CN114678305B - Wafer film covering device and wafer splitting device - Google Patents
Wafer film covering device and wafer splitting device Download PDFInfo
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- CN114678305B CN114678305B CN202210581796.9A CN202210581796A CN114678305B CN 114678305 B CN114678305 B CN 114678305B CN 202210581796 A CN202210581796 A CN 202210581796A CN 114678305 B CN114678305 B CN 114678305B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
A wafer tectorial membrane device and wafer lobe of a leaf device, wafer tectorial membrane device includes: workstation, tectorial membrane mechanism, feed mechanism. The film covering mechanism comprises a film covering assembly and a film box, a first concave part is arranged in the center of the workbench, the film box is arranged on two sides of the first concave part, the film covering assembly is arranged above the film box, and the Mylar film in the film box is transferred into the first concave part; the feeding mechanism is arranged on one side of the film covering mechanism and is used for feeding the wafer into the first concave part. The wafer splitting device is also provided with a rolling mechanism, the rolling mechanism is arranged on the other side of the film covering mechanism and comprises a rolling component and a transfer component, the rolling component is arranged above the first concave part and used for enabling the wafer to be split into crystal grains, the transfer component comprises a moving unit and a turning unit, the moving unit moves the film covering wafer to the lower side of the rolling component, and the turning unit transfers the film covering wafer into a collecting box. The scheme can automatically cover Mylar films on two surfaces of the wafer, and can automatically crack the wafer, so that the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of chip production and processing equipment, in particular to a wafer film covering device and a wafer cracking device.
Background
In the production process of semiconductor chips, after a wafer is processed by related processes, chips with uniform intervals are formed on the wafer, the wafer needs to be subjected to splitting processing, so that the wafer becomes crystal grains, the chips on the wafer are divided, each crystal grain is a chip, and the wafer needs to be protected by a mylar sheet in the splitting process.
Disclosure of Invention
To the not enough of above-mentioned relevant prior art, the application provides a wafer tectorial membrane device and wafer lobe of a leaf device, can be automatically to two surface cover mylar sheets of wafer, can realize again that the automatic lobe of a leaf is handled to the wafer lobe of a leaf, improves production efficiency, has stronger practicality.
In order to achieve the above object, the present invention employs the following techniques:
a wafer laminating apparatus, comprising: workstation, tectorial membrane mechanism, feed mechanism.
One end of the workbench is provided with a concave part along the length direction; the film covering mechanism is arranged on the workbench and comprises a film covering assembly and two symmetrically arranged film boxes, a first concave part is arranged at the center of the workbench and used for bearing a wafer to be covered with a film, the film boxes are respectively arranged at two sides of the first concave part, and the film covering assembly is arranged above the film boxes and used for transferring a Mylar film in the film boxes into the first concave part and covering the Mylar film on the wafer; the feeding mechanism is arranged on the workbench and arranged on one side of the film covering mechanism and used for loading the wafer into the first concave part.
Further, the diaphragm box cross-section is right trapezoid, and its inclined plane is towards first concave part, the inclined plane of diaphragm box is equipped with the chute that runs through along its length direction, the diaphragm box is equipped with the export at the lower extreme on its inclined plane, and the export is connected with the chute, be equipped with the briquetting in the diaphragm box, the briquetting cross-section is triangle-shaped, and the right-angle face of briquetting is equipped with the ejector pin, the ejector pin passes the diaphragm box and wears to locate on a diaphragm, the diaphragm is installed on the workstation, still the cover is equipped with first spring on the ejector pin, diaphragm and briquetting are received respectively to first spring both ends.
Further, the tectorial membrane subassembly includes first lead screw, a supporting plate, first lead screw is installed in the horizontal pole, the horizontal pole is installed on the workstation along workstation width direction setting and through the support column, first motor is connected to first lead screw one end, first motor is installed on the horizontal pole, the cover is equipped with the slider on the first lead screw, the backup pad both ends all are equipped with the slide bar, one of them slide bar is movably worn to locate on the slider, the depression bar is worn to be equipped with by the backup pad in vertical direction, the depression bar lower extreme is equipped with first connection frame, be equipped with the gyro wheel in the first connection frame, be arranged in removing the Mylar piece in the diaphragm box to first recess, the depression bar upper end is equipped with the dog, be used for the butt to the backup pad top surface, still the cover is equipped with the second spring on the depression bar, first connection frame and backup pad are butts respectively to the second spring both ends.
Furthermore, one side of the cross rod is provided with a guide rod and two limiting plates which are symmetrically arranged with a preset distance between the two limiting plates, the guide rod and the limiting plates are both positioned above the membrane box, two ends of the guide rod are arranged on the cross rod through a support rod, the length direction of the guide rod is parallel to the length direction of the cross rod, the side surface of the guide rod is provided with a limiting groove along the length direction, wherein the other slide bar is arranged in the limit groove in a penetrating way, the slide bars are all sleeved with a third spring, one end of each slide bar is provided with a baffle, two ends of a third spring on one slide bar are respectively abutted to the slide block and the baffle, a limiting block is further sleeved on the other slide bar and abutted to the outer side wall of the guide rod, two ends of a third spring on the other sliding rod are respectively abutted to the limiting block and the baffle, and a glue dripping pipe is further arranged below the guide rod and used for dripping adhesive ink on the Mylar film and the wafer so as to adhere the Mylar film on the wafer; the top surface of one end of the supporting plate close to the sliding block is provided with a limiting rod, and the limiting rod is used for contacting with the side surface of the limiting plate.
Furthermore, the limiting plate comprises a straight line section and arc sections, one end of the straight line section is connected to the cross rod through a bump, one ends of the two arc sections are protruded towards the direction far away from the cross rod, and a preset distance is reserved between the bottom surface of the bump and the bottom surface of the limiting plate and used for penetrating through the limiting rod;
further, the center of guide bar is equipped with the changeover portion, and the changeover portion includes straight section and the crooked section of locating straight section both sides, and the length of straight section is greater than the distance between two segmental arcs, and the length sum of two segmental arcs and the length of changeover portion all do not exceed the width of first concave part.
Further, feed mechanism includes centre gripping subassembly and material frame, and the material frame is installed in the workstation below, and is located the region of depressed part to be close to the workstation center, depressed part length direction is equipped with first linear mechanism, and centre gripping subassembly is installed on first linear mechanism, is arranged in the wafer of centre gripping material frame to first concave part.
Furthermore, a bearing frame is arranged below the workbench, the material frame is arranged on the bearing frame, a T-shaped block is arranged at the bottom of the material frame, a clamping groove is formed in the surface of the bearing frame, the T-shaped block penetrates through the clamping groove, and a plurality of flat plates with uniform intervals are arranged in the material frame along the vertical direction and used for bearing the wafer;
further, still be equipped with the second recess in the first recess, be equipped with the layer board in the second recess, the layer board bottom surface is equipped with the telescopic link, and the telescopic link passes the workstation to the lower extreme of telescopic link is installed on the workstation.
Further, the clamping assembly comprises two transfer plates, one end of each transfer plate is installed on a connecting rod of a vertical arrangement, the upper ends of the two connecting rods are connected through a connecting plate, the connecting plate is sleeved on the moving end of a vertical lifting mechanism, the vertical lifting mechanism is installed on a moving rod, the moving rod is located in a concave portion, the two ends of the moving rod are sleeved on the moving end of a first linear mechanism respectively, a guide rod is further arranged on the bottom surface of each connecting plate, and the guide rod penetrates through the moving rod.
Furthermore, one end, far away from the connecting rod, of the top surface of the transfer plate is provided with a first barrier strip for preventing the wafer from falling off during transfer, through grooves are formed in two sides of the bottom surface of the first concave portion, one end of each through groove penetrates through the corresponding concave portion and is used for penetrating through the transfer plate, and the depth of each through groove is not smaller than the height of the corresponding first barrier strip.
A wafer cleaving apparatus, comprising: the wafer coating device and the rolling mechanism are used for coating the wafer.
Further, the rolling mechanism is arranged on the other side of the film laminating mechanism and is installed on the workbench, the rolling mechanism comprises a rolling assembly and a transfer assembly which are sequentially arranged, the rolling assembly is arranged above the first concave portion and is located on one side of the film laminating mechanism and used for rolling the film laminating wafer and enabling the wafer to be cracked into crystal grains, the transfer assembly comprises a moving unit and a turning unit, the moving unit is arranged below the first concave portion and is used for moving the film laminating wafer to the position below the rolling assembly, and the turning unit is arranged at one end of the first concave portion and used for transferring the film laminating wafer after rolling to a collecting box arranged on the workbench.
Further, the rolling assembly comprises a rolling wheel, the rolling wheel is installed in a second connecting frame, the upper end of the second connecting frame is sleeved on the moving end of the second linear mechanism, the second linear mechanism is arranged along the width direction of the workbench, second concave portions are arranged on two sides of one end, away from the feeding mechanism, of the first concave portion, the depth of each second concave portion is the same as that of the corresponding first concave portion, the rolling wheel is located in the corresponding second concave portion, and a preset distance is reserved between the bottom of the rolling wheel and the corresponding second concave portion.
Furthermore, the mobile unit comprises two pull plates which are symmetrically arranged, two sliding grooves are formed in the bottom surface of the first concave part along the length direction of the first concave part, the pull plates are located in the sliding grooves, the lower end of each pull plate is sleeved on a third linear mechanism, the third linear mechanism is arranged below the workbench and is arranged along the length direction of the third linear mechanism, and a second barrier strip is arranged on the top surface of one end, far away from the collecting box, of each pull plate and used for abutting against the film-coated wafer.
Further, the overturning unit comprises a rotating plate, a first groove is formed in one end, close to the collecting box, of the first concave portion, the rotating plate is located in the first groove, one end of the rotating plate is sleeved on the rotating shaft, the rotating shaft penetrates through the workbench, one end of the rotating shaft is connected with a second motor, and the second motor is installed on the workbench.
The invention has the beneficial effects that:
1. the feeding mechanism is used for automatically feeding the wafer in the film covering and splitting processes, so that the automatic processing of the film covering and splitting of the wafer is realized, the production efficiency is improved, and the automation degree of a production line is improved;
2. the film covering mechanism can automatically cover the Mylar films on the upper surface and the lower surface of the wafer without manual operation, film covering can be automatically carried out without manual operation, under the action of the second spring, the roller can be in close contact with the Mylar films, the Mylar films can be smoothly taken out of the membrane box by the roller, and meanwhile, under the action of the guide rod and the limiting plate, the roller can be moved out from the area of the chute in the process of moving from the bottom to the top of the membrane box, so that the roller is prevented from being in contact with the Mylar films in the process of moving upwards, and the pressing block can enable the Mylar films to be always attached to the inclined plane of the membrane box by the pressing block under the action of the first spring, so that the roller can conveniently drive the Mylar films to move;
3. two through grooves are formed in the first concave part and are used for penetrating through the transfer plate, so that the wafer can smoothly fall into the first concave part, and under the compression of the transfer plate, a part of the Mylar film in the first concave part is compressed into the through grooves, so that the interference between the first barrier strips and the wafer is avoided when the transfer plate is moved out of the through grooves;
4. a supporting plate which can be jacked by a telescopic rod is arranged in the first concave part and used for jacking the film-coated wafer to a preset height, so that the film-coated wafer can be conveniently transferred to the lower part of the rolling assembly by a pulling plate;
5. the second concave parts are arranged on the two sides of the first concave part and used for placing the rolling wheels, so that interference when the film-coated wafer is transferred to the lower part of the rolling assembly is avoided.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a schematic perspective view of an overall structure of a wafer film covering device and a wafer breaking device according to an embodiment of the present application.
Fig. 2 is a schematic perspective view of a workbench according to an embodiment of the present application.
Fig. 3 is an enlarged schematic view of a portion a of fig. 2.
Fig. 4 is a schematic perspective view of a material frame according to an embodiment of the present application.
FIG. 5 is a perspective view of a film covering assembly according to an embodiment of the present disclosure.
Fig. 6 is an enlarged schematic view of fig. 5 at B.
Fig. 7 is a schematic perspective view of a cross-sectional structure of a material frame according to an embodiment of the present application.
Fig. 8 is a perspective view of a clamping assembly according to an embodiment of the present application.
Fig. 9 is a schematic perspective view of a cross-sectional structure of a rolling mechanism according to an embodiment of the present application.
Fig. 10 is a top perspective view of a roller pressing mechanism according to an embodiment of the present application.
Description of reference numerals: 100-workbench, 200-laminating mechanism, 300-feeding mechanism, 400-rolling mechanism, 101-recess, 102-first recess, 103-collecting box, 104-transverse plate, 105-bearing frame, 106-clamping groove, 107-through groove, 108-second recess, 109-sliding groove, 110-first groove, 111-second groove, 112-supporting plate, 113-telescopic rod, 201-diaphragm box, 202-chute, 203-outlet, 204-pressing block, 205-ejector rod, 206-first spring, 207-first screw rod, 208-transverse rod, 209-supporting column, 210-first motor, 211-sliding block, 212-supporting plate, 213-sliding rod, 214-pressing rod, 215-first connecting frame, 216-roller, 217-block, 218-second spring, 219-guide rod, 2191-straight segment, 2192-bent segment, 220-limiting plate, 221-limiting groove, 222-third spring, 223-baffle, 224-limiting block, 225-limiting plate, 225-third spring, 226-limiting rod, 227-supporting rod, 301-material frame, 302-T-shaped block, 303-flat plate, 304-transfer plate, 305-connecting rod, 306-connecting plate, 307-moving rod, 308-guide rod, 309-first barrier strip, 401-rolling wheel, 402-second connecting frame, 403-pulling plate, 404-second barrier strip, 405-rotating plate, 406-rotating shaft, 407-second motor, 501-second screw rod, 502-supporting seat, 503-third motor, 601-first linear mechanism, 602-second linear mechanism, 603-third linear mechanism and 604-vertical lifting mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
One aspect of the embodiments of the present application provides a wafer film covering device, as shown in fig. 1 to 2, including: the working table 100, the film coating mechanism 200 and the feeding mechanism 300.
One end of the worktable 100 is provided with a concave part 101 along the length direction thereof; the film coating mechanism 200 is arranged on the workbench 100 and comprises a film coating assembly and two film boxes 201 which are symmetrically arranged, a first concave part 102 is arranged in the center of the workbench 100 and used for bearing a wafer to be coated, the film boxes 201 are respectively arranged on two sides of the first concave part 102, and the film coating assembly is arranged above the film boxes 201 and used for transferring a mylar sheet in the film boxes 201 into the first concave part 102 and covering the mylar sheet on the wafer; the loading mechanism 300 is mounted on the table 100 and disposed on one side of the film coating mechanism 200, and is used for loading wafers into the first recess 102.
Specifically, as shown in fig. 3 and 4, the cross section of the membrane box 201 is in a right trapezoid shape, and is used for placing a mylar sheet, and the inclined surface of the membrane box 201 faces the first concave portion 102, the inclined surface of the membrane box 201 is provided with a through chute 202 along the length direction thereof, the membrane box 201 is provided with an outlet 203 at the lower end of the inclined surface thereof, the mylar sheet enters the first concave portion 102 from the outlet 203, and the outlet 203 is connected with the chute 202, the membrane box 201 is provided with a pressing block 204, the cross section of the pressing block 204 is in a triangle shape, and the right-angle surface of the pressing block 204 is provided with a top bar 205, the top bar 205 penetrates through the membrane box 201 and is arranged on a horizontal plate 104, the horizontal plate 104 is mounted on the workbench 100, the top bar 205 is further sleeved with a first spring 206, two ends of the first spring 206 are respectively abutted to the horizontal plate 104 and the pressing block 204, under the action of the first spring 206, the pressing block 204 always has a tendency of moving towards the inclined surface of the membrane box 201, so that the mylar sheet can always adhere to the inclined surface of the membrane box 201, the Mylar film can be ensured to smoothly enter the first concave part 102 from the outlet 203.
Specifically, as shown in fig. 1, 4 to 6, the film covering assembly includes a first lead screw 207 and a support plate 212, the first lead screw 207 is installed in a cross bar 208, the cross bar 208 is installed along the width direction of the workbench 100 and installed on a support column 209, the support column 209 is installed on the workbench 100, the cross bar 208 is a predetermined distance away from the top surface of the membrane box 201, so as to conveniently place the mylar sheet into the membrane box 201, one end of the first lead screw 207 is connected with a first motor 210, the first motor 210 is installed on the cross bar 208, a slider 211 is sleeved on the first lead screw 207, slide bars 213 are respectively installed at two ends of the support plate 212, one slide bar 213 is movably inserted on the slider 211, a press rod 214 is vertically inserted on the support plate 212, a first connection frame 215 is installed at the lower end of the press rod 214, a roller 216 is installed in the first connection frame 215 and is used for moving the mylar sheet in the membrane box 201 into the first concave 102, a stopper 217 is installed at the upper end of the press rod 214, the pressing rod 214 is used for abutting against the top surface of the supporting plate 212, the second spring 218 is further sleeved on the pressing rod 214, two ends of the second spring 218 abut against the first connecting frame 215 and the supporting plate 212 respectively, and under the action of the second spring 218, the roller 216 can be ensured to be in close contact with the mylar sheet when the mylar sheet is transferred into the first concave portion 102.
Specifically, as shown in fig. 5 and 6, a guide rod 219 and two limit plates 220 are disposed on one side of the cross bar 208, the two limit plates 220 are symmetrically disposed with a predetermined distance therebetween, a limit rod 226 is disposed on a top surface of one end of the support plate 212 close to the slider 211, the limit rod 226 is used for contacting with a side surface of the limit plate 220, under the action of the limit plate 220, the limit rod 226 can be deflected, so as to drive the roller 216 to move out of the area of the chute 202, and when the mylar sheet needs to be transferred, the roller 216 moves back to the area of the chute 202, the guide rod 219 and the limit plate 220 are both located above the membrane cassette 201, both ends of the guide rod 219 are mounted on the cross bar 208 through a support rod 227, the length direction of the guide rod is parallel to the length direction of the cross bar 208, a limit groove 221 is disposed on the side surface of the guide rod 219 along the length direction, wherein another slide bar 213 is inserted into the limit groove 221, a third spring 222 is sleeved on the slide bar 213, slide bar 213 one end all is equipped with baffle 223, and slider 211 and baffle 223 are supported respectively to the third spring 222 both ends on one of them slide bar 213, and wherein still the cover is equipped with stopper 224 on another slide bar 213, and stopper 224 supports to guide bar 219 the lateral wall, and wherein the third spring 222 both ends on another slide bar 213 support stopper 224 and baffle 223 respectively, and guide bar 219 below still is equipped with the glue dripping pipe for drip the glue ink on wheat pulling-on piece and the wafer, with the adhesion of wheat pulling-on piece on the wafer.
Specifically, as shown in fig. 5 and 6, the limiting plate 220 includes a straight line section and two arc-shaped sections, one end of the straight line section is connected to the crossbar 208 by a bump 225, one end of each of the two arc-shaped sections protrudes in a direction away from the crossbar 208, and a predetermined distance is provided between the bottom surface of the bump 225 and the bottom surface of the limiting plate 220 for passing through the limiting rod 226.
Specifically, as shown in fig. 5 and 6, a transition section is disposed at the center of the guide rod 219, the transition section includes a straight section 2191 and a curved section 2192 disposed at two sides of the straight section 2191, the length of the straight section 2191 is greater than the distance between the two arc sections, the sum of the lengths of the two arc sections and the length of the transition section do not exceed the width of the first concave portion 102, and under the effect of the transition section, the third spring 222 on the left side of the guide rod 219 has a stronger elastic force, so that the limiting rod 226 can more easily enter the region on the right side of the limiting plate 220.
Specifically, as shown in fig. 1, the feeding mechanism 300 includes a clamping assembly and a material frame 301, the material frame 301 is installed below the worktable 100 and located in the area of the recessed portion 101 and near the center of the worktable 100, a first linear mechanism 601 is disposed in the length direction of the recessed portion 101, and the clamping assembly is installed on the first linear mechanism 601 and is used for clamping the wafer in the material frame 301 into the first recessed portion 102.
Specifically, as shown in fig. 1, 2 and 7, a bearing frame 105 is arranged below the workbench 100, a material frame 301 is mounted on the bearing frame 105, a T-shaped block 302 is arranged at the bottom of the material frame 301, a clamping groove 106 is arranged on the surface of the bearing frame 105, the T-shaped block 302 is arranged in the clamping groove 106 in a penetrating manner, so that the material frame 301 can be stably mounted on the bearing frame 105 to prevent the material frame from shaking when the wafer is transferred, and a plurality of flat plates 303 with uniform intervals are arranged in the material frame 301 along the vertical direction and used for bearing the wafer.
Specifically, as shown in fig. 2 and 3, a second groove 111 is further disposed in the first concave portion 102, a supporting plate 112 is disposed in the second groove 111, a telescopic rod 113 is disposed on a bottom surface of the supporting plate 112 and used for jacking up the film-coated wafer to a predetermined height, the telescopic rod 113 is driven by a lifting cylinder, the transfer assembly is conveniently transferred below the rolling assembly, the telescopic rod 113 penetrates through the worktable 100, and a lower end of the telescopic rod 113 is mounted on the worktable 100.
Specifically, as shown in fig. 1, fig. 2 and fig. 8, the clamping assembly includes two transfer plates 304, one end of each transfer plate 304 is respectively installed on a vertically disposed connecting rod 305, the upper ends of the two connecting rods 305 are connected through a connecting plate 306, the connecting plate 306 is sleeved on a moving end of a vertical lifting mechanism 604, the vertical lifting mechanism 604 is installed on a moving rod 307, the moving rod 307 is located in the recess 101, two ends of the moving rod 307 are respectively sleeved on moving ends of the linear mechanism, a guide rod 308 is further disposed on the bottom surface of the connecting plate 306, and the guide rod 308 penetrates through the moving rod 307, so that the lifting of the connecting rod 305 is more stable.
Specifically, as shown in fig. 2 to 3 and 8, a first barrier rib 309 is disposed at an end of the top surface of the transfer plate 304, which is away from the link 305, for preventing the wafer from falling off when the wafer is transferred, through grooves 107 are disposed at two sides of the bottom surface of the first recess 102, and one end of each through groove 107 penetrates through the recess 101 for penetrating through the transfer plate 304, and the depth of each through groove 107 is not less than the height of the corresponding first barrier rib 309, so as to prevent the first barrier rib 309 from interfering with the wafer when the transfer plate 304 is moved out of the through groove 107.
In another aspect of the embodiments of the present application, a wafer breaking apparatus is provided, as shown in fig. 1, including: the wafer coating device as described above, and the rolling mechanism 400.
Specifically, as shown in fig. 1 to 2, the rolling mechanism 400 is disposed at the other side of the film covering mechanism 200 and is installed on the workbench 100, and includes a rolling component and a transfer component, which are sequentially disposed, the rolling component is disposed above the first concave portion 102 and located at one side of the film covering mechanism 200, and is used for rolling the film covering wafer and breaking the wafer into crystal grains, the transfer component includes a moving unit and a turning unit, the moving unit is disposed below the first concave portion 102 and is used for moving the film covering wafer to below the rolling component, and the turning unit is disposed at one end of the first concave portion 102 and is used for transferring the rolled film covering wafer to the collecting box 103 disposed on the workbench 100.
Specifically, as shown in fig. 9 to 10, the rolling assembly includes a rolling wheel 401, the rolling wheel 401 is installed in a second connection frame 402, the upper end of the second connection frame 402 is sleeved on the moving end of a second linear mechanism 602, the second linear mechanism 602 is disposed along the width direction of the workbench 100, second recesses 108 are disposed on two sides of one end of the first recess 102 away from the feeding mechanism 300, the second recesses 108 have the same depth as the first recesses 102, the rolling wheel 401 is located in the second recess 108, so as to avoid interference between the rolling wheel 401 when the wafer is transferred to the lower side of the rolling assembly, and a predetermined distance is provided between the bottom of the rolling wheel 401 and the second recess 108, so as to avoid the rolling wheel 401 crushing the wafer.
Specifically, as shown in fig. 9 to 10, the moving unit includes two pull plates 403 which are symmetrically arranged, two sliding grooves 109 are formed in the bottom surface of the first concave portion 102 along the length direction of the first concave portion, the pull plates 403 are located in the sliding grooves 109, the lower end of the pull plates 403 is sleeved on a third linear mechanism 603, the third linear mechanism 603 is arranged below the workbench 100 and along the length direction of the workbench, and a second blocking strip 404 is arranged on the top surface of one end of the pull plates 403 away from the collecting box 103 and used for abutting against the film-coated wafer.
Specifically, as shown in fig. 9 to 10, the turning unit includes a rotating plate 405, one end of the first concave portion 102 close to the collecting box 103 is provided with a first groove 110, the rotating plate 405 is located in the first groove 110, one end of the rotating plate 405 is sleeved on a rotating shaft 406, the rotating shaft 406 is penetrated through the workbench 100, one end of the rotating shaft 406 is connected to a second motor 407, and the second motor 407 is installed on the workbench 100.
Specifically, as shown in fig. 1 to 2 and 9 to 10, the first linear mechanism 601, the second linear mechanism 602, the third linear mechanism 603, and the vertical lifting mechanism 604 all include a second lead screw 501, and one end of the second lead screw 501 is connected to the third motor 503. The second lead screw 501 of the first linear mechanism 601 is directly mounted on the workbench 100 and located at two sides of the recess 101, the third motor 503 of the first linear mechanism 601 is also mounted on the workbench 100, and the moving rod 307 is sleeved on the second lead screw 501 of the first linear mechanism 601; the second screw rods 501 of the second linear mechanism 602, the third linear mechanism 603 and the vertical lifting mechanism 604 are respectively installed in the supporting seats 502, the third motors 503 are respectively installed on the corresponding supporting seats 502, and the supporting seats 502 of the vertical lifting mechanism 604 are vertically installed on the moving rod 307. The connecting plate 306 is sleeved on the second screw rod 501 of the vertical lifting mechanism 604, the upper end of the second connecting frame 402 is sleeved on the second screw rod 501 of the second linear mechanism 602, and the lower end of the pulling plate 403 is sleeved on the second screw rod 501 of the third linear mechanism 603.
With reference to fig. 1 to 10, the detailed operation of the wafer coating device and the wafer breaking device of the present embodiment is described as follows:
firstly, a material frame 301 with wafers placed thereon is placed on a bearing frame 105 at the bottom of a workbench 100, a T-shaped block 302 at the lower part of the material frame 301 is clamped in a clamping groove 106 at the bottom surface of the bearing frame 105 to be stably installed, then a first linear mechanism 601 is started, a third motor 503 drives second screw rods 501 arranged at two sides of a concave part 101 to rotate, a moving rod 307 moves towards the material frame 301 until two transfer plates 304 enter the material frame 301, then the third motor 503 of a vertical lifting mechanism 604 is started to drive the second screw rods 501 connected with the third motor to rotate, a connecting plate 306 is lifted for a preset distance, so that the transfer plate 304 is driven to lift, the wafers on a flat plate 303 are lifted, then the moving rod 307 moves towards the left side for a preset distance, the wafers are taken out of the material frame 301, then the vertical lifting mechanism 604 is started again, the connecting plate 306 drives the transfer plate 304 to lift, until the bottom surface of the transfer plate 304 exceeds the top surface of the workbench 100, the second screw rods 501 on the two sides of the concave part 101 through the first linear mechanism 601 continue to drive the moving rod 307 to move towards the first concave part 102 until the connecting rod 305 abuts against one end of the concave part 101, then the transfer plate 304 is lowered into the through groove 107 through the vertical lifting mechanism 604 again, a mylar piece is already in the first concave part 102, the mylar piece part is pressed into the through groove 107 under the pressing of the transfer plate 304, and finally the moving rod 307 is moved towards the left side through the first linear mechanism 601, so that the wafer is in the first concave part 102, and the wafer is repeatedly conveyed into the first concave part 102;
before a wafer is placed in the first concave part 102, the first motor 210 is started to drive the first lead screw 207 to rotate, so that the slide block 211 is driven to move from one end of the first lead screw 207 to the center, in the process, the limiting rod 226 is positioned between the limiting plate 220 and the guide rod 219, the roller 216 is also positioned in the chute 202 of the membrane box 201, the two third springs 222 are also in a free state, as the slide block 211 continues to move to the center of the first lead screw 207, the roller 216 is in contact with a wheat pull tab in the membrane box 201, is taken out from the opening 203 and moves into the first concave part 102, and at the moment, the rubber dropping pipe arranged below the guide rod 219 drips adhesive ink on the wheat pull tab;
with the continuous movement of the sliding block 211, the limiting rod 226 abuts against the left side wall of the arc-shaped section of the limiting plate 220, under the limitation of the limiting plate 220, the limiting rod 226 can only deflect towards the left side in the moving process, at this time, the third spring 222 on the right side further compresses, the third spring 222 on the left side further relaxes, then, when the limiting rod 226 continues to move, the limiting block 224 enters the straight section 2191 of the guiding rod 219 after passing through the curved section 2192, and springs the limiting rod 226 from the gap between the two limiting plates 220 to the right side of the limiting plate 220 under the dual action of the third springs 222 on the left and right sides, as long as the sliding rod 213 is located at the straight section 2191 of the guiding rod 219, the state is maintained, as the sliding block 211 leaves from the center of the first screw rod 207, the limiting rod 226 abuts against the right side wall of the limiting plate 220, and under the blocking of the limiting plate 220, the limiting rod 226 deflects towards the right side, at this time, the third spring 222 on the left side gradually changes from the expanded state to the compressed state, the third spring 222 on the right side is gradually changed from a compressed state to an extended state, so that the roller 216 is deflected out of the area of the inclined groove 202, the roller 216 is prevented from contacting the mylar sheet in the film case 201 when moving to the two sides, and the state is kept when moving in the area of the straight section of the limit plate 220;
after the slider 211 moves to one end of the first lead screw 207, the limiting rod 226 passes through a gap between the lower part of the projection 225 and the limiting plate 220, and moves from the right side to the left side of the limiting plate 220 under the action of the third springs 222 on the left side and the right side, at this time, the roller 216 is again positioned in the area of the chute 202, then the first lead screw 207 is driven by the first motor 210 to rotate reversely, and the mylar sheet is continuously transferred to the first concave part 102, and so on;
after the roller 216 is removed from the area of the first recess 102, the loading mechanism 300 will transfer the wafer into the first recess 102 and cover the wafer, and then the dropping tube below the guiding rod 219 will drop the adhesive ink onto the wafer, and then the film covering assembly will cover a layer of the wafer;
then the telescopic rod 113 is started to lift the supporting plate 112 by a preset distance, so as to lift the film-coated wafer by a preset height, then the third motor 503 of the third linear mechanism 603, which is positioned below the workbench 100, is started to drive the second screw rod 501 connected with the third linear mechanism to rotate, so that the pulling plate 403 moves to the position below the film-coated wafer, then the supporting plate 112 is lowered by the telescopic rod 113, the film-coated wafer is positioned on the pulling plate 403, then the third linear mechanism 603 is started again to reverse the second screw rod 501, so as to move the film-coated wafer to the position below the rolling component, then the second linear mechanism 602 is started, the second screw rod 501 provided with the second connecting frame 402 is driven to rotate, so as to drive the rolling wheel 401 to move back and forth, so as to press the film-coated wafer into crystal grains, and the crystal grains are adhered between two mylar sheets due to the protection of the mylar sheets and the adhesion of the viscous ink, and finally the second motor 407 is started, the rotating shaft 406 is driven to rotate, so that the rotating plate 405 is driven to rotate, and the rolled film-coated wafer is overturned into the collecting box 103.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A wafer tectorial membrane device which characterized in that includes:
a table (100) having a recess (101) formed at one end thereof along the longitudinal direction thereof;
the film coating mechanism (200) is arranged on the workbench (100) and comprises a film coating assembly and two film boxes (201) which are symmetrically arranged, a first concave part (102) is arranged at the center of the workbench (100) and used for bearing a wafer to be coated, the film boxes (201) are respectively arranged on two sides of the first concave part (102), and the film coating assembly is arranged above the film boxes (201) and used for transferring a Mylar film in the film boxes (201) into the first concave part (102) and covering the Mylar film on the wafer;
tectorial membrane subassembly includes slider (211), backup pad (212), slider (211) are removed along horizontal pole (208) length direction, backup pad (212) both ends all are equipped with slide bar (213), one of them slide bar (213) are movably worn to locate on slider (211), depression bar (214) are worn to be equipped with in vertical direction by backup pad (212), depression bar (214) lower extreme is equipped with first connection frame (215), be equipped with gyro wheel (216) in first connection frame (215), be used for with wheat pulling piece in membrane box (201) move to in first concave part (102), horizontal pole (208) one side is equipped with two symmetrical arrangement and between has predetermined distance's limiting plate (220), one of them slide bar (213) are gone up the cover and are equipped with third spring (222), slide bar (213) one end all is equipped with baffle (223), one of them on slide bar (213) third spring (222) both ends are respectively butt joint slider (211) The top surface of one end, close to the sliding block (211), of the supporting plate (212) is provided with a limiting rod (226), and the limiting rod (226) is used for being in contact with the side surface of the limiting plate (220);
the limiting plate (220) comprises a straight line section and arc sections, one end of the straight line section is connected to the cross bar (208) through a lug (225), one ends of the two arc sections protrude towards the direction far away from the cross bar (208), and a preset distance is reserved between the bottom surface of the lug (225) and the bottom surface of the limiting plate (220) and used for penetrating through the limiting rod (226);
the feeding mechanism (300) is installed on the workbench (100) and arranged on one side of the film laminating mechanism (200) and comprises a clamping assembly and a material frame (301), the material frame (301) is installed below the workbench (100) and located in the area of the concave portion (101), a first linear mechanism (601) is arranged in the length direction of the concave portion (101), and the clamping assembly is installed on the first linear mechanism (601) and used for clamping a wafer in the material frame (301) into the first concave portion (102).
2. The wafer laminating device of claim 1, wherein the membrane cassette (201) is right trapezoid in cross section, the inclined surface of the diaphragm box (201) faces the first concave part (102), a through chute (202) is arranged on the inclined surface of the diaphragm box (201) along the length direction of the inclined surface, an outlet (203) is arranged at the lower end of the inclined surface of the diaphragm box (201), the outlet (203) is connected with the chute (202), a pressing block (204) is arranged in the membrane box (201), the section of the pressing block (204) is triangular, and the right-angle surface of the pressing block (204) is provided with a top rod (205), the top rod (205) penetrates through the diaphragm box (201) and is arranged on a transverse plate (104) in a penetrating way, the transverse plate (104) is arranged on the workbench (100), the top rod (205) is also sleeved with a first spring (206), two ends of the first spring (206) are respectively abutted to the transverse plate (104) and the pressing block (204).
3. The wafer lamination device according to claim 1, wherein the lamination assembly further comprises a first lead screw (207), the first screw rod (207) is arranged in the cross rod (208), the cross rod (208) is arranged along the width direction of the workbench (100) and is arranged on the workbench (100) through a support column (209), one end of the first screw rod (207) is connected with a first motor (210), the first motor (210) is arranged on the cross rod (208), the first screw rod (207) is sleeved with the sliding block (211), the upper end of the pressing rod (214) is provided with a stop block (217), for abutting against the top surface of the supporting plate (212), a second spring (218) is sleeved on the pressure lever (214), the two ends of the second spring (218) are respectively abutted to the first connecting frame (215) and the supporting plate (212).
4. The wafer film covering device according to claim 3, wherein a guide rod (219) is further disposed on one side of the cross rod (208), the guide rod (219) and the limit plate (220) are both located above the membrane cassette (201), two ends of the guide rod (219) are mounted on the cross rod (208) through a support rod (227) and have a length direction parallel to a length direction of the cross rod (208), a limit groove (221) is disposed on a side surface of the guide rod (219) along the length direction of the side surface, one of the other slide rods (213) is disposed in the limit groove (221), the other slide rod (213) is sleeved with the third spring (222), one of the other slide rods (213) is further sleeved with a limit block (224), the limit block (224) abuts against an outer side wall of the guide rod (219), and two ends of the third spring (222) on the other slide rod (213) abut against the limit block (224) and the stop respectively A plate (223), wherein a glue dripping pipe is arranged below the guide rod (219) and is used for dripping adhesive ink on the Mylar film and the wafer to adhere the Mylar film on the wafer;
the center of guide bar (219) is equipped with the changeover portion, the changeover portion includes straight section (2191) and locates crooked section (2192) of straight section both sides, the length of straight section (2191) is greater than two the distance between the segmental arc, and the sum of the length of two segmental arc and the length of changeover portion do not all exceed the width of first concave part (102).
5. The wafer film covering device according to claim 1, wherein a bearing frame (105) is arranged below the workbench (100), the material frame (301) is mounted on the bearing frame (105), a T-shaped block (302) is arranged at the bottom of the material frame (301), a clamping groove (106) is arranged on the surface of the bearing frame (105), the T-shaped block (302) is arranged in the clamping groove (106) in a penetrating manner, and a plurality of flat plates (303) with uniform intervals are arranged in the material frame (301) along the vertical direction and used for bearing a wafer;
a second groove (111) is further formed in the first concave portion (102), a supporting plate (112) is arranged in the second groove (111), an expansion rod (113) is arranged on the bottom surface of the supporting plate (112), the expansion rod (113) penetrates through the workbench (100), and the lower end of the expansion rod (113) is mounted on the workbench (100).
6. The wafer film covering device as claimed in claim 1, wherein the clamping assembly comprises two transfer plates (304), one end of each transfer plate (304) is respectively mounted on a vertically arranged connecting rod (305), the upper ends of the two connecting rods (305) are connected through a connecting plate (306), the connecting plate (306) is sleeved on the moving end of a vertical lifting mechanism (604), the vertical lifting mechanism (604) is mounted on a moving rod (307), the moving rod (307) is located in the recess (101), the two ends of the moving rod (307) are respectively sleeved on the moving end of the first linear mechanism (601), a guide rod (308) is further arranged on the bottom surface of the connecting plate (306), and the guide rod (308) penetrates through the moving rod (307).
7. The wafer film covering device as claimed in claim 6, wherein one end of the top surface of the transfer plate (304) far away from the connecting rod (305) is provided with a first barrier strip (309) for preventing falling off when transferring wafers, through grooves (107) are arranged on two sides of the bottom surface of the first concave part (102), one end of each through groove (107) penetrates through the concave part (101) for penetrating through the transfer plate (304), and the depth of each through groove (107) is not less than the height of the first barrier strip (309).
8. A wafer breaking device is characterized by comprising:
the wafer film coating device according to any one of claims 1 to 7; and
the rolling mechanism (400) is arranged on the other side of the film laminating mechanism (200) and mounted on the workbench (100), and comprises a rolling assembly and a transfer assembly which are sequentially arranged, wherein the rolling assembly is arranged above the first concave part (102) and located on one side of the film laminating mechanism (200) and used for rolling a film laminating wafer and enabling the wafer to be cracked into crystal grains, the transfer assembly comprises a moving unit and a turning unit, the moving unit is arranged below the first concave part (102) and used for moving the film laminating wafer to the lower side of the rolling assembly, and the turning unit is arranged at one end of the first concave part (102) and used for transferring the rolled film laminating wafer into a collecting box (103) on the workbench (100).
9. The wafer splitting apparatus according to claim 8, wherein the rolling assembly comprises a rolling wheel (401), the rolling wheel (401) is installed in a second connection frame (402), the upper end of the second connection frame (402) is sleeved on the moving end of a second linear mechanism (602), the second linear mechanism (602) is arranged along the width direction of the worktable (100), second concave portions (108) are arranged on two sides of one end of the first concave portion (102) far away from the loading mechanism (300), the depths of the second concave portions (108) and the first concave portions (102) are the same, the rolling wheel (401) is located in the second concave portions (108), and a predetermined distance is reserved between the bottoms of the rolling wheel (401) and the second concave portions (108).
10. The wafer splitting device according to claim 8, wherein the moving unit comprises two symmetrically arranged pulling plates (403), the bottom surface of the first concave portion (102) is provided with two sliding grooves (109) along the length direction thereof, the pulling plates (403) are located in the sliding grooves (109), the lower ends of the pulling plates (403) are sleeved on a third linear mechanism (603), the third linear mechanism (603) is arranged below the workbench (100) and along the length direction thereof, and the top surface of one end of the pulling plate (403) far away from the collection box (103) is provided with a second barrier strip (404) for abutting against the film-coated wafer.
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| CN202210581796.9A CN114678305B (en) | 2022-05-26 | 2022-05-26 | Wafer film covering device and wafer splitting device |
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| CN115116908B (en) * | 2022-08-22 | 2023-01-10 | 四川洪芯微科技有限公司 | Wafer groove corrosion device |
| CN118692971B (en) * | 2024-08-28 | 2024-10-29 | 四川上特科技有限公司 | Wafer splitting device |
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|---|---|---|---|---|
| JP2003324142A (en) * | 2002-04-30 | 2003-11-14 | Lintec Corp | Treatment method of semiconductor wafer and transfer device of semiconductor wafer for it |
| CN111462634A (en) * | 2020-05-14 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
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| JP2565919B2 (en) * | 1987-08-20 | 1996-12-18 | 日東電工株式会社 | Frame attachment device for mounting semiconductor wafer |
| JP2006156633A (en) * | 2004-11-29 | 2006-06-15 | Lintec Corp | Processing device of fragile member |
| KR101819162B1 (en) * | 2016-06-23 | 2018-02-28 | (주)크렌텍 | A vacuum laminator for bonding adhesive film to carrier wafer and a method for operating the same |
| CN111710622A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking machine |
| CN112046835A (en) * | 2020-09-23 | 2020-12-08 | 刘亚刚 | Anti-damage wafer film pasting device for integrated circuit chip production |
| CN113327878B (en) * | 2021-08-03 | 2021-10-08 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003324142A (en) * | 2002-04-30 | 2003-11-14 | Lintec Corp | Treatment method of semiconductor wafer and transfer device of semiconductor wafer for it |
| CN111462634A (en) * | 2020-05-14 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
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