CN114747000A - 半导体装置、电力变换装置以及半导体装置的制造方法 - Google Patents

半导体装置、电力变换装置以及半导体装置的制造方法 Download PDF

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Publication number
CN114747000A
CN114747000A CN201980102607.1A CN201980102607A CN114747000A CN 114747000 A CN114747000 A CN 114747000A CN 201980102607 A CN201980102607 A CN 201980102607A CN 114747000 A CN114747000 A CN 114747000A
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resin member
semiconductor device
conductive wire
surface electrode
joint
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CN201980102607.1A
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English (en)
Chinese (zh)
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人见晴子
原田耕三
坂本健
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN114747000A publication Critical patent/CN114747000A/zh
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    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
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CN201980102607.1A 2019-12-04 2019-12-04 半导体装置、电力变换装置以及半导体装置的制造方法 Pending CN114747000A (zh)

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PCT/JP2019/047510 WO2021111563A1 (ja) 2019-12-04 2019-12-04 半導体装置、電力変換装置および半導体装置の製造方法

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US (1) US20220336402A1 (https=)
JP (1) JP7270772B2 (https=)
CN (1) CN114747000A (https=)
DE (1) DE112019007938T5 (https=)
WO (1) WO2021111563A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7489933B2 (ja) * 2021-02-24 2024-05-24 三菱電機株式会社 半導体装置及びその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274234A (ja) * 1995-03-30 1996-10-18 Hitachi Ltd 半導体装置およびその製造方法並びに半導体実装モジュール
JP2015050340A (ja) * 2013-09-02 2015-03-16 株式会社ジェイテクト 半導体装置
JP2015167171A (ja) * 2014-03-04 2015-09-24 三菱電機株式会社 半導体装置
WO2016016970A1 (ja) * 2014-07-30 2016-02-04 株式会社日立製作所 半導体装置、半導体装置の製造方法および電力変換装置
JP2017224778A (ja) * 2016-06-17 2017-12-21 三菱電機株式会社 半導体装置
CN108701621A (zh) * 2016-02-24 2018-10-23 三菱电机株式会社 半导体模块以及半导体模块的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120284A (ja) * 1992-10-05 1994-04-28 Toyota Motor Corp 半導体装置
JP2007012831A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd パワー半導体装置
CN104563693B (zh) 2014-12-31 2016-08-17 湖北盛佳电器设备有限公司 一种a型可拆卸式铰链

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274234A (ja) * 1995-03-30 1996-10-18 Hitachi Ltd 半導体装置およびその製造方法並びに半導体実装モジュール
JP2015050340A (ja) * 2013-09-02 2015-03-16 株式会社ジェイテクト 半導体装置
JP2015167171A (ja) * 2014-03-04 2015-09-24 三菱電機株式会社 半導体装置
WO2016016970A1 (ja) * 2014-07-30 2016-02-04 株式会社日立製作所 半導体装置、半導体装置の製造方法および電力変換装置
DE112014006759T5 (de) * 2014-07-30 2017-05-24 Hitachi, Ltd. Halbleitervorrichtung, Verfahren zum Herstellen einer Halbleitervorrichtung und Leistungsumsetzungsvorrichtung
CN108701621A (zh) * 2016-02-24 2018-10-23 三菱电机株式会社 半导体模块以及半导体模块的制造方法
JP2017224778A (ja) * 2016-06-17 2017-12-21 三菱電機株式会社 半導体装置

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JPWO2021111563A1 (https=) 2021-06-10
DE112019007938T5 (de) 2022-09-15
JP7270772B2 (ja) 2023-05-10
US20220336402A1 (en) 2022-10-20

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Application publication date: 20220712