CN114695792A

CN114695792A - Display panel and preparation method

Info

Publication number: CN114695792A
Application number: CN202210290456.0A
Authority: CN
Inventors: 魏屈平; 鲜于文旭
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-07-01

Abstract

The embodiment of the application discloses display panel and preparation method, including first base plate, two at least second base plates and separation protective layer, a plurality of second base plate concatenations set up on first base plate, there is the gap between the adjacent second base plate, the separation protective layer covers on the second base plate and fills the gap, adopt to cover the second base plate with the optical glue of a high water oxygen separation ability, form complete separation protective layer, make the second base plate not receive the separation protective layer that water oxygen invaded to improve the reliability of product.

Description

Display panel and preparation method

Technical Field

The application relates to the technical field of display, in particular to a display panel and a preparation method thereof.

Background

The current OLED display panel mainly adopts an ink-jet printing process to form a water and oxygen blocking structure formed by an overlapped structure of an organic packaging layer and an inorganic packaging layer in the display panel, so that a display screen is protected from being damaged by water and oxygen. However, for the tiled display panel, the second substrate is directly exposed in the air due to the existence of the gap between the tiled display panels, and the second substrate is easily damaged by water and oxygen for a long time, so that the service life of the display screen is influenced.

In the course of research and practice on the prior art, the inventors of the present application found that, in the conventional process for splicing the first substrate and the second substrate, a gap exists between the first substrate and the second substrate, which causes the first substrate to be corroded by water and oxygen from the gap for a long time, so that the conventional process cannot meet the reliability requirement of the spliced display panel.

Disclosure of Invention

The embodiment of the application provides a display panel, can cover the second base plate with the optical glue of a high water oxygen barrier ability, form complete separation protective layer, make the second base plate not infringe by water oxygen to improve the reliability of product.

An embodiment of the present application provides a display panel, including:

a first substrate;

the second substrates are spliced on the first substrate; a gap exists between the adjacent second substrates;

and the blocking protective layer covers the second substrate and fills the gap.

Optionally, in some embodiments of the present application, the barrier protection layer further encapsulates the side surfaces of the at least two second substrates, and is connected to the first substrate.

Optionally, in some embodiments of the present application, a transparent desiccant is further doped in the barrier protection layer.

Optionally, in some embodiments of the present application, a retaining wall is further disposed on the first substrate and surrounds the at least two second substrates, and the blocking protective layer is disposed on an inner side of the retaining wall.

Optionally, in some embodiments of the present application, a bonding layer is further disposed between the first substrate and the second substrate, and the bonding layer bonds the first substrate and the second substrate.

Optionally, in some embodiments of the present application, the display panel further includes a cover plate functional layer, and one of the cover plate functional layers is disposed corresponding to one of the second substrates; the cover plate functional layer is attached to one surface, far away from the second substrate, of the blocking protective layer.

Optionally, in some embodiments of the present application, the barrier protection layer and the conforming layer are made of the same material.

Optionally, in some embodiments of the present application, the first substrate includes:

a driving circuit layer including a thin film transistor;

at least one first bonding pad, which is arranged on the driving circuit layer and connected to the thin film transistor;

and the driving chip is arranged on the driving circuit layer and corresponds to the frame area of the first substrate.

Optionally, in some embodiments of the present application, the second substrate includes:

a light-emitting cover plate functional layer;

the packaging layer is arranged on one side, away from the first substrate, of the light-emitting cover plate functional layer, and the blocking protective layer is formed on the packaging layer;

the second bonding pad is connected to one side, close to the first substrate, of the light-emitting cover plate functional layer and is arranged corresponding to the first bonding pad, and the second bonding pad is electrically connected with the first bonding pad through conductive adhesive;

the laminating layer is packaged on the first bonding pad, the second bonding pad and the periphery of the conductive adhesive.

Optionally, in some embodiments of the present application, one of the first pad and the second pad is convex, the other of the first pad and the second pad is concave, and the first pad and the second pad are disposed in a concave-convex manner.

The embodiment of the application adopts the optical glue covering the second substrate with a high water oxygen blocking capability to form a complete blocking protective layer, and simultaneously encapsulates the first bonding pad and the second bonding pad to form a complete attaching layer and a blocking protective layer which enables the second substrate not to be damaged by water oxygen, thereby improving the reliability of the product.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a display panel according to an embodiment of the present disclosure;

fig. 2 is a schematic top view of a display panel according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of the structure and connection relationship of the first and second pads;

fig. 4 is a schematic structural diagram of a display panel according to a second embodiment of the present application;

fig. 5 is a schematic top view of a display panel according to a second embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a display panel fabrication method of the present application;

fig. 7 is a schematic structural diagram of a first substrate provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a second substrate according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a first substrate and a second substrate bonded in accordance with a second embodiment of the present disclosure;

fig. 10 is a schematic structural view of a functional layer of the cover plate of the present application.

Description of reference numerals: the display device comprises a display panel 100, a first substrate 10, a second substrate 20, a barrier protection layer 30, a bonding layer 40, a cover plate functional layer 50, a gap 60, a driving circuit layer 101, a thin film transistor 101a, a first bonding pad 102, a driving chip 103, a retaining wall 104, a light-emitting cover plate functional layer 201, a packaging layer 202, a second bonding pad 203, a conductive adhesive 204, a drying agent 30a, an optical membrane 501 and a cover plate 502.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In this application, where the context requires otherwise, the words "upper" and "lower" used in relation to the device in use or operation will generally refer to the upper and lower extremities of the device, particularly as oriented in the drawing figures; while "inner" and "outer" are with respect to the outline of the device.

The embodiments of the present application provide a display panel, which is described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

The first embodiment,

Referring to fig. 1 and fig. 2, an embodiment of the present invention provides a display panel 100, which includes: a first substrate 10, at least two second substrates 20, and a barrier protective layer 30. The plurality of second substrates 20 are arranged on the first substrate 10 in a tiled manner. A gap 60 exists between the adjacent second substrates 20. The blocking protective layer 30 covers the second substrate 20 and fills the gap 60.

It can be understood that the tiled display panel 100 adopts a tiled manner, and therefore it is inevitable that: gaps 60 exist among the second substrates 20, and the second substrates 20 are exposed in the air for a long time, so that water and oxygen invade the second substrates 20, the service life of the second substrates 20 is shortened, the second substrates 20 are covered by optical glue with high water and oxygen blocking capacity, a complete blocking protective layer 30 is formed, the second substrates 20 are prevented from being damaged by the water and oxygen, and the reliability of products is improved.

The barrier protection layer 30 also encapsulates the sides of the at least two second substrates 20 and is connected to the first substrate 10.

It is understood that the barrier protective layer 30 encapsulates the sides of the at least two second substrates 20 and is connected to the first substrate 10, and may prevent the intrusion of water and oxygen from the bottom and sides of the first substrate 10.

In this embodiment, the barrier protection layer 30 may be doped with a transparent desiccant 30 a.

It can be understood that the transparent desiccant 30a is doped in the barrier protection layer 30, so as to further improve the water and oxygen resistance of the barrier protection layer 30, further improve the applicability of the display panel 100 in warm and humid areas, and improve the market competitiveness of the product. In addition, the transparent desiccant 30a also has the function of changing the refractive index of the blocking protection layer 30, and when the refractive index of the blocking protection layer 30 of the product is more flexibly required, the refractive index of the blocking protection layer 30 is further changed by doping the transparent desiccant 30 a. The material of the barrier protective layer 30 includes: silica gel, epoxy sealant, acrylic glue, polyurethane glue and the like and modified optical glue thereof. The modification technology of the material comprises the following steps: grafting, blending, redesigning molecular structure and the like. The material of the transparent desiccant 30a includes anhydrous calcium chloride, magnesium chloride, silica gel, or the like. It should be noted that the optical performance of the optical Adhesive of the blocking protection layer 30 needs to be similar to that of the conventional optical Adhesive (OCA), the color is transparent and colorless, the transmittance is greater than 90%, the water absorption rate and the water vapor transmittance are low, the curing shrinkage rate is small, and the refractive index needs to be similar to that of other film layers.

In this embodiment, a retaining wall 104 surrounding at least two second substrates 20 may be further disposed on the first substrate 10, and the barrier protective layer 30 is disposed inside the retaining wall 104.

It can be understood that the blocking protection layer 30 is disposed on the inner side of the retaining wall 104, and when the blocking protection layer 30 is formed, the material of the blocking protection layer 30 can flow back, so that the formation of the blocking protection layer 30 is facilitated, the film forming quality of the blocking protection layer 30 is improved, and the retaining wall 104 can also play a role in blocking water and oxygen.

A bonding layer 40 is further disposed between the first substrate 10 and the second substrate 20, and the bonding layer 40 bonds the first substrate 10 and the second substrate 20.

It is understood that the adhesive layer 40 adheres the first substrate 10 and the second substrate 20 and also functions as a seal.

The barrier protection layer 30 and the adhesive layer 40 are made of the same material.

It can be understood that, when the adhesion layer 40 and the barrier protection layer 30 are made of the same material, a step of replacing the material can be omitted when forming the barrier protection layer 30 and the adhesion layer 40, which is more beneficial to the process production. And the adhesive layer 40 also has the ability to block water and oxygen.

In some embodiments, the material of the conforming layer 40 is different from that of the barrier protection layer 30, and the material of the conforming layer 40 is selected in a variety of ways because the barrier protection layer 30 mainly functions as a barrier to water and oxygen. For example, the material of the attaching layer 40 further includes a glue film, a tape or glue.

The display panel 100 further includes a cover plate functional layer 50, wherein a cover plate functional layer 50 is disposed corresponding to a second substrate 20; the cover plate functional layer 50 is attached to a surface of the blocking protection layer 30 away from the second substrate 20.

It is understood that the cover plate functional layer 50 includes a cover plate 502 and an optical film 501. The optical film 501 is attached to a surface of the barrier protective layer 30 away from the second substrate 20.

The blocking protective layer 30 has adhesiveness, so that the cover plate functional layer 50 can be directly attached to the blocking protective layer 30, and the adhesive material is saved.

A cover plate 502 is disposed on the optical film 501. The cover plate 502 is made of glass, polyimide, polyethylene terephthalate, woven cloth, polymethyl methacrylate, polyimide, or ultra-thin glass. The optical film 501 includes a diffusion sheet, a micro prism, a polarizer or a protection film, and it is understood that the optical film 501 may be used in combination to achieve a display effect.

The first substrate 10 includes: a driving circuit layer 101, at least one first bonding pad 102 and a driving chip 103. The driving circuit layer 101 includes a thin film transistor 101 a. The first pad 102 is disposed on the driving circuit layer 101 and connected to the thin film transistor 101 a. The driving chip 103 is disposed on the driving circuit layer 101 and corresponds to the frame region of the first substrate 10.

The second substrate 20 includes: a luminescent cover plate functional layer 201, an encapsulation layer 202 and a second pad 203. The encapsulation layer 202 is disposed on a side of the light-emitting cover plate functional layer 201 away from the first substrate 10, and the blocking protection layer 30 is formed on the encapsulation layer 202. The second bonding pad 203 is connected to one side of the light-emitting cover plate functional layer 201 close to the first substrate 10, and is disposed corresponding to the first bonding pad 102, and the second bonding pad 203 is electrically connected to the first bonding pad 102 through the conductive adhesive 204. Wherein, the laminating layer 40 is packaged at the peripheral sides of the first pad 102, the second pad 203 and the conductive adhesive 204.

It is understood that the light emitting cover plate function layer 201 may be an organic light emitting diode light emitting display, a quantum dot light emitting diode light emitting display, a micron-scale light emitting diode light emitting display, or a light emitting diode light emitting display. Since the material adopted by the adhesive layer 40 also has the ability of blocking water and oxygen, the adhesive layer 40 is packaged on the first pad 102, the second pad 203 and the periphery of the conductive adhesive 204, so that the packaging effect of the display panel 100 can be further improved.

Referring to fig. 3, one of the first pad 102 and the second pad 203 is convex, the other of the first pad 102 and the second pad 203 is concave, and the first pad 102 and the second pad 203 are arranged in a concave-convex manner.

It can be understood that the first pad 102 and the second pad 203 are disposed in a concave-convex fit manner, so that the contact area between the two pads can be increased, the stability between the first pad 102 and the second pad 203 can be improved, and the probability of poor contact can be reduced.

Fig. 3 is a schematic diagram showing a structure in which the first pad 102 is convex and the second pad 203 is concave. Fig. 3 is not intended to limit the shape of the first pad 102 and the second pad 203.

Example II,

Referring to fig. 4 and 5, the difference between the first embodiment and the second embodiment is that the retaining wall 104 is not included in the second embodiment. In the embodiment, the retaining wall 104 is eliminated, which is beneficial to realizing the narrow frame effect of the display panel 100.

Referring to fig. 4, an embodiment of the present invention provides a display panel 100, including: a first substrate 10, at least two second substrates 20, and a barrier protective layer 30. The plurality of second substrates 20 are arranged on the first substrate 10 in a tiled manner. A gap 60 exists between the adjacent second substrates 20. The blocking protective layer 30 covers the second substrate 20 and fills the gap 60.

It can be understood that the tiled display panel 100 is tiled, and therefore it is inevitable that: gaps 60 exist among the second substrates 20, and the second substrates 20 are exposed in the air for a long time, so that water and oxygen invade the second substrates 20, the service life of the second substrates 20 is shortened, the second substrates 20 are covered by optical glue with high water and oxygen blocking capacity, a complete blocking protective layer 30 is formed, the second substrates 20 are prevented from being damaged by the water and oxygen, and the reliability of products is improved.

In this embodiment, the barrier protection layer 30 may be doped with a transparent drying agent 30 a.

It is understood that the transparent desiccant 30a is doped in the barrier protection layer 30, so as to further improve the water and oxygen resistance of the barrier protection layer 30. The water and oxygen resistance of the barrier protective layer 30 is further improved, the applicability of the display panel 100 in warm and humid areas can be improved, and the market competitiveness of the product is improved. In addition, the transparent desiccant 30a also has the function of changing the refractive index of the blocking protection layer 30, and when the refractive index of the blocking protection layer 30 of the product is more flexibly required, the refractive index of the blocking protection layer 30 is further changed by doping the transparent desiccant 30 a. The material of the barrier protective layer 30 includes: silica gel, epoxy sealant, acrylic glue, polyurethane glue and the like and modified optical glue thereof. The modification technology of the material comprises the following steps: grafting, blending, redesigning molecular structure and the like. The material of the transparent desiccant 30a includes anhydrous calcium chloride, magnesium chloride, silica gel, or the like. It should be noted that the optical performance of the optical Adhesive of the blocking protection layer 30 needs to be similar to that of the conventional optical Adhesive (OCA), the color is transparent and colorless, the transmittance is greater than 90%, the water absorption rate and the water vapor transmittance are low, the curing shrinkage rate is small, and the refractive index needs to be similar to that of other film layers.

In some embodiments, the barrier protection layer 30 is not doped with a transparent desiccant, and the refractive index of the barrier protection layer 30 is relatively constant when the transparent desiccant 30a is not doped.

It will be appreciated that the cover plate functional layer 50 also includes a cover plate 502 and an optical membrane 501. The optical film 501 is attached to a surface of the barrier protective layer 30 away from the second substrate 20. The cover plate 502 is disposed on the optical film 501. The cover plate 502 is made of glass, polyimide, polyethylene terephthalate, woven cloth, polymethyl methacrylate, polyimide, or ultra-thin glass. The optical film 501 includes a diffusion sheet, a micro prism, a polarizer or a protection film, and it is understood that the optical film 501 may be used in combination to achieve a display effect.

The second substrate 20 includes: a luminescent cover plate functional layer 201, an encapsulation layer 202 and a second pad 203. The encapsulation layer 202 is disposed on the side of the light-emitting cover functional layer 201 away from the first substrate 10, and the blocking protection layer 30 is formed on the encapsulation layer 202. The second bonding pad 203 is connected to one side of the light-emitting cover plate functional layer 201 close to the first substrate 10, and is disposed corresponding to the first bonding pad 102, and the second bonding pad 203 is electrically connected to the first bonding pad 102 through the conductive adhesive 204. Wherein, the laminating layer 40 is packaged at the peripheral sides of the first pad 102, the second pad 203 and the conductive adhesive 204.

Example III,

Referring to fig. 6, the present embodiment further provides a method for manufacturing the display panel 100.

The method of manufacturing the display panel 100 includes the steps of:

step B1, providing a first substrate 10;

step B2, providing at least two second substrates 20, and splicing and arranging a plurality of second substrates 20 on the first substrate 10; a gap 60 exists between the adjacent second substrates 20;

step B3, covering the barrier protection layer 30 on the second substrate 20 and filling the gap 60;

in step B4, the cover plate functional layer 50 is bonded to the second substrate 20.

The following describes the manufacturing method of the display panel 100 in detail:

referring to fig. 7, in step B1, a first substrate 10 is provided. The first substrate 10 includes: a driving circuit layer 101, at least one first bonding pad 102 and a driving chip 103. The driving circuit layer 101 includes a thin film transistor 101 a. The first pad 102 is disposed on the driving circuit layer 101 and connected to the thin film transistor 101 a. The driving chip 103 is disposed on the driving circuit layer 101 and corresponds to the frame region of the first substrate 10.

The substrate of the driving circuit layer 101 may be flexible or rigid, and the substrate material of the driving circuit layer 101 includes: one of glass, sapphire, silicon, silica, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, aromatic fluorotoluene containing polyarylate, polycyclic olefin, polyimide, or polyurethane. The driving chip 103 is assembled on the driving circuit layer 101 through a bonding process and corresponds to the frame region. And then proceeds to step B2.

Referring to fig. 8 and 9, in step B2, providing at least two second substrates 20, and the step of splicing the plurality of second substrates 20 on the first substrate 10 includes:

step B21, disposing the conductive paste 204 on the first pad 102;

step B22, splicing a plurality of second substrates 20 on the first substrate 10, wherein the first pads 102 and the second pads 203 are bound and connected, and the adhesive layer 40 encapsulates the first pads 102, the conductive adhesive 204 and the peripheral sides of the second pads 203;

in step B21, the first pad 102 and the second pad 203 are connected by the conductive paste 204, and the conductive paste 204 may be an anisotropic conductive paste 204 film, an anisotropic conductive paste 204 adhesive, or a conductive paste 204 adhesive. And then proceeds to step B22.

In step B22, the adhesive layer 40 encapsulates the first pad 102, the conductive adhesive 204, and the second pad 203, and in this step, the adhesive layer 40 has viscosity and may have a certain water and oxygen barrier capability. The lamination layer 40 may be made of the same material as the barrier protection layer 30, and in this case, the lamination layer 40 also has water and oxygen barrier capability. The material of the adhesive layer 40 may further include an adhesive film, an adhesive tape, glue, etc., and the material is selected in a variety of ways.

The encapsulation layer 202 is formed on the light emitting cover plate functional layer 201 in such a manner that organic layers and inorganic layers are overlapped by an inkjet printing technique. And the encapsulation layer 202 also encapsulates both sides of the light emitting cover function layer 201. And then proceeds to step B3.

Referring to fig. 9 of the drawings, a schematic diagram of a display device,

step B3, the barrier protection layer 30 is covered on the second substrate 20 and fills the gap 60.

And then proceeds to step B4.

Referring to fig. 10, in step B4, the cover plate functional layer 50 is attached to the second substrate 20.

The cover plate functional layer 50 further includes a cover plate 502 and an optical film 501. The optical film 501 is attached to a surface of the barrier protective layer 30 away from the second substrate 20. A cover plate 502 is disposed on the optical film 501. The cover plate 502 is made of glass, polyimide, polyethylene terephthalate, woven cloth, polymethyl methacrylate, polyimide, or ultra-thin glass. The optical film 501 includes a diffusion sheet, a micro prism, a polarizer or a protection film, and it is understood that the optical film 501 may be used in combination to achieve a display effect.

Thus, the method for manufacturing the display panel of the embodiment of the present application is completed.

It should be noted that the above technical solutions can also form a new embodiment by a combination manner.

The display panel and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principle and the embodiment of the present application are explained herein by applying specific examples, and the description of the embodiments above is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A display panel, comprising:

a first substrate;

2. The display panel of claim 1, wherein the barrier protection layer further encapsulates the sides of the at least two second substrates and connects to the first substrate.

3. The display panel of claim 1, wherein the barrier protective layer is further doped with a transparent desiccant.

4. The display panel according to claim 2, wherein a retaining wall is further disposed on the first substrate around the at least two second substrates, and the barrier protective layer is disposed inside the retaining wall.

5. The display panel according to claim 1, wherein a bonding layer is further disposed between the first substrate and the second substrate, and the bonding layer bonds the first substrate and the second substrate.

6. The display panel according to claim 5, further comprising a cover functional layer, wherein one of the cover functional layers is disposed corresponding to one of the second substrates; the cover plate functional layer is attached to one surface, far away from the second substrate, of the blocking protective layer.

7. The display panel of claim 6, wherein the barrier protection layer and the conforming layer are the same material.

8. The display panel according to claim 5, wherein the first substrate comprises:

a driving circuit layer including a thin film transistor;

9. The display panel according to claim 8, wherein the second substrate comprises:

a light-emitting cover plate functional layer;

the packaging layer is arranged on one side, far away from the first substrate, of the light-emitting cover plate functional layer, and the blocking protective layer is formed on the packaging layer;

the second bonding pad is connected to one side, close to the first substrate, of the light-emitting cover plate functional layer and is arranged corresponding to the first bonding pad, and the second bonding pad is electrically connected with the first bonding pad through a conductive adhesive;

10. The display panel according to claim 9, wherein one of the first pad and the second pad is convex, wherein the other of the first pad and the second pad is concave, and wherein the first pad and the second pad are provided in a concavo-convex manner.