CN205141014U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
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- CN205141014U CN205141014U CN201520903977.4U CN201520903977U CN205141014U CN 205141014 U CN205141014 U CN 205141014U CN 201520903977 U CN201520903977 U CN 201520903977U CN 205141014 U CN205141014 U CN 205141014U
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- Prior art keywords
- transparent cover
- cover plate
- support
- brace table
- projection
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Abstract
The utility model provides a LED packaging structure, include the support and with support complex transparent cover, the sunken storage tank that is used for holding LED that forms of support intermediate position encloses the part of storage tank forms the brace table, transparent cover's edge is located on the brace table, the outside edge of brace table is equipped with a plurality of archs, protruding marginal facies with transparent cover supports, bellied top exceeds transparent cover's top surface, just the arch is equipped with the buckle that sticiss the transparent cover surface. The utility model discloses set up the arch at the border position of support, this arch can play restraint transparent cover on the one hand and remove, as spacing, in addition, setting up the buckle at bellied top, can compressing tightly transparent cover fixedly, the generation type of buckle can have multiplely, for example by bellied top to the formation of buckling of transparent cover direction, perhaps form by bellied top punching press expansion deformation. (U /)
Description
Technical field
The utility model relates to LED field, especially a kind of LED encapsulation structure.
Background technology
The general fixed L ED chip on support before this of the encapsulation flow process of LED, and then cover transparent cover plate LED chip is sealed up for safekeeping in seal cavity.Traditional transparent cover plate fixed form has a variety of, bonded adhesives can be utilized to be fixed by transparent cover plate, but this kind of fixed form can get loose along with aging appearance of bonded adhesives, and the aging of bonded adhesives can be accelerated due to ultraviolet, thus the encapsulation of deep ultraviolet LED does not generally adopt bonded adhesives; Many defects of transparent cover plate existence are fixed in order to solve traditional bonded adhesives, in prior art, have and utilize the mode of welding to be fixed transparent cover plate, if China Patent Publication No. is a kind of LED encapsulation method of 103325922, comprise the following steps: (1) preliminary treatment; Preliminary treatment is carried out comprising to the surface of transparent cover plate, expansion alloy and substrate lands; (2) weld; (a) metal and ceramic welding, be first placed in fixture by expansion alloy and substrate mounting, ceramic substrate connects negative electrode, expansion alloy connects anode, adopt high-frequency induction heating, be placed on by fixture in alternating magnetic field, regulating frequency controls expansion alloy temperature at 200 ~ 300 DEG C; Apply the direct voltage of 700 ~ 900V, after holding temperature, voltage 15 ~ 30min, direct voltage is stopped, ceramic substrate and expansion alloy are welded together; (b) metal and glass solder, moved on to by transparent cover plate on expansion alloy, expansion alloy connects anode, transparent cover plate connects negative electrode, is placed on by fixture in alternating magnetic field, applies the direct voltage of 600 ~ 900v, after holding temperature, voltage 15 ~ 50min, stopped by direct voltage, welding completes.Although the fixed form of above-mentioned transparent cover plate is reliable, and belongs to inorganic encapsulated, can be suitable for deep ultraviolet LED, its packaging technology is comparatively complicated.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of LED encapsulation structure, and packaging technology is simple.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of LED encapsulation structure, comprise support and the transparent cover plate with described support assorted, described support centre position is recessed to form the storage tank for accommodating LED, the part surrounding described storage tank forms brace table, and the edge of described transparent cover plate is located on described brace table; The outer ledge of described brace table is provided with some projections, and the edge of described projection and transparent cover plate offsets, and the top of described projection exceeds the end face of transparent cover plate, and is provided with the buckle pressing transparent cover plate surface.The utility model arranges projection at the marginal position of support, and this projection can play constraint transparent cover plate on the one hand and move, as spacing; In addition, arrange buckle at the top of projection, transparent cover plate can be fixed, the generation type of buckle can have multiple, such as, be bent to form to transparent cover plate direction by the top of projection, or formed by the top punching press dilatancy of projection.
As improvement, described projection and the integrated metal structure of support.
As improvement, described support is metalwork, and described projection is the plastic parts of injection mo(u)lding on support.
As improvement, described brace table is provided with groove, is provided with bonded adhesives in described groove, increases the sealing that transparent cover plate is combined with brace table, also plays certain fixation simultaneously to transparent cover plate.
As improvement, described transparent cover plate is quartz lens.
The beneficial effect that the utility model is compared with prior art brought is:
At the top of projection, buckle is set, transparent cover plate can be fixed, the generation type of buckle can have multiple, such as be bent to form to transparent cover plate direction by the top of projection, or formed by the top punching press dilatancy of projection, thus realizing inorganic encapsulated without the need to loaded down with trivial details operation, packaging technology is simple.
Accompanying drawing explanation
Fig. 1 is the loose encapsulating structure figure of transparent cover plate.
Fig. 2 is the encapsulating structure figure after embodiment 1 transparent cover plate is fixed.
Fig. 3 is the encapsulating structure figure after embodiment 2 transparent cover plate is fixed.
Embodiment
Below in conjunction with Figure of description, the utility model is described in further detail.
Embodiment 1
As shown in Figure 1, 2, a kind of LED encapsulation structure, the transparent cover plate 4 comprising support 1 and coordinate with described support 1, described support 1 centre position is recessed to form the storage tank 5 for accommodating LED, the part surrounding described storage tank 5 forms brace table 2, and the edge of described transparent cover plate 4 is located on described brace table 2.The outer ledge of described brace table 2 is provided with some protruding 3, described protruding 3 with the integrated metal structure of support 1, support 1 overall structure of the present embodiment can be formed by punching press.Described transparent cover plate 4 is quartz lens.The described thinner thickness of protruding 3, width and the quantity of protruding 3 can set as required, but need it to hold to be bent; Described protruding 3 offset with the edge of transparent cover plate 4, and the described top of protruding 3 exceeds the end face of transparent cover plate 4, and the top of this projection 3 bends to transparent cover plate 4 direction and forms the buckle 7 pressing transparent cover plate 4 surface.Described brace table 2 is provided with groove, is provided with bonded adhesives 6 in described groove, increases the sealing that transparent cover plate 4 is combined with brace table 2, also plays certain fixation simultaneously to transparent cover plate 4.
Embodiment 2
As shown in Figure 1,3, a kind of LED encapsulation structure, the transparent cover plate 4 comprising support 1 and coordinate with described support 1, described support 1 centre position is recessed to form the storage tank 5 for accommodating LED, the part surrounding described storage tank 5 forms brace table 2, and the edge of described transparent cover plate 4 is located on described brace table 2.The outer ledge of described brace table 2 is provided with some protruding 3, and described support 1 is metalwork, and described protruding 3 is the plastic parts of injection mo(u)lding on support 1.Described transparent cover plate 4 is quartz lens.The described thinner thickness of protruding 3, width and the quantity of protruding 3 can set as required, but need it to have certain plasticity; Described protruding 3 offset with the edge of transparent cover plate 4, and the described top of protruding 3 exceeds the end face of transparent cover plate 4, and the buckle 7 pressing transparent cover plate 4 surface is formed by punching press dilatancy on the top of this projection 3.Described brace table 2 is provided with groove, is provided with bonded adhesives 6 in described groove, increases the sealing that transparent cover plate 4 is combined with brace table 2, also plays certain fixation simultaneously to transparent cover plate 4.
Claims (7)
1. a LED encapsulation structure, comprise support and the transparent cover plate with described support assorted, it is characterized in that: described support centre position is recessed to form the storage tank for accommodating LED, the part surrounding described storage tank forms brace table, and the edge of described transparent cover plate is located on described brace table; The outer ledge of described brace table is provided with some projections, and the edge of described projection and transparent cover plate offsets, and the top of described projection exceeds transparent cover plate end face, and described projection is provided with the buckle pressing transparent cover plate surface.
2. a kind of LED encapsulation structure according to claim 1, is characterized in that: described buckle is bent to form to transparent cover plate direction by the top of projection.
3. a kind of LED encapsulation structure according to claim 1, is characterized in that: described buckle formed by the top punching press dilatancy of projection.
4. a kind of LED encapsulation structure according to claim 1, is characterized in that: described projection and the integrated metal structure of support.
5. a kind of LED encapsulation structure according to claim 1, is characterized in that: described support is metalwork, and described projection is the plastic parts of injection mo(u)lding on support.
6. a kind of LED encapsulation structure according to claim 1, is characterized in that: described brace table is provided with groove, is provided with bonded adhesives in described groove.
7. a kind of LED encapsulation structure according to claim 1, is characterized in that: described transparent cover plate is quartz lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520903977.4U CN205141014U (en) | 2015-11-13 | 2015-11-13 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520903977.4U CN205141014U (en) | 2015-11-13 | 2015-11-13 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205141014U true CN205141014U (en) | 2016-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520903977.4U Active CN205141014U (en) | 2015-11-13 | 2015-11-13 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205141014U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108258098A (en) * | 2017-12-26 | 2018-07-06 | 佛山市南海区联合广东新光源产业创新中心 | A kind of inorganic integrated deep ultraviolet LED encapsulation structure |
| CN110233195A (en) * | 2019-07-10 | 2019-09-13 | 华南理工大学 | A kind of inorganic UV LED component and preparation method |
| CN112856339A (en) * | 2019-11-28 | 2021-05-28 | 万国球 | Buckle fixing and mounting structure and process of copper wire lamp |
| CN115377270A (en) * | 2022-08-31 | 2022-11-22 | 深圳市聚飞光电股份有限公司 | LED packaging structure |
-
2015
- 2015-11-13 CN CN201520903977.4U patent/CN205141014U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108258098A (en) * | 2017-12-26 | 2018-07-06 | 佛山市南海区联合广东新光源产业创新中心 | A kind of inorganic integrated deep ultraviolet LED encapsulation structure |
| CN110233195A (en) * | 2019-07-10 | 2019-09-13 | 华南理工大学 | A kind of inorganic UV LED component and preparation method |
| CN110233195B (en) * | 2019-07-10 | 2024-04-16 | 华南理工大学 | Inorganic ultraviolet LED device and preparation method thereof |
| CN112856339A (en) * | 2019-11-28 | 2021-05-28 | 万国球 | Buckle fixing and mounting structure and process of copper wire lamp |
| CN115377270A (en) * | 2022-08-31 | 2022-11-22 | 深圳市聚飞光电股份有限公司 | LED packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee before: Guangzhou Hongli Tronic Co., Ltd. |