CN114706281A - Method for improving exposure uniformity of PCB - Google Patents
Method for improving exposure uniformity of PCB Download PDFInfo
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- CN114706281A CN114706281A CN202210543997.XA CN202210543997A CN114706281A CN 114706281 A CN114706281 A CN 114706281A CN 202210543997 A CN202210543997 A CN 202210543997A CN 114706281 A CN114706281 A CN 114706281A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a method for improving the exposure uniformity of a PCB (printed circuit board), which comprises the following steps of: obtaining a theoretical thickness value of the PCB; measuring the thickness of each grid on the PCB; importing the difference value of each grid into a data model constructed by modeling software from top to bottom and from left to right, and visually displaying by adopting different colors; preparing masks which comprise light-transmitting areas and light-proof areas, wherein the light-transmitting areas of each mask are respectively matched with the areas corresponding to the single colors; and exposing the PCB board by adopting the mask plates one by one, adjusting the focal length of an exposure machine according to different colors corresponding to the mask plates, and projecting light penetrating through a light transmission area onto the PCB board by the exposure machine to transfer the pattern. The plate thickness distribution map can express the plate thickness distribution of the plate surface and the area, so that the focal length adjustment of the sub-area exposure during the exposure is guided, the exposure energy received by the whole plate surface is consistent, the risk of local overexposure or exposure deficiency is avoided, and the problem that circuit open circuit or film removal is not clean due to inconsistent exposure energy is solved.
Description
Technical Field
The invention relates to the technical field of printed circuits, in particular to a method for improving the exposure uniformity of a PCB (printed circuit board).
Background
In the manufacturing process of the PCB, exposure is an important link, and the main purpose of the exposure is to transfer an image on an original negative film to a photosensitive bottom plate under the action of a light source. Since exposure is a process in which ultraviolet light is transmitted through a film negative to cause photopolymerization of a photosensitive resist material, it is required that exposure energy be uniform. The existing PCB may have the problem of uneven board thickness, when the PCB is uneven in board thickness, exposure energy received by the surface of the PCB is inconsistent, so that the risk of local overexposure or exposure is easily caused, the defect of open circuit of a circuit or incomplete film removal is caused, and the quality of a product is seriously influenced.
Disclosure of Invention
The present invention is directed to solving one or more of the above problems, and the present invention provides a method for improving the exposure uniformity of a PCB.
The invention provides a method for improving the exposure uniformity of a PCB, which comprises the following steps:
obtaining a theoretical thickness value of the PCB;
dividing the PCB by adopting grids, and measuring the thickness of each grid on the PCB;
calculating the difference value between the thickness value of each grid and the theoretical thickness value, importing the difference value of each grid into a data model constructed by modeling software from top to bottom and from left to right in sequence, and visually displaying the difference values by adopting different colors;
preparing a corresponding number of masks according to the types of colors, wherein the masks comprise light-transmitting areas and light-proof areas, and the light-transmitting areas of each mask are respectively matched with the areas corresponding to a single color;
a layer of UV photosensitive dry film is attached to the whole PCB;
and exposing the PCB board by adopting the mask plates one by one, adjusting the focal length of an exposure machine according to different colors corresponding to the mask plates, and projecting the light penetrating through the light transmission area onto the PCB board by the exposure machine to perform pattern transfer.
In some embodiments, the color comprises light blue, dark blue, light green, dark green, yellow, light orange, dark orange, light red, and dark red.
In some embodiments, when the difference is greater than or equal to-1 mil and less than 1mil, a light blue display is used; when the difference value is larger than or equal to 1mil and smaller than 3 mils, displaying by using dark blue; when the difference value is greater than or equal to 3 mils and less than 5 mils, displaying by adopting light green; when the difference value is greater than or equal to 5mil and less than 7mil, displaying by dark green; when the difference value is greater than or equal to 7 mils and less than 9 mils, displaying by adopting yellow; when the difference value is greater than or equal to-3 mil and less than-1 mil, displaying by light orange; when the absolute value of the difference value is larger than or equal to-5 mil and smaller than-3 mil, displaying by dark orange; when the absolute value of the difference value is larger than or equal to-7 mil and smaller than-5 mil, displaying by adopting light red; and when the absolute value of the difference value is greater than or equal to-9 mil and less than-7 mil, displaying by dark red.
In some embodiments, the focal length of the exposure machine is gradually decreased in the order of light blue, dark blue, light green, dark green, and yellow, and the focal length of the exposure machine is gradually increased in the order of light blue, light orange, dark orange, light red, and dark red.
In some embodiments, the focal length of the exposure machine is in the order of light blue, dark blue, light green, dark green and yellow, the exposure focal length is gradually decreased at each 120nm, the focal length of the exposure machine is in the order of light blue, light orange, dark orange, light red and dark red, and the exposure focal length is gradually increased at each 120 nm.
In some embodiments, the grid is rectangular, square, triangular, or circular.
In some embodiments, the grid is 1 x 1mm or 0.5 x 0.5mm squares.
In some embodiments, the thickness of each grid on the PCB is obtained by laser thickness measurement scanner measurement.
In some embodiments, the method further comprises a developing step, wherein the developing step comprises passing the exposed plate through a developer solution, so that the unexposed dry film is removed by reaction, the hole plugging position is exposed, and the rest part is completely covered by the dry film.
Has the advantages that:
1. the plate thickness distribution map can intuitively and detailedly express the plate thickness distribution of the plate surface and the area, so that the focal length adjustment of the exposure in the sub-areas during the exposure is guided, the exposure energy received by the whole plate surface is consistent, the risk of local overexposure or exposure deficiency is avoided, and the problem that the circuit is opened or the film is not removed cleanly due to inconsistent exposure energy is solved.
2. The thick precision of measurationing of board satisfies 0.4 mil's demand, and repeated precision satisfies 0.03mil, can satisfy the demand of high-end product: the laser thickness gauge with higher accuracy is adopted, and the fixed double-end synchronous test is matched, so that high-precision measurement can be realized.
Drawings
In order to illustrate the technical solutions of the present invention more clearly, the drawings needed for the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for a person skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a 9-color chart of a mark according to a difference in plate thickness according to example 1 of the present invention;
fig. 2 is a picture of the PCB after exposure according to embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step, based on embodiments of the invention, fall within the scope of protection of the invention.
Example 1:
taking a product A as an example, the theoretical design thickness of the product is 210 mils, the size is 18 x 24inch, the tolerance of the thickness of the customer plate is controlled to +/-7%, the deep drilling residual copper is controlled to be 2-10 mils, the product works in total 6WPNL, and the thickness of the plate is measured after lamination hole milling and edge trimming.
Putting the plate on a measuring table board in sequence, clamping a product by using a chuck, starting equipment to work, setting a measuring grid to be 1 x 1mm, measuring the thickness of the whole plate, requiring 278709 points for covering the whole plate according to the configuration of the equipment, wherein the measuring speed of the equipment is 500 times/s, so the measuring time of the whole plate is 9min, and the specific steps are as follows:
1. after the PCB to be tested is fixed by the clamp, the laser Mark head is started first, and a laser Mark A-01 (double faces) is marked;
2. starting the laser thickness measuring instrument, gradually measuring the whole plate surface according to the setting by the equipment, simultaneously working the upper laser thickness measuring scanner and the lower laser thickness measuring scanner to ensure the precision, and uploading the thickness data of each grid to a PC (personal computer) end in real time after setting a walking path according to a drawing;
3. the software at the PC end divides the product into 278709 grids according to the size of the product and the size of the grids, and introduces the absolute value of the difference between the thickness value of each grid and the theoretical thickness value into a data model constructed by modeling software from top to bottom and from left to right, namely, the absolute values of the differences are respectively added into corresponding grid frames, and a 9-color chart is marked according to the difference of the plate thicknesses set by the grids;
the 9-color chart is that according to the requirement of a product, the plate thickness difference is divided into 9 grades from a to i, wherein when the difference is larger than or equal to-1 mil and smaller than 1mil, light blue is used for displaying; when the difference value is larger than or equal to 1mil and smaller than 3 mils, displaying by using dark blue; when the difference value is greater than or equal to 3 mils and less than 5 mils, displaying by adopting light green; when the difference value is greater than or equal to 5mil and less than 7mil, displaying by dark green; when the difference value is greater than or equal to 7 mils and less than 9 mils, displaying by adopting yellow; when the difference value is greater than or equal to-3 mil and less than-1 mil, displaying by light orange; when the absolute value of the difference value is larger than or equal to-5 mil and smaller than-3 mil, displaying by dark orange; when the absolute value of the difference value is larger than or equal to-7 mil and smaller than-5 mil, displaying by adopting light red; when the absolute value of the difference value is larger than or equal to-9 mil and smaller than-7 mil, displaying by dark red;
4. the software marks the plate surface by using the 9-color chart according to the difference between theory and actual measurement, and obtains a regional chart of plate thickness distribution as shown in figure 1;
5. preparing a corresponding number of masks according to the color weight of 9 shown in FIG. 1, wherein the masks comprise a light-transmitting area and a light-proof area, and the light-transmitting area of each mask is respectively matched with an area corresponding to a single color;
6. a layer of UV photosensitive dry film is attached to the whole PCB;
7. and the mask plates are adopted one by one to expose the PCB, the focal length of the exposure machine is adjusted according to different colors corresponding to the mask plates, the focal length of the exposure machine is in the order of light blue, dark blue, light green, dark green and yellow, the exposure focal length is gradually reduced in 120nm every time, the focal length of the exposure machine is in the order of light blue, light orange, dark orange, light red and dark red, the exposure focal length is gradually increased in 120nm every time, and the exposure machine projects the light penetrating through the light transmission area onto the PCB for pattern transfer.
8. And a developing step, wherein the exposed plate is processed by developer, so that the unexposed dry film is removed through reaction, the hole plugging position is exposed, and the rest part is completely covered by the dry film.
The PCB was directly exposed as comparative example 1 for comparison.
The PCB panels of comparative example 1 and example 1 were divided into 10 x 10, 100 areas for exposure energy detection.
As shown in table 1, the data is exposure energy data for each area of the panel of comparative example 1, and the unit is J.
| A | B | C | D | E | F | G | H | I | J | |
| 1 | 20.5 | 18.6 | 20.9 | 21.2 | 19.2 | 20.6 | 21.2 | 20.7 | 18.4 | 19.6 |
| 2 | 20.1 | 17.7 | 20.6 | 22.5 | 20.3 | 19.4 | 20.5 | 21.4 | 19.3 | 19.9 |
| 3 | 18.2 | 19.2 | 20.4 | 20.8 | 21.7 | 20.4 | 19.3 | 20.5 | 19.6 | 19.2 |
| 4 | 17.3 | 18.5 | 19.3 | 20.2 | 20.6 | 19.8 | 19.3 | 19.5 | 19.3 | 19.3 |
| 5 | 16.6 | 17.8 | 18.2 | 19.9 | 20.4 | 19.9 | 19.3 | 19.4 | 19.2 | 19.0 |
| 6 | 17.3 | 18.3 | 18.2 | 18.9 | 19.6 | 19.3 | 19.3 | 19.5 | 19.2 | 19.5 |
| 7 | 18.5 | 19.3 | 19.2 | 19.4 | 20.3 | 19.3 | 19.5 | 19.4 | 19.4 | 19.7 |
| 8 | 19.3 | 19.6 | 19.6 | 19.9 | 20.6 | 19.6 | 19.8 | 19.3 | 19.6 | 19.2 |
| 9 | 20.3 | 20.7 | 20.1 | 20.6 | 20.8 | 20.8 | 20.6 | 20.8 | 20.7 | 20.1 |
| 10 | 20.7 | 20.7 | 20.9 | 20.1 | 21.5 | 21.3 | 20.9 | 20.6 | 21.8 | 20.5 |
Table 1: the exposure energy data for each area of the plate surface of comparative example 1 is shown in table 2, and the data is the exposure energy data for each area of the plate surface of example 1, and the unit is J.
| A | B | C | D | E | F | G | H | I | J | |
| 1 | 20.5 | 20.6 | 20.9 | 21.2 | 20.2 | 20.6 | 20.2 | 20.7 | 20.4 | 20.6 |
| 2 | 20.1 | 20.7 | 20.6 | 20.5 | 20.3 | 20.4 | 20.5 | 20.4 | 20.3 | 20.9 |
| 3 | 20.2 | 20.2 | 20.4 | 20.8 | 20.7 | 20.4 | 20.3 | 20.5 | 20.6 | 20.2 |
| 4 | 20.3 | 20.5 | 20.3 | 20.2 | 20.6 | 20.8 | 20.3 | 20.5 | 20.3 | 20.3 |
| 5 | 20.6 | 20.8 | 20.2 | 20.9 | 20.4 | 20.9 | 20.3 | 20.4 | 20.2 | 20.1 |
| 6 | 20.3 | 20.3 | 20.2 | 20.9 | 20.6 | 20.3 | 20.3 | 20.5 | 20.2 | 20.5 |
| 7 | 20.5 | 20.3 | 20.2 | 20.4 | 20.3 | 20.3 | 20.5 | 20.4 | 20.4 | 20.7 |
| 8 | 20.3 | 20.6 | 20.6 | 20.9 | 20.6 | 20.6 | 20.8 | 20.3 | 20.6 | 20.2 |
| 9 | 20.3 | 20.7 | 20.1 | 20.6 | 20.8 | 20.8 | 20.6 | 20.8 | 20.7 | 20.1 |
| 10 | 20.7 | 20.7 | 20.9 | 20.1 | 20.5 | 20.3 | 20.9 | 20.6 | 20.8 | 20.5 |
Table 2: exposure energy data for each area of the panel of example 1
As can be seen from tables 1 and 2, the exposure energy of each area of the surface of the PCB exposed by the method of the present invention is more uniform than that of the directly exposed area of the surface of the PCB.
Fig. 2 is a picture of a PCB after exposure and development in embodiment 1 of the present invention, and it can be seen from fig. 2 that the PCB exposed by the method of the present invention is uniformly exposed, thereby ensuring product quality.
The above-mentioned embodiments are further described in detail for the purpose of illustrating the invention, and it should be understood that the above-mentioned embodiments are only illustrative of the present invention and are not to be construed as limiting the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A method for improving the exposure uniformity of a PCB is characterized by comprising the following steps:
obtaining a theoretical thickness value of the PCB;
dividing the PCB by adopting grids, and measuring the thickness of each grid on the PCB;
calculating the difference value between the thickness value of each grid and the theoretical thickness value, importing the difference value of each grid into a data model constructed by modeling software from top to bottom and from left to right in sequence, and visually displaying the difference values by adopting different colors;
preparing a corresponding number of masks according to the types of colors, wherein the masks comprise light-transmitting areas and light-proof areas, and the light-transmitting areas of each mask are respectively matched with the areas corresponding to a single color;
a layer of UV photosensitive dry film is attached to the whole PCB;
and exposing the PCB board by adopting the mask plates one by one, adjusting the focal length of an exposure machine according to different colors corresponding to the mask plates, and projecting the light penetrating through the light transmission area onto the PCB board by the exposure machine to perform pattern transfer.
2. The method as claimed in claim 1, wherein the color includes light blue, dark blue, light green, dark green, yellow, light orange, dark orange, light red and dark red.
3. The method of claim 2, wherein when the difference is greater than or equal to-1 mil and less than 1mil, a light blue display is used; when the difference value is larger than or equal to 1mil and smaller than 3 mils, displaying by using dark blue; when the difference value is greater than or equal to 3 mils and less than 5 mils, displaying by adopting light green; when the difference value is greater than or equal to 5mil and less than 7mil, displaying by dark green; when the difference value is greater than or equal to 7 mils and less than 9 mils, displaying by adopting yellow; when the difference value is greater than or equal to-3 mil and less than-1 mil, displaying by light orange; when the absolute value of the difference value is larger than or equal to-5 mil and smaller than-3 mil, displaying by dark orange; when the absolute value of the difference value is larger than or equal to-7 mil and smaller than-5 mil, displaying by adopting light red; and when the absolute value of the difference value is greater than or equal to-9 mil and less than-7 mil, displaying by dark red.
4. The method as claimed in claim 3, wherein the focal length of the exposure machine is gradually decreased in the order of light blue, dark blue, light green, dark green and yellow, and the focal length of the exposure machine is gradually increased in the order of light blue, light orange, dark orange, light red and dark red.
5. The method as claimed in claim 4, wherein the focal length of the exposure machine is in the order of light blue, dark blue, light green, dark green and yellow, the focal length of the exposure machine is gradually decreased at 120nm, the focal length of the exposure machine is in the order of light blue, light orange, dark orange, light red and dark red, and the focal length of the exposure machine is gradually increased at 120 nm.
6. The method as claimed in claim 1, wherein the grid is rectangular, square, triangular or circular.
7. The method of claim 6, wherein the grid is 1 x 1mm or 0.5 x 0.5mm square.
8. The method of claim 1, wherein the thickness of each grid on the PCB is measured by a laser thickness measuring scanner.
9. The method of claim 1, further comprising a developing step, wherein the developing step comprises passing the exposed plate through a developer solution, such that the unexposed dry film is removed by reaction, thereby exposing the via holes, and the remaining portion is completely covered with the dry film.
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| US20220100081A1 (en) * | 2020-09-28 | 2022-03-31 | Canon Kabushiki Kaisha | Information processing apparatus, inspection method, storage medium, exposure apparatus, determination method, and article manufacturing method |
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