CN114786326B - Circuit board, alignment drilling method of circuit board and composite circuit board - Google Patents
Circuit board, alignment drilling method of circuit board and composite circuit board Download PDFInfo
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- CN114786326B CN114786326B CN202210458006.8A CN202210458006A CN114786326B CN 114786326 B CN114786326 B CN 114786326B CN 202210458006 A CN202210458006 A CN 202210458006A CN 114786326 B CN114786326 B CN 114786326B
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- alignment optical
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- 238000005553 drilling Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000002131 composite material Substances 0.000 title claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims abstract description 163
- 229910052705 radium Inorganic materials 0.000 claims abstract description 15
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 13
- 238000003475 lamination Methods 0.000 claims description 13
- 238000012545 processing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board, a counterpoint drilling method of the circuit board and a composite circuit board, wherein the circuit board comprises a reference layer and two conductive layers, the two conductive layers are symmetrically arranged on two sides of the reference layer, and the conductive layers at least comprise a first conductive layer, a second conductive layer and a third conductive layer; the first conducting layer is provided with a first alignment optical point and a second alignment optical point, a first radium perforation and a first base optical point are arranged between the first conducting layer and the second conducting layer, the first base optical point is used for positioning the first radium perforation, and the first radium perforation corresponds to the first base optical point in position; and a second radium perforation is arranged between the second conductive layer and the third conductive layer, and the second radium perforation corresponds to the first radium perforation. In the embodiment of the invention, the deviation of the alignment of the laser holes can be reduced by the alignment relation between the alignment optical points and the laser holes, so that the alignment precision of the stacked holes of the multilayer plate is improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board, a counterpoint drilling method of the circuit board and a composite circuit board.
Background
Along with the development of scientific technology, the demand for high-precision circuit boards is continuously growing, and the demand for processing precision of circuit boards is higher and higher due to the development trend of miniaturization and multilayering of high-frequency circuit boards, for example, as a high-density laminated circuit board widely used in electronic products, the circuit and the via holes for transmitting signals are denser and denser, the space, the density and the aperture of the via holes of the wires are smaller and the demand for alignment precision is higher and higher, and the alignment precision processing of the circuit boards is more and more difficult.
In the circuit board processing process, laser drilling is a conventional communication mode in circuit board processing, the existing drilling alignment mode is to make a reference through an alignment optical point before laser drilling, and then laser drilling is carried out, however, in the drilling alignment processing process, the laser holes can deviate in the same trend along with the deviation of the alignment optical point of the reference layer, so that the alignment of the drilling laser holes is not uniform, and the alignment precision of the laminated holes of the multilayer board is affected.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a circuit board, a circuit board alignment drilling method and a composite circuit board, which can reduce the deviation of laser hole alignment, thereby improving the alignment precision of stacked holes of a multilayer board.
In a first aspect, the invention provides a circuit board, which comprises a reference layer and two conductive layers, wherein the two conductive layers are symmetrically arranged on two sides of the reference layer, and the conductive layers at least comprise a first conductive layer, a second conductive layer and a third conductive layer;
A first alignment optical point and a second alignment optical point are arranged on the first conductive layer, wherein the first alignment optical point is used for aligning the first conductive layer and the second conductive layer, and the second alignment optical point is used for aligning the second conductive layer and the third conductive layer;
A first laser perforation and a first base optical point are arranged between the first conductive layer and the second conductive layer, the first base optical point is used for positioning the first laser perforation, and the first laser perforation corresponds to the first base optical point in position;
And a second radium perforation is arranged between the second conductive layer and the third conductive layer, and the second radium perforation corresponds to the first radium perforation in position.
The circuit board provided by the embodiment of the invention has at least the following beneficial effects: the first alignment optical point and the second alignment optical point are arranged on the first conductive layer, the alignment of the first conductive layer, the second conductive layer and the third conductive layer is achieved, the positions of the first laser perforation arranged between the first conductive layer and the second conductive layer and the positions of the second laser perforation arranged between the second conductive layer and the third conductive layer are obtained through the positions of the first alignment optical point and the second alignment optical point, and accordingly alignment accuracy of the first conductive layer, the second conductive layer and the third conductive layer is improved, and alignment deviation of the first laser perforation and the second laser perforation can be reduced through the arrangement of the first base optical point.
According to some embodiments of the present invention, the number of the first alignment optical points is plural, and the number of the second alignment optical points is equal to the number of the first alignment optical points, so as to facilitate alignment of the first conductive layer and the second conductive layer, and improve alignment accuracy.
According to some embodiments of the invention, the first alignment optical point and the second alignment optical point have the same aperture, so as to avoid deviation of the alignment optical points.
According to some embodiments of the invention, the distance between the first alignment optical point and the second alignment optical point is 0.2mm-0.5mm, so that alignment accuracy between laser holes is improved and alignment deviation is reduced.
According to some embodiments of the invention, the first alignment optical point, the second alignment optical point and the first base optical point are located on the same horizontal plane, and the accuracy between the laser holes is improved through the first alignment optical point, the second alignment optical point and the first base optical point.
According to some embodiments of the invention, the aperture of the first base optical spot is greater than or equal to the aperture of the first laser perforation, so that vertical alignment between the laser perforations is facilitated.
In a second aspect, the present invention provides a method for aligning and drilling a circuit board, where the circuit board includes a reference layer and two conductive layers, the conductive layers are axisymmetrically disposed with the reference layer, and the conductive layers at least include a first conductive layer, a second conductive layer, and a third conductive layer, and the method for aligning and drilling includes:
etching the first conductive layer to obtain a plurality of first alignment optical points, a plurality of second alignment optical points and a first base optical point;
Pressing the second conductive layer, the reference layer and the first conductive layer to obtain a first pressing layer;
burning through the first lamination layer, and determining the positions of a plurality of first alignment optical points;
drilling a first laser perforation between the first conductive layer and the second conductive layer according to the position of the first alignment optical point, wherein the position of the first laser perforation corresponds to the position of the first base optical point;
Pressing the third conductive layer, the reference layer and the first pressing layer to obtain a second pressing layer;
burning through the second pressing layer and the first pressing layer, and determining the positions of a plurality of second alignment optical points on the first conductive layer;
And drilling a second laser perforation between the second conductive layer and the third conductive layer according to the position of the second alignment optical point.
The alignment drilling method of the circuit board provided by the embodiment of the invention has the following beneficial effects: firstly, etching a first conductive layer to obtain a plurality of first alignment optical points, a plurality of second alignment optical points and a first base optical point, so that the subsequent determination of first laser holes is facilitated, secondly, pressing a second conductive layer, a reference layer and the first conductive layer to obtain a first pressing layer, determining the position of the first alignment optical point according to the first pressing layer, finally, drilling a first laser hole between the first conductive layer and the second conductive layer according to the position of the first alignment optical point, facilitating the improvement of alignment precision of the first conductive layer, the second conductive layer and the third conductive layer, and the like, burning through the second pressing layer, determining the positions of the plurality of second alignment optical points, and drilling a second laser hole between the second conductive layer and the third conductive layer according to the position of the second alignment optical point, thereby reducing deviation between the first laser hole and the second laser hole and realizing accurate alignment hole.
According to some embodiments of the invention, after drilling a first laser hole between the first conductive layer and the second conductive layer according to the position of the first alignment optical point, further comprising:
And etching the first laser hole on the second conductive layer to obtain a second base optical point, so that the second laser hole can be conveniently determined subsequently, and the vertical punching precision is improved.
According to some embodiments of the invention, after drilling a second laser hole between the second conductive layer and the third conductive layer according to the position of the second alignment optical point, further comprising:
and etching the second laser hole on the third conductive layer to obtain a third base optical point, so that the third laser hole can be conveniently determined subsequently, and the vertical punching precision is improved.
In a third aspect, the present invention provides a composite circuit board, which includes any one of the circuit boards in the first aspect or is manufactured by an alignment drilling method of any one of the circuit boards in the second aspect.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate and do not limit the invention.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
Fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the present invention;
Fig. 3 is a flowchart of a method for aligning and drilling according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that although a logical order is illustrated in the flowchart, in some cases, the steps illustrated or described may be performed in an order different from that in the flowchart. The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The invention provides a circuit board, a counterpoint drilling method of the circuit board and a composite circuit board, which have at least the following beneficial effects: the first alignment optical point and the second alignment optical point are arranged on the first conductive layer, the alignment of the first conductive layer, the second conductive layer and the third conductive layer is achieved, the positions of the first laser perforation arranged between the first conductive layer and the second conductive layer and the positions of the second laser perforation arranged between the second conductive layer and the third conductive layer are obtained through the positions of the first alignment optical point and the second alignment optical point, and accordingly alignment accuracy of the first conductive layer, the second conductive layer and the third conductive layer is improved, and alignment deviation of the first laser perforation and the second laser perforation can be reduced through the arrangement of the first base optical point.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
In one embodiment, the circuit board includes a reference layer 100 and two conductive layers symmetrically disposed on two sides of the reference layer 100, where the conductive layers include at least a first conductive layer 210, a second conductive layer 220, and a third conductive layer 230; the first conductive layer 210 is provided with a first alignment optical point 110 and a second alignment optical point 120, wherein the first alignment optical point 110 is used for aligning the first conductive layer 210 and the second conductive layer 220, and the second alignment optical point 120 is used for aligning the second conductive layer 220 and the third conductive layer 230; a first laser perforation 300 and a first base optical point 130 are arranged between the first conductive layer 210 and the second conductive layer 220, the first base optical point 130 is used for positioning the first laser perforation 300, and the first laser perforation 300 corresponds to the first base optical point 130 in position; a second laser perforation 400 is disposed between the second conductive layer 220 and the third conductive layer 230, the second laser perforation corresponding to the location of the first laser perforation 300.
It should be noted that, by setting the first alignment optical point 110 and the second alignment optical point 120 on the first conductive layer 210, aligning the first conductive layer 210, the second conductive layer 220 and the third conductive layer 230, and obtaining the position of the first laser hole 300 between the first conductive layer 210 and the second conductive layer 220 and the position of the second laser hole 400 between the second conductive layer 220 and the third conductive layer 230 through the positions of the first alignment optical point 110 and the second alignment optical point 120, the alignment accuracy of the first conductive layer 210, the second conductive layer 220 and the third conductive layer 230 is improved, the alignment deviation of the first laser hole 300 and the second laser hole 400 is reduced, and the alignment deviation of the alignment optical points is avoided.
In an embodiment, the number of the first alignment optical dots 110 is plural, and the number of the second alignment optical dots 120 is equal to the number of the first alignment optical dots 110, so as to align the first conductive layer 210 and the second conductive layer 220, thereby improving alignment accuracy.
It should be noted that, the number of the first alignment optical points 110 and the second alignment optical points 120 is set according to the number of layers of the conductive layer and the reference layer 100, in this embodiment, the number of the first alignment optical points 110 and the second alignment optical points 120 is 4, and two first alignment optical points 110 and second alignment optical points 120 are disposed on each conductive layer on two sides of the reference layer 100, where the alignment optical points are disposed at corners of each conductive layer respectively, for example, the first alignment optical points 110 are disposed at left corners of the first conductive layer 210, and the second alignment optical points 120 are disposed at right corners of the conductive layer, so as to accurately position the laser holes.
In one embodiment, the apertures of the first alignment optical point 110 and the second alignment optical point 120 are the same, so as to avoid deviation of the alignment optical points.
It should be noted that, the first alignment optical point 110 is used for positioning the first laser hole 300, the second alignment optical point 120 is used for positioning the second laser hole 400, and the apertures of the first alignment optical point 110 and the second alignment optical point 120 are the same, so that deviation of the alignment optical points is avoided, and the subsequent accurate positioning of the laser holes is facilitated.
In one embodiment, the distance between the first alignment optical point 110 and the second alignment optical point 120 is 0.2mm to 0.5mm, which improves alignment accuracy between laser holes and reduces alignment deviation.
It should be noted that, the first alignment optical point 110 is located at the outer side of the second alignment optical point 120, and the distance between the adjacent first alignment optical point 110 and the second alignment optical point 120 is kept between 0.2mm and 0.5mm, so as to achieve accurate positioning of the laser perforation.
In an embodiment, the first alignment optical point 110, the second alignment optical point 120 and the first base optical point 130 are located on the same horizontal plane, and the accuracy between laser holes is improved by the first alignment optical point 110 and the second alignment optical point 120.
It should be noted that, the second alignment optical point 120 and the first alignment optical point 110 are disposed on the same horizontal plane, so that the deviation between the first laser hole 300 and the second laser hole 400 is reduced, and the alignment accuracy among the first conductive layer 210, the second conductive layer 220 and the third conductive layer 230 is further improved.
In one embodiment, the aperture of the first base optical spot 130 is greater than or equal to the aperture of the first laser perforation 300, so as to facilitate alignment of the first laser perforation 300.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
It should be noted that, two conductive layers in the circuit board are symmetrically disposed at two sides of the reference layer 100, and the number of conductive layers at the upper and lower sides is the same, wherein the number of conductive layers may be 3, 4 or 5, and when the number of conductive layers is multiple, the conductive layers are sequentially arranged on the core board to be pressed, which is not limited in this embodiment.
It can be understood that when the number of the conductive layers is 4, the number of the alignment optical points is three pairs, and the three pairs of alignment optical points are all located in the same conductive layer; when the number of the conductive layers is 5, the number of the alignment optical points is four pairs, and the four pairs of alignment optical points are all positioned on the same conductive layer.
Referring to fig. 3, fig. 3 is a flowchart of a method for aligning and drilling holes, which may be applied to a circuit board, according to an embodiment of the present invention, including but not limited to step S100 and step S700.
It should be noted that, the circuit board includes reference layer and two conductive layers, and the conductive layer uses the reference layer to set up as axisymmetry, and the conductive layer includes first conductive layer, second conductive layer and third conductive layer at least.
Step S100: etching the first conductive layer to obtain a plurality of first alignment optical points, a plurality of second alignment optical points and a first base optical point;
Step S200: laminating the second conductive layer, the reference layer and the first conductive layer to obtain a first lamination layer;
Step S300: burning through the first lamination layer, and determining the positions of a plurality of first alignment optical points;
Step S400: drilling a first laser perforation between the first conductive layer and the second conductive layer according to the position of the first alignment optical point;
It should be noted that the position of the first laser hole corresponds to the position of the first base optical point.
Step S500: laminating the third conductive layer, the reference layer and the first lamination layer to obtain a second lamination layer;
Step S600: burning through the second lamination layer and the first lamination layer, and determining the positions of a plurality of second alignment optical points on the first conductive layer;
Step S700: and drilling a second laser perforation between the second conductive layer and the third conductive layer according to the position of the second alignment optical point.
In an embodiment, etching the first conductive layer to obtain a plurality of first alignment optical points, a plurality of second alignment optical points and a first base optical point, so as to facilitate subsequent determination of a first laser perforation, then laminating the second conductive layer, the reference layer and the first conductive layer to obtain a first lamination layer, determining the position of the first alignment optical point according to the first lamination layer, finally drilling the first laser perforation between the first conductive layer and the second conductive layer according to the position of the first alignment optical point, facilitating improvement of alignment precision of the first conductive layer, the second conductive layer and the third conductive layer, pushing the second lamination layer, determining the positions of the plurality of second alignment optical points, drilling the second laser perforation between the second conductive layer and the third conductive layer according to the position of the second alignment optical point, and thus reducing deviation between the first laser perforation and the second laser perforation, and realizing accurate alignment perforation.
In an embodiment, after drilling the first laser hole between the first conductive layer and the second conductive layer according to the position of the first alignment optical point, the method further includes: and etching the first laser hole on the second conductive layer to obtain a second base optical point.
It can be understood that after the first laser hole is obtained, copper plating is performed in the first laser hole, and then etching is performed, so that a pattern circuit of the second conductive layer can be manufactured, after copper plating and etching, the second base optical point is confirmed to be obtained, the second laser hole is conveniently drilled, and the alignment punching precision is improved.
In an embodiment, after drilling the second laser hole between the second conductive layer and the third conductive layer according to the position of the second alignment optical point, the method further includes: and etching the second laser hole in the third conductive layer to obtain a third base optical point, so that the third laser hole is conveniently drilled, and the alignment and punching precision is improved.
In addition, an embodiment of the invention also provides a composite circuit board, which comprises any circuit board in the embodiment or any opposite drilling method.
The embodiments described in the embodiments of the present application are for more clearly describing the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application, and those skilled in the art can know that, with the evolution of technology and the appearance of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.
It will be appreciated by those skilled in the art that the solution shown in fig. 3 is not limiting of the embodiments of the application and may include more or fewer steps than shown, or certain steps may be combined, or different steps.
The terms "first," "second," "third," "fourth," and the like in the description of the application and in the above figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be understood that in the present application, "at least one (item)" means one or more, and "a plurality" means two or more. "and/or" for describing the association relationship of the association object, the representation may have three relationships, for example, "a and/or B" may represent: only a, only B and both a and B are present, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b or c may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not thereby limiting the scope of the claims of the embodiments of the present application. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the embodiments of the present application shall fall within the scope of the claims of the embodiments of the present application.
Claims (8)
1. The circuit board is characterized by comprising a reference layer and two conductive layers, wherein the two conductive layers are symmetrically arranged on two sides of the reference layer, and the conductive layers at least comprise a first conductive layer, a second conductive layer and a third conductive layer;
A first alignment optical point and a second alignment optical point are arranged on the first conductive layer, wherein the first alignment optical point is used for aligning the first conductive layer and the second conductive layer, and the second alignment optical point is used for aligning the second conductive layer and the third conductive layer;
A first laser perforation and a first base optical point are arranged between the first conductive layer and the second conductive layer, the first base optical point is used for positioning the first laser perforation, and the first laser perforation corresponds to the first base optical point in position;
a second radium perforation is arranged between the second conductive layer and the third conductive layer, and the second radium perforation corresponds to the first radium perforation in position;
The position of the first laser perforation is determined through the first alignment optical point, the position of the second laser perforation is determined through the second alignment optical point, the aperture of the first alignment optical point is the same as that of the second alignment optical point, and the aperture of the first base optical point is larger than or equal to that of the first laser perforation.
2. The circuit board of claim 1, wherein the number of first alignment optical points is a plurality of, and the number of second alignment optical points is equal to the number of first alignment optical points.
3. The circuit board of claim 1, wherein a distance between the first and second alignment optical points is 0.2mm-0.5mm.
4. The circuit board of claim 1, wherein the first alignment optical point, the second alignment optical point, and the first base optical point are located on a same horizontal plane.
5. The circuit board comprises a reference layer and two conductive layers, wherein the conductive layers are arranged in an axisymmetric manner, and at least comprise a first conductive layer, a second conductive layer and a third conductive layer, and the circuit board is characterized in that the alignment drilling method comprises the following steps:
etching the first conductive layer to obtain a plurality of first alignment optical points, a plurality of second alignment optical points and a first base optical point;
Pressing the second conductive layer, the reference layer and the first conductive layer to obtain a first pressing layer;
burning through the first lamination layer, and determining the positions of a plurality of first alignment optical points;
Drilling a first radium perforation between the first conductive layer and the second conductive layer according to the position of the first alignment optical point, wherein the position of the first radium perforation corresponds to the position of the first base optical point, and the aperture of the first base optical point is larger than or equal to the aperture of the first radium perforation;
Pressing the third conductive layer, the reference layer and the first pressing layer to obtain a second pressing layer;
burning through the second lamination layer and the first lamination layer, and determining the positions of a plurality of second alignment optical points on the first conductive layer, wherein the apertures of the first alignment optical points and the second alignment optical points are the same;
And drilling a second laser perforation between the second conductive layer and the third conductive layer according to the position of the second alignment optical point.
6. The alignment drilling method of a circuit board of claim 5, further comprising, after drilling a first laser hole between the first conductive layer and the second conductive layer according to the position of the first alignment optical point:
And etching the first laser hole on the second conductive layer to obtain a second base optical point.
7. The alignment drilling method of a circuit board of claim 5, further comprising, after drilling a second laser hole between the second conductive layer and the third conductive layer according to the position of the second alignment optical point:
And etching the second laser hole on the third conductive layer to obtain a third base optical point.
8. A composite circuit board comprising a circuit board according to any one of claims 1 to 4 or produced by a method of alignment drilling of a circuit board according to any one of claims 5 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210458006.8A CN114786326B (en) | 2022-04-28 | 2022-04-28 | Circuit board, alignment drilling method of circuit board and composite circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210458006.8A CN114786326B (en) | 2022-04-28 | 2022-04-28 | Circuit board, alignment drilling method of circuit board and composite circuit board |
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| CN114786326A CN114786326A (en) | 2022-07-22 |
| CN114786326B true CN114786326B (en) | 2024-07-26 |
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| CN113286434A (en) * | 2021-05-14 | 2021-08-20 | 宜兴硅谷电子科技有限公司 | Alignment method of HDI (high Density interconnection) boards in any interconnection |
| CN114340225B (en) * | 2021-12-23 | 2024-02-23 | 江苏普诺威电子股份有限公司 | Multilayer packaging substrate alignment method suitable for laser blind holes |
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| CN102123565A (en) * | 2010-01-11 | 2011-07-13 | 苏州统硕科技有限公司 | Manufacturing method of high-alignment interlayer conducting structure of embedded type circuit |
| CN104113995A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Printed circuit board manufacturing method and printed circuit board |
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