CN114858083A - Optical non-contact type measuring device and method for scanning small hole with large depth-diameter ratio - Google Patents

Optical non-contact type measuring device and method for scanning small hole with large depth-diameter ratio Download PDF

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CN114858083A
CN114858083A CN202210544594.7A CN202210544594A CN114858083A CN 114858083 A CN114858083 A CN 114858083A CN 202210544594 A CN202210544594 A CN 202210544594A CN 114858083 A CN114858083 A CN 114858083A
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small hole
sub
light
depth
detected
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CN114858083B (en
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沈泓宇
夏珉
郭文平
李微
杨克成
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Huazhong University of Science and Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/22Measuring arrangements characterised by the use of optical techniques for measuring depth
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00Energy generation of nuclear origin
    • Y02E30/30Nuclear fission reactors

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  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention provides a device and a method for measuring a small hole with large depth-diameter ratio by optical non-contact scanning, belonging to the field of scanning measurement, wherein the method comprises the following steps: splitting incident light into a first sub-beam and a second sub-beam; adding a voltage control signal into the two-dimensional galvanometer system to enable the first sub-beam to reach the small hole area to be detected, adjusting the size and the collimation distance of the light spot of the first sub-beam by adjusting the matching of a collimator and a field lens, scanning the small hole area to be detected, and reflecting the light to form reflected light; reflecting the second sub-beam to form reference light; and (3) interfering the reflected light with the reference light, performing spectral analysis on the interference signal, and then sequentially performing Fourier transform and peak searching to obtain the depth information of the small hole and the surface topography information of the bottom of the small hole. The device for measuring the optical non-contact type scanning small hole with the large depth-diameter ratio can measure the bottom topography information with the hole diameter larger than or equal to 300 mu m, the depth smaller than or equal to 2.3cm and the depth-diameter ratio smaller than 75.

Description

Optical non-contact type measuring device and method for scanning small hole with large depth-diameter ratio
Technical Field
The invention belongs to the field of scanning measurement, and particularly relates to a device and a method for measuring a small hole with a large depth-diameter ratio by optical non-contact scanning.
Background
In modern industrial production, high-precision detection of specific dimensions and features of parts is an important guarantee of high-quality production. The high-speed backplane connector is an important device which can be connected with a plurality of layers of PCBs and simultaneously provides electric power and mechanical connection for each layer of the PCBs, and plays a key role in the high-speed signal transmission process. When the high-speed backplane connector is connected to the PCB, a micro blind via array with an area of about 36mm by 36mm is formed on the PCB. When the high-speed backplane connector is connected with the PCB, the depth of the small hole on the PCB is generally 4mm, when the high-speed backplane connector is connected with the PCB, a blind hole with the depth of 5mm is formed by the small hole on the PCB and the pin-containing base of the connector, meanwhile, the height of the bottom micro-pin is about 1.5mm, and the aperture of the small hole on the PCB is 200-300 μm, so the depth-diameter ratio of the small hole is generally as high as 15-25. When the high-speed connector is not properly connected to the PCB, the high-speed backplane connector may be disabled if the pin is not at the bottom due to misalignment or if the pin is tilted when inserted. Therefore, a means for detecting bottom information with a large depth-diameter ratio of a sub-millimeter aperture is required.
The existing traditional measuring equipment mainly comprises a surface profiler, an ellipsometer and the like, which generally do not have non-contact measuring capability, and can abrade the surface of a sample to be measured during measurement or damage a microneedle at the bottom of a high-speed backplane connector after a probe penetrates into a micropore; similar to other optical measurement means, for example, a confocal microscope can acquire depth information of the small hole, but cannot acquire morphology information of the bottom of the small hole, and cannot meet actual requirements. Although the white light interferometer (WI-001, keyence) can acquire the shape information of the small holes, the surface measurement range is only 1mm x 1mm, the depth range of single measurement is only 1.4mm, and for the small hole array with the depth of 36mm x 36mm and the depth of 5mm, repeated measurement is needed, so that the error is large and the efficiency is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a device and a method for measuring a small hole with a large depth-diameter ratio by optical non-contact scanning, and aims to solve the problems that the measurement depth range of the small hole is only 1.4mm, and repeated measurement is needed for a small hole array with the depth of 5mm, the error is large and the efficiency is low in the existing optical measurement technology such as a white light interferometer.
To achieve the above object, in one aspect, the present invention provides an optical contactless scanning aperture measuring device comprising: the system comprises a computer, a two-dimensional galvanometer system, a spectrometer, a light source, a beam splitter and a reflector;
the input end of the computer is connected with the output end of the spectrometer, and the output end of the computer is connected with the input end of the two-dimensional galvanometer system; the input end of the beam splitter is connected with the light source, the first output end of the beam splitter is connected with the reflector, and the second output end of the beam splitter is connected with the spectrometer; the output end of the two-dimensional galvanometer system is over against the small hole area to be detected;
the light source is used for outputting wide-spectrum incident light; the beam splitter is used for splitting the wide-spectrum incident light into a first sub-beam and a second sub-beam and receiving reflected light generated by the first sub-beam in the small hole area to be detected; the reflector is used for reflecting the second sub-beam to generate reference light; the computer is used for generating a voltage control signal for controlling the two-dimensional galvanometer system; the two-dimensional galvanometer system is used for rotating under the control of a voltage control signal to enable the first sub-beam to reach the scanning position of the small hole area to be measured, and meanwhile, the size and the collimation distance of the light spot of the first sub-beam are adjusted by adjusting the matching of the collimator and the field lens, so that the measurement of the small holes with different depth-diameter ratios in the small hole area to be measured is realized; the reference light and the reflected light interfere in the beam splitter; the spectrometer is used for carrying out spectral analysis on the interference signal; and the computer is used for sequentially carrying out Fourier transform and peak searching on the spectrum to obtain the depth information of the small hole to be detected and the surface appearance information of the bottom of the small hole.
Further preferably, the aperture of the small hole which can be measured by the measuring device is larger than or equal to 300 μm, and the depth is smaller than or equal to 2.3 cm; and can measure bottom surface topography information below a depth to diameter ratio of 75.
Further preferably, the beam splitter is a fiber coupler;
further preferably, the reflecting mirror is a plane mirror;
further preferably, the two-dimensional galvanometer system comprises: the X optical scanning head, the Y optical scanning head, the collimator and the field lens;
the collimator and the field lens are used for controlling the spot size and the collimation distance of the first sub-beam in the small hole area to be measured through various matching, so that the measurement of the small holes with different depth-diameter ratios is realized;
the X optical scanning head and the Y optical scanning head are used for rotating under the action of the voltage control signal to scan the small hole area to be detected.
Further preferably, the voltage control signal is a sawtooth voltage signal and a step voltage signal; the sawtooth voltage signal is used for controlling the rotation of the X optical scanning head; the step voltage signal is used to control the rotation of the Y optical scan head.
On the other hand, the invention provides a corresponding measuring method based on the measuring device, which comprises the following steps:
splitting incident light into a first sub-beam and a second sub-beam;
adding a voltage control signal into the two-dimensional galvanometer system to enable the first sub-beam to reach the small hole area to be detected, adjusting the size and the collimation distance of the light spot of the first sub-beam by adjusting the matching of a collimator and a field lens, scanning the small hole area to be detected, and reflecting the light to form reflected light;
reflecting the second sub-beam to form reference light;
and the reflected light interferes with the reference light, the interference signal is subjected to spectral analysis and then subjected to Fourier transform and peak searching in sequence, and the depth information of the small hole and the surface topography information of the bottom of the small hole are obtained.
Further preferably, the voltage control signal is a sawtooth voltage signal and a step voltage signal; the sawtooth voltage signal is used for controlling the rotation of the X optical scanning head; the step voltage signal is used to control the rotation of the Y optical scan head.
Generally, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:
according to the invention, different voltage control signals are generated to the two-dimensional galvanometer system through a computer, so that a scanning light beam reaches the scanning position of the small hole area to be detected, meanwhile, the collimator at the incident light position of the two-dimensional galvanometer system and the field lens at the emergent position are matched in different choices, so that the light spot size and the collimation distance of the scanned single-point light beam can be controlled, the minimum feature area for acquiring complete information can not exceed 2 times of the diameter of the light spot according to experimental experience, and the maximum depth for acquiring the complete small hole information can not exceed 2 times of the collimation distance. Therefore, the optical non-contact type measuring device for scanning the small hole with the large depth-diameter ratio can measure the bottom topography information with the hole diameter of more than or equal to 300 mu m, the depth of less than or equal to 2.3cm and the depth-diameter ratio of less than 75.
The spectrometer has higher sensitivity to spectral interference measurement, and the two-dimensional galvanometer is used for rapid point scanning, so that the range of one-time measurement can reach 14mm x 14mm, the scanning times and time are reduced, and the measurement requirement of high-speed backplane connectors on the bottom information of small holes with large depth-diameter ratio can be completely met.
Drawings
FIG. 1 is a schematic diagram of a measuring apparatus for optical non-contact scanning of a large depth-to-diameter ratio aperture according to an embodiment of the present invention;
description of the labeling:
1-a computer; 2-a two-dimensional galvanometer system; 3-a spectrometer; 4-a light source; 5-small holes with large depth-diameter ratio to be detected; 6-fiber coupler; 7-mirror.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes several devices involved in the present invention:
the scanning galvanometer comprises an X optical scanning head, a Y optical scanning head, an electronic driving amplifier and an optical reflecting mirror lens, and the optical scanning head is driven through a driving amplifying circuit so as to control the deflection of a scanning light beam on an X-Y plane. The scanning principle is as follows: the scanning pattern is a two-dimensional effect pattern, the position of one point is determined at one moment by changing the positions of an X optical scanning head and a Y optical scanning head, and the position of the point at different moments is controlled by scanning frequency to achieve the transformation of the whole scanning pattern.
The spectrometer is a scientific instrument which decomposes light with complex components into spectral lines and is composed of a prism or a diffraction grating and the like, and the spectrometer can be used for measuring light rays reflected by the surface of an object.
Examples
The embodiment of the invention provides a measuring device for optical non-contact scanning of a small hole with a large depth-diameter ratio, which comprises: the device comprises a computer 1, a two-dimensional galvanometer system 2, a spectrometer 3, a broad spectrum light source 4, an optical fiber coupler 6 and a reflector 7;
the input end of the computer 1 is connected with the output end of the spectrometer 3, and the output end of the computer is connected with the input end of the two-dimensional galvanometer system 2; the input end of the spectrometer 3 is connected with the second output port of the optical fiber coupler 6; the light source 4 is connected with the input port of the optical fiber coupler 6; the first output end of the optical fiber coupler 6 is connected with the reflector 7; the output end of the two-dimensional galvanometer system 2 is just opposite to the area of the small hole to be detected, and the parameters of the small hole are as follows: the aperture is 200 mu m; the hole depth is 4.5 mm; the height of the needle is as follows: 1.5 mm;
the broad spectrum light source 4 generates incident light; the optical fiber coupler 6 realizes 50:50 beam splitting to generate a first sub-beam and a second sub-beam, and the first sub-beam and the second sub-beam are respectively transmitted to the two-dimensional galvanometer system 2 and the reflector 7; the computer 1 controls a signal card to generate voltage control signals of two rows of lenses in the two-dimensional galvanometer system 2; the two-dimensional galvanometer system 2 rotates two rows of lenses under the action of a voltage control signal, so that the first sub-beam reaches the current scanning position of the small hole area 5 with the large depth-diameter ratio to be measured; by adjusting the matching of the collimator and the field lens, the light spot size and the collimation distance of the first sub-beam are adjusted by controlling the matching of the collimator and the field lens in the two-dimensional galvanometer system 2, so that large-range point scanning of the small hole area 5 with the large depth-diameter ratio to be detected can be realized; in the case of a single point of the scanning process, the first sub-beam is returned to the fiber coupler 6 as reflected light by being reflected by the surface of the pinhole area; the second sub-beam is reflected by a reflector 7 and returns to the optical fiber coupler 6 as reference light; the reflected light and the reference light interfere at the optical fiber coupler 6, the obtained interference signal is transmitted to the spectrometer 3 through the optical fiber coupler 6, and the spectrometer 3 is used for receiving the interference signal and performing spectral analysis; the computer 1 is used for sequentially carrying out Fourier transform and peak searching processing on the spectrum to obtain depth information of the small hole with the large depth-diameter ratio to be detected in a large range and surface appearance information including the bottom of the deep hole in the large range.
The method for measuring the small hole with the large depth-diameter ratio based on the optical non-contact scanning comprises the following steps:
splitting incident light into a first sub-beam and a second sub-beam;
adding a voltage control signal in the two-dimensional galvanometer system to enable the first sub-beam to reach a small hole area with a large depth-diameter ratio to be detected for scanning, and forming reflected light through reflection;
reflecting the second sub-beam to form reference light;
and interfering the reflected light with the reference light, performing spectral analysis on the interference signal, and then sequentially performing Fourier transform and peak searching to obtain the depth information of the small hole with the large depth-diameter ratio to be detected in the large range and the surface appearance information of the bottom of the deep hole in the large range.
Further preferably, the two-dimensional galvanometer system comprises: the X optical scanning head, the Y optical scanning head, the collimator and the field lens;
the collimator and the field lens are matched in various ways and are used for controlling the size of a light spot and the collimation distance of the first sub-beam and realizing the scanning of the small hole area with the large depth-diameter ratio to be detected;
the X optical scanning head and the Y optical scanning head are used for rotating under the action of the voltage control signal, so that the first sub-beam reaches the small hole area to be measured.
Further preferably, the voltage control signal is a sawtooth voltage signal and a step voltage signal; the sawtooth voltage signal is used for controlling the rotation of the X optical scanning head; the step voltage signal is used to control the rotation of the Y optical scan head.
The invention is not limited to the fact that the beam splitter must be an optical fiber coupler, and other beam splitters meeting the application requirements can also replace the optical fiber coupler;
the reflecting mirror is a plane mirror.
According to the invention, different voltage control signals are generated to the two-dimensional galvanometer system through a computer, so that a scanning light beam reaches the scanning position of the small hole area to be detected, meanwhile, the collimator at the incident light position of the two-dimensional galvanometer system and the field lens at the emergent position are matched in different choices, so that the light spot size and the collimation distance of the scanned single-point light beam can be controlled, the minimum feature area for acquiring complete information can not exceed 2 times of the diameter of the light spot according to experimental experience, and the maximum depth for acquiring the complete small hole information can not exceed 2 times of the collimation distance. Therefore, the optical non-contact type measuring device for scanning the small hole with the large depth-diameter ratio can measure the bottom topography information with the hole diameter of more than or equal to 300 mu m, the depth of less than or equal to 2.3cm and the depth-diameter ratio of less than 75.
After the collimators with different focal lengths and the field lens are combined, several light beams with different spot radius sizes and collimation distances and corresponding depth-to-diameter ratio measurement are obtained through experimental verification, and the details are shown in table 1;
TABLE 1
Spot radius (mum) Collimation distance (mum) Depth-diameter ratio measurable
4.7555497 85.600 4.5
5.70665964 123.264 5.4
7.133324549 192.600 6.75
7.925916166 237.777 7.5
8.594366927 279.576 8.13253012
10.56788822 422.716 10
10.93229816 452.371 10.34482759
11.88887425 534.999 11.25
13.20986028 660.493 12.5
13.98691088 740.484 13.23529412
15.91549431 958.765 15.06024096
16.39844724 1017.835 15.51724138
19.41040694 1426.071 18.36734694
20.98036632 1666.088 19.85294118
21.13577644 1690.862 20
22.01643379 1834.703 20.83333333
29.11561041 3208.659 27.55102041
30.36749489 3490.517 28.73563218
79.57747155 23969.118 75.30120482
The spectrometer has higher sensitivity to spectral interference measurement, and the two-dimensional galvanometer is used for rapid point scanning, so that the range of one-time measurement can reach 14mm x 14mm, the scanning times and time are reduced, and the measurement requirement of high-speed backplane connectors on the bottom information of small holes with large depth-diameter ratio can be completely met.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (8)

1. An optical, contactless scanning aperture measurement device comprising: the system comprises a computer, a two-dimensional galvanometer system, a spectrometer, a light source, a beam splitter and a reflector;
the input end of the computer is connected with the output end of the spectrometer, and the output end of the computer is connected with the input end of the two-dimensional galvanometer system; the input end of the beam splitter is connected with a light source, the first output end of the beam splitter is connected with the reflector, and the second output end of the beam splitter is connected with the spectrometer; the output end of the two-dimensional galvanometer system is over against the small hole area to be detected;
the light source is used for outputting incident light; the beam splitter is used for splitting incident light into a first sub-beam and a second sub-beam and receiving reflected light generated by the first sub-beam in the small hole area to be detected; the reflector is used for reflecting the second sub-beam to generate reference light; the computer is used for generating a voltage control signal for controlling the two-dimensional galvanometer system; the two-dimensional galvanometer system is used for rotating under the control of a voltage control signal to enable the first sub-beam to reach the scanning position of the small hole area to be measured, and meanwhile, the size and the collimation distance of the light spot of the first sub-beam are adjusted by adjusting the matching of the collimator and the field lens, so that the measurement of the small holes with different depth-diameter ratios in the small hole area to be measured is realized; the reference light and the reflected light interfere in the beam splitter; the spectrometer is used for carrying out spectral analysis on the interference signal; the computer is used for sequentially carrying out Fourier transform and peak searching processing on the spectrum to obtain depth information of the small hole to be detected and surface appearance information of the bottom of the small hole.
2. The measuring device according to claim 1, wherein the aperture of the small hole capable of measuring is 300 μm or more and the depth is 2.3cm or less; and it can measure bottom surface topography information below a depth to diameter ratio of 75.
3. A measuring device according to claim 1 or 2, wherein the beam splitter is a fibre optic coupler.
4. A measuring device according to claim 1 or 2, characterized in that the mirror is a flat or curved mirror.
5. A measurement device according to claim 2, wherein the two-dimensional galvanometer system comprises: the X optical scanning head, the Y optical scanning head, the collimator and the field lens;
the collimator and the field lens are used for controlling the spot size and the collimation distance of the first sub-beam in the area of the small hole to be measured through various combinations, so as to realize the measurement of the small holes with different depth-diameter ratios;
the X optical scanning head and the Y optical scanning head are used for rotating under the action of the voltage control signal to scan the small hole area to be detected.
6. The measurement device of claim 5, wherein the voltage control signal is a sawtooth voltage signal and a step voltage signal; the sawtooth voltage signal is used for controlling the rotation of the X optical scanning head; the step voltage signal is used to control the rotation of the Y optical scanning head.
7. The measurement method based on the measurement device according to claim 1, comprising the steps of:
splitting incident light into a first sub-beam and a second sub-beam;
adding a voltage control signal into the two-dimensional galvanometer system to enable the first sub-beam to reach the small hole area to be detected, adjusting the size and the collimation distance of the light spot of the first sub-beam by adjusting the matching of a collimator and a field lens, scanning the small hole area to be detected, and reflecting the light to form reflected light;
reflecting the second sub-beam to form reference light;
and the reflected light interferes with the reference light, the interference signal is subjected to spectral analysis and then subjected to Fourier transform and peak searching in sequence, and the depth information of the small hole and the surface topography information of the bottom of the small hole are obtained.
8. The measurement method according to claim 7, wherein the voltage control signal is a sawtooth voltage signal and a step-type voltage signal; the sawtooth voltage signal is used for controlling the rotation of the X optical scanning head; the step voltage signal is used to control the rotation of the Y optical scanning head.
CN202210544594.7A 2022-05-19 2022-05-19 Optical non-contact type measuring device and method for scanning small holes with large depth-diameter ratio Active CN114858083B (en)

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CN113040722A (en) * 2021-04-30 2021-06-29 电子科技大学 Method for improving frequency domain coherence tomography imaging depth

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