CN205380793U - Afterbody hold -down mechanism and silicon bulk evolution cutting equipment - Google Patents
Afterbody hold -down mechanism and silicon bulk evolution cutting equipment Download PDFInfo
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- CN205380793U CN205380793U CN201620111413.1U CN201620111413U CN205380793U CN 205380793 U CN205380793 U CN 205380793U CN 201620111413 U CN201620111413 U CN 201620111413U CN 205380793 U CN205380793 U CN 205380793U
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Abstract
The utility model discloses a be applied to silicon bulk evolution cutting equipment's afterbody hold -down mechanism and silicon bulk evolution cutting equipment, silicon bulk evolution cutting equipment includes cutting mechanism and bearing frame, the bearing frame bottom is equipped with and supplies to bear the plummer of waiting to cut the silicon bulk, the afterbody hold -down mechanism include: locate the rotating member on bearing frame upper portion, locate compress tightly the piece on the rotating member, and locate bearing frame and connect in the driving piece of rotating member, when the cutting mechanism cutting when waiting to cut the silicon bulk, the driving piece drive the rotating member is in order to drive compress tightly rotatory a rotation, until compress tightly support press in wait to cut the afterbody of silicon bulk. Utilize the utility model discloses, can solve and wait to process the work piece among the prior art and beat easily and influence off -the -shelf quality scheduling problem when present cutting equipment cuts into the finished product of blocking.
Description
Technical field
This utility model relates to cutting field, particularly relates to a kind of afterbody hold-down mechanism being applied to silicon ingot evolution cutting equipment and silicon ingot evolution cutting equipment.
Background technology
Line cutting technology is evolution process technology more advanced in the world at present, its principle is by the diamond wire of high-speed motion, workpiece to be processed (such as: silicon rod, sapphire or other quasiconductor hard brittle materials) to be rubbed, the side's of cutting out ingot, thus reaching cutting purpose.In the cutting process to workpiece, the diamond wire guiding by guide roller, main line roller is formed a bracing cable net, and workpiece to be processed realizes the feeding of workpiece by the rise and fall of workbench, under the effect of compression pump, it is assemblied in the cooling water automatic spraying device on equipment and cooling water is sprayed to the cutting position of diamond wire and workpiece, diamond wire move back and forth and produce cutting, the hard brittle materials such as quasiconductor to be once cut into polylith simultaneously.Line cutting technology has efficiency height, production capacity height, precision advantages of higher compared with cutting with traditional knife saw sheet, grinding wheel and inner circle.
When workpiece to be processed is cut into the finished product of in bulk by current linear cutting equipment, workpiece to be processed is first carried out longitudinally cutting to obtain sheet of finished product by needs, carry out transverse cuts again and obtain the finished product of in bulk, but, linear cutting equipment is when cutting last row's silicon ingot, owing to only one arranges silicon ingot, own wt is inadequate, producing displacement, silicon ingot easily again contacts with diamond wire when displacement and causes cutting damage, affects the quality of finished product.
Utility model content
This utility model provides a kind of afterbody hold-down mechanism and silicon ingot evolution cutting equipment, for solve workpiece to be processed existing cutting equipment when cutting last row's silicon ingot easy displacement and affect the problem such as quality of finished product.
This utility model provides a kind of afterbody hold-down mechanism being applied to silicon ingot evolution cutting equipment on the one hand, described silicon ingot evolution cutting equipment includes cutting mechanism and carrying support body, being provided with mean for carrying the plummer of silicon ingot to be cut bottom described carrying support body, described afterbody hold-down mechanism includes: be located at the revolving part on described carrying support body top；It is located at the compressing member on described revolving part；And be located at described carrying support body and be connected to the actuator of described revolving part；When described cutting mechanism cuts described silicon ingot to be cut, described actuator drives described revolving part to drive described compressing member rotary motion, until described compressing member presses on the afterbody of described silicon ingot to be cut.
Alternatively, described revolving part includes: be fixedly arranged on two rotating shaft bases on described carrying support body；And it is located at the rotating shaft between two described rotating shaft bases；Described compressing member is arranged on described rotating shaft, and described actuator is connected to described rotating shaft to drive described rotating shaft to rotate.
Alternatively, described compressing member includes: depression bar, sets end including the card being arranged in described rotating shaft and sets the compression end of end relative to described card；And it is located at described compression end to press on the compression contact of described silicon ingot to be cut.
Alternatively, described card sets end and is provided with clamping assembly, described clamping assembly includes all with the first jigsaw of semi-circular recesses and the second jigsaw, described first jigsaw and described depression bar Construction integration molding, when, after described first jigsaw and described second jigsaw splicing, two described semi-circular recesses constitute the bayonet socket worn for described rotating shaft.
Alternatively, described compression contact includes: be located at the buffer spring of described compression end；And it is located in described buffer spring away from the pressure pad of one end of described compression end.
Alternatively, described compression end is equipped with screw rod, and described screw rod includes laying respectively at being arranged with the first end of clamp nut and being arranged with the second end of described buffer spring of described compression end both sides, and the length of described second end is less than the own length of described buffer spring.
Alternatively, described actuator includes: compression cylinder；And connecting rod, including being connected to first link of piston rod of described compression cylinder by flake bearing and being connected to the second link of described rotating shaft.
This utility model provides a kind of silicon ingot evolution cutting equipment on the other hand, including: base；Being located at the carrying support body on described base, be provided with mean for carrying the plummer of silicon ingot to be cut bottom described carrying support body, described plummer is provided with parallel multiple cutting seams；Cutting mechanism, including the cutting support being located on described base and parallel laying in a plurality of line of cut of described cutting support；When the convergence motion relative to described cutting support of described plummer, the silicon ingot described to be cut on described plummer is cut by described line of cut, and described line of cut is positioned at described cutting seam when cutting described silicon ingot to be cut；And above-mentioned afterbody hold-down mechanism.
Alternatively, described cutting support is added is provided with multipair cutting roller, and arbitrary is setting up and down to two described cutting rollers in described cutting roller, and correspondence is wrapped in the line of cut on cutting roller described in a pair and forms cutting net；Or described cutting support is added is provided with multipair cutting wheel, arbitrary to the described cutting wheel of two in described cutting wheel for setting up and down, the line of cut that correspondence is wrapped on multipair described cutting wheel forms cutting net.
Alternatively, described base is relatively set with a pair slide rail slided for described plummer and/or described cutting mechanism；Described slide rail is chute, and the bottom of described plummer is provided with the pulley be suitable in described chute；Or, described slide rail is provided with pulley, and the bottom of described plummer is provided with the chute of corresponding described pulley.
This utility model afterbody hold-down mechanism and silicon ingot evolution cutting equipment, at least have the following technical effect that or advantage:
By arranging afterbody hold-down mechanism on the carrying support body of silicon ingot evolution cutting equipment, when the cutting mechanism of silicon ingot evolution cutting equipment cuts described silicon ingot to be cut, described Lift Part declines and drives described rolled-up stock to press on by the silicon ingot to be cut of in bulk, make silicon ingot to be cut in the moment of cutting in bulk because the compacting of described rolled-up stock is without displacement of beating, thus the silicon ingot being not result in bulk is touched with line of cut and caused damage.
Accompanying drawing explanation
Fig. 1 is the perspective view of this utility model silicon ingot evolution cutting equipment.
Fig. 2 is the perspective view of this utility model afterbody hold-down mechanism.
Fig. 3 is the side view of this utility model afterbody hold-down mechanism.
Fig. 4 is this utility model afterbody hold-down mechanism side view on other direction.
Fig. 5 is the top view of this utility model afterbody hold-down mechanism.
Fig. 6 is the perspective view that this utility model afterbody hold-down mechanism is pressed in silicon ingot to be cut.
Fig. 7 is the side view that this utility model afterbody hold-down mechanism is pressed in silicon ingot to be cut.
Fig. 8 is that this utility model afterbody hold-down mechanism is pressed in the silicon ingot to be cut side view on other direction.
Fig. 9 is the top view that this utility model afterbody hold-down mechanism is pressed in silicon ingot to be cut.
Figure 10 is the side view of this utility model silicon ingot evolution cutting equipment.
Figure 11 is the side view that in this utility model silicon ingot evolution cutting equipment one embodiment, silicon ingot to be cut is positioned over plummer.
Figure 12 is the side view that in this utility model silicon ingot evolution cutting equipment one embodiment, line of cut is close in reserved uncut area, silicon ingot edge to be cut.
Figure 13 is the top perspective view of silicon ingot to be cut in Figure 12.
Figure 14 is that in this utility model silicon ingot evolution cutting equipment one embodiment, the push rod in lifting rotation mechanism correspond to cutting and stitches the side view of up jacking silicon ingot to be cut.
Figure 15 is that in this utility model silicon ingot evolution cutting equipment one embodiment, silicon ingot to be cut departs from when plummer plummer from the side view detached between silicon ingot to be cut and lifting rotation mechanism.
Figure 16 is that in this utility model silicon ingot evolution cutting equipment one embodiment, the push rod in lifting rotation mechanism drives silicon ingot to be cut to rotate the side view of a cutting angle.
Figure 17 be in this utility model silicon ingot evolution cutting equipment one embodiment silicon ingot to be cut rotate a cutting angle after the plummer side view mechanism that moves between silicon ingot to be cut and lifting rotation mechanism.
Figure 18 is that in this utility model silicon ingot evolution cutting equipment one embodiment, silicon ingot to be cut rotates the side view that lifting rotation mechanism declines after a cutting angle.
Figure 19 is that after in this utility model silicon ingot evolution cutting equipment one embodiment, silicon ingot to be cut rotates a cutting angle, line of cut treats the side view that cutting silicon ingot is full-cutting.
Detailed description of the invention
Below by way of specific instantiation, embodiment of the present utility model being described, those skilled in the art the content disclosed by this specification can understand other advantages of the present utility model and effect easily.This utility model can also be carried out by additionally different detailed description of the invention or apply, and the every details in this specification based on different viewpoints and application, can also carry out various modification or change under without departing from spirit of the present utility model.
It should be noted that, the structure of this specification institute accompanying drawings depicted, ratio, size etc., all only in order to coordinate the disclosed content of description, understand for those skilled in the art and read, it is not limited to the enforceable qualifications of this utility model, therefore do not have technical essential meaning, the adjustment of the modification of any structure, the change of proportionate relationship or size, under not affecting effect that this utility model can be generated by and the purpose that can reach, all should still drop on the disclosed technology contents of this utility model and obtain in the scope that can contain.Simultaneously, in this specification cited as " on ", D score, "left", "right", " centre " and " one " etc. term, it is merely convenient to understanding of narration, and it is not used to limit the enforceable scope of this utility model, the change of its relativeness or adjustment, changing under technology contents without essence, when being also considered as the enforceable category of this utility model.
Refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5, show this utility model silicon ingot evolution cutting equipment structural representation in one embodiment, wherein, Fig. 1 is the perspective view (in Fig. 1 not shown afterbody hold-down mechanism) of this utility model silicon ingot evolution cutting equipment, Fig. 2 is the perspective view of this utility model afterbody hold-down mechanism, Fig. 3 is the side view of this utility model afterbody hold-down mechanism, Fig. 4 is this utility model afterbody hold-down mechanism side view on other direction, and Fig. 5 is the top view of this utility model afterbody hold-down mechanism.It should be noted that, in this utility model, silicon ingot evolution cutting equipment except can carrying out cutting evolution to silicon ingot, other workpiece to be cut can also be cut, for instance: glass cover-plate, pottery, graphite, sapphire etc., following example are mainly described in detail for silicon ingot.Existing silicon ingot is when carrying out evolution, can first by silicon ingot dicing, then the silicon ingot of dicing one by one laterally disposed is being carried out cutting to obtain the finished product of in bulk on the table, when cutting last row's silicon ingot, owing to only one arranges silicon ingot, own wt is inadequate, can produce displacement, silicon ingot easily again contacts with diamond wire when displacement and causes cutting damage, affects the quality of finished product.As shown in Figure 6 and Figure 7, Fig. 6 is the perspective view that this utility model afterbody hold-down mechanism is pressed in silicon ingot to be cut, Fig. 7 is the side view that this utility model afterbody hold-down mechanism is pressed in silicon ingot to be cut, this utility model afterbody hold-down mechanism is when silicon ingot evolution cutting equipment cuts silicon ingot, actuator 82 drives revolving part 80 to drive compressing member 81 rotary motion, until compressing member 81 presses on the afterbody of silicon ingot 4 to be cut such that it is able to prevent silicon ingot 4 to be cut from producing displacement and causing cutting damage.
As shown in Figure 1, Figure 2 with shown in Fig. 6, this utility model shows the afterbody hold-down mechanism being applied to silicon ingot evolution cutting equipment in one embodiment, described silicon ingot evolution cutting equipment includes cutting mechanism 2 and carrying support body 1, being provided with mean for carrying the plummer 10 of silicon ingot 4 to be cut bottom carrying support body 1, described afterbody hold-down mechanism includes: be located at the revolving part 80 on carrying support body 1 top；It is located at the compressing member 81 on revolving part 80；And be located at carrying support body 1 and be connected to the actuator 82 of revolving part 80；When cutting mechanism 2 cuts silicon ingot 4 to be cut, actuator 82 drives revolving part 80 to drive compressing member 81 rotary motion, until compressing member 81 presses on the afterbody of silicon ingot 4 to be cut.
Hereinafter this utility model afterbody hold-down mechanism is described in detail.
Revolving part 80 is located at carrying support body 1 top, is used for rotatably compressing part.As shown in Figure 2 and Figure 6, revolving part 80 includes: be fixedly arranged on two rotating shaft bases 801 on carrying support body 1；And it is located at the rotating shaft 802 between two described rotating shaft bases 801；Compressing member 81 is arranged on rotating shaft 802, and actuator 82 is connected to rotating shaft 802 to drive rotating shaft 802 to rotate.Carrying support body 1 can be a rectangular block as depicted in figs. 1 and 2, plummer 10 is located at the side bottom in described rectangular block towards cutting mechanism 2, and protruding from described rectangular block, revolving part 80 and plummer 10 are positioned at same side, and are located at the upper part of this side.Rotating shaft base 801 can be through screw and is screwed together in this side, it is of course also possible to be otherwise secured to this side by welding etc..Being provided with mean for the perforating that rotating shaft 802 wears on rotating shaft base 801, rotating shaft base 801 can be the projection in one " convex " word, and this projection includes even a flange and two wing plates being located at described flange both sides.Described perforating is located on described flange, and described screw is by wearing wing plate and described rectangular block and then rotating shaft base 801 being fixedly arranged on described rectangular block.After the two ends of rotating shaft 802 wear the perforating on two rotating shaft bases 801 respectively, rotating shaft 802 should be parallel to plummer 10, and rotating shaft 802 can rotate relative to rotating shaft base 801.Rotating shaft 802 presses on the afterbody of silicon ingot 4 to be cut by rotarily driving compressing member 81.
As shown in Figure 2 and Figure 6, compressing member 81 is located on revolving part 80, for pressing on the afterbody of silicon ingot 4 to be cut.Further, compressing member 81 includes: depression bar 810, sets end including the card being arranged in rotating shaft 802 and sets the compression end of end relative to described card；And it is located at described compression end to press on the compression contact 811 of silicon ingot 4 to be cut.The described card of depression bar 810 sets end and is tightly opened in rotating shaft 802, when rotating shaft 802 rotates, and then depression bar 810 can be driven to rotate.The described card of depression bar 810 sets end can be arranged in rotating shaft 802 in the following manner: described card sets end and is provided with clamping assembly, and described clamping assembly is provided with mean for the bayonet socket that rotating shaft 802 wears；Described clamping assembly includes all with the first jigsaw of semi-circular recesses and the second jigsaw, when, after described first jigsaw and described second jigsaw splicing, two described semi-circular recesses constitute described bayonet socket；It is preferred that described first jigsaw and depression bar 810 Construction integration molding；Described first jigsaw and described second jigsaw are provided with pin hole, described first jigsaw and described second jigsaw and are spliced into described clamping assembly by latch.Preferably, as shown in Figure 8 and Figure 9, Fig. 8 is that this utility model afterbody hold-down mechanism is pressed in the silicon ingot to be cut side view on other direction, Fig. 9 is the top view that this utility model afterbody hold-down mechanism is pressed in silicon ingot to be cut, the quantity of compressing member 81 is multiple, and interval is equidistantly located on revolving part 80, when silicon ingot 4 to be cut is cut by line of cut 21, and compressing contact 811 when pressing on silicon ingot 4 to be cut, each compression contact 811 correspondence is between adjacent two lines of cut 21.
Further, as shown in Figure 2 and Figure 6, compress contact 811 to include: be located at the buffer spring of described compression end；And it is located in described buffer spring away from the pressure pad of one end of described compression end.Compress the spring on contact 811 and play cushioning effect, and compress the spring on contact and can regulate buffering capacity.Buffer spring can be located at described compression end in the following manner: one, the side that one end of buffer spring is tightly fixed in described compression end towards plummer either directly through modes such as welding or stickups；Two, described compression end is equipped with screw rod, and described screw rod includes the first end and the second end that lay respectively at described compression end both sides；It is preferred that described screw rod is screw mandrel, described compression end is provided with screw, and described screw rod is screwed together in described compression end；First end of described screw rod is arranged with clamp nut, is screwed together in the first end of described screw rod and then fixing described screw rod by described clamp nut；Buffer spring is sheathed on the second end of described screw rod, and the length of described second end is less than the drift of described buffer spring, and in which, one end of buffer spring only need to be resisted against the side of described compression end.Pressure pad is located in buffer spring away from the other end of described compression end, and in order to avoid the surface of silicon ingot to be cut is caused damage, pressure pad is that quality of rubber materials is constituted.
As shown in Figure 2 and Figure 6, actuator 82 is located at described rectangular block top and is connected to revolving part 80, and actuator 82 is used for driving revolving part 80 to rotate, and then drives compressing member to rotate the afterbody to press on silicon ingot 4 to be cut.Further, actuator 82 includes: compression cylinder 820 (or oil cylinder)；And connecting rod 821, including being connected to first link of piston rod of compression cylinder 820 by flake bearing 822 and being connected to the second link of rotating shaft 802.Compression cylinder 820 includes cylinder block and the movable piston rod being inserted in described cylinder block, and described rectangular block top is fixed in one end of described cylinder block, and one end of described piston rod is exposed to the other end of described cylinder block.First link of connecting rod 821 by flake bearing 82 be connected in described piston rod to be exposed to described cylinder block one end；Second link of connecting rod 821 is fixedly connected on rotating shaft, concrete, and described second link can pass through the above clamping assembly and tightly be arranged in rotating shaft.When the described piston rod of compression cylinder 820 forward extends out in described cylinder block, described piston rod promotes connecting rod 821 to rotate forward, and then connecting rod 821 is rotated axle 802 and rotates clockwise, rotating shaft 802 drives depression bar 810 to rotate, and depression bar 810 and then drive compress contact 811 and press on the afterbody of silicon ingot 4 to be cut；When the described piston rod of compression cylinder 820 is to after-contraction, described piston rod hauls connecting rod 821 and rotates backward, and then connecting rod 821 is rotated axle 802 and rotates counterclockwise, rotating shaft 802 drives depression bar 810 to rotate, and depression bar 810 and then drive compress contact 811 and be away from silicon ingot 4 to be cut.
This utility model provides a kind of silicon ingot evolution cutting equipment on the other hand, including: base 5；Being located at the carrying support body 1 on base 5, be provided with mean for carrying the plummer 10 of silicon ingot 4 to be cut bottom carrying support body 1, plummer 10 is provided with parallel multiple cutting seams 100；Cutting mechanism 2, including the cutting support 20 being located on base 5 and parallel laying in a plurality of line of cut 21 of cutting support 20；When plummer 10 convergence motion relative to cutting support 20, the silicon ingot to be cut 4 on plummer 10 is cut by line of cut 21, and line of cut 21 is positioned at cutting seam 100 when cutting silicon ingot 4 to be cut；And above-mentioned afterbody hold-down mechanism.It is preferred that after silicon ingot 4 to be cut first time has cut, be automatically rotated to, in order to realize silicon ingot 4 to be cut, the angle that second time cutting is required, described silicon ingot evolution cutting equipment farther includes to be located at the lifting rotation mechanism 3 of base 5.Wherein it is possible to be that carrying support body is slidedly arranged on base 5, it is also possible to be that cutting mechanism 2 is slidedly arranged on base 5, or carrying support body 1 and cutting mechanism 2 are all slidedly arranged on base 5；When carrying support body 1 and being slidedly arranged on base 5, the plummer being placed with silicon ingot to be cut slides in cutting support to cut silicon ingot to be cut；When cutting mechanism 2 is slidedly arranged on base 5, cutting support slides in being placed with the plummer of silicon ingot to be cut to cut silicon ingot to be cut；When carrying support body 1 and cutting mechanism 2 and being all slidedly arranged on base 5, it is placed with the plummer 10 of silicon ingot 4 to be cut and cutting support slide in opposition to cut silicon ingot to be cut.It is slidedly arranged on base 5 and is described in detail carrying support body 1 below.
Hereinafter this utility model silicon ingot evolution cutting equipment is described in detail.
As shown in figures 1 to 6, base 5, as the main body frame of this utility model silicon ingot evolution cutting equipment, carrying support body 1, cutting mechanism 2 and lifting rotation mechanism 3 are all located on base 5, wherein, carrying support body 1 is slidedly arranged on base 5, and cutting mechanism 2 is fixedly installed on the one end of base 5.It is preferred that for preventing carrying support body 1 from skidding off in base 5, as in figure 2 it is shown, the other end of base 5 is provided with baffle plate 6, baffle plate 6 can be curved.Carrying support body 1 is slidedly arranged between cutting mechanism 2 and baffle plate 6.Lifting rotation mechanism 3 is fixedly installed on base 5, and between cutting mechanism 2 and baffle plate 6, it is preferred that, lifting rotation mechanism 3 is near cutting mechanism 2.
Carrying support body 1 can be a rectangular block as depicted in figs. 1 and 2, and plummer 10 is located at the side bottom in described rectangular block towards cutting mechanism 2, and protrudes from described rectangular block.As shown in figures 1 to 6, plummer 10, it is used for carrying silicon ingot 4 to be cut, plummer 10 row is provided with multiple cutting seam 100.As shown in figures 1 to 6, plummer 10 can pass through but be not limited in the following manner and be slidedly arranged on base 5, base 5 is relatively set with a pair slide rail 70, plummer 10 is slidedly arranged on slide rail 70, the bracing frame 71 being slidedly arranged on respectively on a pair slide rail 70 relatively it is installed with bottom plummer 10, bracing frame 71 can be side plate as shown in figures 1 to 6, and described side plate top is fixed on bottom plummer 10, and described side plate bottom is slidedly arranged on slide rail 70.Slide rail 70 can be chute, it is positioned at the bracing frame 71 bottom plummer 10 and is provided with the pulley being suitable to described chute, in order to realize the sliding of Automated condtrol plummer 10, described pulley can be connected to drive motor, the traveling of plummer 10 is controlled with realization by controlling the operating of described drive motor, it is possible to make plummer 10 along described chute constantly near cutting mechanism 2, advance to the left, also can also make plummer 10 along chute away from cutting mechanism 2, advance to the right.In other embodiments, slide rail 70 can also be provided with pulley, it is positioned at the bracing frame 71 bottom plummer 10 and is provided with the chute of corresponding described pulley, in order to realize the sliding of Automated condtrol plummer 10, described chute can be connected to drive motor, the traveling of plummer 10 is controlled with realization by controlling the operating of drive motor, plummer 10 can be made constantly near cutting mechanism 2 along described pulley, advance to the left, it is possible to also make plummer 10 along described pulley away from cutting mechanism 2, advance to the right.
As shown in figures 1 to 6, cutting mechanism 2 includes being fixedly arranged on base 5 and being positioned at the cutting support 20 on the sliding set direction of plummer 10 and parallel laying in a plurality of line of cut 21 of cutting support 20.Line of cut 21 can apply to cut the diamond wire of parts to be processed (such as: crystalline silicon, pottery, glass, graphite, sapphire etc.).Cutting support 20 is added is provided with multipair cutting wheel 22, arbitrary is setting up and down to two cutting wheels 22 in cutting roller, each line of cut correspondence is wrapped on a pair pair of cutting wheel 22, and so, a plurality of line of cut 21 correspondence is wrapped on multipair cutting wheel 22 to form cutting net；Or cutting support is added is provided with multipair cutting roller, and arbitrary is setting up and down to two cutting rollers in cutting roller, and each line of cut correspondence is wrapped on a pair pair of cutting roller, so, a plurality of line of cut correspondence is wrapped on multipair cutting roller to form cutting net.Between adjacent two lines of cut 21 and row distance stitches the distance between 100 corresponding to two cuttings adjacent in plummer 10, thus when plummer 10 slides to cutting support 20, line of cut 21 can stitch 100 entrance to cut silicon ingot 4 to be cut along the cutting in plummer 1.Cutting support 20 can be as shown in Figure 1 in П type structure, and including a back timber 201 and the support beam 202 being positioned at back timber 201 opposite sides, a pair slide rail 70 is arranged at two and supports between beam 202.As shown in Figure 9 and Figure 10, when plummer 10 slides to cutting support 20 on slide rail 70, line of cut 21 stitches 100 entrance plummers 10 inside along the cutting in plummer 10 and silicon ingot 4 to be cut is cut, and line of cut 21 is always positioned at when cutting silicon ingot 4 to be cut in cutting seam 10.
It should be noted that the described afterbody hold-down mechanism being located on carrying support body 1 above-mentioned about be applied to silicon ingot evolution cutting equipment afterbody hold-down mechanism embodiment in be described in detail, succinct for description, again not followed by elaboration.Next, in conjunction with Fig. 1 and Fig. 6 to Figure 17, Figure 14 to Figure 18 is the process status schematic diagram of this utility model silicon ingot evolution cutting equipment cutting method, when silicon ingot 4 to be cut carries out evolution, namely silicon ingot 4 to be cut is when cutting, actuator 82 drives revolving part 80 to drive compressing member 81 rotary motion, until compressing member 81 presses on the afterbody of silicon ingot 4 to be cut, silicon ingot 4 to be cut will not be beated displacement under the compacting compressing contact 811, thus being not result in the silicon ingot after cutting and line of cut 21 is touched and caused damage.Hereinafter the use procedure of described afterbody hold-down mechanism is briefly described, as shown in Figure 7 to 10, silicon ingot 4 to be cut is when carrying out cutting for the first time, when silicon ingot 4 to be cut slides to cutting support 20 on slide rail 70, line of cut 21 stitches 100 entrance plummers 10 inside along the cutting in plummer 10 and silicon ingot 4 to be cut is cut, when line of cut 21 cuts silicon ingot 4 to be cut, the described piston rod of compression cylinder 820 forward extends out in described cylinder block, described piston rod promotes connecting rod 821 to rotate forward, and then connecting rod 821 is rotated axle 802 and rotates clockwise, rotating shaft 802 drives depression bar 810 to rotate, depression bar 810 and then drive compress contact 811 and press on the afterbody of silicon ingot 4 to be cut；Silicon ingot 4 to be cut is after carrying out first time cutting, silicon ingot 4 to be cut leaves a plurality of cutting gap 41 side by side, silicon ingot 4 to be cut slides backward away from cutting support 20 on slide rail 70, when line of cut 21 is completely withdrawn from out silicon ingot 4 to be cut, the described piston rod of compression cylinder 820 is to after-contraction, described piston rod hauls connecting rod 821 and rotates backward, and then connecting rod 821 is rotated axle 802 and rotates counterclockwise, rotating shaft 802 drives depression bar 810 to rotate, and depression bar 810 and then drive compress contact 811 and be away from silicon ingot 4 to be cut；When carrying out second time and cutting, when silicon ingot 4 to be cut slides to cutting support 20 on slide rail 70, line of cut 21 stitches 10 along the cutting in plummer 10 and is again introduced into plummer 1 inside and silicon ingot 4 to be cut is cut, when line of cut 21 second time cuts silicon ingot 4 to be cut, the described piston rod of compression cylinder 820 forward extends out in described cylinder block, described piston rod promotes connecting rod 821 to rotate forward, and then connecting rod 821 is rotated axle 802 and rotates clockwise, rotating shaft 802 drives depression bar 810 to rotate, depression bar 810 and then drive compress contact 811 and press on last row's silicon ingot of silicon ingot 4 to be cut, until line of cut 21 cuts whole silicon ingot to be cut 4, silicon ingot 4 to be cut is made to become the finished product of in bulk.
As shown in Figure 10 and Figure 11, this utility model provides is located at base 5, it is positioned at the lifting rotation mechanism 3 below plummer 10, including: mounting 30, the lifting support 35 on mounting 30 it is located at by elevating mechanism, it is located at the revolving part on described lifting support 35, and it is located at the push rod 33 on revolving part 80, here, described elevating mechanism includes the multiple elevating levers 31 being located between mounting 30 and described lifting support 35, elevating lever 31 can be connected with a lift cylinder and be controlled, the lifting of elevating lever 31 is controlled by controlling the operating of described lift cylinder, described lift cylinder can be arranged at base 5 or the inside of mounting 30.Revolving part 80 includes being set up on lifting support 35, swivel plate 32 for rotating, and push rod 33 is fixedly arranged on swivel plate 32.Swivel plate 32 can be through in the following manner and rotates, and lifting support 35 top is provided with rotating shaft base, and swivel plate 32 is located on rotating shaft base and engages each other with swivel bearing.Specifically, the top of rotating shaft base is provided with multiple first fluted disc, the bottom of swivel plate 32 is provided with multiple second fluted discs corresponding with the first fluted disc of rotating shaft base, in the present embodiment, the central authorities of the bottom of swivel plate 32 are additionally provided with a rotating shaft, and described rotating shaft is to be connected with a rotary cylinder and be controlled, and described rotary cylinder is arranged at the lower section of rotating shaft base, utilize rising rotary cylinder and rising rotating shaft, swivel plate 32 can be driven to rotate.It was verified that the table top running accuracy of swivel plate 32 is up within the scope of ± 3um.Swivel plate 32 is installed with push rod 33, so that push rod 33 can enter in cutting seam 10 when lifting rotation mechanism 3 rises, the width of push rod 33 is corresponding to the width of cutting seam 100, simultaneously so that silicon ingot 4 to be cut can be lifted off plummer 10 by push rod 33, the length of push rod 33 is more than the thickness of plummer 10.In actual applications, when lifting rotation mechanism 3 rises, namely when elevating lever 31 rises, as shown in figure 14, drive push rod 33 along cutting seam 100 up jacking silicon ingot 4 to be cut, the length of push rod 33 is more than the thickness of plummer 10, and then silicon ingot 4 to be cut is departed from plummer 10 under the jacking of push rod 33；When lifting rotation mechanism 3 rotates, when namely swivel plate 32 rotates, under the effect of the frictional force between push rod 33 and silicon ingot to be cut 4, push rod 33 drives silicon ingot 4 to be cut to rotate a cutting angle, and described cutting angle at least includes 90 ° or 270 °.It should be noted that, depart under the jacking of push rod 33 after plummer 10 at silicon ingot 4 to be cut, and before lifting rotation mechanism 3 rotates, refer to Figure 15, plummer 10 cutting support 20 sliding to the right dorsad need to be controlled and detach between silicon ingot 4 to be cut and lifting rotation mechanism 3, only at plummer 10 from after detaching between silicon ingot 4 to be cut and lifting rotation mechanism 3, refer to Figure 16, swivel plate 32 can rotate, and drives silicon ingot 4 to be cut to rotate a cutting angle by push rod 33.
It follows that in conjunction with Fig. 1 to Figure 19, for above-mentioned silicon ingot evolution cutting equipment, this utility model can be implemented by procedure below:
Step 1, refer to Fig. 1, Fig. 2, Figure 10, Figure 11 and Figure 12, is placed with the plummer 10 convergence motion relative to cutting support 20 of silicon ingot 4 to be cut, the line of cut on cutting support 20 stitches 100 along the cutting on plummer 10 and silicon ingot 4 to be cut is cut.Concrete, silicon ingot 4 to be cut is positioned on plummer 10, open described drive motor, and by controlling the operating of described drive motor, the plummer 10 being placed with silicon ingot 4 to be cut is advanced to the left, along described chute constantly near cutting support 20, in fig. 11, plummer 10 is moved to the left with silicon ingot 4 to be cut；Referring next to Figure 11 and Figure 12, when plummer 10 slides to cutting support 20 on slide rail 70, line of cut 21 stitches 100 entrance plummers 10 inside along the cutting in plummer 10 and silicon ingot 4 to be cut is cut, and line of cut 21 is always positioned at when cutting silicon ingot 4 to be cut in cutting seam 100.
It is preferred that when silicon ingot 4 to be cut carries out cutting for the first time, refer to Figure 11, Figure 12 and Figure 13, silicon ingot 4 edge to be cut is reserved with uncut area 40, and operator can design the width of uncut area 40 according to practical situation.Refer to Figure 13, silicon ingot 4 to be cut, after carrying out first time cutting, silicon ingot 4 to be cut also leaves a plurality of cutting gap 41 side by side simultaneously.When carrying out and cutting silicon ingot 4 to be cut for the first time, uncut area 40 is set, make first time cutting terminate rear sheet of silicon chip to be sticked together due to uncut area 40 in common one end, make described silicon chip when carrying out second time and cutting, not easily topple over, ensure that being smoothed out of silicon ingot evolution, and owing to silicon ingot 4 edge to be cut is reserved with uncut area 40, when carrying out cutting silicon ingot 4 to be cut for the first time, described afterbody hold-down mechanism is without carrying out the afterbody of silicon ingot 4 to be cut compressing operation.As shown in Figure 11, Figure 12 and Figure 14, when silicon ingot 4 to be cut carries out cutting for the first time, and when line of cut 21 is close in the uncut area 40 that silicon ingot 4 edge to be cut is reserved, by controlling the operating of described drive motor so that plummer 10 stops mobile and cutting support 20 sliding dorsad to the right.On slide rail 70, accurate sliding is carried out in order to realize plummer 10, such as, when line of cut 21 is close in the uncut area 40 that silicon ingot 4 edge to be cut is reserved, plummer 10 needs to stop mobile and cutting support 20 sliding dorsad to the right, cutting support 20 can arrange positioning component, the distance between plummer 10 and cutting support 20 can be obtained by described positioning component, and then may determine that whether line of cut 21 is close in the uncut area 40 that silicon ingot 4 edge to be cut is reserved, and then according to judged result, the operating of described drive motor is controlled.
Certainly, if silicon ingot to be cut 4 carry out first time cut time, it does not have uncut area 40 is set, namely line of cut 21 to silicon ingot 4 to be cut full-cutting/or carry out second time cutting time perform step 2.Perform step 2 time below to carry out second time cutting to be described in detail.
Step 2, when cutting mechanism 2 cuts silicon ingot 4 to be cut, actuator 82 drives revolving part 80 to drive compressing member 81 to rotate, until compressing member 81 presses on the afterbody of silicon ingot 4 to be cut.After line of cut 21 departs from silicon ingot 4 to be cut, when carrying out cutting for the second time, rotate silicon ingot 4 to cutting angle to be cut.nullConcrete，Rotate silicon ingot 4 to cutting angle to be cut to include: refer to Figure 14，Silicon ingot 4 to be cut is after cutting terminates for the first time，By controlling the operating of described drive motor，Make plummer 10 sliding to the right，In the process of plummer 10 sliding to the right，By above-mentioned positioning component orient plummer 10 slide onto above lifting rotation mechanism 3 time，Close described drive motor，Plummer 10 is made to stop sliding，Followed by the operating controlling described lift cylinder，Control elevating lever 31 to rise，And then described lifting support is risen overally，And drive is set up on described lifting support、Swivel plate 32 for rotating ramps up，Push rod 33 on swivel plate 32 is upwardly in cutting seam 100，And up jacking silicon ingot 4 to be cut，When swivel plate 32 upwards rises to the bottom being posted by plummer 10，Owing to the length of push rod 33 is more than the thickness of plummer 10，Silicon ingot to be cut 4 now departs from plummer 10 under the jacking of push rod 33.Next refer to Figure 15, when silicon ingot 4 to be cut departs from plummer 10, open described drive motor, by controlling the operating of described drive motor, plummer 10 is made to continue sliding to the right, when plummer 10 continues cutting support 20 sliding to the right dorsad and from after detaching between silicon ingot 4 to be cut and lifting rotation mechanism 3, cutting out described drive motor so that plummer 10 stops sliding.Next refer to Figure 16, control lifting rotation mechanism 3 rotate by controlling the operating of described rotary cylinder, the operating of described rotary cylinder drives swivel plate 32 to rotate, and swivel plate 32 rotarily drives push rod 33 and rotates.Under the effect of the frictional force between push rod 33 and silicon ingot to be cut 4, silicon ingot 4 to be cut is driven to rotate a cutting angle by push rod 33, described cutting angle at least includes 90 ° or 270 °, now, it can be seen that silicon ingot to be cut 4 first time cut seam 10 cuts the gap stayed from side view.Next refer to Figure 17, after push rod 33 drives silicon ingot 4 to be cut to rotate a cutting angle, open described drive motor, by controlling the operating of described drive motor, plummer 10 is made to continue sliding to the left, until plummer 10 towards cutting support 20 sliding and moves between silicon ingot 4 to be cut and lifting rotation mechanism 3, close described drive motor so that plummer 10 stops sliding.Then refer to Figure 18, by controlling the operating of described lift cylinder, control elevating lever 31 to decline, and then make described lifting support entire lowering, and drive be set up on described lifting support, for the swivel plate 32 that rotates to decline, lifting rotation mechanism 3 declines, until the silicon ingot to be cut 4 being positioned on push rod 33 falls within plummer 10 and push rod 33 departs from plummer 10.
nullRefer to Figure 19，When silicon ingot 4 to be cut falls within plummer 10 and push rod 33 departs from after plummer 10，Open described drive motor，And by controlling the operating of described drive motor，The plummer 10 being placed with silicon ingot 4 to be cut is continued towards cutting support 20 direction sliding，Along described chute constantly near cutting support 20，Along the cutting seam 100 on plummer 10, silicon ingot 4 to be cut is full-cutting by the line of cut 21 on cutting support 20，Complete the evolution of silicon ingot，When line of cut 21 cuts silicon ingot 4 to be cut，Line of cut 21 stitches 100 along the cutting in plummer 10 and is again introduced into plummer 10 inside and silicon ingot 4 to be cut is cut，When line of cut 21 cuts silicon ingot 4 to be cut，The described piston rod of compression cylinder 820 forward extends out in described cylinder block，Described piston rod promotes connecting rod 821 to rotate forward，And then connecting rod 821 is rotated axle 802 and rotates clockwise，Rotating shaft 802 drives depression bar 810 to rotate，Depression bar 810 and then drive compress contact 811 and press on last row's silicon ingot of silicon ingot 4 to be cut，Until line of cut 21 cuts whole silicon ingot to be cut 4，Silicon ingot 4 to be cut is made to become the finished product of in bulk.
This utility model afterbody hold-down mechanism and silicon ingot evolution cutting equipment, at least have the following technical effect that or advantage:
1) by arranging briquetting machine on the cutting support of cutting mechanism, when silicon ingot to be cut is when carrying out second time and cutting, described Lift Part declines and drives described rolled-up stock to press on by the silicon ingot to be cut of in bulk, make silicon ingot to be cut in the moment of cutting in bulk because the compacting of described rolled-up stock is without displacement of beating, thus the silicon ingot being not result in bulk is touched with line of cut and caused damage；
2) below plummer, lifting rotation mechanism is set by being positioned in the base, before silicon ingot to be cut carries out second time cutting, silicon ingot to be cut described in the rising jacking of lifting rotation mechanism departs from described plummer, and rotarily drive described silicon ingot to be cut and rotate a cutting angle, it is achieved thereby that be automatically adjusted the cutting angle needed for described silicon ingot to be cut, solve existing cutting equipment to need repeatedly to cut one by one when obtaining in bulk finished product and make cutting efficiency low, and need artificial upset to cause the problems such as waste of manpower cost, it is greatly improved work efficiency.
Obviously, this utility model can be carried out various change and modification without deviating from spirit and scope of the present utility model by those skilled in the art.So, if these amendments of the present utility model and modification belong within the scope of this utility model claim and equivalent technologies thereof, then this utility model is also intended to comprise these change and modification.
Claims (10)
1. the afterbody hold-down mechanism being applied to silicon ingot evolution cutting equipment, described silicon ingot evolution cutting equipment includes cutting mechanism and carrying support body, it is provided with mean for carrying the plummer of silicon ingot to be cut bottom described carrying support body, it is characterised in that described afterbody hold-down mechanism includes:
It is located at the revolving part on described carrying support body top；
It is located at the compressing member on described revolving part；And
It is located at described carrying support body and is connected to the actuator of described revolving part；When described cutting mechanism cuts described silicon ingot to be cut, described actuator drives described revolving part to drive described compressing member to rotate, until described compressing member presses on the afterbody of described silicon ingot to be cut.
2. afterbody hold-down mechanism as claimed in claim 1, it is characterised in that described revolving part includes:
It is fixedly arranged on two rotating shaft bases on described carrying support body；And
It is located at the rotating shaft between two described rotating shaft bases；Described compressing member is arranged on described rotating shaft, and described actuator is connected to described rotating shaft to drive described rotating shaft to rotate.
3. afterbody hold-down mechanism as claimed in claim 2, it is characterised in that described compressing member includes:
Depression bar, sets end including the card being arranged in described rotating shaft and sets the compression end of end relative to described card；And
It is located at described compression end to press on the compression contact of described silicon ingot to be cut.
4. afterbody hold-down mechanism as claimed in claim 3, it is characterized in that, described card sets end and is provided with clamping assembly, described clamping assembly includes all with the first jigsaw of semi-circular recesses and the second jigsaw, described first jigsaw and described depression bar Construction integration molding, when, after described first jigsaw and described second jigsaw splicing, two described semi-circular recesses constitute the bayonet socket worn for described rotating shaft.
5. afterbody hold-down mechanism as claimed in claim 3, it is characterised in that described compression contact includes:
It is located at the buffer spring of described compression end；And
It is located in described buffer spring away from the pressure pad of one end of described compression end.
6. afterbody hold-down mechanism as claimed in claim 5, it is characterized in that, described compression end is equipped with screw rod, described screw rod includes laying respectively at being arranged with the first end of clamp nut and being arranged with the second end of described buffer spring of described compression end both sides, and the length of described second end is less than the drift of described buffer spring.
7. afterbody hold-down mechanism as claimed in claim 2, it is characterised in that described actuator includes:
Compression cylinder；And
Connecting rod, including being connected to first link of piston rod of described compression cylinder by flake bearing and being connected to the second link of described rotating shaft.
8. a silicon ingot evolution cutting equipment, it is characterised in that including:
Base；
Being located at the carrying support body on described base, be provided with mean for carrying the plummer of silicon ingot to be cut bottom described carrying support body, described plummer is provided with parallel multiple cutting seams；
Cutting mechanism, including the cutting support being located on described base and parallel laying in a plurality of line of cut of described cutting support；When the convergence motion relative to described cutting support of described plummer, the silicon ingot described to be cut on described plummer is cut by described line of cut, and described line of cut is positioned at described cutting seam when cutting described silicon ingot to be cut；And
Afterbody hold-down mechanism as according to any one of claim 1 to 7.
9. silicon ingot evolution cutting equipment as claimed in claim 8, it is characterised in that
Described cutting support is added is provided with multipair cutting roller, and arbitrary is setting up and down to two described cutting rollers in described cutting roller, and correspondence is wrapped in the line of cut on cutting roller described in a pair and forms cutting net；Or
Described cutting support is added is provided with multipair cutting wheel, arbitrary to the described cutting wheel of two in described cutting wheel for setting up and down, the line of cut that correspondence is wrapped on multipair described cutting wheel forms cutting net.
10. silicon ingot evolution cutting equipment as claimed in claim 8, it is characterised in that
Described base is relatively set with a pair slide rail slided for described plummer and/or described cutting mechanism；
Described slide rail is chute, and the bottom of described plummer is provided with the pulley be suitable in described chute；Or, described slide rail is provided with pulley, and the bottom of described plummer is provided with the chute of corresponding described pulley.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620111413.1U CN205380793U (en) | 2016-02-02 | 2016-02-02 | Afterbody hold -down mechanism and silicon bulk evolution cutting equipment |
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| CN201620111413.1U CN205380793U (en) | 2016-02-02 | 2016-02-02 | Afterbody hold -down mechanism and silicon bulk evolution cutting equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105538524B (en) * | 2016-02-02 | 2017-07-04 | 上海日进机床有限公司 | Afterbody hold-down mechanism, silicon ingot evolution cutting equipment and silicon ingot evolution cutting method |
| CN110023255A (en) * | 2016-12-02 | 2019-07-16 | 日本电气硝子株式会社 | The manufacturing method of glass plate and the breaking device of glass plate |
-
2016
- 2016-02-02 CN CN201620111413.1U patent/CN205380793U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105538524B (en) * | 2016-02-02 | 2017-07-04 | 上海日进机床有限公司 | Afterbody hold-down mechanism, silicon ingot evolution cutting equipment and silicon ingot evolution cutting method |
| CN110023255A (en) * | 2016-12-02 | 2019-07-16 | 日本电气硝子株式会社 | The manufacturing method of glass plate and the breaking device of glass plate |
| CN110023255B (en) * | 2016-12-02 | 2022-08-19 | 日本电气硝子株式会社 | Method for manufacturing glass plate and device for breaking glass plate |
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Effective date of registration: 20180528 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Zhejiang. Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |
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Effective date of registration: 20180807 Address after: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Patentee after: Zhejiang Ji Ying Precision Machinery Co., Ltd. Address before: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Zhejiang. Patentee before: Haining Dijin science and Technology Co., Ltd. |
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Address after: 314400 6 Building 129, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Patentee after: Tiantong Tijin Precision Technology Co., Ltd. Address before: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Patentee before: Zhejiang Ji Ying Precision Machinery Co., Ltd. |
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Denomination of utility model: Tail pressing mechanism and silicon ingot square cutting equipment Effective date of registration: 20211126 Granted publication date: 20160713 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: TIANTONG RIJIN PRECISION TECHNOLOGY Co.,Ltd. Registration number: Y2021330002258 |