JPWO2021256083A1 - - Google Patents

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Publication number
JPWO2021256083A1
JPWO2021256083A1 JP2022532347A JP2022532347A JPWO2021256083A1 JP WO2021256083 A1 JPWO2021256083 A1 JP WO2021256083A1 JP 2022532347 A JP2022532347 A JP 2022532347A JP 2022532347 A JP2022532347 A JP 2022532347A JP WO2021256083 A1 JPWO2021256083 A1 JP WO2021256083A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022532347A
Other languages
Japanese (ja)
Other versions
JPWO2021256083A5 (https=
JP7424489B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021256083A1 publication Critical patent/JPWO2021256083A1/ja
Publication of JPWO2021256083A5 publication Critical patent/JPWO2021256083A5/ja
Application granted granted Critical
Publication of JP7424489B2 publication Critical patent/JP7424489B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2022532347A 2020-06-17 2021-04-22 冷却装置および半導体モジュール Active JP7424489B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104802 2020-06-17
JP2020104802 2020-06-17
PCT/JP2021/016327 WO2021256083A1 (ja) 2020-06-17 2021-04-22 冷却装置および半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2021256083A1 true JPWO2021256083A1 (https=) 2021-12-23
JPWO2021256083A5 JPWO2021256083A5 (https=) 2022-08-01
JP7424489B2 JP7424489B2 (ja) 2024-01-30

Family

ID=79267744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022532347A Active JP7424489B2 (ja) 2020-06-17 2021-04-22 冷却装置および半導体モジュール

Country Status (4)

Country Link
US (1) US12424507B2 (https=)
JP (1) JP7424489B2 (https=)
CN (1) CN114747003A (https=)
WO (1) WO2021256083A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7577948B2 (ja) * 2020-09-15 2024-11-06 富士電機株式会社 冷却器及び半導体装置
DE102022209698A1 (de) 2022-09-15 2024-03-21 Robert Bosch Gesellschaft mit beschränkter Haftung Fluiddurchströmbarer Kühler zum Kühlen eines Leistungsmoduls
KR102844401B1 (ko) * 2023-08-01 2025-08-08 아이엠에이치(주) 방열 장치 일체형 반도체용 방열기판의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013024483A (ja) * 2011-07-21 2013-02-04 Mitsubishi Electric Corp プレート積層型冷却器
JP2016120526A (ja) * 2011-03-03 2016-07-07 昭和電工株式会社 鍛造加工方法
JP2018049861A (ja) * 2016-09-20 2018-03-29 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2019160852A (ja) * 2018-03-08 2019-09-19 昭和電工株式会社 ヒートシンクの製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1158001A (ja) * 1997-08-07 1999-03-02 Hitachi Zosen Corp 両面開先溶接方法
JP2006114571A (ja) 2004-10-12 2006-04-27 Hitachi Ltd 半導体装置およびこれを実装した電子機器
JP4799098B2 (ja) * 2005-09-20 2011-10-19 株式会社東芝 ジェットポンプ
JP4797077B2 (ja) * 2009-02-18 2011-10-19 株式会社日立製作所 半導体パワーモジュール、電力変換装置、および、半導体パワーモジュールの製造方法
JP5542627B2 (ja) 2010-11-11 2014-07-09 新電元工業株式会社 接続板、接合構造及び半導体装置
JP2014011447A (ja) * 2012-06-29 2014-01-20 Nakamura Mfg Co Ltd 発熱体冷却装置
JP6186146B2 (ja) 2013-03-15 2017-08-23 株式会社Uacj 熱交換器
US9633967B2 (en) 2013-10-21 2017-04-25 Nsk Ltd. Semiconductor module
WO2016203884A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
CA3036731A1 (en) * 2016-10-14 2018-04-19 Dana Canada Corporation Heat exchanger having bypass seal with retention clip
FR3080174B1 (fr) * 2018-01-29 2020-05-29 Valeo Systemes Thermiques Plaque pour echangeur de chaleur
JP7067129B2 (ja) * 2018-03-06 2022-05-16 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7116576B2 (ja) * 2018-04-02 2022-08-10 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7205071B2 (ja) * 2018-04-02 2023-01-17 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7159617B2 (ja) * 2018-05-25 2022-10-25 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
WO2020003757A1 (ja) * 2018-06-27 2020-01-02 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7367394B2 (ja) * 2018-11-22 2023-10-24 富士電機株式会社 半導体モジュール、車両および製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016120526A (ja) * 2011-03-03 2016-07-07 昭和電工株式会社 鍛造加工方法
JP2013024483A (ja) * 2011-07-21 2013-02-04 Mitsubishi Electric Corp プレート積層型冷却器
JP2018049861A (ja) * 2016-09-20 2018-03-29 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2019160852A (ja) * 2018-03-08 2019-09-19 昭和電工株式会社 ヒートシンクの製造方法

Also Published As

Publication number Publication date
CN114747003A (zh) 2022-07-12
US12424507B2 (en) 2025-09-23
US20220278014A1 (en) 2022-09-01
WO2021256083A1 (ja) 2021-12-23
JP7424489B2 (ja) 2024-01-30

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