CN114749800B - Method for processing diamond micro-groove heat sink by ultraviolet nanosecond laser - Google Patents

Method for processing diamond micro-groove heat sink by ultraviolet nanosecond laser Download PDF

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CN114749800B
CN114749800B CN202210379746.2A CN202210379746A CN114749800B CN 114749800 B CN114749800 B CN 114749800B CN 202210379746 A CN202210379746 A CN 202210379746A CN 114749800 B CN114749800 B CN 114749800B
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scanning
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CN114749800A (en
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崔健磊
董向阳
梅雪松
王文君
凡正杰
刘斌
孙铮
段文强
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Xian Jiaotong University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a method for processing a diamond micro-groove heat sink by ultraviolet nanosecond laser, which comprises the following steps: step one, configuring an ultraviolet nanosecond laser processing system, preheating and debugging when the machine is started, and calibrating a laser focus; positioning the workpiece to enable the coordinate system of the workpiece to coincide with the origin of the laser scanning coordinate system; positioning the light beam, and immersing the Rayleigh length of the laser into the upper surface of the workpiece; step four, configuring an online observation microscope, perpendicular to the side surface of the workpiece, and monitoring the processing morphology in real time; step five, processing and testing according to the minimum topological structure; step six, regulating and controlling the processing of the minimum topological structure to finish the finish processing of the minimum topological structure; and seventhly, placing a sample blank, configuring a paraxial for observation, processing the sample according to the same parameters of the minimum topological structure, observing in real time, processing the sample, and observing in real time.

Description

Method for processing diamond micro-groove heat sink by ultraviolet nanosecond laser
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a method for processing a diamond micro-groove heat sink by ultraviolet nanosecond laser.
Background
Chip heat dissipation technology is critical to the stability and reliability of electronic products. The micro-groove heat sink can be used for effectively radiating the electronic product chip. Among the numerous heat sink materials, diamond has the highest thermal conductivity and highest heat exchange efficiency. Micro-groove heat sink processed by diamond can realize 300W/cm 2 The heat dissipation capacity of the heat flux density greatly improves the reliability of the electronic chip, greatly improves the work load of the electronic chip, and can be applied to scenes with higher requirements. The strength of the diamond reaches 8600MPa, the strength is extremely high, and the diamond can bear the high-pressure work of the heat sink fluid heat dissipation working mediumConditions. Diamond has extremely high strength and hardness, with mohs hardness reaching a maximum of 10. Diamond, which is the standard material with the highest mohs hardness, is the hardest material known in nature and is extremely difficult to process. Conventional machining methods cannot find a tool material with a hardness greater than that of diamond, so that diamond cannot be formed by turning, milling, or other machining methods. The laser processing technology removes diamond material by utilizing high energy density in the range of Rayleigh length near the focus of focused laser, and can process diamond into different microstructures. The thermal design of the diamond micro-groove heat sink has high requirements on the processing precision of the micro-groove structure, the section of the micro-groove structure is required to be rectangular, the taper of the side wall of the micro-structure is required to be as small as possible, and meanwhile, the depth-to-width ratio of the micro-groove is required to be high, and the depth-to-width ratio is required to be 7:1-9:1. The heat sink with the rectangular section micro-groove with large depth-to-width ratio has better heat dissipation effect. It is very difficult to process diamond micro-groove heat sink with large depth-to-width ratio, rectangular section and no taper on side wall or similar taper. The microstructure obtained by laser processing generally has large taper, and rectangular diamond micro grooves with large depth-to-width ratio are difficult to obtain. Meanwhile, laser processing of periodic array microstructures often causes errors in the shape and dimensions of the microstructures, and it is difficult to obtain high microstructure consistency. Therefore, the diamond micro-groove heat sink is processed by using a laser processing mode, and a great challenge is presented to a processing technology method.
The existing laser processing micro-groove technology has the problems that the section of the processed micro-groove has taper and the bottom roughness of the micro-groove is large, and is not suitable for processing the heat sink micro-groove with higher precision requirement, and in the currently disclosed technical scheme, no complete applicable scheme for processing the diamond micro-groove heat sink sample piece by the laser exists.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a method for processing a diamond micro-groove heat sink by ultraviolet nanosecond laser, which can solve the problems in the prior art.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: a method for processing a diamond micro-groove heat sink by ultraviolet nanosecond laser comprises the following steps:
step one: configuring an ultraviolet nanosecond laser processing system, preheating and debugging when the machine is started, and calibrating a laser focus;
step two: positioning the workpiece to enable the coordinate system of the workpiece to coincide with the origin of the laser scanning coordinate system;
step three: positioning the light beam, and immersing the Rayleigh length of the laser into the upper surface of the workpiece;
step four: configuring an online observation microscope, and monitoring the processing morphology in real time, wherein the online observation microscope is vertical to the side surface of a workpiece;
step five: processing and testing according to a minimum topological structure;
step six: regulating and controlling the processing of the minimum topological structure to finish the finish processing of the minimum topological structure;
step seven: placing a sample blank, configuring a paraxial for observation, processing the sample according to the same parameters of the minimum topological structure, and observing in real time.
The workpiece positioning step in the step two comprises the following steps:
a. fastening the positioning plate on a table top for placing a workpiece;
b. drawing a rectangle on the positioning plate body through the galvanometer drawing software;
c. setting laser parameters and scanning, and forming the rectangle on a positioning plate;
d. and (5) tightly attaching the workpiece to the left lower corner of the hollowed-out area on the positioning plate.
The laser parameter in the step c is frequency 50kHz and power 3.5W; the number of scans was 2.
The method for determining the Rayleigh length of the laser in the third step is to move the z-axis of the laser system downwards by a distance of half of the Rayleigh length.
The minimum topology structure processing test in the fifth step is specifically as follows:
the first step: scanning the profile;
and a second step of: scanning the interior region;
and a third step of: the profile and the depth of the interior region are measured.
Ultraviolet nanosecond laser is adopted, the wavelength is 355nm, the pulse width is 15ns, and the parameters of the laser are set as follows: the power is 10.5W, and the repetition frequency is 50kHz;
the scanning contour is scanned for 500 times clockwise and then scanned for 500 times anticlockwise, and the scanning speed is set to be 500mm/s;
the scanning device comprises a scanning inner area, a scanning line filling, a spacing of 0.001mm, a well-shaped filling, a scanning transverse line scanning from top to bottom, a vertical line scanning from left to right, a scanning transverse line scanning from bottom to top, a vertical line scanning from right to left.
The galvanometer controller is communicated with the laser electronic shutter, and the laser electronic shutter is closed when the laser scans the jump path, and no light is emitted when the laser jumps.
A horizontal observation microscope is configured, and a digital microscope with a 100-fold tele objective is used, wherein the objective of the microscope is perpendicular to the observed side of the workpiece.
During the processing test of the minimum topological structure, ultraviolet nanosecond laser is adopted, the wavelength is 355nm, the pulse width is 15ns, and the parameters of the laser are set as follows: power 10.5W, repetition frequency 50kHz, galvanometer motion parameters: the profile scanning speed and the jump rotational speed are set to 500mm/s, and the internal filling area scanning speed and the jump rotational speed are set to 300mm/s.
Arranging a paraxial observation microscope, obliquely observing a sample to be processed, calibrating the paraxial observation microscope by using the edge of the sample, drawing the outline and filling area of the sample, processing the minimum topological structure and the sample structure, and measuring the processing depth of the sample in real time until the processing of the sample reaches the design depth.
Compared with the prior art, the invention has at least the following beneficial effects: the method for processing the diamond micro-groove heat sink by utilizing the ultraviolet nanosecond laser provided by the invention utilizes online observation, respectively processing the outline and the inner area, and guiding and processing the outline, thereby overcoming the problems of large taper and low precision in the prior art for processing the diamond micro-groove, wherein the taper of the diamond micro-groove processed by adopting the method is controlled within +/-1.5 degrees, and the processing precision is +/-5 mu m.
Drawings
Fig. 1 is a schematic structural diagram of an ultraviolet nanosecond laser processing system in step one of the present invention.
FIG. 2 is a drawing of a hollowed-out area for positioning in the present invention.
Fig. 3 is a schematic view of the laser beam waist of the present invention just buried below the surface of the workpiece.
Fig. 4 is a schematic diagram of the profile scanning mode of the present invention.
FIG. 5 is a schematic diagram of the internal area scanning mode of the present invention.
FIG. 6 is a schematic illustration of sample profile and internal line fill scanning in accordance with the present invention.
In the drawings, a 1-reflecting mirror, a 2-vibrating mirror, a field mirror, a 3-triaxial servo motion axis, a 4-workbench, a 5-vibrating mirror controller, a 6-motion axis driver, a 7-industrial personal computer, an 8-ultraviolet nanosecond laser, a 9-display and a 10-water cooler are arranged.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "one side", "one end", "one side", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The invention provides a method for processing a diamond micro-groove heat sink by ultraviolet nanosecond laser, which comprises the following steps:
step one: configuring an ultraviolet nanosecond laser processing system, preheating and debugging when the machine is started, and calibrating a laser focus;
step two: positioning the workpiece, and enabling the coordinate system of the workpiece to coincide with the origin of the laser scanning coordinate system; specifically comprises the following steps of,
a. fastening the positioning plate on a table top for placing a workpiece;
b. drawing a rectangle on the positioning plate body through the galvanometer drawing software;
c. setting laser parameters and scanning, and forming the rectangle on a positioning plate;
d. the workpiece is tightly attached to the left lower corner of the hollowed-out area on the positioning plate, and reference is made to FIG. 2;
step three: positioning the light beam, and immersing the Rayleigh length of the laser into the upper surface of the workpiece; the method for determining the Rayleigh length of the specific laser comprises the steps of moving the z-axis of the laser system downwards by a distance of half of the Rayleigh length; referring to fig. 3;
step four: configuring an on-line observation microscope, wherein the axis of an objective lens of the on-line observation microscope is perpendicular to the side surface of a workpiece, and monitoring the processing morphology in real time, referring to fig. 4;
step five: processing and testing according to a minimum topological structure; the method comprises the following steps: the first step: scanning the profile; and a second step of: scanning the interior region; and a third step of: the machining depth of the profile and the inner area was measured, the scanning profile was scanned 500 times clockwise and 500 times counterclockwise, the scanning speed was set to 500mm/s, the scanning inner area was scanned at 300mm/s, the scanning lines were filled, the pitch was 0.001mm, the well was filled, the horizontal lines were scanned first, the vertical lines were scanned from top to bottom, the vertical lines were scanned from left to right, the horizontal lines were scanned again, the vertical lines were scanned from bottom to top, the vertical lines were scanned from right to left, refer to fig. 5 and 6.
Step six: regulating and controlling the processing of the minimum topological structure to finish the finish processing of the minimum topological structure;
step seven: placing a sample blank, configuring a paraxial for observation, processing the sample according to the same parameters of the minimum topological structure, and observing in real time.
Referring to fig. 1, the method for processing the diamond micro-groove heat sink by using the ultraviolet nanosecond laser provided by the invention comprises the following feasible steps when being implemented: an ultraviolet nanosecond laser processing system is configured. The reflector 1, the galvanometer and the field lens 2, the triaxial servo motion axis 3 and the ultraviolet nanosecond laser 8 are all arranged on the workbench 4, and a person skilled in the art can arrange the structure and the position according to the shape and the size of an actual part so as to achieve the purpose of processing the surface of a workpiece by laser; the water cooling machine 10, the industrial personal computer 7 and the motion shaft driver 6 for controlling the triaxial servo motion shaft 3 are all arranged below the workbench, and specifically, the water cooling machine 10, the industrial personal computer 7, the laser controller, the servo driver and the galvanometer controller 5 are started; wiping the outer sides of a light emergent window mirror, a reflecting mirror 1 and a field lens protecting mirror of the ultraviolet nanosecond laser 8 by using mirror wiping paper to remove dust in a light path; opening a servo control software end, opening laser control software, connecting a laser, opening a galvanometer drawing software, ultrasonically cleaning a diamond workpiece in deionized water for 10 minutes, removing surface impurities, at the moment, starting laser indicating light, and finally enabling the laser to sequentially pass through a reflector 1, a galvanometer and a field lens 2 and finally reach the surface of the workpiece to be processed on a servo motion platform. The galvanometer controller 5 is communicated with the laser electronic shutter, the laser electronic shutter is closed when the laser scans the jump path, no light is emitted during the jump, and the laser scanning of the complex path can not destroy the non-processing area swept by the jump path.
As an alternative embodiment, the invention adopts a rectangular white paper as a locating plate to locate the workpiece, and a piece of rectangular white paper with the size of 50mm multiplied by 40mm is stuck on a moving platform. The z-axis is moved to enable the laser focus to coincide with the upper surface of the motion platform. And opening the galvanometer drawing software to draw a rectangle, wherein the length is 14mm, and the width is 12mm. Setting laser parameters by adopting an ultraviolet nanosecond laser 8: the repetition frequency is 50kHz, and the power is 3.5W; setting vibrating mirror parameters: the scanning speed is 10mm/s, and the scanning is repeated for 2 times. Starting laser, scanning a rectangle, and placing the diamond with the diameter of 12mm multiplied by 8mm multiplied by 2mm close to a hollow square frame in the middle of the white paper. The motion axes x, y are each shifted by 10 μm in the positive direction to compensate for the kerf caused by the laser spot. The thickness of the diamond was measured using a micrometer, the reading was accurate to 1 μm, and the z-coordinate of the beam was moved upward, the moving distance being the thickness of the diamond. At this time, the far point of the laser coordinate system controlled by the galvanometer is just at the corner point of the upper surface of the workpiece, and the workpiece is positioned in the first quadrant. The positioning accuracy of the workpiece is about 10 μm. The positioning of the workpiece can ensure that the diamond heat sink micro-groove structure is positioned at the right center of the upper surface of the workpiece.
Positioning the light beam, adjusting the negative defocus, and processing by utilizing the Rayleigh length. Specifically, the z-axis of motion is shifted so that the rayleigh length with the highest laser energy is just buried below the upper surface of the workpiece. The focused large laser is converged firstly, the energy is highest when passing through a beam waist region, the light spot is minimum, the laser energy density is uniform in the region with the height of about 0.8mm in the center of the beam waist, the laser beam with the beam diameter of 6mm, the wavelength of 355nm and the effective focal length of 100mm is adopted, the Rayleigh length of about 0.8mm, and the Rayleigh length in the center of the beam waist of the laser beam can be just buried below the upper surface of a workpiece by adopting the negative defocus amount of-500 mu m. If other laser wavelengths or field lens focal lengths are used, the corresponding rayleigh lengths can also be calculated and half the rayleigh length is used as the negative defocus.
A horizontal observation microscope is configured, a digital microscope with a 100-time long-focus objective lens is selected, the microscope is horizontally placed, and the objective lens of the microscope is perpendicular to the observed side surface of the workpiece. The microscope is connected with a computer, the brightness of the light-supplementing LED lamp of the microscope is adjusted, and the position and the posture of the microscope are fully adjusted, so that the observed side surface of the workpiece is horizontally and clearly displayed on the display 9. The calibrated length was measured using microscope software. And simultaneously, measuring the length of the corresponding edge of the workpiece by using a micrometer. Inputting the actual length of the edge and the pixel number of the calibrated length into a calibration column of microscope software, and automatically calibrating the size of the microscope. Thereafter, the dimensions of the structure being machined of the workpiece can be measured at the software end of the microscope. The size of the workpiece processing can be measured in real time, which is helpful for on-line flexible process formulation.
The minimum topological structure processing test specifically adopts ultraviolet nanosecond laser and inherent parameters: wavelength 355nm, pulse width 15ns. The parameters of the laser are set as follows: the power is 10.5W and the repetition frequency is 50kHz. Setting vibrating mirror motion parameters: the scanning speed is 500mm/s, the jump speed is 500mm/s, and the minimum topological structure of the large-scale periodic array structure in the drawing of the microstructure is drawn in CAD software and used for test processing. The experimental processing is a key link of the method, and errors caused by inconsistent equipment, process, materials and experience can be found and solved in time. The material areas to be removed are filled with equidistant section lines. CAD is exported in dxf format, and dxf files are imported into ScanMaster software in actual proportion and broken up. The edges are replicated and rotated 180 ° around the center of symmetry, and the profile is scanned first clockwise and then counterclockwise. The inner filling area is reset to be scanned from top to bottom, then from left to right, then from bottom to top and then from right to left, so that the asymmetry of processing results caused by the asymmetry of scanning paths is avoided. The profile scanning speed and the jump rotational speed are set to 500mm/s, and the internal filling area scanning speed and the jump rotational speed are set to 300mm/s. The contours are scanned first and then the interior fill area is scanned. While measuring the contour machining depth and the internal machining depth on the screen. In combination with on-line observation, the depth of the profile and the removal of the interior region is measured in real time, maintaining the profile depth at least 50 μm greater than the interior line fill scan process depth. And stopping contour machining until the contour depth reaches 1000 mu m, and continuing scanning the filling area until the machining depth of the filling area reaches 1000 mu m.
Positioning a sample blank, arranging a paraxial for observation, and processing the sample. And in the first step and the second step, a hollowed rectangle is engraved on the rear of the test piece on the white paper by using laser, and a sample piece to be processed is placed in the left lower corner of the hollowed area to be aligned. Arranging a paraxial observation microscope, obliquely observing a sample to be processed, calibrating the paraxial observation microscope by using the edge of the sample, drawing the outline and the filling area of the sample, simultaneously processing the minimum topological structure and the sample structure by using the completely same scanning path and scanning parameters in the steps, measuring the processing depth of the sample in real time until the processing depth of the sample reaches 1000 mu m,
the invention utilizes on-line observation to process the outline and the inner area respectively, and the outline guiding process, overcomes the problems of bigger taper and low precision of the diamond micro-groove processed by the method in the prior art, the taper is controlled within +/-1.5 degrees, and the processing precision is +/-5 mu m.
The above examples are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Various modifications and improvements of the technical scheme of the present invention will fall within the protection scope of the present invention without departing from the design concept of the present invention, and the technical content of the present invention is fully described in the claims.

Claims (6)

1. A method for processing a diamond micro-groove heat sink by ultraviolet nanosecond laser is characterized by comprising the following steps of: the method comprises the following steps:
step one: configuring an ultraviolet nanosecond laser processing system, preheating and debugging when the machine is started, and calibrating a laser focus;
step two: positioning the workpiece to enable the coordinate system of the workpiece to coincide with the origin of the laser scanning coordinate system;
step three: positioning the light beam, and performing negative defocus so that the focal depth of the laser just drops into the upper surface of the workpiece; the method for determining the defocusing amount of the specific laser comprises the steps of moving the z-axis of the laser system downwards by a distance of one Rayleigh length;
step four: configuring an online observation microscope, and monitoring the processing morphology in real time, wherein the online observation microscope is vertical to the side surface of a workpiece;
step five: processing and testing according to a minimum topological structure;
step six: regulating and controlling the processing of the minimum topological structure to finish the finish processing of the minimum topological structure;
step seven: placing a sample blank, configuring a paraxial observation, processing the sample according to the same parameters of the minimum topological structure, and observing in real time; the minimum topology structure processing test in the fifth step is specifically as follows:
the first step: scanning the profile;
and a second step of: scanning the interior region;
and a third step of: measuring the machining depth of the profile and the interior region;
ultraviolet nanosecond laser is adopted, the wavelength is 355nm, the pulse width is 15ns, and the parameters of the laser are set as follows: the power is 10.5W, and the repetition frequency is 50kHz;
the scanning contour is scanned for 500 times clockwise and then scanned for 500 times anticlockwise, and the scanning speed is set to be 500mm/s;
the scanning device comprises a scanning inner area, a scanning line filling, a spacing of 0.001mm, a well-shaped filling, a scanning transverse line scanning from top to bottom, a vertical line scanning from left to right, a scanning transverse line scanning from bottom to top, a vertical line scanning from right to left.
2. The method for processing the diamond micro-groove heat sink by using the ultraviolet nanosecond laser as claimed in claim 1, wherein the method comprises the following steps: the workpiece positioning step in the step two comprises the following steps:
a. fastening the positioning plate on a table top for placing a workpiece;
b. drawing a rectangle on the positioning plate body through the galvanometer drawing software;
c. setting laser parameters and scanning, and forming the rectangle on a positioning plate;
d. and (5) tightly attaching the workpiece to the left lower corner of the hollowed-out area on the positioning plate.
3. The method for processing the diamond micro-groove heat sink by using the ultraviolet nanosecond laser as claimed in claim 2, wherein the method comprises the following steps: the laser parameter in the step c is frequency 50kHz and power 3.5W; the number of scans was 2.
4. The method for processing the diamond micro-groove heat sink by using the ultraviolet nanosecond laser as claimed in claim 1, wherein the method comprises the following steps: the galvanometer controller is communicated with the laser electronic shutter, and the laser electronic shutter is closed when the laser scans the jump path, and no light is emitted when the laser jumps.
5. The method for processing the diamond micro-groove heat sink by using the ultraviolet nanosecond laser as claimed in claim 1, wherein the method comprises the following steps: a horizontal observation microscope is configured, and a digital microscope with a 100-fold tele objective is used, wherein the objective of the microscope is perpendicular to the observed side of the workpiece.
6. The method for processing the diamond micro-groove heat sink by using the ultraviolet nanosecond laser as claimed in claim 1, wherein the method comprises the following steps: arranging a paraxial observation microscope, obliquely observing a sample to be processed, calibrating the paraxial observation microscope by using the edge of the sample, drawing the outline of the sample and a filling area, processing a minimum topological structure and a sample structure, measuring the processing depth of the sample in real time, and ensuring the processing depth of the outline to be greater than the depth of the filling area in the process until the processing of the sample reaches the design depth.
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