CN217360551U - Photoetching system for double-sided photoetching - Google Patents
Photoetching system for double-sided photoetching Download PDFInfo
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- CN217360551U CN217360551U CN202120617640.2U CN202120617640U CN217360551U CN 217360551 U CN217360551 U CN 217360551U CN 202120617640 U CN202120617640 U CN 202120617640U CN 217360551 U CN217360551 U CN 217360551U
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Abstract
A photoetching system for double-sided photoetching comprises a first carrying table, a second carrying table, a photoetching mechanism and a controller, wherein the front surface of a substrate is upwards placed on the first carrying table, the back surface of the substrate is upwards placed on the second carrying table, the photoetching mechanism carries out photoetching operation on the substrate, the controller controls the first carrying table, the second carrying table and the photoetching mechanism, the first carrying table is provided with a first image acquisition device, when the substrate is placed on the first carrying table, a first image of the back surface of the substrate is acquired, a second image acquisition device is arranged above the second carrying table, and the second image acquisition device acquires a second image according to the position of the first image on the back surface of the substrate. The alignment of the front side and the back side of the substrate is realized based on the first image and the second image, and the image information is used as the mark point information, so that the alignment precision is higher.
Description
Technical Field
The present invention relates to a lithography system, and more particularly to a system for double-sided lithography of the front and back sides of a substrate.
Background
The photolithography technique is widely used in the field of semiconductor and PCB production, is one of the process steps for manufacturing products such as semiconductor devices, chips, PCB boards, etc., and is used to print characteristic patterns on the surface of a substrate, and finally obtain a pattern structure required according to circuit design. The traditional photoetching technology needs to make a master mask or a film negative film of a mask for exposure operation, the making period is long, and each plate corresponds to a single pattern and cannot be widely applied. In order to solve the above problems of the conventional lithography, the direct-write lithography has come to use, which utilizes the digital light processing technology to edit different required pattern structures through a programmable digital mirror device, so as to rapidly switch patterns, thereby not only reducing the cost, but also shortening the manufacturing cycle, and being widely applied to the lithography field. The principle of direct-write lithography is to transfer a design pattern to the surface of a substrate coated with a photosensitive material by a method of modulating a light beam, and then to obtain a required pattern structure through processes of developing, etching and the like.
For a printed circuit board, a form of a multilayer board is generally adopted, an inner layer board capable of communicating two sides is required in the multilayer board, and the inner layer board not only needs to be exposed on one side, but also needs to be exposed on two sides of the inner layer board. When the inner layer board is exposed, the front surface and the back surface of the inner layer board need to be exposed respectively, and meanwhile, the positions of the patterns on the front surface and the back surface of the inner layer board need to be ensured to be corresponding. Among the prior art, normally when the first side figure of inner plate front exposure, form the counterpoint mark through beating the mark device at the back of inner plate, after the inner plate front exposure was accomplished, upwards place the inner plate back, snatch the counterpoint mark that forms through beating the mark device through counterpoint camera, calculate the required accurate printing position of drawing the figure of second face. The marking device needs to use a laser, and a mark is formed on the back surface of the inner layer plate through the laser, but the energy of the laser is not easy to control, the shape of a mark boundary is easy to change, the boundary is difficult to accurately identify, and the precision is reduced.
Disclosure of Invention
The utility model aims to solve the technical problem that a photoetching system for improving counterpoint precision is provided.
In order to solve the problem, the utility model provides a photoetching system of two-sided photoetching, photoetching system includes first microscope carrier, second microscope carrier, photoetching mechanism and controller, the basement openly upwards place in first microscope carrier, the basement back upwards place in the second microscope carrier, photoetching mechanism carries out the photoetching operation to the basement, controller control first microscope carrier the second microscope carrier with photoetching mechanism, first microscope carrier is provided with first image acquisition device, and when the basement was placed in first microscope carrier, the basement acquireed the first image at the basement back, second microscope carrier top sets up second image acquisition device, second image acquisition device foundation first image is in the position at the basement back acquires the second image.
Further, the first image acquisition device comprises at least two first image acquisition units.
Further, the first image acquisition device and the second image acquisition device have the same magnification.
Further, the controller comprises an analysis module, the analysis module acquires a template picture based on the first image, and matches the template picture in the second image according to the pixel information of the template picture to acquire the position information of the central point of the template picture in the second image.
Further, the first image acquiring apparatus includes at least three first image acquiring units, two of the first image acquiring units are located at one side of the first stage, and at least one of the first image acquiring units is located at an adjacent side.
Further, the first stage has an opening, and the first image capturing device captures a first image of the back surface of the substrate through the opening.
Further, the opening is covered with a light-transmitting separation blade, a mark point is arranged on the part, which is not covered with the opening, of the light-transmitting separation blade, the mark point is close to the edge of the first carrying platform, and when the substrate is placed on the first carrying platform, the mark point is exposed.
Further, the lithography mechanism is located between the first stage and the second stage, and the first stage and the second stage respectively move to the lithography mechanism for performing lithography operation.
Further, the first stage and the second stage share the lithography mechanism or the second image acquisition device, and the first stage and the second stage are arranged in parallel, or the first stage and the second stage are at different plane heights and can move between the different plane heights.
Further, the lithography mechanism includes a first lithography mechanism and a second lithography mechanism, the first lithography mechanism corresponds to the first stage, and the second lithography mechanism corresponds to the second stage.
Compared with the prior art, the first image acquisition device acquires a first image on the back of the substrate, the second image acquisition device acquires a second image after the substrate is turned over, the front and back patterns of the substrate are aligned based on the first image and the second image, the image information is used as the mark point information, the mark point position is confirmed through regional matching, and the alignment precision is higher.
Drawings
FIG. 1 is a schematic diagram of a dual-sided lithography system.
Fig. 2 is a schematic diagram of an embodiment of a first stage.
Fig. 3 is a schematic diagram of another embodiment of the first stage.
FIG. 4 is a schematic diagram of a first embodiment of a lithography system.
FIG. 5 is a schematic diagram of a second embodiment of a lithography system.
FIG. 6 is a schematic diagram of a third embodiment of a lithography system.
FIG. 7 is a schematic diagram of a fourth embodiment of a lithography system.
Detailed Description
In order that the objects, aspects and advantages of the invention will become more apparent, the invention will be described by way of example only, and in connection with the accompanying drawings.
Fig. 1 to 3 show a lithography system for performing double-sided lithography on a substrate, the lithography system including a first stage 1, a second stage 2, and a controller, the first stage 1 and the second stage 2 are used for carrying the substrate, the first stage 1 is provided with a first image acquisition device 10, the first image acquisition device 10 is used for acquiring an image of the back of the substrate placed on the first stage 1 with the front side facing upward, the second stage 2 is correspondingly provided with a second image acquisition device 20, the second image acquisition device 20 is used for acquiring an image of the back of the substrate placed with the back side facing upward, the controller controls the first stage 1 and the second stage 2 to move, the controller includes an analysis module, the analysis module receives image information acquired by the first image acquisition device 10 and the second image acquisition device 20 and analyzes the images acquired by the first image acquisition device 10 and the second image acquisition device 20, and obtaining the relative position information of the substrate on the first stage and the second stage. Preferably, the first image capturing device 10 and the second image capturing device 20 have the same magnification, which may be a magnification, an enlargement magnification or a reduction magnification. The method comprises the steps that images obtained at different positions of a substrate material have different detailed characteristics, a first image at one position of the back of the substrate is obtained 10 through the first image, after the substrate moves to a second carrying table 2, the position of the substrate changes, the position of the first image is searched in the second image, and the relative position of the substrate after the substrate moves to different carrying tables is determined.
The front surface of the substrate is a surface on which a lithography operation is performed first, and in a stage in which the substrate is placed on the first stage 1, including a process of performing alignment and exposure operations on the substrate or a front stage and a rear stage of the above operations, the first image of the back surface of the substrate acquired by the first image acquisition device 10 is transmitted to an analysis module and stored. The substrate is turned over and moved to the second stage 2, at this time, the front surface of the substrate faces the second stage 2, the back surface of the substrate faces upward, and the second image acquiring device 20 acquires a second image of the back surface of the substrate at the same and close position of the back surface of the substrate according to the position of the first image acquiring device 10 acquiring the first image. The control module compares the information of the first image acquired by the first image acquiring device 10 with the information of the second image acquired by the second image acquiring device 20 to obtain the position information of the substrate placed on the second stage 2, and performs the lithography operation on the substrate according to the position information, so that the front pattern and the back pattern of the substrate are aligned.
After the substrate is turned over, in the process of aligning the substrate, the analysis module takes the first image acquired by the first image acquisition unit as a template picture, and finds the position matched with the template picture in the second image acquired by the second image acquisition unit. The template picture may be the whole of the first image, or a part of the image is cut from the first image to be used as the template picture, preferably, a part with obvious features in the first image is selected to be used as the template picture. The image is intercepted in the first image, so that the data operation amount can be reduced, and the problem caused by diffraction of light on the edge image when the first image is selected as the template picture can be avoided. Meanwhile, the image is intercepted from the first image to serve as the template image, the area shape of the template image is more flexible, and the appropriate area shape can be selected.
The analysis module finds the position of the template picture in the second image by using the information of the template picture and the second image and by using the modes of image correlation, shape matching and the like, and obtains the position information of the central point of the area which is arranged on the substrate of the second carrying platform and corresponds to the template picture. The mode of obtaining the position information of the central point through the regional matching of the template picture and the second image is not influenced by the edge shape, and the precision is higher.
Taking an image correlation matching mode as an example, the analysis module creates a data group template containing each pixel by using a template picture, and finds the central point position of the area corresponding to the template picture in the second image by using a normalized cross correlation algorithm according to the data group template.
Normalized cross correlation (ncc) is a method for mathematically determining whether there is a relationship between two sets of data. The calculation formula is as follows:
wherein:
wherein the size and sum of squares of any window can be calculated in advance from the integrogram;
wherein
Respectively representing the window mean values of the image to be detected and the reference template image. The NCC final result is between 0 and 1, making it easy to quantify the comparison results.
And the integral image is used for establishing the average value sum and the square sum of the image to be detected and the template image below the window and the cross product of the image to be detected and the template image, and five integral image indexes are used for completing the generation of the whole precomputation. By looking up the calculation result through the index table, the NCC can realize the complexity calculation of linear time, and the time consumption is approximately constant and is irrelevant to the size of an effective area.
And calculating and comparing each pixel of the first image and each pixel of the second image in a normalized cross correlation mode, and acquiring the position corresponding to the template picture in the second image so as to obtain the position of the central point of the corresponding area of the template picture in the second image.
The first stage has at least two openings 11, and the openings 11 are covered by a light-transmitting barrier 12 to prevent dust from affecting the quality of the image acquired by the first image acquiring unit 10. The openings can be regular or irregular patterns, such as circles, squares, scalene polygons, curved patterns and the like, and preferably, the openings are regular patterns, so that the position of the center point of the patterns is easy to calculate. The first image acquisition device 10 acquires at least two images through the opening 11. The first image acquiring device 10 is provided with a corresponding first image acquiring unit 13 corresponding to the opening 11, and the first image acquiring unit 13 includes a light source, which may be a coaxial light source, an annular light source, etc., and is convenient for acquiring an image and calibrating a position. A second image acquiring device 20 is arranged above the second stage 2, the second image acquiring device 20 includes at least one image acquiring unit 21 and a driving unit, the second image acquiring unit 21 is used for acquiring an image, and the driving unit is used for driving the second image acquiring unit 21 to move to a corresponding position of the substrate. As shown in fig. 3, preferably, the first stage 1 has three openings 11, two of the openings 11 are located at one side of the first stage 1, and the other opening 11 is located at the adjacent side of the first stage 1. Preferably, the part of the transparent blocking sheet not covering the opening is provided with a mark point 15, the mark point is close to the edge of the first stage 1, when the substrate is placed on the first stage 1, the mark point can be exposed, and the alignment camera corresponding to the first stage 1 obtains the relative position of the front surface of the substrate according to the position of the mark point.
Before the first stage 1 places a substrate, the first image acquisition unit 13 is calibrated first. The coaxial light source used in the first image capturing unit 13 is turned on, and the light source forms a light beam having the same shape as the opening through the opening 11 and the light-transmitting shutter 12. And the alignment camera corresponding to the first stage 1 captures the pattern formed by the light beam, and records the coordinate of the first image acquisition unit 13 on the first stage 1 at this time, so as to complete the calibration work.
The front side of a substrate is placed upwards on the first carrying platform 1, the front side of the substrate is subjected to alignment exposure, after the alignment exposure of the front side is completed, the first image acquisition unit 13 starts to acquire a first image through the light-transmitting blocking piece 12, the first image is taken as a template image or the template image is selected from the first image, the template image is stored locally, each first image acquisition unit 13 has a corresponding number, and the template image is stored according to the number of the first image acquisition unit 13. The template picture can be a regular or irregular figure, such as a circle, a square, a scalene polygon and the like, and preferably, the template picture is a regular figure, so that the position of the central point of the figure is easy to calculate. After the front exposure is finished, the left and right turning plates start the back contraposition exposure.
The analysis module calculates the reference position of the corresponding area of the template picture on the second carrier according to the position of the first image acquisition unit, the second image acquisition unit 21 moves to the reference position of the template sample to acquire the second image of the area, calls the template picture stored before according to the number of the first image acquisition unit 13, creates an NCC template, finds the corresponding position of the template picture in the second image according to the template picture, and acquires the central point position of the corresponding area of the current template picture, namely the coordinate value of the central point. Besides the position information of the central point, the rotation angle of the corresponding area of the current template picture relative to the template picture and the similarity of the two can be obtained at the same time, so as to control the alignment accuracy.
The first stage 1 and the second stage 2 may use the same lithography mechanism and the same alignment mechanism to perform pattern exposure on the substrate, or use different lithography mechanisms and different alignment mechanisms to perform pattern exposure on the substrate, or use different alignment mechanisms and the same lithography mechanism to perform pattern exposure on the substrate. The first stage 1 is provided with a first image acquisition unit, and when the back surface of the substrate faces the first stage, the first image is acquired to obtain a template picture, or the first image acquisition unit can be arranged on the second stage as required.
Specifically, as shown in fig. 4, the lithography system includes a first stage 100, a first lithography mechanism 300, a first alignment mechanism 400, a second stage 200, a second lithography mechanism 500, a second alignment mechanism 600, and a turnover mechanism, where the second alignment mechanism 600 is a second image acquisition device, and is configured to acquire an image of the back surface of the substrate. The first stage is provided with a first image acquisition device 101. The front side of the substrate is placed upwards on the first stage 100, the first stage 100 moves to the first alignment mechanism 400 for alignment operation, and then moves to the first lithography mechanism 300 for exposure operation, and in this process, the first image capturing mechanism 101 captures an image of the back side of the substrate through an opening in the first stage 100. After the substrate is exposed, the substrate is moved to the turnover mechanism, and the back of the substrate is placed on the second carrying platform 200 upwards through the turnover of the turnover mechanism. The second alignment mechanism 600 captures a to-be-detected picture in a corresponding area on the back of the substrate according to the position of the image acquired by the first image acquisition device 101, finds the corresponding position of the template in the to-be-detected picture according to the template picture acquired by the first image acquisition device 101, and acquires position information, wherein the position information includes the position, the similarity and the like of the template.
As shown in fig. 5, the lithography system includes a first stage 100, a lithography mechanism 300, an alignment mechanism 400, a second stage 200, and a turnover mechanism, where the alignment mechanism 400 is a second image capturing device, the first stage 100 and the second stage 200 are arranged in parallel, the lithography mechanism 300 and the alignment mechanism 400 are arranged in a sliding manner, the lithography mechanism 300 and the alignment mechanism 400 move above the first stage 100 or the second stage 200 corresponding to the positions of the first stage 100 and the second stage 200 to perform alignment or exposure operation on the first stage 100 or the second stage 200, and the first stage 100 is provided with a first image capturing device 101. The front side of the substrate is placed on the first stage 100 upwards, the first stage 100 moves to the alignment mechanism 400 for alignment operation, and then moves to the photolithography mechanism 300 for exposure operation, during which the first image capturing device 101 captures an image of the back side of the substrate through an opening on the first stage 100. After the substrate is exposed, the substrate is moved to the turnover mechanism, and the back of the substrate is placed on the second carrying platform 200 upwards through the turnover of the turnover mechanism. The alignment mechanism 400 captures a to-be-detected picture in a corresponding region on the back of the substrate according to the position of the image acquired by the first image acquisition device 101, finds the corresponding position of the template in the to-be-detected picture according to the template picture acquired by the first image acquisition device 101, and acquires position information, wherein the position information includes the central position, the similarity and the like of the template picture.
As shown in fig. 6, the lithography system includes a first stage 100, a lithography mechanism 300, an alignment mechanism 400, a second stage 200, and a turnover mechanism, where the heights of the top surfaces of the first stage 100 and the second stage 200 can be adjusted in a vertical direction, and at least the first stage 100 and the second stage 200 are at different heights of the top surfaces when moving relatively. The lithography mechanism 300 and the alignment mechanism 400 are fixedly disposed, the alignment mechanism 400 is a second image capturing device, and the second image capturing unit 401 is slidably disposed therein. The first stage 100 and the second stage 200 move to the alignment mechanism 400 and the lithography mechanism 300 respectively to perform alignment or exposure operation, and the first stage 100 is provided with a first image acquisition device. The front side of the substrate is placed on the first stage 100 upwards, the first stage 100 moves to the alignment mechanism 400 for alignment operation, and then moves to the photolithography mechanism 300 for exposure operation, during which the first image capturing device captures an image of the back side of the substrate through the opening on the first stage 100. After the substrate is exposed, the substrate is moved to the turnover mechanism, and the back of the substrate is placed on the second carrying platform 200 upwards through turnover of the turnover mechanism. The alignment mechanism 400 captures a to-be-detected picture in a corresponding region on the back of the substrate according to the position of the image acquired by the first image acquisition device, finds the corresponding position of the template picture in the to-be-detected picture according to the template picture acquired by the first image acquisition device, and acquires position information, wherein the position information includes the position, the similarity and the like of the template.
As shown in fig. 7, the lithography system includes a first stage 100, a lithography mechanism 300, a first alignment mechanism 400, a second stage 200, a second alignment mechanism 500, and a turnover mechanism, where the second alignment mechanism 500 is a second image acquisition device, the first alignment mechanism 400 and the second alignment mechanism 500 are located at two sides of the lithography mechanism 300, the first stage 100 performs alignment and exposure operations through the first alignment mechanism 400 and the lithography mechanism 300, and the second stage 200 performs alignment and exposure operations through the second alignment mechanism 500 and the lithography mechanism 300. The photoetching mechanism 300, the first aligning mechanism 400 and the second aligning mechanism 500 are fixedly arranged, and the image acquisition units 600 of the first aligning mechanism 400 and the second aligning mechanism 500 are arranged in a sliding mode. The first stage 100 and the second stage 200 perform alignment and exposure operations, respectively, and the first stage 100 is provided with a first image capturing device 101. The front side of the substrate is placed on the first stage 100 upwards, the first stage 100 moves to the first alignment mechanism 400 for alignment operation, and then moves to the lithography mechanism 300 for exposure operation, and in this process, the first image capturing device 101 captures an image of the back side of the substrate through an opening on the first stage 100. After the substrate is exposed, the substrate is moved to the turnover mechanism, and the back of the substrate is placed on the second carrying platform 200 upwards through the turnover of the turnover mechanism. The second alignment mechanism 500 captures a to-be-detected picture in a corresponding region on the back of the substrate according to the position of the image acquired by the first image acquisition device, and finds the corresponding position of the template picture in the to-be-detected picture according to the template picture acquired by the first image acquisition device to acquire position information, wherein the position information includes the position, the similarity and the like of the template.
The photoetching system is not only suitable for printed circuit boards, but also suitable for other substrates which are inconvenient to mark by a laser, such as silicon wafers and the like.
Claims (9)
1. A lithography system for double-sided lithography, the lithography system comprising a first stage, a second stage, a lithography mechanism and a controller, wherein the front side of a substrate is placed on the first stage upwards, the back side of the substrate is placed on the second stage upwards, the lithography mechanism performs lithography operation on the substrate, and the controller controls the first stage, the second stage and the lithography mechanism, characterized in that: the first carrying platform is provided with a first image acquisition device, when a substrate is placed on the first carrying platform, a first image of the back of the substrate is acquired, the second carrying platform is correspondingly provided with a second image acquisition device, the second image acquisition device acquires a second image according to the position of the first image on the back of the substrate, and the position information of the substrate is acquired through the first image and the second image.
2. The lithography system of claim 1, wherein: the first image acquisition device includes at least two first image acquisition units.
3. The lithography system of claim 1, wherein: the first image acquisition device and the second image acquisition device have the same magnification.
4. The lithography system of claim 1, wherein: the first image acquisition device comprises at least three first image acquisition units, wherein two first image acquisition units are positioned on one side edge of the first carrying platform, and at least one first image acquisition unit is positioned on the adjacent side edge.
5. The lithography system of claim 1, wherein: the first stage has an opening through which the first image capturing device captures a first image of the back surface of the substrate.
6. The lithography system of claim 5, wherein: the opening is covered by a light-transmitting separation blade, a mark point is arranged on the part, which is not covered by the opening, of the light-transmitting separation blade, the mark point is close to the edge of the first carrying platform, and when the substrate is placed on the first carrying platform, the mark point is exposed.
7. The lithography system of claim 1, wherein: the photoetching mechanism is positioned between the first carrying table and the second carrying table, and the first carrying table and the second carrying table respectively move to the photoetching mechanism to carry out photoetching operation.
8. The lithography system of claim 1, wherein: the first stage and the second stage share a lithography mechanism or a second image acquisition device, and the first stage and the second stage are arranged in parallel, or the first stage and the second stage are at different plane heights and can move between the different plane heights.
9. The lithography system of claim 1, wherein: the photoetching mechanism comprises a first photoetching mechanism and a second photoetching mechanism, the first photoetching mechanism corresponds to the first carrying table, and the second photoetching mechanism corresponds to the second carrying table.
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