CN114747003A - 冷却装置和半导体模块 - Google Patents

冷却装置和半导体模块 Download PDF

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Publication number
CN114747003A
CN114747003A CN202180006651.XA CN202180006651A CN114747003A CN 114747003 A CN114747003 A CN 114747003A CN 202180006651 A CN202180006651 A CN 202180006651A CN 114747003 A CN114747003 A CN 114747003A
Authority
CN
China
Prior art keywords
cooling device
top plate
bottom plate
cooling
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180006651.XA
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English (en)
Chinese (zh)
Inventor
玉井雄大
小山贵裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN114747003A publication Critical patent/CN114747003A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202180006651.XA 2020-06-17 2021-04-22 冷却装置和半导体模块 Pending CN114747003A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-104802 2020-06-17
JP2020104802 2020-06-17
PCT/JP2021/016327 WO2021256083A1 (ja) 2020-06-17 2021-04-22 冷却装置および半導体モジュール

Publications (1)

Publication Number Publication Date
CN114747003A true CN114747003A (zh) 2022-07-12

Family

ID=79267744

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180006651.XA Pending CN114747003A (zh) 2020-06-17 2021-04-22 冷却装置和半导体模块

Country Status (4)

Country Link
US (1) US12424507B2 (https=)
JP (1) JP7424489B2 (https=)
CN (1) CN114747003A (https=)
WO (1) WO2021256083A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7577948B2 (ja) * 2020-09-15 2024-11-06 富士電機株式会社 冷却器及び半導体装置
DE102022209698A1 (de) 2022-09-15 2024-03-21 Robert Bosch Gesellschaft mit beschränkter Haftung Fluiddurchströmbarer Kühler zum Kühlen eines Leistungsmoduls
KR102844401B1 (ko) * 2023-08-01 2025-08-08 아이엠에이치(주) 방열 장치 일체형 반도체용 방열기판의 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1158001A (ja) * 1997-08-07 1999-03-02 Hitachi Zosen Corp 両面開先溶接方法
JP2007085793A (ja) * 2005-09-20 2007-04-05 Toshiba Corp ジェットポンプ
US20140054023A1 (en) * 2011-03-03 2014-02-27 Showa Denko K.K. Forging method
JP2018049861A (ja) * 2016-09-20 2018-03-29 富士電機株式会社 半導体装置及び半導体装置の製造方法
CN109844441A (zh) * 2016-10-14 2019-06-04 达纳加拿大公司 具有带有保持夹的旁通密封件的换热器
JP2019186237A (ja) * 2018-04-02 2019-10-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
CN110534486A (zh) * 2018-05-25 2019-12-03 富士电机株式会社 冷却装置、半导体模块、车辆以及制造方法
JP2020092250A (ja) * 2018-11-22 2020-06-11 富士電機株式会社 半導体モジュール、車両および製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114571A (ja) 2004-10-12 2006-04-27 Hitachi Ltd 半導体装置およびこれを実装した電子機器
JP4797077B2 (ja) * 2009-02-18 2011-10-19 株式会社日立製作所 半導体パワーモジュール、電力変換装置、および、半導体パワーモジュールの製造方法
JP5542627B2 (ja) 2010-11-11 2014-07-09 新電元工業株式会社 接続板、接合構造及び半導体装置
JP5724710B2 (ja) * 2011-07-21 2015-05-27 三菱電機株式会社 プレート積層型冷却器
JP2014011447A (ja) * 2012-06-29 2014-01-20 Nakamura Mfg Co Ltd 発熱体冷却装置
JP6186146B2 (ja) 2013-03-15 2017-08-23 株式会社Uacj 熱交換器
US9633967B2 (en) 2013-10-21 2017-04-25 Nsk Ltd. Semiconductor module
WO2016203884A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
FR3080174B1 (fr) * 2018-01-29 2020-05-29 Valeo Systemes Thermiques Plaque pour echangeur de chaleur
JP7067129B2 (ja) * 2018-03-06 2022-05-16 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7033470B2 (ja) * 2018-03-08 2022-03-10 昭和電工株式会社 ヒートシンクの製造方法
JP7205071B2 (ja) * 2018-04-02 2023-01-17 富士電機株式会社 冷却装置、半導体モジュールおよび車両
WO2020003757A1 (ja) * 2018-06-27 2020-01-02 富士電機株式会社 冷却装置、半導体モジュールおよび車両

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1158001A (ja) * 1997-08-07 1999-03-02 Hitachi Zosen Corp 両面開先溶接方法
JP2007085793A (ja) * 2005-09-20 2007-04-05 Toshiba Corp ジェットポンプ
US20140054023A1 (en) * 2011-03-03 2014-02-27 Showa Denko K.K. Forging method
JP2018049861A (ja) * 2016-09-20 2018-03-29 富士電機株式会社 半導体装置及び半導体装置の製造方法
CN109844441A (zh) * 2016-10-14 2019-06-04 达纳加拿大公司 具有带有保持夹的旁通密封件的换热器
JP2019186237A (ja) * 2018-04-02 2019-10-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
CN110534486A (zh) * 2018-05-25 2019-12-03 富士电机株式会社 冷却装置、半导体模块、车辆以及制造方法
JP2020092250A (ja) * 2018-11-22 2020-06-11 富士電機株式会社 半導体モジュール、車両および製造方法

Also Published As

Publication number Publication date
US12424507B2 (en) 2025-09-23
US20220278014A1 (en) 2022-09-01
JPWO2021256083A1 (https=) 2021-12-23
WO2021256083A1 (ja) 2021-12-23
JP7424489B2 (ja) 2024-01-30

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