CN114709321A - Take LED encapsulation of inner chamber to use quartz window - Google Patents
Take LED encapsulation of inner chamber to use quartz window Download PDFInfo
- Publication number
- CN114709321A CN114709321A CN202011133356.4A CN202011133356A CN114709321A CN 114709321 A CN114709321 A CN 114709321A CN 202011133356 A CN202011133356 A CN 202011133356A CN 114709321 A CN114709321 A CN 114709321A
- Authority
- CN
- China
- Prior art keywords
- quartz
- inner cavity
- window
- quartz window
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 82
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 238000005538 encapsulation Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 6
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000006722 reduction reaction Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a quartz window with an inner cavity for LED packaging, which comprises a substrate, a quartz window with an inner cavity and a deep ultraviolet LED chip, wherein the quartz window with the inner cavity is arranged on the substrate; the quartz window with the inner cavity comprises a quartz body and a placing window, wherein the quartz body is arranged on the substrate, and the placing window is arranged at the center of the bottom wall of the quartz body. The invention belongs to the technical field of quartz windows, and particularly relates to a quartz window for LED packaging with an inner cavity, which has the advantages of simple structure, low investment, easiness in operation, suitability for large-scale and batch production, reduction in production cost, and capability of solving the problem of difficult processing of a metal dam.
Description
Technical Field
The invention belongs to the technical field of quartz windows, and particularly relates to a quartz window with an inner cavity for LED packaging.
Background
The ultraviolet sterilization by utilizing the deep ultraviolet LED is a common recognition in the industry, but due to the limitation of the deep ultraviolet LED packaging process, a ceramic substrate with a metal dam must be used as an LED packaging support, the manufacturing process of the metal dam is complex, the production period is long, the cost is high, and the metal dam is a bottleneck of industry development all the time.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention provides the quartz window with the inner cavity for LED packaging, which has the advantages of simple structure, low investment, easiness in operation, suitability for large-scale and batch production, reduction in production cost, and solution to the problem of difficult processing of the metal dam.
The technical scheme adopted by the invention is as follows: the invention relates to a quartz window with an inner cavity for LED packaging, which comprises a substrate, a quartz window with an inner cavity and a deep ultraviolet LED chip, wherein the quartz window with the inner cavity is arranged on the substrate, and the deep ultraviolet LED chip is arranged on the substrate and is arranged in the quartz window with the inner cavity; the quartz window with the inner cavity comprises a quartz body and a placing window, wherein the quartz body is arranged on the substrate, and the placing window is arranged at the center of the bottom wall of the quartz body.
Further, the placing window is cylindrical.
Furthermore, the cross section of the quartz window with the inner cavity is arranged in an inverted concave shape.
Further, the quartz window with the inner cavity is connected with the substrate in a welding mode.
Further, the deep ultraviolet LED chip is connected with the substrate through a die bonding process.
Furthermore, the quartz window with the inner cavity is made of quartz.
Further, the substrate is a ceramic material.
A production process of a quartz window with an inner cavity for LED packaging is characterized by comprising the following steps:
the method comprises the following steps: polishing two sides of the quartz wafer;
step two: grinding the quartz wafer to obtain a placing window structure, and polishing;
step three: and obtaining a single quartz window with an inner cavity through cutting.
The invention with the structure has the following beneficial effects: the utility model provides a take LED encapsulation of inner chamber to use quartz window, simple structure, the input is low, and easily operation is suitable for extensive, mass production, has reduced manufacturing cost, has solved the difficult problem of metal box dam processing, has designed the plane window structure of cavity, has effectively solved LED encapsulation on the existing market and has used quartz window effect poor, and self structure is complicated, maintains comparatively inconvenient problem.
Drawings
FIG. 1 is a schematic view of the overall structure of a quartz window for LED package with an inner cavity according to the present invention;
FIG. 2 is a top view of the quartz window with inner cavity for LED package according to the present invention;
FIG. 3 is a schematic view of a grinding structure of a quartz window quartz wafer for LED packaging with an inner cavity according to the present invention;
fig. 4 is a schematic diagram of a cutting structure of a quartz window quartz wafer for LED packaging with an inner cavity according to the present invention.
The LED chip comprises a substrate 1, a substrate 2, a quartz window with an inner cavity 3, a deep ultraviolet LED chip 4, a quartz body 5 and a placement window.
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-4, the quartz window for LED package with an inner cavity of the present invention includes a substrate 1, a quartz window 2 with an inner cavity, and a deep ultraviolet LED chip 3, wherein the quartz window 2 with an inner cavity is disposed on the substrate 1, and the deep ultraviolet LED chip 3 is disposed on the substrate 1 and in the quartz window 2 with an inner cavity; the quartz window 2 with the inner cavity comprises a quartz body 4 and a placing window 5, wherein the quartz body 4 is arranged on the substrate 1, and the placing window 2 is arranged at the center of the bottom wall of the quartz body 4.
The placement window 5 is cylindrically arranged.
The cross section of the quartz window 2 with the inner cavity is arranged in an inverted concave shape.
The quartz window 2 with the inner cavity is connected with the substrate 1 in a welding mode.
The deep ultraviolet LED chip 3 is connected with the substrate 1 through a die bonding process.
The quartz window 2 with the inner cavity is made of quartz.
The substrate 1 is a ceramic material.
A production process of a quartz window with an inner cavity for LED packaging is characterized by comprising the following steps:
the method comprises the following steps: polishing two sides of the quartz wafer;
step two: grinding the quartz wafer to obtain a placing window structure, and polishing;
step three: and obtaining a single quartz window with an inner cavity through cutting.
Example one
Polishing two sides of a quartz wafer, grinding the quartz wafer to obtain a placing window 5 structure, polishing, cutting to obtain a single quartz window 2 with an inner cavity, connecting a deep ultraviolet LED chip 3 with a substrate 1 through a die bonding process, welding the quartz window 2 with the inner cavity with the substrate 1, and placing the deep ultraviolet LED chip 3 in the placing window 5.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The utility model provides a take LED of inner chamber for encapsulation quartz window which characterized in that: the device comprises a substrate, a quartz window with an inner cavity and a deep ultraviolet LED chip, wherein the quartz window with the inner cavity is arranged on the substrate, and the deep ultraviolet LED chip is arranged on the substrate and is arranged in the quartz window with the inner cavity; the quartz window with the inner cavity comprises a quartz body and a placing window, wherein the quartz body is arranged on the substrate, and the placing window is arranged at the center of the bottom wall of the quartz body.
2. The quartz window with inner cavity for LED package of claim 1, wherein: the placing window is arranged in a cylindrical shape.
3. The quartz window with inner cavity for LED package of claim 2, wherein: the cross section of the quartz window with the inner cavity is arranged in an inverted concave shape.
4. The quartz window with inner cavity for LED package according to claim 3, wherein: and the quartz window with the inner cavity is connected with the substrate in a welding way.
5. The quartz window with inner cavity for LED package according to claim 4, wherein: the deep ultraviolet LED chip is connected with the substrate through a die bonding process.
6. The quartz window with inner cavity for LED package according to claim 5, wherein: the quartz window with the inner cavity is made of quartz.
7. The quartz window with inner cavity for LED package according to claim 6, wherein: the substrate is made of ceramic material.
8. A production process of a quartz window with an inner cavity for LED packaging is characterized by comprising the following steps:
the method comprises the following steps: polishing two sides of the quartz wafer;
step two: grinding the quartz wafer to obtain a placing window structure, and polishing;
step three: and obtaining a single quartz window with an inner cavity through cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011133356.4A CN114709321A (en) | 2020-10-21 | 2020-10-21 | Take LED encapsulation of inner chamber to use quartz window |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011133356.4A CN114709321A (en) | 2020-10-21 | 2020-10-21 | Take LED encapsulation of inner chamber to use quartz window |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114709321A true CN114709321A (en) | 2022-07-05 |
Family
ID=82166159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011133356.4A Pending CN114709321A (en) | 2020-10-21 | 2020-10-21 | Take LED encapsulation of inner chamber to use quartz window |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114709321A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231976A (en) * | 2017-12-29 | 2018-06-29 | 上海大学 | A kind of UV LED and packaging method |
| WO2018121103A1 (en) * | 2016-12-30 | 2018-07-05 | 江苏稳润光电有限公司 | Ultraviolet led packaging method |
| CN209896097U (en) * | 2019-04-11 | 2020-01-03 | 武汉高星紫外光电科技有限公司 | Deep ultraviolet LED all-inorganic airtight packaging structure |
| CN110808321A (en) * | 2019-10-12 | 2020-02-18 | 深圳市柔升科技有限公司 | Ultraviolet light LED packaging structure |
| CN110828633A (en) * | 2019-11-08 | 2020-02-21 | 武汉高星紫外光电科技有限公司 | Deep ultraviolet LED wafer level packaging method |
-
2020
- 2020-10-21 CN CN202011133356.4A patent/CN114709321A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018121103A1 (en) * | 2016-12-30 | 2018-07-05 | 江苏稳润光电有限公司 | Ultraviolet led packaging method |
| CN108231976A (en) * | 2017-12-29 | 2018-06-29 | 上海大学 | A kind of UV LED and packaging method |
| CN209896097U (en) * | 2019-04-11 | 2020-01-03 | 武汉高星紫外光电科技有限公司 | Deep ultraviolet LED all-inorganic airtight packaging structure |
| CN110808321A (en) * | 2019-10-12 | 2020-02-18 | 深圳市柔升科技有限公司 | Ultraviolet light LED packaging structure |
| CN110828633A (en) * | 2019-11-08 | 2020-02-21 | 武汉高星紫外光电科技有限公司 | Deep ultraviolet LED wafer level packaging method |
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