CN114450802A - 一种显示面板、掩膜组件和显示装置 - Google Patents
一种显示面板、掩膜组件和显示装置 Download PDFInfo
- Publication number
- CN114450802A CN114450802A CN202180002382.XA CN202180002382A CN114450802A CN 114450802 A CN114450802 A CN 114450802A CN 202180002382 A CN202180002382 A CN 202180002382A CN 114450802 A CN114450802 A CN 114450802A
- Authority
- CN
- China
- Prior art keywords
- sub
- pixel
- pixels
- display panel
- virtual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 53
- 230000001788 irregular Effects 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 144
- 238000000034 method Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 30
- 239000010408 film Substances 0.000 description 28
- 230000000694 effects Effects 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 239000000463 material Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 20
- 239000011295 pitch Substances 0.000 description 14
- 238000009826 distribution Methods 0.000 description 12
- 238000001704 evaporation Methods 0.000 description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 229910010272 inorganic material Inorganic materials 0.000 description 8
- 239000011147 inorganic material Substances 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 239000002346 layers by function Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000004680 force modulation microscopy Methods 0.000 description 5
- 230000005525 hole transport Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- DTSBBUTWIOVIBV-UHFFFAOYSA-N molybdenum niobium Chemical compound [Nb].[Mo] DTSBBUTWIOVIBV-UHFFFAOYSA-N 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 210000001624 hip Anatomy 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
Abstract
一种显示面板(10)包括呈阵列设置的多个像素单元(12),每个像素单元(12)包括位于虚拟六边形内的一个第一子像素(122)、一个第二子像素(124)和两个第三子像素(126);第一子像素(122)和第二子像素(124)相邻,两个第三子像素(126)均与第一子像素(122)和第二子像素(124)相邻;在列延伸方向上相邻的像素单元(12)共用第一子像素(122)和第二子像素(124),且在行延伸方向上相邻的像素单元(12)共用一个第三子像素(126)。本申请还公开了一种掩膜组件和显示装置。
Description
PCT国内申请,说明书已公开。
Claims (45)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010900933.1A CN111987130A (zh) | 2020-08-31 | 2020-08-31 | 一种显示面板、掩膜组件和显示装置 |
CN2020109009331 | 2020-08-31 | ||
PCT/CN2021/115759 WO2022042749A1 (zh) | 2020-08-31 | 2021-08-31 | 一种显示面板、掩膜组件和显示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114450802A true CN114450802A (zh) | 2022-05-06 |
CN114450802B CN114450802B (zh) | 2023-12-19 |
Family
ID=73448580
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010900933.1A Pending CN111987130A (zh) | 2020-08-31 | 2020-08-31 | 一种显示面板、掩膜组件和显示装置 |
CN202180002382.XA Active CN114450802B (zh) | 2020-08-31 | 2021-08-31 | 一种显示面板、掩膜组件和显示装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010900933.1A Pending CN111987130A (zh) | 2020-08-31 | 2020-08-31 | 一种显示面板、掩膜组件和显示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230247883A1 (zh) |
CN (2) | CN111987130A (zh) |
WO (1) | WO2022042749A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111987130A (zh) * | 2020-08-31 | 2020-11-24 | 京东方科技集团股份有限公司 | 一种显示面板、掩膜组件和显示装置 |
CN114141834B (zh) * | 2021-11-24 | 2023-05-09 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
CN115101561A (zh) * | 2022-06-24 | 2022-09-23 | 京东方科技集团股份有限公司 | 显示基板、掩膜组件以及显示面板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103311266A (zh) * | 2012-03-06 | 2013-09-18 | 三星显示有限公司 | 用于有机发光显示装置的像素排列结构 |
US20180088260A1 (en) * | 2016-02-18 | 2018-03-29 | Boe Technology Group Co., Ltd. | Pixel arrangement structure, display panel and display device |
CN109686778A (zh) * | 2019-01-31 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
CN109994509A (zh) * | 2018-01-02 | 2019-07-09 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN109994506A (zh) * | 2018-01-02 | 2019-07-09 | 京东方科技集团股份有限公司 | 一种像素排布结构、高精度金属掩模板及显示装置 |
CN110137206A (zh) * | 2018-02-09 | 2019-08-16 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN212412057U (zh) * | 2020-08-31 | 2021-01-26 | 京东方科技集团股份有限公司 | 一种显示面板、掩膜组件和显示装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110277436A (zh) * | 2019-06-28 | 2019-09-24 | 云谷(固安)科技有限公司 | 像素排列结构及显示面板 |
CN111987130A (zh) * | 2020-08-31 | 2020-11-24 | 京东方科技集团股份有限公司 | 一种显示面板、掩膜组件和显示装置 |
-
2020
- 2020-08-31 CN CN202010900933.1A patent/CN111987130A/zh active Pending
-
2021
- 2021-08-31 CN CN202180002382.XA patent/CN114450802B/zh active Active
- 2021-08-31 US US17/922,382 patent/US20230247883A1/en active Pending
- 2021-08-31 WO PCT/CN2021/115759 patent/WO2022042749A1/zh active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103311266A (zh) * | 2012-03-06 | 2013-09-18 | 三星显示有限公司 | 用于有机发光显示装置的像素排列结构 |
US20180088260A1 (en) * | 2016-02-18 | 2018-03-29 | Boe Technology Group Co., Ltd. | Pixel arrangement structure, display panel and display device |
CN109994509A (zh) * | 2018-01-02 | 2019-07-09 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN109994506A (zh) * | 2018-01-02 | 2019-07-09 | 京东方科技集团股份有限公司 | 一种像素排布结构、高精度金属掩模板及显示装置 |
CN110137206A (zh) * | 2018-02-09 | 2019-08-16 | 京东方科技集团股份有限公司 | 一种像素排布结构及相关装置 |
CN109686778A (zh) * | 2019-01-31 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
CN212412057U (zh) * | 2020-08-31 | 2021-01-26 | 京东方科技集团股份有限公司 | 一种显示面板、掩膜组件和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
US20230247883A1 (en) | 2023-08-03 |
WO2022042749A1 (zh) | 2022-03-03 |
CN114450802B (zh) | 2023-12-19 |
CN111987130A (zh) | 2020-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11812648B2 (en) | Pixel array and display device | |
CN112470287B (zh) | 一种显示基板及相关装置 | |
CN114450802B (zh) | 一种显示面板、掩膜组件和显示装置 | |
US11864447B2 (en) | Display substrate, display device and high-precision metal mask | |
CN114730800B (zh) | 像素阵列及显示装置 | |
WO2022110173A1 (zh) | 显示基板、显示装置及高精度金属掩模板 | |
WO2022052194A1 (zh) | 一种显示基板及相关装置 | |
WO2022110169A1 (zh) | 一种显示基板及相关装置 | |
CN218158982U (zh) | 触控结构、触控显示面板以及显示装置 | |
WO2022052193A1 (zh) | 显示基板、显示装置及高精度金属掩模板 | |
WO2022141628A1 (zh) | 一种显示基板及相关装置 | |
CN219087721U (zh) | 一种显示面板和显示装置 | |
WO2022193152A1 (zh) | 显示面板及其制作方法以及显示装置 | |
US20240032376A1 (en) | Pixel array and display device | |
RU2779136C1 (ru) | Пиксельный массив и устройство отображения | |
WO2022052192A1 (zh) | 像素阵列及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |