CN114730800A - 像素阵列及显示装置 - Google Patents
像素阵列及显示装置 Download PDFInfo
- Publication number
- CN114730800A CN114730800A CN202180000017.5A CN202180000017A CN114730800A CN 114730800 A CN114730800 A CN 114730800A CN 202180000017 A CN202180000017 A CN 202180000017A CN 114730800 A CN114730800 A CN 114730800A
- Authority
- CN
- China
- Prior art keywords
- pixel
- sub
- virtual
- pixels
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 47
- 239000000126 substance Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 219
- 238000010586 diagram Methods 0.000 description 44
- 239000010408 film Substances 0.000 description 31
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 9
- 238000004680 force modulation microscopy Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 8
- 229910010272 inorganic material Inorganic materials 0.000 description 8
- 239000011147 inorganic material Substances 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000002346 layers by function Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000005525 hole transport Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- DTSBBUTWIOVIBV-UHFFFAOYSA-N molybdenum niobium Chemical compound [Nb].[Mo] DTSBBUTWIOVIBV-UHFFFAOYSA-N 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种像素阵列及显示装置,像素阵列包括多个子像素;多个子像素中的每个均具有虚拟像素中心,多个子像素包括第一子像素(R)、第二子像素(G)和第三子像素(B);其中,两个第一子像素(R)和两个第三子像素(B)的虚拟中心的依次连线构成第二虚拟四边形(100);呈阵列排布的四个第二虚拟四边(100)形以共邻边的方式构成第一虚拟多边形(10),且第一子像素(R)和第三子像素(B)位于第一虚拟多边形(10)的顶角或边上,且沿顺时针方向交替分布于该第一虚拟多边形(10)的顶角或边位置上;第一虚拟多边形(10)内具有第一虚拟点(P),第一虚拟点(P)与第一虚拟多边形(10)上的四个第三子像素(B)的虚拟中心的连线,将第一虚拟多边形(10)分割为四个虚拟等腰梯形(300)。
Description
PCT国内申请,说明书已公开。
Claims (27)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2020114619 | 2020-09-10 | ||
CNPCT/CN2020/114619 | 2020-09-10 | ||
PCT/CN2020/118991 WO2022052192A1 (zh) | 2020-09-10 | 2020-09-29 | 像素阵列及显示装置 |
CNPCT/CN2020/118991 | 2020-09-29 | ||
PCT/CN2020/125469 WO2022052254A1 (zh) | 2020-09-10 | 2020-10-30 | 像素阵列及显示装置 |
CNPCT/CN2020/125469 | 2020-10-30 | ||
PCT/CN2021/070308 WO2022052390A1 (zh) | 2020-09-10 | 2021-01-05 | 像素阵列及显示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114730800A true CN114730800A (zh) | 2022-07-08 |
CN114730800B CN114730800B (zh) | 2023-12-22 |
Family
ID=80630107
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080002587.3A Pending CN114467179A (zh) | 2020-09-10 | 2020-10-30 | 像素阵列及显示装置 |
CN202180000017.5A Active CN114730800B (zh) | 2020-09-10 | 2021-01-05 | 像素阵列及显示装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080002587.3A Pending CN114467179A (zh) | 2020-09-10 | 2020-10-30 | 像素阵列及显示装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20220352259A1 (zh) |
CN (2) | CN114467179A (zh) |
DE (2) | DE112020007366T5 (zh) |
MX (1) | MX2021016051A (zh) |
WO (1) | WO2022052390A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024078341A1 (zh) * | 2022-10-10 | 2024-04-18 | 华为技术有限公司 | 像素排列结构、电子设备、显示面板和制备方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114420722A (zh) * | 2020-09-10 | 2022-04-29 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
CN114937687B (zh) * | 2022-07-25 | 2022-12-23 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887404A (zh) * | 2016-09-29 | 2018-04-06 | 昆山国显光电有限公司 | Amoled像素结构及显示装置 |
US20180261654A1 (en) * | 2014-12-10 | 2018-09-13 | Lg Display Co., Ltd. | Organic light emitting display device |
CN207966995U (zh) * | 2018-02-09 | 2018-10-12 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN207966983U (zh) * | 2018-01-02 | 2018-10-12 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN109860237A (zh) * | 2018-12-13 | 2019-06-07 | 昆山国显光电有限公司 | 像素排列结构、显示面板及显示装置 |
CN110137206A (zh) * | 2018-02-09 | 2019-08-16 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN110620135A (zh) * | 2019-09-30 | 2019-12-27 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
CN111341817A (zh) * | 2020-03-11 | 2020-06-26 | 昆山国显光电有限公司 | 像素排布结构、显示面板及显示装置 |
CN111341815A (zh) * | 2020-03-11 | 2020-06-26 | 昆山国显光电有限公司 | 像素排布结构、显示面板及显示装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10854684B2 (en) * | 2016-02-18 | 2020-12-01 | Boe Technology Group Co., Ltd. | Pixel arrangement structure and driving method thereof, display substrate and display device |
CN109994505A (zh) * | 2018-01-02 | 2019-07-09 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
-
2020
- 2020-09-29 MX MX2021016051A patent/MX2021016051A/es unknown
- 2020-10-30 US US17/434,877 patent/US20220352259A1/en active Pending
- 2020-10-30 DE DE112020007366.1T patent/DE112020007366T5/de active Pending
- 2020-10-30 CN CN202080002587.3A patent/CN114467179A/zh active Pending
-
2021
- 2021-01-05 DE DE112021002769.7T patent/DE112021002769T5/de active Pending
- 2021-01-05 CN CN202180000017.5A patent/CN114730800B/zh active Active
- 2021-01-05 WO PCT/CN2021/070308 patent/WO2022052390A1/zh active Application Filing
- 2021-01-05 US US17/439,940 patent/US20220310711A1/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180261654A1 (en) * | 2014-12-10 | 2018-09-13 | Lg Display Co., Ltd. | Organic light emitting display device |
CN107887404A (zh) * | 2016-09-29 | 2018-04-06 | 昆山国显光电有限公司 | Amoled像素结构及显示装置 |
CN207966983U (zh) * | 2018-01-02 | 2018-10-12 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN207966995U (zh) * | 2018-02-09 | 2018-10-12 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN110137206A (zh) * | 2018-02-09 | 2019-08-16 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN109860237A (zh) * | 2018-12-13 | 2019-06-07 | 昆山国显光电有限公司 | 像素排列结构、显示面板及显示装置 |
CN110620135A (zh) * | 2019-09-30 | 2019-12-27 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
CN111341817A (zh) * | 2020-03-11 | 2020-06-26 | 昆山国显光电有限公司 | 像素排布结构、显示面板及显示装置 |
CN111341815A (zh) * | 2020-03-11 | 2020-06-26 | 昆山国显光电有限公司 | 像素排布结构、显示面板及显示装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024078341A1 (zh) * | 2022-10-10 | 2024-04-18 | 华为技术有限公司 | 像素排列结构、电子设备、显示面板和制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220352259A1 (en) | 2022-11-03 |
CN114730800B (zh) | 2023-12-22 |
WO2022052390A1 (zh) | 2022-03-17 |
DE112020007366T5 (de) | 2023-05-17 |
US20220310711A1 (en) | 2022-09-29 |
MX2021016051A (es) | 2022-04-07 |
DE112021002769T5 (de) | 2023-03-02 |
CN114467179A (zh) | 2022-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112368840B (zh) | 像素阵列及显示装置 | |
CN112470287B (zh) | 一种显示基板及相关装置 | |
CN114730800B (zh) | 像素阵列及显示装置 | |
US11864447B2 (en) | Display substrate, display device and high-precision metal mask | |
US11587983B2 (en) | Electroluminescent display module and display device with reduced color cast | |
US20230143544A1 (en) | Display substrate, display device and high-precision metal mask | |
WO2022052194A1 (zh) | 一种显示基板及相关装置 | |
CN114450802A (zh) | 一种显示面板、掩膜组件和显示装置 | |
WO2022110169A1 (zh) | 一种显示基板及相关装置 | |
CN219087721U (zh) | 一种显示面板和显示装置 | |
CN218158982U (zh) | 触控结构、触控显示面板以及显示装置 | |
WO2022052192A1 (zh) | 像素阵列及显示装置 | |
WO2022141628A1 (zh) | 一种显示基板及相关装置 | |
WO2022052193A1 (zh) | 显示基板、显示装置及高精度金属掩模板 | |
US20240032376A1 (en) | Pixel array and display device | |
RU2779136C1 (ru) | Пиксельный массив и устройство отображения | |
WO2022193152A1 (zh) | 显示面板及其制作方法以及显示装置 | |
WO2024125167A1 (zh) | 一种显示面板和显示装置 | |
CN117193551A (zh) | 触控结构、触控显示面板以及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |