CN112917028A - Laser processing method for flat-bottom blind hole on surface of packaging substrate - Google Patents
Laser processing method for flat-bottom blind hole on surface of packaging substrate Download PDFInfo
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- CN112917028A CN112917028A CN202110135813.1A CN202110135813A CN112917028A CN 112917028 A CN112917028 A CN 112917028A CN 202110135813 A CN202110135813 A CN 202110135813A CN 112917028 A CN112917028 A CN 112917028A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- Laser Beam Processing (AREA)
Abstract
A laser processing method of a flat-bottom blind hole on the surface of a packaging substrate comprises the steps of firstly, building a laser processing system, then cleaning the packaging substrate, drying the packaging substrate, fixing the packaging substrate on a processing station of a movable processing platform, and adjusting the height of the movable processing platform to focus laser on the upper surface of the packaging substrate; then controlling the on-off of the short pulse laser through a computer, and setting laser processing parameters of the short pulse laser; then drawing a laser processing path through a computer, and setting path track parameters; then controlling a short pulse laser to output laser through a computer, and controlling the laser to process a blind hole on the packaging substrate along a set path by using a scanning galvanometer; after the blind holes are processed, taking down the packaging substrate, and carrying out ultrasonic cleaning to obtain a finished product of the packaging substrate; the invention utilizes the optimized laser processing path, the bottom of the processed blind hole is flat and smooth, the edge profile of the bottom is clear, the blind hole is clean and has no crack, the processing precision is high, and the processing efficiency is high.
Description
Technical Field
The invention belongs to the technical field of laser processing of packaging substrates, and particularly relates to a laser processing method of a flat-bottomed blind hole on the surface of a packaging substrate.
Background
The packaging substrate is a platform for realizing the functionalization and the modularization of components, is an important link of microelectronic packaging, is used for bearing electronic components and connecting circuits thereof, has good electrical insulation, has mechanical support and environmental protection effects on chips, and plays an important role in the thermal performance and the reliability of the components and circuits. With the rapid development of the fields of aerospace, information technology, military and the like, electronic devices are also developing towards multifunction, high integration, microminiaturization and intellectualization, and the requirements on the technical performance of the packaging substrate are higher and higher.
The package substrate is required to have excellent thermal conductivity, electrical resistivity, low dielectric constant and thermal expansion coefficient matching with the chip, sufficient rigidity and strength to support and protect the chip, and low cost as possible to meet the requirement of large-scale commercial application. The packaging substrate material can be divided into an organic substrate, an inorganic substrate and a composite substrate, wherein commonly used materials include alumina ceramics, aluminum nitride ceramics, epoxy resin, polyimide, aluminum alloy, diamond and the like. In order to maintain the inherent properties of chips and devices without causing deterioration of signal transmission performance, careful selection of substrate materials, careful design of wiring patterns, and completion of high-quality precision processing are required. The high-density interconnection and pin fixing of the package substrate are required to be realized by processing high-quality blind holes on the substrate.
At present, mature blind hole processing modes in many industrial applications are not suitable for packaging substrates, for example, the substrate is easy to break and the abrasion to a cutter is serious in the traditional mechanical processing mode; the processing modes of electric spark and electrochemistry can not be carried out on insulating materials, and the ultrasonic processing efficiency is low; the electron beam processing equipment is expensive and has harsh use conditions. The laser processing is a non-contact processing mode, has the characteristics of high efficiency, controllability, high processing precision and capability of processing materials with high hardness, high brittleness and high melting point, is easy to be fused with the technologies of robots, computers and the like, and realizes the large-scale processing of the packaging substrate.
When blind hole processing is performed on a packaging substrate by using laser, a laser scanning track is preset in a circular pattern in a concentric circle filling mode, and at the moment, a scanning galvanometer controls deflection of a reflecting mirror through a servo motor, so that the laser scans according to the preset pattern, and materials in the blind hole area are removed layer by layer. However, because the energy of the laser spot is gaussian distributed, and the laser beam is reflected when passing through the inclined plane of the inner side wall of the hole, energy loss is caused, the overall energy distribution of the laser in the blind hole area is uneven, the phenomenon of excessive central ablation occurs at the bottom of the blind hole, bullet-shaped pits with low centers and high edges are formed at the bottom of the blind hole, the base material is easy to penetrate, and the depth of the blind hole cannot meet the precision requirement.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a laser processing method of a flat-bottom blind hole on the surface of a packaging substrate, wherein the processed blind hole has the advantages of flat and smooth bottom, clear bottom edge profile, cleanness without cracks, high processing precision and high processing efficiency.
In order to achieve the purpose, the invention adopts the technical scheme that:
a laser processing method of a flat-bottom blind hole on the surface of a packaging substrate comprises the following steps:
1) a laser processing system is set up, the laser processing system comprises a short pulse laser 1, a laser beam output by the short pulse laser 1 is expanded by a beam expander 2, the expanded beam sequentially passes through an eyelet 3, a first reflector 4 and a second reflector 5 and enters a scanning galvanometer 6 and a focusing field lens 7, the focusing field lens 7 focuses the laser and then vertically irradiates a processing station of a mobile processing platform 8, and the short pulse laser 1, the scanning galvanometer 6, the mobile processing platform 8 and a computer 9 are connected;
2) placing the packaging substrate in an ultrasonic cleaning machine for cleaning, fixing the dried packaging substrate on a processing station of a movable processing platform 8, and adjusting the height of the movable processing platform 8 to focus laser on the upper surface of the packaging substrate;
3) controlling the on-off of the short pulse laser 1 through a computer 9, and setting laser processing parameters of the short pulse laser 1;
4) drawing a laser processing path through a computer 9, and setting path track parameters;
opening control software of the scanning galvanometer 6 on a computer 9, drawing a laser processing path diagram, setting a circular pattern according to a preprocessed blind hole, adopting a # -shaped filling track in the circular pattern, and setting a filling interval d, namely the interval between lines in the transverse and longitudinal directions in the circular pattern; the processing and scanning sequence of the laser is to process a circular pattern track first and then process a # -shaped filling track;
5) the computer 9 is used for controlling the short pulse laser 1 to output laser, and the scanning galvanometer 6 is used for controlling the laser to process blind holes on the packaging substrate along a set path;
6) and after the blind holes are processed, taking down the packaging substrate, and respectively carrying out ultrasonic cleaning for 20 minutes by using acetone and absolute ethyl alcohol in sequence to obtain a processed finished product of the packaging substrate.
The short pulse laser 1 in the step 1) is a nanosecond laser, a picosecond laser or a femtosecond laser with the pulse width less than or equal to 15 ns.
The packaging substrate material in the step 2) is an epoxy resin material, a metal material, a ceramic material, a silicon substrate, diamond or a functional composite material.
The step 4) of drawing the laser processing path specifically comprises the following steps: the laser reaches the circular pattern scanning initial point A from the coordinate origin O through the jumping track firstly, and starts to scan the circular pattern track secondly, the scanning times are N1Secondly, after the scanning is finished, the laser reaches the scanning starting point B of the cross-shaped filling track inside the circular pattern from the point A through the jumping track c1Preparing to start the processing of the filling track shaped like a Chinese character 'jing'; firstly scanning transverse lines by laser, and jumping among lines follows the principle of shortest path, i.e. scanning and jumping in S shape, and then scanning and jumping in B shape1Point start to B2Finishing the point; then from B2Point jumps to C1Point starts scanning longitudinal line, still scans and jumps in S-shape to C2Completing one scanning cycle; at this time, the laser returns to B through a jump track1The point continues to perform the second scanning, and the scanning process of the filling track in the shape of the Chinese character 'jing' is repeated until the scanning times are N2Then completing the processing of the filling track in the shape of Chinese character 'jing', laserFrom C2And (5) directly jumping the point to the original point O, and finishing scanning.
The radius of the circular pattern track is R, the radius of the blind hole is R, the radius of the focusing light spot is omega, the radius of the circular pattern track is equal to the radius of the blind hole minus the radius of the focusing light spot, and R is R-omega.
The distance between filling lines of the inside # -shaped filling tracks of the circular pattern is d, the distance between the filling lines is equal to the radius of a focusing light spot, namely d is omega, and the overlapping rate of the light spots perpendicular to the scanning direction during laser scanning is 50%.
The path track parameters in the step 4) comprise laser scanning speed, laser jumping speed and laser scanning times, the laser scanning times are determined according to the blind hole depth, and the scanning times N of the circular pattern track1Number of scanning times N for filling track in a shape of Chinese character' jing2Half of (i.e. N)1＝1/2N2So as to ensure that the material at the bottom of the blind hole is uniformly removed.
Compared with the prior art, the invention has the following advantages:
the invention utilizes the optimized laser processing path, effectively solves the problem that the laser energy is not uniformly distributed in the bottom area of the blind hole in the conventional processing, and the processed blind hole has the advantages of flat and smooth bottom, no bullet-shaped pits with low center and high edges, and easy regulation and control of the depth of the blind hole. The invention adopts short pulse laser to process holes on the packaging substrate, and greatly improves the processing quality and the processing precision compared with long pulse laser such as millisecond laser.
Drawings
FIG. 1 is a schematic view of a laser processing system of the present invention.
FIG. 2 is a schematic diagram of a laser processing path of a flat-bottomed blind hole on a surface of a package substrate according to the present invention.
In fig. 3, (a) is a side cross-sectional profile of a blind hole processed by using a filling track in a shape like a Chinese character 'jing' in example 1, and (b) is a side cross-sectional profile of a blind hole processed by using a filling track in a concentric circle in a comparative example.
FIG. 4 is a schematic illustration of concentric circular fill traces used with blind vias of a comparative example.
FIG. 5 is a side sectional profile of a blind hole machined in example 2.
FIG. 6 is a side sectional profile of a blind hole machined in example 3.
FIG. 7 is a side sectional view of a blind hole machined in example 4.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
1) a laser processing system is set up, and as shown in fig. 1, the laser processing system comprises a short pulse laser 1, a beam expander 2, an aperture diaphragm 3, a first reflector 4, a second reflector 5, a scanning galvanometer 6, a focusing field lens 7, a mobile processing platform 8 and a computer 9; the short pulse laser 1 is a nanosecond laser, a laser beam output by the short pulse laser 1 is expanded by the beam expander 2, and the numerical aperture is increased so as to reduce the size of a focused laser spot; expanded beam light sequentially passes through the small-hole diaphragm 3, the first reflecting mirror 4 and the second reflecting mirror 5 to enter the scanning galvanometer 6 and the focusing field lens 7, laser is focused by the focusing field lens 7 and then vertically irradiates a processing station of the mobile processing platform 8, and the short pulse laser 1, the scanning galvanometer 6, the mobile processing platform 8 and the computer 9 are connected; the aperture diaphragm 3 is used for filtering out diffraction apertures at the edges of light spots and improving the quality of the light spots; the scanning galvanometer 6 is internally provided with a pair of deflection lenses, and the deflection lenses are controlled by a servo motor to deflect so as to finish high-speed accurate control on laser beams and realize scanning processing of two-dimensional patterns; the computer 9 controls the whole laser processing process;
2) ultrasonically cleaning an aluminum oxide ceramic packaging substrate with the thickness of 0.38mm and the mass fraction of 96% for 30 minutes by using an organic solvent, removing substances such as grease, dust and the like on the surface, and drying by using compressed air after cleaning; fixing the dried packaging substrate on a processing station of a movable processing platform 8, searching the focal plane position of laser by using a layer-by-layer scribing method, wherein the laser power during scribing is set to be 0.05W, the repetition frequency is 50kHz, the laser scanning speed is 0.3mm/s, and the scanning frequency is 1 time; adjusting the height of the mobile processing platform 8 until a focusing spot irradiates on the upper surface of the packaging substrate to show a macroscopic minimum spot, opening the short pulse laser 1, controlling the mobile processing platform 8 to respectively move 10 times along the positive and negative directions of a Z axis in a step length of 100 microns, respectively scribing different positions on the upper surface of the packaging substrate in different focal planes, selecting a line with the thinnest width on the packaging substrate after scribing is finished, wherein the corresponding processing height is the position of the laser focusing on the upper surface of the packaging substrate, and the diameter of the focusing spot irradiated on the upper surface of the packaging substrate by the focusing field lens 7 is 20 microns;
3) controlling the on-off of the short pulse laser 1 through a computer 9, and setting laser processing parameters of the short pulse laser 1, wherein the laser wavelength is 355nm, the pulse width is 11ns, the single pulse energy is 120 muJ, the repetition frequency is 50kHz, and the laser power is 6W;
4) drawing a laser processing path through a computer 9, and setting path track parameters;
opening a control software ScanMaster Designer of a scanning galvanometer 6 on a computer 9, drawing a laser processing path diagram as shown in (a) in FIG. 2, preprocessing a blind hole with the diameter of 200 mu m and the depth of 100 mu m, setting the radius r of a circular pattern to be 90 mu m, adopting a # -shaped filling track in the circular pattern, and setting the filling interval d to be 10 mu m, namely setting the intervals between lines in the horizontal and vertical directions in the circular pattern to be 10 mu m; the processing scanning sequence of the laser is to process the circular pattern track firstly, as shown in (b) of fig. 2, and then process the # -shaped filling track, as shown in (c) of fig. 2;
the method specifically comprises the following steps: the laser reaches the circular pattern scanning initial point A from the coordinate origin O through the jumping track firstly, and starts to scan the circular pattern track secondly, the scanning times are N1Secondly, after the scanning is finished, the laser reaches the scanning starting point B of the cross-shaped filling track inside the circular pattern from the point A through the jumping track c1Preparing to start the processing of the filling track shaped like a Chinese character 'jing'; firstly scanning transverse lines by laser, and jumping among lines follows the principle of shortest path, i.e. scanning and jumping in S shape, and then scanning and jumping in B shape1Point start to B2Finishing the point; then from B2Point jumps to C1Point starts scanning longitudinal line, still scans and jumps in S-shape to C2Completing one scanning cycle; at this time, the laser returns to B through a jump track1The point continues the second round of scanning, and the above well is repeatedScanning process of font filling track until scanning times are N2Then completing the processing of the filling track in the shape of Chinese character 'jing', the laser is driven from C2The point directly jumps back to the original point O, and the scanning is finished; setting the laser scanning speed to 300mm/s, the laser jumping speed to 4000mm/s and the scanning times N of the circular pattern track110 times of well-shaped filling track scanning times N2Is 20 times;
5) the computer 9 is used for controlling the short pulse laser 1 to output laser, and the scanning galvanometer 6 is used for controlling the laser to process blind holes on the packaging substrate along a set path;
6) and after the blind holes are processed, taking down the packaging substrate, and respectively carrying out ultrasonic cleaning for 20 minutes by using acetone and absolute ethyl alcohol in sequence to obtain a processed finished product of the packaging substrate.
The effect of this embodiment: the shape of the micropores was observed by a scanning electron microscope, and referring to (a) in fig. 3, blind holes with an entrance aperture of 196 μm and a depth of 97 μm were obtained with a machining precision of ± 4 μm, the bottoms of the blind holes were smooth, and the entrance edge and the sidewall were free of edge chipping and slag adhering.
Comparative example: the inner part of the circular pattern in the step 4) adopts a conventional concentric circle filling track, as shown in fig. 4, the filling distance d is set to be 10 μm, other steps are the same as the embodiment 1, the side cross section of the processed blind hole is as shown in (b) in fig. 3, the diameter of the inlet of the blind hole is 174 μm, the depth is 70.3 μm, and the actual processing precision is +/-30 μm. Bullet-shaped pits with low centers and high edges appear at the bottoms of the blind holes, the bottoms of the side sections present sawtooth profiles, the side walls have obvious slag residues and laminated concentric circle scanning traces, the hole walls of partial areas fall off, and the overall processing quality is poor.
Through comparison, the bottom appearance of the blind hole can be effectively optimized by adopting the # -shaped filling track, the problems of low center and high edge of the bottom of the blind hole in conventional processing are solved, and the profile quality of the blind hole side profile is improved.
Example 2: the blind holes with the inlet diameter of 200 μm and the depth of 150 μm are preprocessed, the number of times of scanning the circular pattern track in the step 4) is set to be 15, the number of times of scanning the filling track in the shape of a Chinese character jing is 30, other steps are the same as the step 1, the profile of the processed blind hole is shown in figure 5, the diameter of the inlet of the blind hole is 202 μm, the depth is 148 μm, and the processing precision is +/-2 μm.
Example 3: preprocessing a blind hole with the inlet diameter of 500 mu m and the depth of 50 mu m, setting the radius of the circular pattern in the step 4) to be 240 mu m, setting the track scanning times of the circular pattern to be 5 times, setting the track scanning times of the # -shaped filling track to be 10 times, and the other steps are the same as the step 1, wherein the profile of the processed blind hole is shown in figure 6, the inlet diameter of the blind hole is 502 mu m, the depth of the blind hole is 51.6 mu m, and the processing precision is +/-2 mu m.
Example 4: and (3) preprocessing a blind hole with the inlet diameter of 500 microns and the depth of 250 microns, setting the radius of the circular pattern in the step 4) to be 240 microns, setting the track scanning times of the circular pattern to be 24 times, setting the track scanning times of the # -shaped filling track to be 48 times, and the other steps are the same as the step 1, wherein the side cross section of the processed blind hole is as shown in FIG. 7, and the inlet diameter of the blind hole is 500 microns and the depth of the blind hole is 50 microns.
Claims (8)
1. A laser processing method of a flat-bottom blind hole on the surface of a packaging substrate is characterized by comprising the following steps:
1) the laser processing method comprises the steps of setting up a laser processing system, wherein the laser processing system comprises a short pulse laser (1), a laser beam output by the short pulse laser (1) is expanded by a beam expander (2), the expanded beam sequentially passes through a small hole diaphragm (3), a first reflector (4) and a second reflector (5) to enter a scanning galvanometer (6) and a focusing field lens (7), the focusing field lens (7) focuses the laser and then vertically irradiates a processing station of a mobile processing platform (8), and the short pulse laser (1), the scanning galvanometer (6), the mobile processing platform (8) and a computer (9) are connected;
2) the packaging substrate is placed in an ultrasonic cleaning machine for cleaning, the dried packaging substrate is fixed on a processing station of a movable processing platform (8), and the height of the movable processing platform (8) is adjusted to focus laser on the upper surface of the packaging substrate;
3) controlling the on-off of the short pulse laser (1) through a computer (9), and setting laser processing parameters of the short pulse laser (1);
4) drawing a laser processing path through a computer (9), and setting path track parameters;
opening control software of a scanning galvanometer (6) on a computer (9), drawing a laser processing path diagram, setting a circular pattern according to a preprocessed blind hole, adopting a # -shaped filling track in the circular pattern, and setting a filling interval d, namely the interval between lines in the horizontal and vertical directions in the circular pattern; the processing and scanning sequence of the laser is to process a circular pattern track first and then process a # -shaped filling track;
5) the computer (9) is used for controlling the short pulse laser (1) to output laser, and the scanning galvanometer (6) is used for controlling the laser to process blind holes on the packaging substrate along a set path;
6) and after the blind holes are processed, taking down the packaging substrate, and respectively carrying out ultrasonic cleaning for 20 minutes by using acetone and absolute ethyl alcohol in sequence to obtain a processed finished product of the packaging substrate.
2. The laser processing method of the flat-bottomed blind hole on the surface of the package substrate according to claim 1, wherein: the short pulse laser (1) in the step 1) is a nanosecond laser, a picosecond laser or a femtosecond laser with the pulse width less than or equal to 15 ns.
3. The laser processing method of the flat-bottomed blind hole on the surface of the package substrate according to claim 1, wherein: the packaging substrate material in the step 2) is an epoxy resin material, a metal material, a ceramic material, a silicon substrate, diamond or a functional composite material.
4. The laser processing method of a flat-bottomed blind hole on a surface of a package substrate according to claim 1, wherein the step 4) of drawing a laser processing path specifically comprises: the laser reaches the circular pattern scanning initial point A from the coordinate origin O through the jumping track firstly, and starts to scan the circular pattern track secondly, the scanning times are N1Secondly, after the scanning is finished, the laser reaches the scanning starting point B of the cross-shaped filling track inside the circular pattern from the point A through the jumping track c1Preparing to start the processing of the filling track shaped like a Chinese character 'jing'; firstly scanning transverse lines by laser, and jumping among lines follows the principle of shortest path, namely SType scans and jumps, from B1Point start to B2Finishing the point; then from B2Point jumps to C1Point starts scanning longitudinal line, still scans and jumps in S-shape to C2Completing one scanning cycle; at this time, the laser returns to B through a jump track1The point continues to perform the second scanning, and the scanning process of the filling track in the shape of the Chinese character 'jing' is repeated until the scanning times are N2Then completing the processing of the filling track in the shape of Chinese character 'jing', the laser is driven from C2And (5) directly jumping the point to the original point O, and finishing scanning.
5. The laser processing method of the flat-bottomed blind hole on the surface of the package substrate according to claim 4, wherein: the radius of the circular pattern track is R, the radius of the blind hole is R, the radius of the focusing light spot is omega, the radius of the circular pattern track is equal to the radius of the blind hole minus the radius of the focusing light spot, and R is R-omega.
6. The laser processing method of the flat-bottomed blind hole on the surface of the package substrate according to claim 5, wherein: the distance between filling lines of the inside # -shaped filling tracks of the circular pattern is d, the distance between the filling lines is equal to the radius of a focusing light spot, namely d is omega, and the overlapping rate of the light spots perpendicular to the scanning direction during laser scanning is 50%.
7. The laser processing method of the flat-bottomed blind hole on the surface of the package substrate according to claim 5, wherein: the path track parameters in the step 4) comprise laser scanning speed, laser jumping speed and laser scanning times, the laser scanning times are determined according to the blind hole depth, and the scanning times N of the circular pattern track1Number of scanning times N for filling track in a shape of Chinese character' jing2Half of (i.e. N)1＝1/2N2So as to ensure that the material at the bottom of the blind hole is uniformly removed.
8. A laser processing method of a flat-bottom blind hole on the surface of a packaging substrate is characterized by comprising the following steps: the method comprises the following steps:
1) a laser processing system is set up, and comprises a short pulse laser (1), a beam expander (2), an aperture diaphragm (3), a first reflector (4), a second reflector (5), a scanning galvanometer (6), a focusing field lens (7), a mobile processing platform (8) and a computer (9); the short pulse laser (1) is a nanosecond laser, a laser beam output by the short pulse laser (1) is expanded by the beam expander (2), and the numerical aperture is increased so as to reduce the size of a focused laser spot; expanded beam light sequentially passes through the small-hole diaphragm (3), the first reflecting mirror (4) and the second reflecting mirror (5) to enter the scanning galvanometer (6) and the focusing field lens (7), the focusing field lens (7) focuses laser and then vertically irradiates a processing station of the mobile processing platform (8), and the short-pulse laser (1), the scanning galvanometer (6) and the mobile processing platform (8) are connected with the computer (9); the aperture diaphragm (3) is used for filtering out diffraction apertures at the edges of light spots, the scanning galvanometer (6) is internally provided with a pair of deflection lenses, and the deflection lenses are controlled by a servo motor to deflect so as to finish high-speed accurate control on laser beams and realize scanning processing of two-dimensional patterns; the computer (9) controls the whole laser processing process;
2) ultrasonically cleaning an aluminum oxide ceramic packaging substrate with the thickness of 0.38mm and the mass fraction of 96% for 30 minutes by using an organic solvent, removing grease and dust substances on the surface, and drying by using compressed air after cleaning; fixing the dried packaging substrate on a processing station of a movable processing platform (8), and searching the focal plane position of laser by using a layer-by-layer scribing method, wherein the laser power during scribing is set to be 0.05W, the repetition frequency is 50kHz, the laser scanning speed is 0.3mm/s, and the scanning frequency is 1 time; adjusting the height of a movable processing platform (8) until a focusing spot irradiates on the upper surface of a packaging substrate to present a macroscopic minimum spot, opening a short pulse laser (1), controlling the movable processing platform (8) to move 10 times along the positive and negative directions of a Z axis in a step length of 100 micrometers, respectively scribing different positions of the upper surface of the packaging substrate in different focal planes, selecting a line with the thinnest width on the packaging substrate after scribing is finished, wherein the corresponding processing height is the position of focusing the laser on the upper surface of the packaging substrate, and the diameter of the focusing spot irradiated on the upper surface of the packaging substrate by a focusing field lens (7) is 20 micrometers;
3) controlling the on-off of the short pulse laser 1 through a computer (9), and setting laser processing parameters of the short pulse laser (1), wherein the laser wavelength is 355nm, the pulse width is 11ns, the single pulse energy is 120 muJ, the repetition frequency is 50kHz, and the laser power is 6W;
4) drawing a laser processing path through a computer (9), and setting path track parameters;
opening a control software ScanMasterDesigner of a scanning galvanometer (6) on a computer (9), drawing a laser processing path diagram, preprocessing a blind hole with the diameter of 200 mu m and the depth of 100 mu m, setting the radius r of a circular pattern to be 90 mu m, adopting a # -shaped filling track in the circular pattern, setting the filling interval d to be 10 mu m, namely setting the intervals between lines in the horizontal and vertical directions in the circular pattern to be 10 mu m; the processing and scanning sequence of the laser is to process a circular pattern track first and then process a # -shaped filling track;
the method specifically comprises the following steps: the laser reaches the circular pattern scanning initial point A from the coordinate origin O through the jumping track firstly, and starts to scan the circular pattern track secondly, the scanning times are N1Secondly, after the scanning is finished, the laser reaches the scanning starting point B of the cross-shaped filling track inside the circular pattern from the point A through the jumping track c1Preparing to start the processing of the filling track shaped like a Chinese character 'jing'; firstly scanning transverse lines by laser, and jumping among lines follows the principle of shortest path, i.e. scanning and jumping in S shape, and then scanning and jumping in B shape1Point start to B2Finishing the point; then from B2Point jumps to C1Point starts scanning longitudinal line, still scans and jumps in S-shape to C2Completing one scanning cycle; at this time, the laser returns to B through a jump track1The point continues to perform the second scanning, and the scanning process of the filling track in the shape of the Chinese character 'jing' is repeated until the scanning times are N2Then completing the processing of the filling track in the shape of Chinese character 'jing', the laser is driven from C2The point directly jumps back to the original point O, and the scanning is finished; setting the laser scanning speed to 300mm/s, the laser jumping speed to 4000mm/s and the scanning times N of the circular pattern track110 times of well-shaped filling track scanning times N2Is 20 times;
5) the computer (9) is used for controlling the short pulse laser (1) to output laser, and the scanning galvanometer (6) is used for controlling the laser to process blind holes on the packaging substrate along a set path;
6) and after the blind holes are processed, taking down the packaging substrate, and respectively carrying out ultrasonic cleaning for 20 minutes by using acetone and absolute ethyl alcohol in sequence to obtain a processed finished product of the packaging substrate.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113478068A (en) * | 2021-06-16 | 2021-10-08 | 西安理工大学 | Real-time detection method for thermal deformation of laser processing thin-wall part |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
| CN113798665A (en) * | 2021-09-17 | 2021-12-17 | 中国科学院上海光学精密机械研究所 | Laser processing method of round pits on metal surface |
| CN114260563A (en) * | 2021-12-30 | 2022-04-01 | 江苏大学 | Path-limited nanosecond laser scanning impact forming method for surface of discrete curved surface microstructure array |
| CN114260559A (en) * | 2021-12-22 | 2022-04-01 | 江苏大学 | Nanosecond laser scanning induction preparation method of random micropore surface |
| CN114523196A (en) * | 2022-04-22 | 2022-05-24 | 武汉铱科赛科技有限公司 | Blind hole drilling method, equipment, device and system with selective laser absorption |
| CN114633030A (en) * | 2022-02-24 | 2022-06-17 | 江门金鸿桦烨电子科技有限公司 | Lens processing method |
| CN114888430A (en) * | 2022-06-29 | 2022-08-12 | 中国航发动力股份有限公司 | Method and system for processing blade temperature measurement blind hole |
| CN116974243A (en) * | 2023-09-21 | 2023-10-31 | 北京金橙子科技股份有限公司 | Control method and control system for laser processing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010489A (en) * | 2006-06-27 | 2008-01-17 | Disco Abrasive Syst Ltd | Method of processing via hole |
| CN103212858A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Method for processing FPC (flexible printed circuit) blind hole |
| CN105598593A (en) * | 2016-02-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing system and method used for hard and brittle material drilling |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN109014615A (en) * | 2018-09-29 | 2018-12-18 | 英诺激光科技股份有限公司 | A kind of short pulse duration laser cutting device and its cutting method |
| CN111940930A (en) * | 2020-08-05 | 2020-11-17 | 大族激光科技产业集团股份有限公司 | Micropore laser processing method and equipment |
-
2021
- 2021-02-01 CN CN202110135813.1A patent/CN112917028A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010489A (en) * | 2006-06-27 | 2008-01-17 | Disco Abrasive Syst Ltd | Method of processing via hole |
| CN103212858A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Method for processing FPC (flexible printed circuit) blind hole |
| CN105598593A (en) * | 2016-02-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing system and method used for hard and brittle material drilling |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN109014615A (en) * | 2018-09-29 | 2018-12-18 | 英诺激光科技股份有限公司 | A kind of short pulse duration laser cutting device and its cutting method |
| CN111940930A (en) * | 2020-08-05 | 2020-11-17 | 大族激光科技产业集团股份有限公司 | Micropore laser processing method and equipment |
Non-Patent Citations (1)
| Title |
|---|
| 曹万里: "短脉冲激光加工碳纤维复合材料盲孔工艺研究", 《中国优秀博硕士学位论文全文数据库(硕士) 工程科技Ⅰ辑》 * |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113478068A (en) * | 2021-06-16 | 2021-10-08 | 西安理工大学 | Real-time detection method for thermal deformation of laser processing thin-wall part |
| CN113798665A (en) * | 2021-09-17 | 2021-12-17 | 中国科学院上海光学精密机械研究所 | Laser processing method of round pits on metal surface |
| CN113798665B (en) * | 2021-09-17 | 2024-04-12 | 中国科学院上海光学精密机械研究所 | Laser processing method for round pits on metal surface |
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| CN114260559A (en) * | 2021-12-22 | 2022-04-01 | 江苏大学 | Nanosecond laser scanning induction preparation method of random micropore surface |
| CN114260563A (en) * | 2021-12-30 | 2022-04-01 | 江苏大学 | Path-limited nanosecond laser scanning impact forming method for surface of discrete curved surface microstructure array |
| CN114633030A (en) * | 2022-02-24 | 2022-06-17 | 江门金鸿桦烨电子科技有限公司 | Lens processing method |
| CN114633030B (en) * | 2022-02-24 | 2024-03-26 | 江门金鸿桦烨电子科技有限公司 | Lens processing method |
| CN114523196B (en) * | 2022-04-22 | 2022-07-15 | 武汉铱科赛科技有限公司 | Blind hole drilling method, equipment, device and system with selective laser absorption |
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| CN114888430A (en) * | 2022-06-29 | 2022-08-12 | 中国航发动力股份有限公司 | Method and system for processing blade temperature measurement blind hole |
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| CN116974243B (en) * | 2023-09-21 | 2023-11-28 | 北京金橙子科技股份有限公司 | Control method and control system for laser processing |
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