CN105415509B - Silicon ingot excavation machine and silicon ingot evolution cutting method - Google Patents
Silicon ingot excavation machine and silicon ingot evolution cutting method Download PDFInfo
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- CN105415509B CN105415509B CN201510617450.XA CN201510617450A CN105415509B CN 105415509 B CN105415509 B CN 105415509B CN 201510617450 A CN201510617450 A CN 201510617450A CN 105415509 B CN105415509 B CN 105415509B
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Abstract
The present invention provides a kind of silicon ingot excavation machine and silicon ingot evolution cutting method, and silicon ingot excavation machine includes：Base；The plummer on base is slidedly arranged on, provided with multiple cutting seams；Cutting mechanism, including the cutting support and parallel laying that are fixedly arranged on base and are located on plummer cunning set direction are in a plurality of line of cut of cutting support；Lifting rotation mechanism located at base, below plummer, including：Mounting, elevating mechanism, lifting support, revolving part and push rod；When lifting rotation mechanism rises, push rod is driven to stitch up jacking silicon ingot to be cut along cutting so that silicon ingot to be cut departs from plummer under the jacking of push rod；When lifting rotation mechanism rotates, silicon ingot to be cut is driven to rotate a cutting angle by push rod.The silicon ingot excavation machine and silicon ingot evolution cutting method provided using the present invention, it is possible to resolve existing cutting equipment needs repeatedly to carry out cutting one by one and make it that cutting efficiency is low and need the problems such as artificial upset causes waste of manpower cost when obtaining blocking finished product.
Description
Technical field
The present invention relates to cutting field, more particularly to a kind of silicon ingot excavation machine and silicon ingot evolution cutting method.
Background technology
Line cutting technology is more advanced evolution process technology in the world at present, and its principle is by high-speed motion
Golden steel wire to workpiece to be processed (for example：Silicon rod, sapphire or other semiconductor hard brittle materials) rubbed, the side's of cutting out ingot, from
And reach cutting purpose.In the cutting process to workpiece, golden steel wire forms one by the guiding of guide roller on main line roller
Gauze, and workpiece to be processed realizes the feeding of workpiece by the rise and fall of workbench, in the presence of compression pump, is assemblied in and sets
Cooling water is sprayed to the cutting position of golden steel wire and workpiece by standby upper cooling water automatic spraying device, is moved back and forth by golden steel wire
Cutting is produced, the hard brittle materials such as semiconductor are once cut into polylith simultaneously.Line cutting technology and traditional knife saw piece, emery wheel
Piece and inner circle cutting, which are compared, has the advantages that efficiency high, production capacity height, precision are high.However, current linear cutting equipment still has
Deficiency, cutting effect is only capable of in flakes, if want to obtain blocking finished product, it is necessary to by the workpiece of dicing being placed across one by one
Cut on workbench so that cutting efficiency is low, and needing artificial operation, waste of manpower cost.
The content of the invention
The present invention provides a kind of silicon ingot excavation machine, many for solving existing cutting equipment needs when obtaining blocking finished product
Secondary progress is cut and make it that cutting efficiency is low and need the problems such as artificial upset causes waste of manpower cost one by one.
One aspect of the present invention provides a kind of silicon ingot excavation machine, including：Base；Be slidedly arranged on the base, for carry it is to be cut
The plummer of silicon ingot is cut, the plummer is parallel provided with multiple cutting seams；Cutting mechanism, including be fixedly arranged on the base and be located at
Cutting support and parallel laying on the plummer cunning set direction is in a plurality of line of cut of the cutting support；Held when described
When microscope carrier slides to the cutting support, the line of cut is cut to the silicon ingot to be cut on the plummer, described
Line of cut is located at when cutting the silicon ingot to be cut in the cutting seam；And located at the base, positioned at the plummer
The lifting rotation mechanism of lower section, including：Mounting, by lifting support of the elevating mechanism on the mounting, located at the liter
Revolving part on descending branch frame and the push rod on the revolving part；When the lifting rotation mechanism rises, the top is driven
Bar stitches up silicon ingot to be cut described in jacking along the cutting so that the silicon ingot to be cut takes off under the jacking of the push rod
From in the plummer；During the lifting rotation mechanism rotation, the silicon ingot rotation one to be cut is driven to cut by the push rod
Angle.
Alternatively, the elevating mechanism is included located at multiple elevating levers between the mounting and the lifting support.
Alternatively, the revolving part include be set up on the lifting support, the swivel plate for rotation, the push rod consolidate
On the swivel plate.
Alternatively, the length of the push rod is more than the thickness of the plummer.
Alternatively, a pair of slide rails are relatively set with the base, the plummer is slidedly arranged on the slide rail.
Alternatively, the slide rail is chute, and the bottom of the plummer is provided with the pulley being suitable in the chute；Or institute
Slide rail is stated provided with pulley, chute of the bottom provided with the correspondence pulley of the plummer.
Alternatively, the cutting support restocking is provided with multipair cutting roller, is cut described in any two in the cutting roller
It is setting up and down to cut roller, and a plurality of line of cut correspondence is wrapped on the multipair cutting roller to form cutting net.
Alternatively, the cutting support is in П type structures, including a back timber and the support positioned at the back timber opposite sides
Beam.
Alternatively, the cutting angle is 90 ° or 270 °.
On the other hand, present invention also offers a kind of silicon ingot evolution cutting applied to above-mentioned silicon ingot evolution cutting equipment
Method, including：The plummer for being placed with silicon ingot to be cut slides towards cutting support, the line of cut edge on the cutting support
The seam of the cutting on the plummer and the silicon ingot to be cut is not exclusively cut；Described in being close in when the line of cut
During the uncut area that silicon ingot edge to be cut is reserved, the plummer stops the mobile and dorsad cutting support sliding；When
The plummer is slid onto above lifting rotation mechanism, and the lifting support in the lifting rotation mechanism rises, the lifting rotation
Push rod on rotation mechanism correspond to the cutting seam up silicon ingot to be cut described in jacking so that the silicon ingot to be cut is described
Depart under the jacking of push rod in the plummer；It is described to hold in the case of the silicon ingot to be cut departs from the plummer
Microscope carrier continues the dorsad cutting support and slides and detached between the silicon ingot to be cut and the lifting rotation mechanism, described
Revolving part rotation in lifting rotation mechanism, drives the silicon ingot to be cut to rotate a cutting angle by the push rod；It is described to hold
Microscope carrier slides and moved between the silicon ingot to be cut and the lifting rotation mechanism towards the cutting support, the lifting
The lifting support of rotating mechanism declines, and the silicon ingot to be cut is fallen within the plummer；And the plummer continues direction
Cutting support direction slides, and the line of cut on the cutting support is along the cutting seam on the plummer to described to be cut
Cut that silicon ingot is full-cutting, complete the evolution of silicon ingot.
The silicon ingot excavation machine and silicon ingot evolution cutting method of the present invention, has at least the following technical effects or advantages：
By being located at the setting lifting rotation mechanism below plummer in the base, when silicon ingot to be cut is cut for the second time
Before cutting, silicon ingot to be cut described in the rising jacking of lifting rotation mechanism departs from the plummer, and it is described to be cut to rotate drive
Cut silicon ingot and rotate a cutting angle, it is achieved thereby that automatically adjusting the cutting angle needed for the silicon ingot to be cut, solve existing
Some cutting equipments need repeatedly to carry out cutting one by one and make it that cutting efficiency is low and need manually to turn over when obtaining blocking finished product
The problems such as turning to cause waste of manpower cost, greatly improves operating efficiency.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of silicon ingot excavation machine of the present invention.
Fig. 2 is the side view of silicon ingot excavation machine in Fig. 1.
Fig. 3 is positioned over the side view of plummer for silicon ingot to be cut in the embodiment of silicon ingot excavation machine one of the present invention.
Fig. 4 is positioned over the top view of plummer for silicon ingot to be cut in the embodiment of silicon ingot excavation machine one of the present invention.
Fig. 5 be the embodiment of silicon ingot excavation machine one of the present invention in line of cut be close in silicon ingot edge to be cut reserve do not cut
The side view in region.
Fig. 6 be the embodiment of silicon ingot excavation machine one of the present invention in line of cut be close in silicon ingot edge to be cut reserve do not cut
The top view in region.
Fig. 7 is the top perspective view of silicon ingot to be cut in Fig. 6.
Fig. 8 correspond to cutting seam for the push rod in lifting rotation mechanism in the embodiment of silicon ingot excavation machine one of the present invention and up push up
Rise the side view of silicon ingot to be cut.
Fig. 9 is that silicon ingot to be cut departs from when plummer plummer to be cut in the embodiment of silicon ingot excavation machine one of the present invention
The side view detached between silicon ingot and lifting rotation mechanism.
Figure 10 drives silicon ingot rotation to be cut for the push rod in lifting rotation mechanism in the embodiment of silicon ingot excavation machine one of the present invention
Turn the side view of a cutting angle.
Figure 11 rotates plummer after a cutting angle for silicon ingot to be cut in the embodiment of silicon ingot excavation machine one of the present invention and moved into
To the side view between silicon ingot to be cut and lifting rotation mechanism.
Figure 12 rotates elevating and rotating machine after a cutting angle for silicon ingot to be cut in the embodiment of silicon ingot excavation machine one of the present invention
The side view that structure declines.
Figure 13 is line of cut after one cutting angle of silicon ingot rotation to be cut in the embodiment of invention silicon ingot excavation machine one to be cut
Cut the full-cutting side view of silicon ingot.
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through specific realities different in addition
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
It should be noted that structure, ratio, size depicted in this specification institute accompanying drawings etc., only to coordinate
Content disclosed in bright book, so that those skilled in the art understands and reads, is not limited to the enforceable limit of the present invention
Fixed condition, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, not
Under influence effect of the invention that can be generated and the purpose that can reach, it all should still fall and be obtained in disclosed technology contents
In the range of covering.Meanwhile, it is cited such as " on ", " under ", "left", "right", " centre " and " one " etc. in this specification
Term, is merely convenient to understanding for narration, and is not used to limit enforceable scope of the invention, the change of its relativeness or tune
It is whole, under without essence change technology contents, when being also considered as enforceable category of the invention.
Refer to Fig. 1, Fig. 2 and Fig. 3, it is shown that the structural representation of silicon ingot excavation machine of the present invention in one embodiment
Figure, wherein, Fig. 1 is the dimensional structure diagram of silicon ingot excavation machine of the present invention, and Fig. 2 is the side view of silicon ingot excavation machine in Fig. 1, figure
3 are positioned over the side view of plummer for silicon ingot to be cut in the embodiment of silicon ingot excavation machine one of the present invention.It should be noted that, the present invention
Middle silicon ingot excavation machine can also be cut, for example in addition to it can carry out cutting evolution to silicon ingot to other workpiece to be cut：
Glass cover-plate, ceramics, graphite, sapphire etc., following examples are mainly described in detail by taking silicon ingot as an example.Existing silicon ingot
When carrying out evolution, can first by silicon ingot dicing, then by the silicon ingot of dicing one by one be placed across workbench
On being cut to obtain blocking finished product, this method needs artificial operation, and cutting efficiency is low, waste of manpower cost.This hair
Bright silicon ingot excavation machine carries out silicon ingot 4 to be cut after first time cutting, drives silicon ingot 4 to be cut to rotate a cutting angle rotation
Degree, it is achieved thereby that automatically adjusting the cutting angle needed for silicon ingot 4 to be cut.
As depicted in figs. 1 and 2, the present invention shows the silicon ingot excavation machine in one embodiment, including：Base 5, it is slidedly arranged on
Plummer 1, cutting mechanism 2 on base 5 and the lifting rotation mechanism 3 located at base 5.
Silicon ingot excavation machine of the present invention is described in detail below.
As depicted in figs. 1 and 2, base 5, are used as the main body frame of silicon ingot excavation machine of the present invention, plummer 1, cutting mechanism 2
And lifting rotation mechanism 3 is on base 5, wherein, plummer 1 is slidedly arranged on base 5, and cutting mechanism 2 is fixedly installed on
The one end of base 5.It is preferred that to prevent plummer 1 from skidding off in base 5, as shown in Fig. 2 the other end of base 5 is provided with gear
Plate 6, baffle plate 6 can be curved.Plummer 1 is slidedly arranged between cutting mechanism 2 and baffle plate 6.Lifting rotation mechanism 3 is fixed and set
It is placed on base 5, and positioned between cutting mechanism 2 and baffle plate 6, it is preferred that lifting rotation mechanism 3 is close to cutting mechanism 2.
As depicted in figs. 1 and 2, plummer 1, for carrying silicon ingot 4 to be cut and being slidedly arranged on base 5, plummer 1 is parallel
Provided with multiple cutting seams 10.As depicted in figs. 1 and 2, it is in a stair-stepping carrying workbench, silicon to be cut that plummer 1, which can be,
Ingot 4, which is positioned in plummer 1, to be located on relatively low ladder loading end.Plummer 1 can by but be not limited in the following manner slide
On base 5, as depicted in figs. 1 and 2, a pair of slide rails 70 are relatively set with base 5, plummer 1 is slidedly arranged on slide rail 70,
The bottom of plummer 1 is relative to be installed with the support frame 71 being slidedly arranged on respectively on a pair of slide rails 70, and support frame 71 can be such as Fig. 1 and figure
The bottom of plummer 1 is fixed on side plate shown in 2, the side plate top, and the side plate bottom is slidedly arranged on slide rail 70.Slide rail 70 can
To be chute, the support frame 71 positioned at the bottom of plummer 1 is provided with the pulley being suitable in the chute, in order to realize Automated condtrol
The sliding of plummer 1, the pulley can be connected with motor, by controlling the operating of the motor to realize to holding
The traveling control of microscope carrier 1, can make plummer 1, constantly close to cutting mechanism 2, advance, also can also make to the left along the chute
Plummer 1, away from cutting mechanism 2, is advanced to the right along chute.In other embodiments, pulley can also be provided with slide rail 70,
Chute of the support frame 71 provided with the correspondence pulley positioned at the bottom of plummer 1, in order to realize the cunning of Automated condtrol plummer 1
Move, the chute can be connected with motor, by controlling the operating of motor to realize the traveling control to plummer 1
System, can make plummer 1, constantly close to cutting mechanism 2, advance to the left along the pulley, also can also make plummer 1 along institute
Pulley is stated away from cutting mechanism 2, is advanced to the right.
As depicted in figs. 1 and 2, cutting mechanism 2 includes being fixedly arranged on base 5 and slides the cutting on set direction positioned at plummer 1
Support 20 and parallel laying are in a plurality of line of cut 21 of cutting support 20.Line of cut 21 can apply to cut the Ministry of worker to be added
Part is (for example：Crystalline silicon, ceramics, glass, graphite, sapphire etc.) diamond wire.The restocking of cutting support 20 is provided with multipair cutting roller
22, any two cutting rollers 22 in cutting roller are setting up and down, and each line of cut correspondence is wrapped in a pair pairs of cutting rollers
On 22, in this way, a plurality of line of cut 21 correspondence be wrapped on multipair cutting roller 22 with formed cutting net, adjacent two lines of cut 21 it
Between and row distance correspond to plummer 1 in it is two neighboring cutting seam the distance between 10 so that when plummer 1 slide to cutting
During frame 20, line of cut 21 can enter to cut silicon ingot 4 to be cut along the seam of the cutting in plummer 1 10.Cutting support 20 can
It is in П type structures, including a back timber 201 and the support beam 202 positioned at the opposite sides of back timber 201, a pair of cunnings as shown in Figure 1 to be
Rail 70 is arranged between two support beams 202.As shown in Figure 5 and Figure 6, when plummer 1 slides to cutting support 20 on slide rail 70
When, line of cut 21 enters the inside of plummer 1 along the cutting seam 10 in plummer 1 and silicon ingot 4 to be cut is cut, and cuts
Line 21 is always positioned at when cutting silicon ingot 4 to be cut in cutting seam 10.
As shown in Figures 2 and 3, the invention provides the lifting rotation mechanism 3 located at base 5, positioned at the lower section of plummer 1,
Including：Mounting 30, pass through lifting support 35 of the elevating mechanism on the mounting 30, the rotation on the lifting support 35
Part and the push rod 33 on the revolving part, herein, the elevating mechanism are included located at mounting 30 and the lifting branch
Multiple elevating levers 31 between frame 35, elevating lever 31 can be connected and be controlled by it with a lift cylinder, described by control
The lifting of the operating control elevating lever 31 of lift cylinder, the lift cylinder can be arranged at the inside of base 5 or mounting 30.Institute
State revolving part and include being set up on lifting support 35, the swivel plate 32 for rotation, push rod 33 is fixedly arranged on swivel plate 32.Rotation
Plate 32 can be rotated in the following manner, and the top of lifting support 35 is provided with rotating shaft base, and swivel plate 32 is located at rotary shaft
It is intermeshed on seat and with swivel bearing.Specifically, the top of rotating shaft base is provided with multiple first fluted discs, the bottom of swivel plate 32
Portion is provided with multiple second fluted discs corresponding with the first fluted disc of rotating shaft base, in the present embodiment, the bottom of swivel plate 32
Center is additionally provided with a rotating shaft, and the rotating shaft is connected and is controlled by it with a rotary cylinder, and the rotary cylinder is arranged at rotation
The lower section of axle bed, using rising rotary cylinder and rising rotating shaft, can drive swivel plate 32 to rotate.It was verified that swivel plate 32
Within the scope of the reachable ± 3um of table top running accuracy.Swivel plate 32 is installed with push rod 33, in order that obtaining push rod 33 in lifting rotation
Mechanism 3 can enter in cutting seam 10 when rising, and the width of push rod 33 corresponds to the width of cutting seam 10, while in order that must push up
Silicon ingot 4 to be cut can be lifted off plummer 1 by bar 33, and the length of push rod 33 is more than the thickness of plummer 1.In actual applications,
When lifting rotation mechanism 3 rises, i.e., when elevating lever 31 rises, as shown in figure 8, driving push rod 33 to stitch 10 up jackings along cutting
Silicon ingot 4 to be cut, the length of push rod 33 is more than the thickness of plummer 1, and then causes silicon ingot 4 to be cut under the jacking of push rod 33
Depart from plummer 1；When lifting rotation mechanism 3 rotates, i.e., when swivel plate 32 rotates, between push rod 33 and silicon ingot to be cut 4
Frictional force in the presence of, push rod 33 drives silicon ingot 4 to be cut to rotate a cutting angle, and the cutting angle at least includes 90 °
Or 270 °.It should be noted that depart from silicon ingot 4 to be cut under the jacking of push rod 33 after plummer 1, and in lifting
Before rotating mechanism 3 rotates, Fig. 9 is refer to, need to controlling plummer 1, dorsad cutting support 20 slides to the right and from silicon ingot to be cut
Detached between 4 and lifting rotation mechanism 3, only in plummer 1 after being detached between silicon ingot 4 to be cut and lifting rotation mechanism 3,
Swivel plate 32 can rotate, and drive silicon ingot 4 to be cut to rotate a cutting angle by push rod 33.
Next, with reference to Fig. 1 to Figure 13, the present invention can also provide a kind of silicon ingot evolution cutting method, applied to above-mentioned
Silicon ingot excavation machine, methods described following steps：
Step 1, Fig. 1, Fig. 2, Fig. 3 and Fig. 4 are refer to, silicon ingot 4 to be cut is positioned on plummer 1, described drive is opened
Dynamic motor, and by controlling the operating of the motor so that the plummer 1 for being placed with silicon ingot 4 to be cut is advanced to the left, edge
The chute constantly close to cutting support 20, in figure 3, plummer 1 is moved to the left with silicon ingot 4 to be cut；Next join
According to Fig. 5 and Fig. 6, when plummer 1 slides to cutting support 20 on slide rail 70, line of cut 21 is stitched along the cutting in plummer 1
10 enter the inside of plummer 1 and silicon ingot 4 to be cut are cut, and line of cut 21 is always positioned at when cutting silicon ingot 4 to be cut
In cutting seam 10.
Step 2, Fig. 5, Fig. 6 and Fig. 7 are refer to, when silicon ingot 4 to be cut cut for the first time, the edge of silicon ingot 4 to be cut
Uncut area 40 is reserved with, the width of uncut area 40 can be 1mm to 5mm.Carrying out cutting silicon to be cut for the first time
Uncut area 40 is set during ingot 4 so that cutting terminates rear sheet of silicon chip in common one end due to non-cutting area for the first time
Domain 40 and be sticked together so that the silicon chip is difficult to topple over or beated, it is ensured that stability when carrying out second and cutting,
It ensure that being smoothed out for silicon ingot evolution.When silicon ingot 4 to be cut carry out for the first time cut when, and line of cut 21 be close in it is to be cut
When cutting the uncut area 40 that the edge of silicon ingot 4 is reserved, by the operating for controlling the motor so that plummer 1 stops moving
Move and dorsad cutting support 20 slides to the right.In order to realize that plummer 1 is accurately slid on slide rail 70, for example, cutting
When secant 21 is close in the reserved uncut area 40 in the edge of silicon ingot 4 to be cut, plummer 1 needs to stop mobile and to the right dorsad
Cutting support 20 is slid, and positioning component can be set on cutting support 20, and the positioning component can include being arranged at cutting branch
Laser emission and receiving device on frame 20 and hold the laser reflection equipment being correspondingly arranged on microscope carrier 1, the Laser emission and
Receiving device is located in cutting support 20 on the one side of plummer 1, and the Laser emission and receiving device are right against and held
Microscope carrier 1, the laser reflection equipment is right against the Laser emission and receiving device.Work below to the positioning component is former
Reason is illustrated：In positioning, first, the laser transmitting set swashs against the continual transmitting of the laser reflection equipment
Light, the laser reflection equipment is continual to give the laser receiving set by laser reflection, by calculating Laser emission and connecing
The time difference of receipts can draw the distance between plummer 1 and cutting support 20, and then whether can go out line of cut 21 with real-time judge
It is close in the reserved uncut area 40 in the edge of silicon ingot 4 to be cut, and then the operating according to judged result to the motor
It is controlled.
Step 3, Fig. 8 is refer to, silicon ingot 4 to be cut is after cutting terminates for the first time, by controlling the motor
Operating so that plummer 1 slides to the right and away from cutting support 20, during plummer 1 slides to the right, passes through above-mentioned positioning
When component orients plummer 1 and slides onto 3 top of lifting rotation mechanism, the motor is closed so that plummer 1 stops sliding
Move, followed by the operating for controlling the lift cylinder, control elevating lever 31 rises, and then causes the lifting support overall
Rise, and drive and be set up on the lifting support, ramped up for the swivel plate 32 of rotation, the push rod 33 on swivel plate 32 to
Upper to enter in cutting seam 10, and up jacking silicon ingot 4 to be cut is posted by the bottom of plummer 1 when swivel plate 32 rises to upwards
When, because the length of push rod 33 is more than the thickness of plummer 1, silicon ingot to be cut 4 now depart under the jacking of push rod 33 in
Plummer 1.
Step 4, Fig. 9 is refer to, in the case of silicon ingot 4 to be cut departs from plummer 1, the motor is opened,
By the operating for controlling the motor so that plummer 1 continues to slide to the right, when plummer 1 continues dorsad cutting support
20 slide to the right and after being detached between silicon ingot 4 to be cut and lifting rotation mechanism 3, close the motor so that carrying
Platform 1 stops sliding.Next Figure 10 is refer to, controls lifting rotation mechanism 3 to revolve by controlling the operating of the rotary cylinder
Turn, i.e. the operating driving swivel plate 32 of the rotary cylinder rotates, and the rotation of swivel plate 32 drives push rod 33 to rotate.In push rod 33
In the presence of frictional force between silicon ingot 4 to be cut, silicon ingot 4 to be cut is driven to rotate a cutting angle by push rod 33, it is described
Cutting angle includes 90 ° or 270 °, now, it can be seen that silicon ingot 4 to be cut is cut the cutting of seam 10 for the first time from side view
The gap left.
Step 5, Figure 11 is refer to, after push rod 33 drives silicon ingot 4 to be cut to rotate a cutting angle, the driving is opened
Motor, by the operating for controlling the motor so that plummer 1 continues to slide to the left, until plummer 1 is propped up towards cutting
Frame 20 slides and moved between 4 silicon ingots 4 to be cut and lifting rotation mechanism 3, closes the motor so that plummer 1
Stop sliding.Then Figure 12 is refer to, by controlling the operating of the lift cylinder, control elevating lever 31 declines, and then causes
The lifting support entire lowering, and drive be set up on the lifting support, for rotation swivel plate 32 to decline, lifting
Rotating mechanism 3 declines, until the silicon ingot to be cut 4 on push rod 33 is fallen within plummer 1 and push rod 33 departs from carrying
Platform 1.
Step 6, Figure 13 is refer to, after silicon ingot 4 to be cut is fallen within plummer 1 and push rod 33 departs from plummer 1,
The motor is opened, and by controlling the operating of the motor so that it is placed with the plummer 1 of silicon ingot 4 to be cut
Advance to the left, along the chute constantly close to cutting support 20, line of cut 21 on cutting support 20 is along on plummer 1
Cutting seam 10 and silicon ingot to be cut 4 is full-cutting, complete silicon ingot evolution.
The silicon ingot excavation machine and silicon ingot evolution cutting method of the present invention, at least has the following technical effect that or advantage：
By being located at the setting lifting rotation mechanism below plummer in the base, when silicon ingot to be cut is cut for the second time
Before cutting, silicon ingot to be cut described in the rising jacking of lifting rotation mechanism departs from the plummer, and it is described to be cut to rotate drive
Cut silicon ingot and rotate a cutting angle, it is achieved thereby that automatically adjusting the cutting angle needed for the silicon ingot to be cut, solve existing
Some cutting equipments need repeatedly to carry out cutting one by one and make it that cutting efficiency is low and need manually to turn over when obtaining blocking finished product
The problems such as turning to cause waste of manpower cost, greatly improves operating efficiency.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (10)
1. a kind of silicon ingot excavation machine, it is characterised in that including：
Base；
It is slidedly arranged on the base, for the plummer of carrying silicon ingot to be cut, the plummer is parallel provided with multiple cutting seams；
Cutting mechanism, including be fixedly arranged on the base and slide the cutting support and parallel frame on set direction positioned at the plummer
Located at a plurality of line of cut of the cutting support；When the plummer slides to the cutting support, the line of cut is to described
The silicon ingot to be cut on plummer is cut, and the line of cut is located at the cutting when cutting the silicon ingot to be cut
In seam；And
Lifting rotation mechanism located at the base, below the plummer, including：Mounting, it is located at by elevating mechanism
Lifting support on the mounting, the revolving part on the lifting support and the push rod on the revolving part；Institute
When stating the rising of lifting rotation mechanism, the push rod is driven to stitch up silicon ingot to be cut described in jacking along the cutting so that institute
Silicon ingot to be cut is stated under the jacking of the push rod to depart from the plummer；During the lifting rotation mechanism rotation, by described
Push rod drives the silicon ingot to be cut to rotate a cutting angle.
2. silicon ingot excavation machine as claimed in claim 1, it is characterised in that the elevating mechanism includes being located at the mounting and institute
State multiple elevating levers between lifting support.
3. silicon ingot excavation machine as claimed in claim 2, it is characterised in that the revolving part includes being set up in the lifting support
The upper, swivel plate for rotation, the push rod is fixedly arranged on the swivel plate.
4. silicon ingot excavation machine as claimed any one in claims 1 to 3, it is characterised in that the length of the push rod is more than institute
State the thickness of plummer.
5. silicon ingot excavation machine as claimed in claim 1, it is characterised in that a pair of slide rails, institute are relatively set with the base
Plummer is stated to be slidedly arranged on the slide rail.
6. silicon ingot excavation machine as claimed in claim 5, it is characterised in that
The slide rail is chute, and the bottom of the plummer is provided with the pulley being suitable in the chute；Or
The slide rail is provided with pulley, chute of the bottom provided with the correspondence pulley of the plummer.
7. silicon ingot excavation machine as claimed in claim 1, it is characterised in that the cutting support restocking is provided with multipair cutting roller,
Any two cutting rollers in the cutting roller are setting up and down, and a plurality of line of cut correspondence is wrapped in multipair described
On cutting roller net is cut to be formed.
8. silicon ingot excavation machine as claimed in claim 7, it is characterised in that the cutting support is in П type structures, including a top
Beam and the support beam positioned at the back timber opposite sides.
9. silicon ingot excavation machine as claimed in claim 1, it is characterised in that the cutting angle is 90 ° or 270 °.
10. a kind of silicon ingot evolution cutting method, sets applied to silicon ingot evolution as claimed in any one of claims 1-9 wherein cutting
It is standby, it is characterised in that to comprise the following steps：
It is placed with the plummer of silicon ingot to be cut to slide towards cutting support, the line of cut on the cutting support is along described
Cutting on plummer is stitched and the silicon ingot to be cut is not exclusively cut；
When the line of cut is close in the reserved uncut area in the silicon ingot edge to be cut, the plummer stops movement
And the dorsad cutting support sliding；
When the plummer is slid onto above lifting rotation mechanism, the lifting support in the lifting rotation mechanism rises, described
Push rod in lifting rotation mechanism correspond to the cutting seam up silicon ingot to be cut described in jacking so that the silicon ingot to be cut
Depart under the jacking of the push rod in the plummer；
In the case of the silicon ingot to be cut departs from the plummer, the plummer, which continues the dorsad cutting support, to be slided
Move and detached between the silicon ingot to be cut and the lifting rotation mechanism, the revolving part rotation in the lifting rotation mechanism
Turn, drive the silicon ingot to be cut to rotate a cutting angle by the push rod；
The plummer slid towards the cutting support and move into the silicon ingot to be cut and the lifting rotation mechanism it
Between, the lifting support of the lifting rotation mechanism declines, and the silicon ingot to be cut is fallen within the plummer；And
The plummer continues towards the sliding of cutting support direction, and the line of cut on the cutting support is along the plummer
On cutting seam and it is full-cutting to the silicon ingot to be cut, complete silicon ingot evolution.
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| CN105415509B true CN105415509B (en) | 2017-07-28 |
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| JPS5822308B2 (en) * | 1979-02-20 | 1983-05-07 | 松下電器産業株式会社 | Block cutting device |
| JPH05220732A (en) * | 1992-02-17 | 1993-08-31 | Sumitomo Metal Ind Ltd | Multi-channel roller for multi-wire saw |
| CN101602232B (en) * | 2009-07-15 | 2013-03-20 | 北京京联发数控科技有限公司 | Wire butting machine tool |
| CN203266963U (en) * | 2013-04-24 | 2013-11-06 | 北京京运通科技股份有限公司 | Squaring machine |
| CN103507174A (en) * | 2013-09-27 | 2014-01-15 | 无锡荣能半导体材料有限公司 | Squarer crystal support |
| CN205310555U (en) * | 2015-09-25 | 2016-06-15 | 上海日进机床有限公司 | Silicon bulk squaring machine |
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Effective date of registration: 20180522 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |