CN114695187A - 半导体封装件转移方法、半导体封装件转移模块及半导体封装件锯切和分拣装置 - Google Patents

半导体封装件转移方法、半导体封装件转移模块及半导体封装件锯切和分拣装置 Download PDF

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Publication number
CN114695187A
CN114695187A CN202111579949.8A CN202111579949A CN114695187A CN 114695187 A CN114695187 A CN 114695187A CN 202111579949 A CN202111579949 A CN 202111579949A CN 114695187 A CN114695187 A CN 114695187A
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China
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semiconductor packages
semiconductor
semiconductor package
tray
remaining
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CN202111579949.8A
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English (en)
Chinese (zh)
Inventor
李济秀
裴汉洙
李龙玹
李硕镇
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN114695187A publication Critical patent/CN114695187A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CN202111579949.8A 2020-12-29 2021-12-22 半导体封装件转移方法、半导体封装件转移模块及半导体封装件锯切和分拣装置 Pending CN114695187A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200185923A KR102630948B1 (ko) 2020-12-29 2020-12-29 반도체 패키지 이송 방법과 반도체 패키지 이송 모듈 및 반도체 패키지 절단 및 분류 장치
KR10-2020-0185923 2020-12-29

Publications (1)

Publication Number Publication Date
CN114695187A true CN114695187A (zh) 2022-07-01

Family

ID=82135475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111579949.8A Pending CN114695187A (zh) 2020-12-29 2021-12-22 半导体封装件转移方法、半导体封装件转移模块及半导体封装件锯切和分拣装置

Country Status (4)

Country Link
JP (1) JP2022104810A (ko)
KR (1) KR102630948B1 (ko)
CN (1) CN114695187A (ko)
TW (1) TWI811900B (ko)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611036A (ja) * 1984-06-13 1986-01-07 Internatl Rectifier Corp Japan Ltd 半導体チツプの整列方法
US6467824B2 (en) * 2001-03-13 2002-10-22 Data I/O Corporation Floating seal pick and place system and unit therefor
KR101305346B1 (ko) 2007-02-09 2013-09-06 한미반도체 주식회사 반도체 패키지 절단 및 핸들링 장치
JP2012069836A (ja) * 2010-09-27 2012-04-05 Juki Corp 電子部品実装装置
KR101228199B1 (ko) * 2010-11-22 2013-01-30 세크론 주식회사 반도체 소자에 대한 픽 앤 플레이스 공정을 수행하기 위한 피커의 압력 제어 방법 및 이를 수행하기 위한 제어 변수들을 설정하는 방법
KR101853287B1 (ko) * 2012-12-20 2018-05-02 (주)테크윙 테스트핸들러
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置
KR102446947B1 (ko) 2015-10-26 2022-09-23 세메스 주식회사 반도체 패키지 절단 및 분류 장치
JP2020194986A (ja) * 2020-09-04 2020-12-03 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法

Also Published As

Publication number Publication date
KR102630948B1 (ko) 2024-01-30
JP2022104810A (ja) 2022-07-11
TW202230585A (zh) 2022-08-01
KR20220094575A (ko) 2022-07-06
TWI811900B (zh) 2023-08-11

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