CN114823419A - Semiconductor chip intelligent manufacturing system with high adaptability - Google Patents
Semiconductor chip intelligent manufacturing system with high adaptability Download PDFInfo
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- CN114823419A CN114823419A CN202210342958.3A CN202210342958A CN114823419A CN 114823419 A CN114823419 A CN 114823419A CN 202210342958 A CN202210342958 A CN 202210342958A CN 114823419 A CN114823419 A CN 114823419A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/3412—Sorting according to other particular properties according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
Abstract
The invention provides a semiconductor chip intelligent manufacturing system with high adaptability, which comprises a database, a transportation module, an acquisition module, a marking module, a verification module, a screening module and a processor, wherein the transportation module is used for transporting chips and conveying the chips to each station; the acquisition module is used for acquiring the position of the chip so as to acquire the current position and the processing temperature of the chip; the marking module is used for marking the chip and marking the processing data of the chip; the verification module is used for verifying the marking pattern and the marking position of the chip so as to adjust the marks at different positions; the screening module is used for screening the chips to distinguish different specifications of chip types; according to the invention, by adopting the matching of the clamping component and the marking unit, the position of the marked content can be accurately adjusted in the process of marking the chip, and meanwhile, the angle of the mark can be adjusted in different postures of the chip, so that the reliability and the accuracy of the chip marking are effectively improved.
Description
Technical Field
The application relates to the technical field of chip manufacturing, in particular to a semiconductor chip intelligent manufacturing system with high adaptability.
Background
With the continuous development of human society, people have more and more extensive demands on electronic products. Accordingly, as a basic unit of electronic products, the manufacture of chips has received a high degree of attention from researchers. Among them, how to improve the quality of the chip becomes more important.
For example, CN113333306B prior art discloses a method and a system for sorting poor chip appearance, where the poor chip appearance is detected in the production process, and usually, the poor chip appearance is not sorted, but marked with a symbol in the poor chip appearance, but in the subsequent links such as chip electrical performance detection, the same detection processing is still performed on the poor chip appearance, which results in failure to effectively screen and filter the poor chip appearance, so that the subsequent chip production links are prone to abnormal data statistics such as chip performance, and the production and processing process also performs processing of each link on the poor chip appearance, resulting in a problem of reduced production and processing efficiency.
In another typical method for analyzing warpage of a chip and a method for manufacturing a chip disclosed in the prior art of CN105868520B, a wafer is usually used as a basic unit in a chip manufacturing process, a dielectric layer (e.g., SiO2, Si3N4 layer, etc.) is deposited on the wafer, a metal interconnection structure (e.g., Cu metal interconnection structure) is formed, and a pad (e.g., aluminum pad) is formed above the metal interconnection structure, thereby forming a chip. The deposition of the dielectric layer, the metal interconnection structure and the bonding pad usually needs to be performed at a high temperature, and the temperature is usually reduced to room temperature after the deposition is finished. In the process of such repeated temperature rise and temperature reduction, thermal stress is easily generated at the interface between the layers due to different thermal expansion coefficients of the material layers, so that the whole chip is warped and deformed. When the thermal expansion coefficients of the dielectric layer, the metal interconnection structure and the welding pad are larger than that of the wafer, the center of the chip is sunken after the warping deformation; when the thermal expansion coefficients of the dielectric layer, the metal interconnection structure and the welding pad are smaller than that of the wafer, the center of the chip is raised after the warping deformation.
The invention aims to solve the problems that the marking angle can not be adjusted, the chip processing process can not be monitored, only one chip can be marked, the adaptability is low and the like in the field.
Disclosure of Invention
The invention aims to provide a semiconductor chip intelligent manufacturing system with high adaptability aiming at the defects.
The invention adopts the following technical scheme:
an intelligent manufacturing system of a semiconductor chip with high adaptability comprises a database, a transportation module, an acquisition module, a marking module, a verification module, a screening module and a processor;
the processor is respectively in control connection with the transportation module, the database, the acquisition module, the marking module, the verification module and the screening module; the database is respectively connected with the acquisition module, the marking module, the screening module and the verification module;
the transportation module is used for transporting the chips and transporting the chips to each station; the acquisition module is used for acquiring the current position and the processing temperature of the chip; the marking module is used for marking the chip and marking the processing data of the chip; the verification module is used for verifying the marking pattern and the marking position of the chip so as to adjust the marks at different positions; the screening module is used for screening the chips to distinguish different specifications of chip types;
the marking module comprises an operation area, a marking unit and a positioning unit, and the positioning unit is used for positioning the position mark of the chip; the marking unit marks the chip based on the data of the positioning unit; the marking unit and the positioning unit are both arranged in the operation area;
the marking unit comprises a controller, a laser and a cooler, wherein the cooler is used for cooling the laser, and the laser is used for marking a chip; the controller is used for controlling the content of the mark, and the control unit is electrically connected with the laser;
the positioning unit comprises a clamping member and a guide member, wherein the clamping member is used for clamping the chip; the guide member is used for guiding the marking position of the marking unit;
the guide member receives marker position data set by an operator, wherein the marker position data includes marker content, marker spacing, and marker direction;
the clamping component comprises a group of clamping seats, a plurality of distance sensors, buffering cotton and a clamping driving mechanism, wherein the buffering cotton is arranged at the upper top of the group of clamping seats and used for buffering pins of the chip; the group of clamping seats are jointly provided with an L-shaped clamping cavity for clamping the chip, and the distance sensors are oppositely arranged on the inner wall of the clamping cavity and acquire at least two groups of detection data; the clamping driving mechanism is in driving connection with the group of clamping seats;
the determination of the printing parameters of the laser comprises the following steps:
step 1: determining a lateral resolution B of print content u And longitudinal resolution B v ；
Acquiring data of the mark content set by an operator, wherein the data comprises the word number and the line number of the mark, the layout formed according to the word number and the line number of the mark is set as a square, and the coordinates of four vertexes are respectively a (u) 1 ，v 1 )、b(u 1 ，v 2 )、c(u 2 ，v 2 )、d(u 1 ，v 2 ) And according to the conditions, calculating the side length J of the square in the layout:
in the formula, n 0 A row number that is a minimum mark area; k is the total number of words of the set marking content; alpha is a side length coefficient for adjusting display content, and the value of alpha satisfies:
in the formula, P is the size of the selected font;
determining the lateral resolution B of the printed content from the marked content u And longitudinal resolution B v ；
Step 2: determining the area of a chip;
calculating an area G (Δ t) of the chip from the chip held by the holding member, there being:
G(Δt)＝(Q 1 (Δt)+2Δx)·(Q 2 (Δt)+2Δy)
in the formula, delta t is the number of times of clamping the chip; q 1 (delta t) is the detection value of a group of transversely distributed distance sensors on the clamping seat at delta t times; q 2 (delta t) is the detection value of a group of longitudinally distributed distance sensors on the clamping seat at delta t times; delta x is the transverse inherent distance of the chip pin; Δ y is the longitudinal intrinsic distance of the chip pins;
step3, calculating the area ratio of the marked content;
determining the layout area S of the mark content according to the side length J of the square to be laid out:
S＝J*J
according to the layout area S of the marked contents and the area G (delta t) of the chip, determining the area ratio K of the marked contents:
marking the marking content on the chip according to the position marked on the chip set by the operator and the parameters obtained in the step1-step 3.
Optionally, the verification module is arranged in a next process of the marking module, and is configured to recheck the mark of the chip; the verification module comprises a verification unit and a lifting unit, and the lifting unit is used for adjusting the position of the verification unit; the verification unit is used for verifying the mark of the chip; the verification unit comprises a verification probe and a memory, the verification probe collects the marking data of the chip and transmits the marking data to the memory for caching, and the memory transmits the collected data to the processor and the database.
Optionally, the acquisition module is disposed in the operation area and acquires a chip position of the operation area; the acquisition module comprises an acquisition unit and a sensing unit, wherein the acquisition unit is used for detecting the temperature of the chip, and the sensing unit is used for detecting the position of the chip; the sensing unit comprises a plurality of groups of photoelectric sensors and a data sensor, and the sensor is used for summarizing data sensed by the photoelectric sensors; and the photoelectric sensors are arranged on two sides of the chip transportation direction at equal intervals and used for sensing the position of the chip.
Optionally, the transportation module comprises a transportation belt, a plurality of transportation rollers, a group of barriers and a transportation driving mechanism, the transportation belt is nested on the transportation rollers, and the transportation driving mechanism drives the transportation belt to rotate; the enclosing barriers are arranged on two sides of the conveying direction of the conveying belt so as to limit the position of the chip.
Optionally, the screening module includes a screening unit, a position adjusting unit and a storage disk, the screening unit is connected to the position adjusting unit, and the position adjusting unit is configured to adjust the position of the screening unit; the position adjusting unit comprises a fixed seat, a connecting plate, an offset plate, a first adjusting track, a second adjusting track, a first adjusting driving mechanism and a second adjusting driving mechanism, wherein the fixed seat is arranged at the upper top of the first adjusting track and is provided with a hollow sliding cavity; the second adjusting track penetrates through the sliding cavity and is connected with the upper top wall of the sliding cavity through the connecting plate, the second adjusting driving mechanism is fixed on the offset plate and is in driving connection with one end of a screw rod, and the other end of the screw rod is connected with one side frame of the connecting plate, so that the connecting plate can be offset relative to the offset plate; one end of the offset plate is connected with the rack, and the other end of the offset plate penetrates through the sliding cavity and is suspended and extends out towards the upper part of the storage disc.
The beneficial effects obtained by the invention are as follows:
1. by adopting the matching of the clamping component and the marking unit, the position of the marked content can be accurately adjusted in the process of marking the chip, meanwhile, the angles of the mark can be adjusted in different postures of the chip, and the reliability and the accuracy of the chip marking are effectively improved;
2. the verification module is used for verifying the marking pattern and the marking position of the chip so as to adjust the marks at different positions; the screening module is used for screening the chips to distinguish different specifications of chip types;
3. the cleaning module is used for cleaning the chip; the cleaning module is arranged before the marking process of the marking module and is used for cleaning dust on the surface of the chip, so that the chip can obtain a better marking effect in the marking process;
4. the screening component can store chips at different positions of the storage disc in the process of screening the chips, so that the chips with different types or different qualified standards can be distinguished, and meanwhile, the screening efficiency is also considered;
5. through adopting guide member and mark unit to mutually support for mark unit can guide mark unit through the guide member when marking the chip, makes the more accurate of the position location of mark unit mark.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
The invention will be further understood from the following description in conjunction with the accompanying drawings. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the embodiments. Like reference numerals designate corresponding parts throughout the different views.
FIG. 1 is an overall block diagram of the present invention.
Fig. 2 is a schematic structural diagram of the screening module of the present invention.
Fig. 3 is a schematic structural diagram of the chip of the present invention.
Fig. 4 is a schematic structural view of the transportation module and the marking module according to the present invention.
Fig. 5 is a schematic structural view of the clamping member of the present invention.
Fig. 6 is a detailed schematic view of the suction head of the present invention.
FIG. 7 is a schematic top view of the cleaning module of the present invention.
FIG. 8 is a side view of the cleaning module of the present invention.
The reference numbers illustrate: 1-a transport module; 2-a storage plate; 3-position acquisition probe; 4-a sucking member; 5-a first adjustment track; 6-a second adjustment drive mechanism; 7-a second adjustment track; 8-pin; 9-chip; 10-mark circle; 11-mark content; 12-a marker member; 13-fencing; 14-a support unit; 15-a guide member; 16-a rotating member; 17-a clamping seat; 18-a verification probe; 19-lifting the rod; 20-a clamping drive mechanism; 21-buffer cotton; 22-a distance sensor; 23-lifting the rail; 24-a slider; 25-a suction head; 26-a suction conduit; 27-a telescopic rod; 28-an adsorption unit; 29-an adjusting seat; 30-a first adjustment track; 31-a second adjustment track; 32-a second adjustment drive mechanism; 33-a connecting rod; 34-an offset plate; 35-fixed seat.
Detailed Description
The following is a description of embodiments of the present invention with reference to specific embodiments, and those skilled in the art will understand the advantages and effects of the present invention from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
The first embodiment.
According to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, the present embodiment provides a semiconductor chip smart manufacturing system with high adaptability, comprising a database, a transportation module, an acquisition module, a marking module, a verification module, a screening module and a processor,
the processor is respectively in control connection with the transportation module, the database, the acquisition module, the marking module, the verification module and the screening module, and the transportation module, the acquisition module, the marking module, the verification module and the screening module are subjected to centralized control through the processor;
the database is respectively connected with the acquisition module, the marking module, the screening module and the verification module, and transmits the acquired data to the database for other modules to call;
the transportation module is used for transporting the chips and transporting the chips to each station; the acquisition module is used for acquiring the current position and the processing temperature of the chip; the marking module is used for marking the chip and marking the processing data of the chip; the verification module is used for verifying the marking pattern and the marking position of the chip so as to adjust the marks at different positions; the screening module is used for screening the chips to distinguish different specifications of chip types;
optionally, the transportation module comprises a transportation belt, a plurality of transportation rollers, a group of barriers and a transportation driving mechanism, the transportation belt is nested on the transportation rollers, and the transportation driving mechanism drives the transportation belt to rotate; the enclosing barriers are arranged on two sides of the conveying direction of the conveying belt so as to limit the position of the chip; the transportation module transports the chips to each operation station in the process of transporting the chips and is matched with the marking module to mark the chips;
meanwhile, the transportation module is also matched with an acquisition module to acquire the position data of the chip;
the transportation module is matched with the screening module to screen the chip;
the transportation module is matched with the verification module to verify the chip;
the marking module comprises an operation area, a marking unit and a positioning unit, and the positioning unit is used for positioning the position marking position of the chip; the marking unit marks the chip based on the data of the positioning unit; the marking unit and the positioning unit are both arranged in the operation area;
the marking unit comprises a controller, a laser and a cooler, wherein the cooler is used for cooling the laser, and the laser is used for marking a chip; the controller is used for controlling the content of the mark, and the control unit is connected with the laser;
the marking module further comprises a supporting unit, and the supporting unit is used for supporting the marking unit so that the marking unit is arranged right above the chip transportation path;
the supporting unit comprises a supporting rod and a vertical rod, one end of the vertical rod is vertically and fixedly connected with one end of the supporting rod, and the other end of the supporting rod extends out of the upper part of the conveying path of the chip; the other end of the upright rod is connected with a side frame of the transportation module;
the marking unit further comprises a rotating member for adjusting the angle of the laser; the rotating component comprises a rotating seat, an angle detection piece and a rotating driving mechanism, the laser is arranged on the rotating seat, the rotating seat is hinged with the supporting rod, and the rotating driving mechanism is arranged between the rotating seat and the supporting rod in a driving mode and drives the rotating component to rotate along the hinged position; the angle detection piece is used for detecting the rotation angle of the rotation seat;
the positioning unit comprises a clamping member and a guide member, wherein the clamping member is used for clamping the chip; the guide member is used for guiding the marking position of the marking unit;
the guide member receives marker position data set by an operator, wherein the marker position data includes marker content, marker spacing, and marker direction;
the guide component comprises a guide probe and a memory, and the memory is used for storing the data acquired by the guide probe; the guide probe is used for positioning the position of the chip and guiding the marking unit to mark the chip; when the guide probe is used for positioning the chip, the guide probe is used for capturing the position of the chip and sending a marking instruction to the marking unit, so that the marking unit marks the chip; in addition, the guide member is provided on the support rod;
the guide member is matched with the marking unit, so that the marking unit can be guided by the guide member when the chip is marked by the marking unit, and the marking position of the marking unit is more accurate;
particularly, the chip is provided with a positive placing mark circle, and the guide member is used for detecting the position of the positive placing mark circle of the chip;
the clamping component is arranged in the operation area, and the two sides of the operation area are provided with transportation modules, so that the chip before marking can be transported into the operation area through the transportation modules, and after marking, the chip can be transported to the next process through another transportation module;
the clamping component comprises a group of clamping seats, a plurality of distance sensors, buffering cotton and a clamping driving mechanism, wherein the buffering cotton is arranged at the upper top of the group of clamping seats and used for buffering pins of the chip; an L-shaped clamping cavity for clamping the chip is arranged on one group of clamping seats together, the distance sensors are oppositely arranged on the inner wall of the clamping cavity, and at least two groups of detection data (two groups of data in the horizontal direction and the longitudinal direction) are obtained; the clamping driving mechanism is in driving connection with the group of clamping seats; the clamping seat is provided with a pressure detection piece, and the pressure detection piece is used for detecting the clamping force of the chip, so that the chip cannot be damaged when the chip is clamped by the clamping seat;
the determination of the printing parameters of the laser comprises the following steps:
step 1: determining a lateral resolution B of print content u And longitudinal resolution B v ；
Acquiring data of the mark content set by an operator, wherein the data comprises the word number and the line number of the mark, the layout formed according to the word number and the line number of the mark is set as a square, and the coordinates of four vertexes are respectively a (u) 1 ，v 1 )、b(u 1 ，v 2 )、c(u 2 ，v 2 )、d(u 1 ，v 2 ) And according to the conditions, calculating the side length J of the square in the layout:
in the formula, n 0 A row number that is a minimum mark area; k is the total number of words of the set marking content; alpha is a side length coefficient for adjusting display content, and the value of alpha satisfies:
in the formula, P is the size of the selected font;
determining the lateral resolution B of the printed content from the marked content u And longitudinal resolution B v ；
Step 2: determining the area of a chip;
calculating an area G (Δ t) of the chip from the chip held by the holding member, there being:
G(Δt)＝(Q 1 (Δt)+2Δx)·(Q 2 (Δt)+2Δy)
in the formula, delta t is the number of times of clamping the chip; q 1 (delta t) is the detection value of a group of transversely distributed distance sensors on the clamping seat at delta t times; q 2 (delta t) is the detection value of a group of longitudinally distributed distance sensors on the clamping seat at delta t times; delta x is the transverse inherent distance of the chip pin; Δ y is the longitudinal intrinsic distance of the chip pins;
step3, calculating the area ratio of the marked content;
determining the layout area S of the mark content according to the side length J of the square to be laid out:
S＝J*J
according to the layout area S of the marked contents and the area G (delta t) of the chip, determining the area ratio K of the marked contents:
marking the marking content on the chip according to the position marked on the chip set by the operator and the parameters obtained by step1-step 3.
Determining parameters of the marked content by comparing the area ratio of the marked content (equivalent to the determined printing size), the resolution of the marked content and the chip type, and transmitting the parameters to the laser, wherein the laser marks the chip according to the parameters;
by determining the distance function and transmitting the data of the distance function into the marking module, the marking module can mark according to the area range of the chip outline, and the accuracy and the reliability of the marking module are improved;
detecting the positive placement marking circle through the guide probe, and controlling the marking module to directly mark the marking content on the chip through the processor if the current position of the chip is in a positive placement state;
the placement mode of the chip comprises four conditions: the position of the mark on the chip is different when the chip is placed, deflected by 90 degrees, deflected by 180 degrees and deflected by 270 degrees in different placing modes;
before the marking module performs marking, acquiring the posture of the chip through the guide probe, wherein the posture of the chip is determined through the following steps:
step 1: firstly, acquiring image data of a chip through the guide probe, carrying out binarization processing on the acquired image data of the chip, and smoothing the binarized image by using a Gaussian convolution template, wherein the smoothing processing is calculated according to the following formula:
wherein, (x, y) is the pixel coordinate of any point in the image, sigma is more than or equal to 1 and less than or equal to 10, and if the value of sigma is larger, the smoothness degree after the image processing is higher;
step 2: calculating the gradient direction and gradient value of the pixel points; the gradient direction theta and the gradient value M (x, y) of each pixel point;
wherein (g) x ，g y ) The gradients of any pixel point in the x direction and the y direction;
step3: comparing the gradient values of the pixel points (x, y) with those of the pixel points in the neighborhood of the pixel points (x, y), and if the gradient value of the pixel points (x, y) is the maximum value, considering the pixel points (x, y) as edge points; otherwise, point (x, y) is a non-edge point, and let (g) x ，g y )＝0；
Step 4: scanning edge points of the chip image from top to bottom and from left to right in the range of the chip image, recording the coordinate position of the first edge pixel when the first edge pixel is met, taking the first edge pixel as a starting point, scanning the first edge pixel from the first edge pixel to the circle center direction at intervals of 10 degrees along the circumference anticlockwise, and judging that the first edge pixel is an edge point and is an area for placing a mark circle when the pixel value of the scanned pixel is greater than a set mark threshold value; the marking threshold of the area of the marking point can be determined according to the area of the mark arranged on the chip;
step 5: performing primary circle fitting on the collected area edge points of the positive placement marker circle by adopting a least square circle fitting algorithm to obtain the circle center and radius rough calculation parameters of the marker circle; if the rough calculation parameters are matched with the actual radius, recording the position coordinates of the marking circle, and controlling the laser to mark the chip through the processor;
if the position of the marking circle on the chip is in a non-normal position, the angle of the laser is adjusted to be matched with the current angle of the chip correspondingly, so that the chip is marked;
meanwhile, if the position of the marking circle on the chip is in a non-normal position, the laser directly marks from the initial position according to the set marking content;
if the position of the current marking circle of the chip is 90 degrees of deflection, the laser is deflected by 90 degrees, and then the chip is marked; after marking is finished, the laser recovers to the initial position;
if the position of the current marking circle of the chip is deflected by 180 degrees, the laser is deflected by 180 degrees, and then the chip is marked; after marking is finished, the laser recovers to the initial position;
if the position of the current marking circle of the chip is 270 degrees of deflection, the laser is deflected by 270 degrees, and then the chip is marked; after marking is finished, the laser recovers to the initial position;
wherein the initial state of the laser is set to correspond to the state when the chip is placed right;
optionally, the acquisition module is disposed in the operation area and acquires a chip position of the operation area; the acquisition module comprises an acquisition unit and a sensing unit, wherein the acquisition unit is used for detecting the temperature of the chip, and the sensing unit is used for detecting the position of the chip; the sensing unit comprises a plurality of groups of photoelectric sensors and a data sensor, and the sensor is used for summarizing data sensed by the photoelectric sensors; the photoelectric sensors are arranged on two sides of the chip transportation direction and distributed at equal intervals and used for sensing the position of the chip;
when the photoelectric sensor detects the chip, sending an induction signal to the processor, so that the processor controls the transportation speed of the transportation module, transports the chip to the operation area, and clamps the chip through the clamping mechanism;
optionally, the verification module is arranged in a next process of the marking module, and is configured to recheck the mark of the chip; the verification module comprises a verification unit and a lifting unit, and the lifting unit is used for adjusting the position of the verification unit; the verification unit is used for verifying the mark of the chip; the verification unit comprises a verification probe, an analyzer and a memory, wherein the verification probe acquires image data of the marking data of the chip and transmits the image data to the memory for caching; the analyzer is used for analyzing the image data cached in the memory to check whether the marking content meets the requirement; the memory sends a verification request to the processor after receiving the image data, and the processor controls the analyzer to analyze the image data after receiving the verification request;
the analyzer extracts the characteristics of the image data in the process of analyzing the image data of the marked data to obtain the character data of the marked content, compares the character data with the set marked content, and screens the character data out through a screening module if the character data does not meet the set requirement;
in the process of verifying and analyzing the image data of the chip acquired by the analyzer, the image can be subjected to identification operations such as background removal, character feature extraction, character correction and the like, which are technical means well known to those skilled in the art, and the skilled in the art can inquire related technologies to obtain the technologies, so that the details are not repeated herein;
the lifting unit comprises a lifting rod, a lifting driving mechanism, a lifting detection piece and a distance detection piece, the verification probe is arranged at one end of the lifting rod, the other end of the lifting rod is in driving connection with the lifting driving mechanism to form a lifting part, and the lifting part is arranged above the chip transportation path and matched with the verification probe to recheck the chip; the distance detection piece is arranged at one end of the lifting rod, which is far away from the lifting part, and is used for detecting the distance between the lifting rod and the chip; the lifting detection piece is used for detecting the telescopic distance of the lifting rod;
in addition, after the checking probe checks the chip, the marking effect of the chip can be rechecked so as to realize the statistics of the marking condition of the chip;
optionally, the screening module includes a screening unit, a position adjusting unit and a storage disk, the screening unit is connected to the position adjusting unit, and the position adjusting unit is configured to adjust the position of the screening unit; the position adjusting unit comprises a fixed seat, a connecting plate, an offset plate, a first adjusting track, a second adjusting track, a first adjusting driving mechanism and a second adjusting driving mechanism, wherein the fixed seat is arranged at the upper top of the first adjusting track and is provided with a hollow sliding cavity; the second adjusting track penetrates through the sliding cavity and is connected with the upper top wall of the sliding cavity through the connecting plate, the second adjusting driving mechanism is fixed on the offset plate and is in driving connection with one end of a screw rod, and the other end of the screw rod is connected with one side frame of the connecting plate, so that the connecting plate can be offset relative to the offset plate; one end of the offset plate is connected with the rack, and the other end of the offset plate penetrates through the sliding cavity and is suspended and extends out towards the upper part of the storage disc;
the second adjusting track is arranged on the offset plate, and the track direction of the first adjusting track is parallel to the length direction of the offset plate;
in addition, when the second adjustment driving mechanism drives the connecting plate to deflect, the second adjustment driving mechanism drives the fixed seat to adjust the position together with the first adjustment track, so that the screening unit can screen the chips;
specifically, the track direction of the second adjustment track is perpendicular to the track direction of the first adjustment track, and the second adjustment track is arranged above the storage disk;
the first adjusting track and the second adjusting track are matched with each other, so that the screening component can store chips at different positions of the storage disc in the process of screening the chips, the chips are used for distinguishing different types or different qualified standard chips, and meanwhile, the screening efficiency is considered;
the screening unit comprises a suction component, a storage plate, an acquisition component and a fixing plate, wherein the storage plate is used for storing the marked chips; the sucking component is used for sucking the chip and transporting the chip to the storage plate; wherein, the storage plate is provided with a plurality of storage grooves for placing the chips; the sucking component is arranged on the fixing plate and moves along with the movement of the fixing plate; the collecting component is arranged on the sucking component and matched with the sucking component to suck the chip;
through the matching of the position adjusting unit and the screening unit, the chips with different checking results can be screened out;
the collecting component comprises a collecting probe, the collecting probe is used for collecting the position of the chip, and is matched with the sucking component to suck the chip, so that the chip is transferred from the conveying belt to the storage groove of the storage disc;
the suction member comprises a plurality of suction heads, a suction pump and a suction pipeline, and the suction heads are used for being adsorbed on the upper end surface of the chip; the two ends of the suction pipeline are respectively connected with the suction heads and the suction pump, and suction force is provided through the suction pump so as to adsorb the chip; the sucking component also comprises a sliding block, a lifting track and a height driving mechanism; the suction head is arranged on the sliding block, and the sliding block is connected with the lifting track in a sliding manner; the direction of the lifting track is vertical to the sliding direction of the fixing plate, and the lifting track is fixedly connected to the side edge of the fixing plate; the height driving mechanism is arranged on the sliding block and drives the sliding block to slide along the direction of the lifting track;
the acquisition component further comprises a distance detection piece, the distance detection piece is arranged on the sliding seat and is used for detecting the distance between the sliding seat and the chip, so that the chip can be accurately absorbed by the absorption component and transferred from the transportation module to the storage groove;
the screening module further comprises a position acquisition probe, the position acquisition probe acquires the position of the storage disc so as to distinguish the currently occupied storage groove from the unoccupied storage groove, and the storage position of the chip adsorbed by the adsorption unit is adjusted through the processor.
Example two.
This embodiment should be understood to include at least all the features of any of the embodiments described above and further improved upon with reference to fig. 1, 2, 3, 4, 5, 6, 7 and 8, and in that the manufacturing system further includes a cleaning module for cleaning the chip; the cleaning module is arranged before the marking process of the marking module and is used for cleaning dust on the surface of the chip; the cleaning module is arranged above the chip transportation path, and the chips are sent to the next flow (the flow for marking the chips) after being cleaned;
the cleaning module comprises an adjusting unit, an adsorption unit and a connecting rod, and the adsorption unit is used for adsorbing the dust; the adjusting unit is used for adjusting the position of the adsorption unit; the adsorption unit is arranged on the cleaning unit, the adjusting unit comprises an adjusting member and a telescopic member, the telescopic member is arranged on the adjusting member, and the adjusting member adjusts the transverse displacement of the telescopic member; the telescopic component is used for adjusting the height displacement of the adsorption unit;
one end of the connecting rod is connected with the adjusting component, and the adjusting component is arranged right above the transportation module in a suspending way; the other end of the connecting rod is connected with the rack;
the telescopic member is matched with the adjusting member, so that all positions of the chip are cleaned, and dust on the chip is effectively prevented from influencing the mark of the marking module; in addition, the telescopic component adjusts the distance between the adsorption unit and the chip, so that the adsorption unit can clean the chip more stably and reliably;
optionally, the telescopic member includes a telescopic rod, a telescopic detection member and a telescopic driving mechanism, one end of the telescopic rod is connected with the telescopic driving mechanism to form a telescopic portion, and the telescopic portion is arranged on the adjusting member; the other end of the telescopic rod extends out towards one side of the adjusting member and is connected with the adsorption unit; the telescopic detection piece is used for detecting the extending length of the telescopic rod; the telescopic driving mechanism drives the telescopic rod to extend or retract;
the telescopic component is in control connection with the processor, so that the processor can control the telescopic driving mechanism to drive the telescopic rod to be driven in a telescopic mode, and the adsorption unit arranged on the telescopic rod can adsorb or clean dust;
the telescopic rod, the telescopic detection piece, the telescopic driving mechanism and the processor form a closed loop, so that the extension degree of the telescopic rod can be accurately controlled, and the chip is effectively prevented from being damaged due to the fact that the telescopic rod is excessively extended;
optionally, the adsorption unit comprises an adsorption nozzle, an adsorption pipeline and a filter cavity, the adsorption nozzle is arranged at one end of the telescopic rod, one end of the adsorption pipeline is connected with the adsorption nozzle, and the other end of the adsorption pipeline is connected with the filter cavity; a suction pump is arranged in the filter cavity and adsorbs dust on the chip through an adsorption nozzle and an adsorption pipeline;
meanwhile, the suction force of the suction pump acts on the outer surface of the chip through an adsorption pipeline and the adsorption nozzle, so that dust on the chip can be cleaned;
optionally, the adjusting member adjusts the position of the telescopic member, so that each position of the upper top of the chip can be cleaned; the adjusting component comprises an adjusting seat, a first adjusting track, a second adjusting track, a first adjusting driving mechanism and a second adjusting driving mechanism, the adjusting seat is connected with the first adjusting track in a sliding mode, and the first adjusting driving mechanism is arranged on the adjusting seat and drives the adjusting seat to slide along the direction of the first adjusting track; one end of the first adjusting track is connected with the second adjusting track in a sliding manner, and the second adjusting driving mechanism is arranged at one end of the first adjusting track and one end of the second adjusting track, so that the first adjusting track slides along the direction of the second adjusting track under the driving of the second adjusting driving mechanism; in addition, the telescopic component is arranged on the sliding seat, and particularly, the telescopic part is arranged on the adjusting seat;
optionally, the adjusting member further includes a group of identification probes, a plurality of first position markers and a plurality of second position markers, and the group of identification probes is respectively used for identifying the first position markers and the second position markers;
the first position markers are distributed at equal intervals along the length direction of the first adjusting track; the second position markers are distributed at equal intervals along the length direction of the second adjusting track;
wherein a group of identification probes are respectively arranged on the sliding seat and the first adjusting track and extend out towards one side of the first position marker and one side of the second position marker;
each first position marker is distributed at equal intervals along the first adjusting track, so that a group of identification probes can identify the current position in the process of identifying each first position marker and each second position marker, and the position of the telescopic member is adjusted more accurately.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the invention, and further, the elements thereof can be updated as the technology develops.
Claims (5)
1. The intelligent manufacturing system of the semiconductor chip with high adaptability comprises a database and a transportation module, and is characterized by further comprising an acquisition module, a marking module, a verification module, a screening module and a processor;
the processor is respectively in control connection with the transportation module, the database, the acquisition module, the marking module, the verification module and the screening module; the database is respectively connected with the acquisition module, the marking module, the screening module and the verification module;
the transportation module is used for transporting the chips and transporting the chips to each station; the acquisition module is used for acquiring the current position and the processing temperature of the chip; the marking module is used for marking the chip and marking the processing data of the chip; the verification module is used for verifying the marking pattern and the marking position of the chip so as to adjust the marks at different positions; the screening module is used for screening the chips to distinguish different specifications of chip types;
the marking module comprises an operation area, a marking unit and a positioning unit, and the positioning unit is used for positioning the position mark of the chip; the marking unit marks the chip based on the data of the positioning unit; the marking unit and the positioning unit are both arranged in the operation area;
the marking unit comprises a controller, a laser and a cooler, wherein the cooler is used for cooling the laser, and the laser is used for marking a chip; the controller is used for controlling the content of the mark, and the control unit is electrically connected with the laser;
the positioning unit comprises a clamping member and a guide member, wherein the clamping member is used for clamping the chip; the guide member is used for guiding the marking position of the marking unit;
the guide member receives marker position data set by an operator, wherein the marker position data includes marker content, marker spacing, and marker direction;
the clamping component comprises a group of clamping seats, a plurality of distance sensors, buffering cotton and a clamping driving mechanism, wherein the buffering cotton is arranged at the upper top of the group of clamping seats and used for buffering pins of the chip; the group of clamping seats are jointly provided with an L-shaped clamping cavity for clamping the chip, and the distance sensors are oppositely arranged on the inner wall of the clamping cavity and acquire at least two groups of detection data; the clamping driving mechanism is in driving connection with the group of clamping seats;
the determination of the printing parameters of the laser comprises the following steps:
step 1: determining a lateral resolution B of print content u And longitudinal resolution B v ；
Acquiring data of the mark content set by an operator, wherein the data comprises the number of words and the number of lines of the mark, the layout formed according to the number of words and the number of lines of the mark is set to be a square, and the coordinates of four vertexes are respectively a (u) 1 ，v 1 )、b(u 1 ，v 2 )、c(u 2 ，v 2 )、d(u 1 ，v 2 ) And according to the conditions, calculating the side length J of the square in the layout:
in the formula, n 0 A row number that is a minimum mark area; k is the total number of words of the set marking content; alpha is a side length coefficient for adjusting display content, and the value of alpha satisfies:
in the formula, P is the size of the selected font;
determining the lateral resolution B of the printed content from the marked content u And longitudinal resolution B v ；
Step 2: determining the area of a chip;
calculating an area G (Δ t) of the chip from the chip held by the holding member, there being:
G(Δt)＝(Q 1 (Δt)+2Δx)·(Q 2 (Δt)+2Δy)
in the formula, delta t is the number of times of clamping the chip; q 1 (delta t) is the detection value of a group of transversely distributed distance sensors on the clamping seat at delta t times; q 2 (delta t) is the detection value of a group of longitudinally distributed distance sensors on the clamping seat at delta t times;delta x is the transverse inherent distance of the chip pin; Δ y is the longitudinal intrinsic distance of the chip pins;
step3, calculating the area ratio of the marked content;
determining the layout area S of the mark content according to the side length J of the square to be laid out:
S＝J*J
according to the layout area S of the mark contents and the area G (delta t) of the chip, determining the area ratio K of the mark contents:
marking the marking content on the chip according to the position of the chip marking set by the operator and the parameters obtained in the step1-step 3.
2. The semiconductor chip smart manufacturing system with high adaptability according to claim 1, wherein the verification module is disposed at the next process of the marking module, wherein the verification module comprises a verification unit and a lifting unit, and the lifting unit is used for adjusting the position of the verification unit; the verification unit is used for verifying the mark of the chip; the verification unit comprises a verification probe and a memory, the verification probe collects the marking data of the chip and transmits the marking data to the memory for caching, and the memory transmits the collected data to the processor and the database.
3. The intelligent manufacturing system for semiconductor chips with high adaptability as claimed in claim 2, wherein the collecting module is disposed in the operation area and collects chip positions for performing the operation area; the acquisition module comprises an acquisition unit and a sensing unit, wherein the acquisition unit is used for detecting the temperature of the chip, and the sensing unit is used for detecting the position of the chip; the sensing unit comprises a plurality of groups of photoelectric sensors and data sensors, and the sensors are used for summarizing data sensed by the photoelectric sensors; and the photoelectric sensors are arranged on two sides of the chip transportation direction at equal intervals and used for sensing the position of the chip.
4. The intelligent manufacturing system for semiconductor chips with high adaptability according to claim 3, wherein the transportation module comprises a transportation belt, a plurality of transportation rollers, a group of baffles and a transportation driving mechanism, the transportation belt is nested on the transportation rollers, and the transportation driving mechanism drives the transportation belt to rotate; the enclosing barriers are arranged on two sides of the conveying direction of the conveying belt so as to limit the position of the chip.
5. The intelligent manufacturing system for semiconductor chips with high adaptability according to claim 4, wherein the screening module comprises a screening unit, a position adjusting unit and a storage disk, the screening unit is connected with the position adjusting unit, and the position adjusting unit is used for adjusting the position of the screening unit; the position adjusting unit comprises a fixed seat, a connecting plate, an offset plate, a first adjusting track, a second adjusting track, a first adjusting driving mechanism and a second adjusting driving mechanism, wherein the fixed seat is arranged at the upper top of the first adjusting track and is provided with a hollow sliding cavity; the second adjusting track penetrates through the sliding cavity and is connected with the upper top wall of the sliding cavity through the connecting plate, the second adjusting driving mechanism is fixed on the offset plate and is in driving connection with one end of a screw rod, and the other end of the screw rod is connected with one side frame of the connecting plate, so that the connecting plate can be offset relative to the offset plate; one end of the offset plate is connected with the rack, and the other end of the offset plate penetrates through the sliding cavity and is suspended and extends out towards the upper part of the storage disc.
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