor of high power solid state laser according to claim 5, is characterized in that, working media is the liquid between 60 DEG C～100 DEG C through the water of purified treatment or other boiling points;
On built-in pipe internal face in described Puncture Tube internal face, liquid backflow hole and below liquid backflow hole, be equipped with liquid-sucking core.
7. the heat abstractor of high power solid state laser according to claim 6, is characterized in that, described liquid-sucking core comprises: woven wire liquid-sucking core or metallic particles sintered wicks.
8. the heat abstractor of high power solid state laser according to claim 1, is characterized in that, when the shunting heat pipe in described heat abstractor is while being multiple, each shunting heat pipe is arranged with order or staggered mode be distributed in heat sink in.
9. the heat abstractor of high power solid state laser according to claim 1, is characterized in that, the evaporation section of shunting heat pipe scribbles heat-conducting silicone grease with the heat sink place that contacts.
10. the heat abstractor of high power solid state laser according to claim 1, is characterized in that, the mode that a described heat sink side is welded by low contact heat resistance and the gain media close contact of described solid state laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410312039.7A CN104124605B (en) | 2014-07-02 | 2014-07-02 | A kind of radiator of high power solid state laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410312039.7A CN104124605B (en) | 2014-07-02 | 2014-07-02 | A kind of radiator of high power solid state laser |
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| CN104124605A true CN104124605A (en) | 2014-10-29 |
| CN104124605B CN104124605B (en) | 2018-04-27 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106654818A (en) * | 2016-12-22 | 2017-05-10 | 中国电子科技集团公司第十研究所 | High-power solid laser thermal management system |
| CN107634441A (en) * | 2017-09-14 | 2018-01-26 | 中国人民解放军国防科技大学 | Phase change cold accumulation thermal management system for high-power optical fiber laser |
| US20220103018A1 (en) * | 2015-07-16 | 2022-03-31 | Wi-Charge Ltd. | System for optical wireless power supply |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201001247Y (en) * | 2007-01-12 | 2008-01-02 | 华南理工大学 | Pulsatile hot pipe type cooling plate |
| CN100483869C (en) * | 2007-02-02 | 2009-04-29 | 清华大学 | Pulse laser for increasing outputting stability |
| CN102141351B (en) * | 2011-04-24 | 2012-08-08 | 广州大学 | Heat pipe |
| CN102315585A (en) * | 2011-07-26 | 2012-01-11 | 中国科学院长春光学精密机械与物理研究所 | Air-cooling and heat-radiating device for high-power semiconductor laser module |
-
2014
- 2014-07-02 CN CN201410312039.7A patent/CN104124605B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220103018A1 (en) * | 2015-07-16 | 2022-03-31 | Wi-Charge Ltd. | System for optical wireless power supply |
| US11527919B2 (en) | 2015-07-16 | 2022-12-13 | Wi-Charge Ltd. | System for optical wireless power supply |
| CN106654818A (en) * | 2016-12-22 | 2017-05-10 | 中国电子科技集团公司第十研究所 | High-power solid laser thermal management system |
| CN106654818B (en) * | 2016-12-22 | 2019-03-22 | 中国电子科技集团公司第十一研究所 | A kind of high power solid state laser heat management system |
| CN107634441A (en) * | 2017-09-14 | 2018-01-26 | 中国人民解放军国防科技大学 | Phase change cold accumulation thermal management system for high-power optical fiber laser |
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| CN104124605B (en) | 2018-04-27 |
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