CN106079125A - Rotary multi-thread excavation machine and workpiece evolution method - Google Patents
Rotary multi-thread excavation machine and workpiece evolution method Download PDFInfo
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- CN106079125A CN106079125A CN201610648706.8A CN201610648706A CN106079125A CN 106079125 A CN106079125 A CN 106079125A CN 201610648706 A CN201610648706 A CN 201610648706A CN 106079125 A CN106079125 A CN 106079125A
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- cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of rotary multi-thread excavation machine and workpiece evolution method, this rotary multi-thread excavation machine includes base, Workpiece carrier device, work piece cut mechanism, workpiece top bracing mechanism, and rotary apparatus, wherein, utilize the workpiece to be cut that workpiece top bracing mechanism is shored on Workpiece carrier platform so that workpiece to be cut departs from Workpiece carrier platform, rotary apparatus is utilized to drive Workpiece carrier device and work piece cut mechanism to rotate against to adjust cutting angle, achieve the cutting angle being automatically adjusted needed for described workpiece to be cut, it is thus possible to cutting angle after the adjustment proceeds cutting to workpiece to be cut.The present invention solve prior art need to cut the most one by one when obtaining in bulk finished product and make cutting efficiency upset low, artificial cause waste of manpower cost, the cutting angle that changed workpiece by auxiliary fixture easily there will be the problems such as accident such as interference, collision in moving process, be greatly improved work efficiency and improve the cut quality of workpiece.
Description
Technical field
The present invention relates to cutting field, particularly relate to a kind of rotary multi-thread excavation machine and workpiece evolution method.
Background technology
Line cutting technology is the most more advanced evolution process technology, and its principle is by high-speed motion
Workpiece to be processed (such as: silicon rod, sapphire or other quasiconductor hard brittle materials) is rubbed by gold steel wire, the side's of cutting out ingot, from
And reach to cut purpose.In the cutting process to workpiece, the gold steel wire guiding by guide roller, main line roller forms one
Cutting gauze, utilizes this cutting gauze to cut workpiece to be processed, and meanwhile, the cooling water being assemblied on equipment is certainly
Cooling water is sprayed to gold steel wire and the cutting position of workpiece by dynamic flusher, gold steel wire move back and forth and produce cutting, with will
The hard brittle materials such as quasiconductor are cut into polylith the most simultaneously.
As a example by silicon ingot evolution, it usually needs silicon ingot to be processed carries out cutting twice, and (the first cutting angle and second is cut
Chamfer degree typically differs 90 ° of angles), then, certainly will need to change cutting angle later in cutting for the first time and cut to carry out second time
Cutting, and in the prior art, be mostly to use additional auxiliary fixture to act on silicon ingot to be processed so that it adjusts position, change is cut
Chamfer degree.But, such technology, there is structure complexity, be difficult to the problems such as manipulation in additional auxiliary fixture, and silicon ingot to be processed exists
Easily occur when adjusting position each cut portion (owing to silicon ingot to be processed is adjusting before position cutting operation of executed,
Defining the silicon ingot bar of multiple strip, between each silicon ingot bar, gap is the least) in moving process, there will be interference, collision etc.
Accident, affects the cut quality of follow-up silicon ingot.
Summary of the invention
The present invention provides a kind of rotary multi-thread excavation machine, is used for solving existing cutting equipment when obtaining in bulk finished product
Need to cut the most one by one and make cutting efficiency low and need artificial upset to cause waste of manpower cost, by auxiliary
Tool changes the cutting angle of workpiece and easily there will be the problems such as accident such as interference, collision in moving process.
The present invention provides a kind of rotary multi-thread excavation machine on the one hand, including:
Base；
Workpiece carrier device, is movably arranged on described base, includes the Workpiece carrier platform for carrying workpiece to be cut；
Described Workpiece carrier platform offers parallel multiple cutting seams；
Work piece cut mechanism, is located at described base and is oppositely arranged with described Workpiece carrier platform；Described work piece cut mechanism
Including cutting support, at least one pair of cutting wheels and line of cut of being located on described cutting support, described line of cut correspondence twines
It is around at least one pair of cutting wheels described to form cutting net；When described Workpiece carrier device and described work piece cut mechanism
During relative movement, the workpiece described to be cut on described Workpiece carrier platform is entered by the described line of cut in described work piece cut mechanism
Row cutting, described line of cut is positioned at described cutting seam when cutting described workpiece to be cut；
Workpiece top bracing mechanism, is located at the zone line of described base, treats described on described Workpiece carrier platform for shoring
Cutting workpiece is so that described workpiece to be cut departs from described Workpiece carrier platform；And
Rotary apparatus, is located on described base, is used for driving described Workpiece carrier device and described work piece cut mechanism phase
Described base is rotated to adjust cutting angle.
The rotary multi-thread excavation machine of the present invention, includes base, Workpiece carrier device, work piece cut mechanism, workpiece top
Support mechanism and rotary apparatus, wherein, utilize workpiece to be cut that workpiece top bracing mechanism shores on Workpiece carrier platform to be cut
Cut workpiece and depart from Workpiece carrier platform, utilize rotary apparatus to drive Workpiece carrier device and work piece cut mechanism to rotate against to adjust
Cutting angle, it is achieved that be automatically adjusted the cutting angle needed for described workpiece to be cut, it is thus possible to cutting angle after the adjustment
Workpiece to be cut is proceeded cutting.The rotary multi-thread excavation machine of the present invention, solves existing cutting equipment and is obtaining into
Need to cut the most one by one and make cutting efficiency upset low, artificial cause waste of manpower cost, by auxiliary during block finished product
Help tool easily to there will be the problems such as accident such as interference, collision in moving process to the cutting angle changing workpiece, be greatly promoted
Work efficiency and improve the cut quality of workpiece.
Alternatively, described base is provided with slipping mechanism, described slipping mechanism is slidably equipped with described Workpiece carrier device and/
Or described work piece cut mechanism.
Alternatively, described slipping mechanism includes slide rail or slideway.
Alternatively, also including carrier in described Workpiece carrier device, described Workpiece carrier platform passes through the first elevating mechanism
It is movably arranged on described carrier；Described workpiece top bracing mechanism includes: seat stand；Mandrel plate, is located on described seat stand；Push rod, if
On described mandrel plate, it is positioned at treating on described Workpiece carrier platform for wearing the cutting seam in described Workpiece carrier platform to shore
Cutting workpiece.
Alternatively, described Workpiece carrier device also including, carrier, described Workpiece carrier platform are fixedly arranged on described carrier
On；Described workpiece top bracing mechanism includes: seat stand；Lifting platform, is movably arranged on described seat stand by the second elevating mechanism；Push rod,
It is located on described lifting platform, is positioned on described Workpiece carrier platform to shore for wearing the cutting seam in described Workpiece carrier platform
Workpiece to be cut.
Alternatively, also including carrier in described Workpiece carrier device, described Workpiece carrier platform passes through the first elevating mechanism
It is movably arranged on described carrier；Described workpiece top bracing mechanism includes: seat stand；Lifting platform, is set by the second elevating mechanism activity
On described seat stand；Push rod, is located on described lifting platform, is positioned to shore for wearing the cutting seam in described Workpiece carrier platform
Workpiece to be cut on described Workpiece carrier platform.
Alternatively, the length of described push rod is more than the thickness of described Workpiece carrier platform.
Alternatively, described rotary apparatus includes: swivel base, is located on described base；Described Workpiece carrier device and institute
State work piece cut branch construction in the opposite sides of described swivel base；Drive motor；And link gear, it is located at described driving
Rotation link gear between motor and described swivel base；Described rotation link gear includes the tooth being located at described swivel base
Carry and be engaged in described cingulum and be controlled by the driving gear of described driving motor.
The present invention provides a kind of workpiece evolution method on the other hand, is applied to above-mentioned rotary multi-thread excavation machine, including
Step:
Under the first cutting angle, drive Workpiece carrier device and the relative movement of work piece cut mechanism, described workpiece cut
Line of cut on cutting mill structure is to be cut to carried on described Workpiece carrier platform along the cutting seam on described Workpiece carrier platform
Cut workpiece to carry out cutting for the first time；
After having cut for the first time, workpiece top bracing mechanism shore the workpiece described to be cut on described Workpiece carrier platform
So that described workpiece to be cut departs from described Workpiece carrier platform；
Described Workpiece carrier device and described work piece cut mechanism is driven to carry out rotating to adjust to second by rotary apparatus
Cutting angle；And
Under the second cutting angle, drive described Workpiece carrier device and the relative movement of described work piece cut mechanism, by institute
The line of cut stated in work piece cut mechanism stitches along the cutting on described Workpiece carrier platform and is held on described Workpiece carrier platform
The workpiece to be cut carried carries out second time and cuts, and completes the evolution of described workpiece to be cut.
Alternatively, the edge at described workpiece to be cut is reserved with uncut area；When carrying out cutting for the first time, described
Line of cut in work piece cut mechanism stitches along the cutting on described Workpiece carrier platform and cuts described workpiece to be cut,
During until closing on to the uncut area that the described edge of work to be cut is reserved, stop driving described Workpiece carrier device and described
The relative movement of work piece cut mechanism so that after cutting terminates for the first time, described workpiece to be cut does not cuts due to described at end
Region and still connect together.
The workpiece evolution method of the present invention, first, under the first cutting angle, drives Workpiece carrier device and work piece cut
Mechanism's relative movement, is carried out cutting for the first time to workpiece to be cut by the line of cut in work piece cut mechanism；In cutting for the first time
After completing, workpiece top bracing mechanism shore workpiece to be cut so that workpiece to be cut departs from Workpiece carrier device；By rotary apparatus
Workpiece carrier device and work piece cut mechanism is driven to carry out rotating to be adjusted by cutting angle to the second cutting angle, it is achieved that from
The dynamic cutting angle regulated needed for described workpiece to be cut；Under the second cutting angle, Workpiece carrier device and workpiece is driven to cut
Cutting mill structure relative movement, is carried out second time by the workpiece to be cut of the line of cut in work piece cut mechanism and cuts, complete described to be cut
Cut the evolution of workpiece.Workpiece evolution method of the present invention, solving existing cutting equipment needs repeatedly when obtaining in bulk finished product
Cut one by one and make cutting efficiency upset low, artificial cause waste of manpower cost, change workpiece by auxiliary fixture
Cutting angle in moving process, easily there will be the problems such as accident such as interference, collision, be greatly improved work efficiency and raising
The cut quality of workpiece.
Accompanying drawing explanation
Fig. 1 is the front view of the rotary multi-thread excavation machine of the present invention.
Fig. 2 is the top view of the rotary multi-thread excavation machine of the present invention.
Fig. 3 is the side view of the rotary multi-thread excavation machine of the present invention.
Fig. 4 is Tu1Zhong work piece cut mechanism three-dimensional oblique view in one embodiment.
Fig. 5 is the schematic diagram after Fig. 2 adjusts clockwise.
Fig. 6 is the schematic diagram after Fig. 2 adjusts counterclockwise.
Fig. 7 is workpiece evolution method of the present invention schematic flow sheet in one embodiment.
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also be by the most different concrete realities
The mode of executing is carried out or applies, the every details in this specification can also based on different viewpoints and application, without departing from
Various modification or change is carried out under the spirit of the present invention.
It should be noted that structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only in order to coordinate
Content disclosed in bright book, understands for those skilled in the art and reads, being not limited to the enforceable limit of the present invention
Fixed condition, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, not
Affect under effect that the present invention can be generated by and the purpose that can reach, all should still fall and obtain at disclosed technology contents
In the range of containing.Meanwhile, in this specification cited as " on ", D score, "left", "right", " middle " and " one " etc.
Term, is merely convenient to understanding of narration, and is not used to limit the enforceable scope of the present invention, the change of its relativeness or tune
Whole, changing under technology contents without essence, when being also considered as the enforceable category of the present invention.
Refer to Fig. 1 to Fig. 3, it is shown that the structural representation in one embodiment of the rotary multi-thread excavation machine of the present invention
Figure, wherein, Fig. 1 is the front view of the rotary multi-thread excavation machine of the present invention, and Fig. 2 is the vertical view of the rotary multi-thread excavation machine of the present invention
Figure, Fig. 3 is the side view of the rotary multi-thread excavation machine of the present invention.It should be noted that, in following instance describes, the present invention is revolved
Rotatable multi-thread excavation machine is to be applied to polysilicon silicon ingot to develop operation, and being used for will be in cubical larger-size polysilicon
By cutting twice, evolution is in cube but the less polycrystalline silicon ingot bar of size to silicon ingot, but is not limited thereto, actual
On, in the present invention, rotary multi-thread excavation machine is in addition to can carrying out polysilicon silicon ingot cutting evolution, it is also possible to treat other
Cutting workpiece cuts, such as: glass cover-plate, pottery, graphite, sapphire etc..Existing polysilicon silicon ingot is carrying out evolution
Time, it usually needs carry out cutting twice, before typically and also not carrying out cutting for the second time after having carried out cutting for the first time,
The position of polysilicon silicon ingot to be processed is adjusted to change cutting angle by manual type or additional auxiliary fixture, but on
State technological means and have that structure is complicated, be difficult to the problems such as manipulation, cost Gao Qi, and easily cause polysilicon silicon ingot movement deviation and
Each cut portion there will be the accidents such as interference, collision in moving process, affects the cut quality of follow-up silicon ingot.Because
This, the rotary multi-thread excavation machine of the present invention passes through technological transformation, does not removes to move or adjust workpiece to be cut, but creative area
Dynamic Workpiece carrier device and work piece cut mechanism respect thereto rotate, it is achieved thereby that cutting needed for being automatically adjusted workpiece to be cut
Chamfer degree.
In conjunction with Fig. 1 and Fig. 3, the present invention shows rotary multi-thread excavation machine in one embodiment, including: base (does not shows
In graphic), for carrying the Workpiece carrier device 1 of workpiece 9 to be cut, for the workpiece that workpiece 9 to be cut is cut
Cutting mechanism 2, for shoring the workpiece top bracing mechanism 3 of workpiece 9 to be cut and for driving Workpiece carrier device 1 and workpiece
The rotary apparatus 4 that cutting mechanism 2 rotates.As it was previously stated, workpiece to be cut 9 here is to illustrate as a example by silicon ingot to be cut
, the cutting operation that this silicon ingot 9 to be cut is to be carried out is silicon ingot evolution operation.In this example, silicon ingot 9 to be cut is block
Structure, silicon ingot 9 the most to be cut is rectangular structure.
Multi-thread excavation machine rotary to the present invention is described in detail below.
Base, as the main part of the rotary multi-thread excavation machine of the present invention.
Workpiece carrier device 1, is movably arranged on described base.In the present embodiment, Workpiece carrier device 1 can be in the source of driving
Move relative to described base under the control of (such as driving motor).Preferentially, described base is provided with slideway or slide rail,
For Workpiece carrier device 1 sliding on described slideway or described slide rail.
Further, Workpiece carrier device 1 includes carrier 11 and the Workpiece carrier platform 12 being located on carrier 11.Workpiece
Plummer 12 is horizontally set, it may be preferable that Workpiece carrier platform 12 is for being horizontally disposed with.The mesa shape of Workpiece carrier platform 12 can be such as
For rectangle, so, suitable with silicon ingot to be cut 9 to be carried.Further, for the line of cut with work piece cut mechanism 2
Each cutting line segment (can hereinafter continue to describe in detail) in net is corresponding, and Workpiece carrier platform 12 offers parallel multiple cuttings
Seam 120, to accommodate each the described cutting line segment in described cutting gauze when performing cutting operation, therefore, cutting seam 120
Gap width is larger than the line footpath of cutting line segment.In one implementation, Workpiece carrier platform 12 can use the plate of a monoblock
Face structure, cutting seam 120 is then formed after cleaved processing in described board face structure.In another kind of implementation,
Workpiece carrier platform 12 can be assembled by the narrow panels of multiple strips, and adjacent two described narrow panels reserve certain gap,
This gap i.e. constitutes cutting seam 120.It addition, the overall rectangular shape of Workpiece carrier platform 12, the side in Workpiece carrier platform 12
As mounting portion, therefore, Workpiece carrier platform 12 is that the mounting portion by this side is suspended in carrier 11.Carrier 11
Substantially gate frame structure, such as, in П type, support beam column including two and be positioned at the company of two described support beam capital ends
Connect crossbeam.
Work piece cut mechanism 2, is located at described base and is oppositely arranged with Workpiece carrier platform 12.
Further, as shown in Figure 4, work piece cut mechanism 2 includes cutting support (be not depicted in graphic in), is located at cutting
At least one pair of cutting wheels 21,22 and line of cut 29 on support (be not depicted in graphic in).
At least one pair of cutting wheels is relatively arranged on work piece cut mechanism 2, in the present embodiment, this pair cutting wheels bag
Include the first cutting wheels 21 and the second cutting wheels 22 setting up and down, wherein, the first cutting wheels 21 comprise the most
Individual first cutting wheel 210, comprises multiple second cutting wheels 220 side by side, in the second cutting wheels 22 in the second cutting wheels 22
Multiple second cutting wheel 220 with first cutting wheels 21 in multiple first cutting take turns 210 one_to_one corresponding.
Line of cut 29, in the first cutting wheel 210 being sequentially wound in the first cutting wheels 21 and the second cutting wheels 22
Second cutting wheel 220, thus one to one first cutting wheel 210 and second cutting wheel 220 between quantity of formation suitable
A plurality of cutting line segment 290, this plurality of cutting line segment 290 is spaced and is parallel to each other, formed cutting gauze.Preferably, cut
Secant 29 can for example, diamond wire.
Further, work piece cut mechanism 2 can also include at least one pair of transition guide wheel group, in the present embodiment, and this
A pair transition guide wheel group includes First Transition guide wheel group 23 setting up and down and the second transition guide wheel group 24, wherein, First Transition
Guide wheel group 23 is adjacent to the first cutting wheels 21 and First Transition guide wheel group 23 includes multiple First Transition guide wheels side by side
230, the second transition guide wheel group 24 is adjacent to the second cutting wheels 22 and the second transition guide wheel group 24 includes multiple side by side
Two transition guide wheels 240.Due to this at least one pair of transition guide wheel group, line of cut 29 is the most sequentially wound in First Transition guide wheel
230, the first cutting wheel 210, second cuts wheel 220 and the second transition guide wheel 240, so, it can be ensured that the line of cut 29 of winding
Stability, first cutting wheel 210 and second cutting wheel 220 between cutting line segment 290 line length and adjacent two cutting line segments
The stability of the line-spacing between 290.
Specifically: in one case, if the first cutting wheel 210 in the first cutting wheels 21 is cut with second
Cut the spacing between the in wheels 22 second cutting wheel 220 be fixing if (i.e. cutting line segment 290 is a length of constant), then
Cannot adjust according to the cut lengths of workpiece to be cut, it is impossible to successfully manage, then cutting efficiency can be the lowest；Citing comes
Say: if the length of the cut lengths of workpiece (such as cutting-height) heavy rain cutting line segment 290, then cannot realize effectively cutting；If
The cut lengths (such as cutting-height) of workpiece much smaller than the length of cutting line segment 290, then need bigger power consumption to maintain and cut
Secant tension force, and cutting accuracy and speed has decline in various degree.In view of this, in the present invention, the first cutting wheels
21 are arranged to make away from relative to another one or closely move (i.e., i.e. first with at least one in the second cutting wheels 22
Cutting wheels 21 are removable and the second cutting wheels 22 are fixed, or the second cutting wheels 22 are removable and the first cutting wheels 21
Fixing, or the first cutting wheels 21 and the second cutting wheels 22 the most removable), change the first cutting in the first cutting wheels 21
In wheel 210 and the second cutting wheels 22, the spacing between 220 is taken turns in the second cutting, adjusts cutting line segment 290 in described cutting gauze
Length.In specific implementation, available as by First Transition guide wheel group 23 and/or the second transition guide wheel group 24 slidably
Be combined in the Sliding Structures such as slideway and slide rail and realize.In another scenario, in work piece cut operation, due to cutting
The place of the last outlet of line segment 290 is easiest to make workpiece produce and collapses limit, undermines the surface of workpiece, causes under the cut quality of workpiece
Fall, and general linear cutting equipment, upper and lower two cutting wheels are fixedly installed, the cutting line segment 290 of corresponding two cutting wheels
The workpiece the most to be cut of two ends up and down with enter with go out, therefore, when cut line segment 290 last outlet time, the final stage of workpiece
Surface often entirety create and collapse limit, must give up to fall, cause workpiece waste, virtually add manufacturing cost.Because
This, especially, in the present invention, the first cutting wheels 21 are arranged to at least one in the second cutting wheels 22 can be relative another
It is mobile that one makees deflection so that the first cutting wheels 21 and second cut wheels 22 relative to described workpiece to be cut for front and back to set
Put and adjust the cutting angle of cutting line segment 290 and workpiece to be cut.So, when work piece cut mechanism 2 with just to be cut
During workpiece relative displacement, the first cutting wheels 21 and the second cutting wheels 22 are owing to making line of cut for arranging before and after skew
(this cutting angle is acute angle or obtuse angle to the cutting angle that section 290 and this side-play amount front and back arranged are determined, and unconventional
90 °) and approaching workpiece to be cut cuts, and can there are the feelings of before and after's outlet for cutting line segment 290 workpiece the most to be cut
Shape, meets different cutting technique requirements.In specific implementation, in the first cutting wheels 21 and the second cutting wheels 22
At least one is made deflection relative to another one and is moved by skew drive mechanism realization (i.e., i.e. first cutting wheels 21 phase
Second cutting wheels 22 are made deflection mobile, or the second cutting wheels 22 are made deflection relative to the first cutting wheels 21 and moved, or
Person first cuts wheels 21 and the second cutting wheels 22 all can be partial to movement).
For making at least one pair of cutting wheels 21,22 preferably be set up in carrier 11, in an alternative embodiment, carrying
Frame 11 is two the support beam columns being oppositely arranged, the opposite end (such as by a cutting wheel carrier) of the first cutting wheels 21
Being located at two described support beam columns, the opposite end (such as by a cutting wheel carrier) of the second cutting wheels 22 is also across setting
In two described support beam columns, the second cutting wheels 22 are positioned at the lower section of the first cutting wheels 21.In another alternative embodiment,
Carrier 11 substantially gate frame structure, such as, in П type, support beam column including two and be positioned at two described support beam columns
The connecting cross beam (relatively can strengthen the stable degree of two described support beam columns) on top, the opposite end of the first cutting wheels 21
(such as by a cutting wheel carrier) is located at two described support beam columns, and the opposite end of the second cutting wheels 22 is (such as
By a cutting wheel carrier) also it is located at two described support beam columns, the second cutting wheels 22 are positioned at the first cutting wheels 21
Lower section.
It is noted that in practical work piece evolution operation, be by driving Workpiece carrier device 1 and work piece cut mechanism
2 relative movements, the cutting gauze in work piece cut mechanism 2 silicon ingot to be cut 9 carried Workpiece carrier device 1 is carried out
Cutting.
Workpiece carrier device 1 and work piece cut mechanism 2 relative movement, it may include following three kinds can implementation: a, workpiece
Bogey 1 is fixing and work piece cut mechanism 2 moves towards Workpiece carrier device 1；B, Workpiece carrier device 1 are towards work piece cut
Mechanism 2 moves and work piece cut mechanism 2 is fixed；C, Workpiece carrier device 1 and work piece cut mechanism 2 move towards.As it was previously stated,
In the present embodiment, Workpiece carrier device 1, it is movably arranged on described base.Therefore, in an alternative embodiment, work piece cut
Mechanism 2 is fixed on described base.And in another alternative embodiment, work piece cut mechanism 2 is movably arranged on described base,
Specifically, work piece cut mechanism 2 can move relative to described base under the control in the source of driving (such as driving motor).Preferentially
Ground, is provided with slideway or slide rail, for work piece cut mechanism 2 sliding on described slideway or described slide rail on described base.
The slideway of Workpiece carrier device 1 movement on described base or slide rail and work piece cut mechanism 2 cunning of movement on described base
Road or slide rail are in line.
Workpiece top bracing mechanism 3, is located at the zone line of described base, for shoring the silicon to be cut on Workpiece carrier platform 12
Ingot 9 is so that silicon ingot to be cut 9 can depart from Workpiece carrier platform 12.The zone line of described base i.e. cutting as silicon ingot 9 to be cut
Cut operating area.
From the foregoing, it will be observed that Workpiece carrier platform 12 is used for carrying silicon ingot 9 to be cut, workpiece top bracing mechanism 3 is then to be cut for shoring
Cutting silicon ingot 9 and disengage it from Workpiece carrier platform 12, therefore, workpiece top bracing mechanism 3 must cooperate with Workpiece carrier platform 12.
In the present embodiment: for Workpiece carrier device, Workpiece carrier platform 12 therein is lived by the first elevating mechanism 13
Move and be located on carrier 11.For workpiece top bracing mechanism 3, workpiece top bracing mechanism specifically includes: seat stand 31；Mandrel plate 33, is located at
On seat stand 31；Push rod 35, is located on mandrel plate 33, is positioned at work for wearing the cutting seam 120 in Workpiece carrier platform 12 to shore
Silicon ingot to be cut 9 on part plummer 12.Further: the first elevating mechanism 13 can for example, pushing and withstanding cylinder, pushing and withstanding cylinder
The quantity of 13 is two, is respectively arranged on the opposite sides of Workpiece carrier platform 12 and is adjacent at the described support beam column of correspondence.Top
The length of bar 35 is greater than the thickness of Workpiece carrier platform 12, so, when silicon ingot 9 to be cut shored by push rod 35, has foot
Enough spaces are inserted or pulled out for Workpiece carrier platform 12.
In other another alternative embodiments: for Workpiece carrier device, Workpiece carrier platform 12 therein is fixedly arranged on carrying
On frame 11.For workpiece top bracing mechanism 3, workpiece top bracing mechanism specifically includes: seat stand 31；Lifting platform 33, by the second elevator
Structure (being shown the most in the drawings) is located on seat stand 31；Push rod 35, is located on lifting platform 33, is used for wearing Workpiece carrier platform 12
In cutting seam 120 to shore the silicon ingot to be cut 9 being positioned on Workpiece carrier platform 12.Further, described second elevator
Structure can include the multiple elevating levers being located between seat stand 31 and lifting platform 33 and for controlling the lift cylinder of multiple elevating lever.Top
The length of bar 35 is greater than the thickness of Workpiece carrier platform 12, so, when silicon ingot 9 to be cut shored by push rod 35, has foot
Enough spaces are inserted or pulled out for Workpiece carrier platform 12.
In other yet another alternative embodiment: for Workpiece carrier device, Workpiece carrier platform 12 therein is by first liter
Descending mechanism 13 is movably arranged on carrier 11.For workpiece top bracing mechanism 3, workpiece top bracing mechanism specifically includes: seat stand 31；Lifting
Platform 33, is located on seat stand 31 by the second elevating mechanism (being shown the most in the drawings)；Push rod 35, is located on lifting platform 33,
For wearing the cutting seam 120 in Workpiece carrier platform 12 to shore the silicon ingot to be cut 9 being positioned on Workpiece carrier platform 12.More enter one
Step ground, the first elevating mechanism 13 can for example, pushing and withstanding cylinder, the quantity of pushing and withstanding cylinder 13 is two, is respectively arranged on Workpiece carrier platform
The opposite sides of 12 and being adjacent at the described support beam column of correspondence.Described second elevating mechanism can include being located at seat stand 31 and rising
Drop the multiple elevating levers between platform 33 and be used for controlling the lift cylinder of multiple elevating lever.The length of push rod 35 is greater than workpiece and holds
The thickness of microscope carrier 12, so, when silicon ingot 9 to be cut shored by push rod 35, has sufficient space to insert for Workpiece carrier platform 12
Enter or extract out.
Rotary apparatus 4, is located on described base, is used for driving Workpiece carrier device 1 relative with work piece cut mechanism 2 described
Base rotates to adjust cutting angle.In the present embodiment, described rotary apparatus includes: swivel base 41, driving motor (do not exist
Shown in graphic) and link gear (being shown the most in the drawings).Further: institute is located at by swivel base 41
Stating on base, Workpiece carrier device 1 and work piece cut mechanism 2 are divided into the opposite sides of swivel base 41.It is preferred that at the bottom of rotation
Dish 41 for example, circular ring structure or disc structure, Workpiece carrier device 1 and work piece cut mechanism 2 are disposed on described circular ring structure
Or the described edge of disc structure and the line of Workpiece carrier device 1 and work piece cut mechanism 2 and described circular ring structure or described
The diameter of disc structure coincides.The rotation between described driving motor and swivel base 41 can be for example, located at by described link gear
Turning link gear, described rotation link gear more can farther include be located at the cingulum of swivel base 41 and be engaged in described cingulum
And it is controlled by the driving gear of described driving motor.Described cingulum can enclose under inner side lower limb or the outside being located at swivel base 41
Edge, the quantity of described driving gear is then more than one, such as, when the quantity of described driving gear is two, the two institute
Stating the relative position driving gear then can be symmetrically set in swivel base 41, the quantity of described driving gear is three or more
Time, these multiple described driving gears then can be angularly located on swivel base 41.Utilize described rotary apparatus, workpiece can be driven to hold
Carrying and put 1 described base relative with work piece cut mechanism 2 and rotate, in principle, the anglec of rotation can be unrestricted
Meaning angle, it is preferable that for as the silicon ingot evolution operation of workpiece to be cut, first for carrying out cutting for the first time cuts
Chamfer degree differs 90 ° of angles with the second cutting angle cut for carrying out second time, and (referring to Fig. 5 and Tu, wherein, Fig. 5 is profit
Driving Workpiece carrier device 1 and work piece cut mechanism 2 to carry out turning clockwise the schematic diagram behind 90 ° of angles with rotary apparatus, Fig. 6 is
Schematic diagram after utilizing rotary apparatus to drive Workpiece carrier device 1 and work piece cut mechanism 2 to carry out half-twist angle counterclockwise).
The rotary multi-thread excavation machine of the present invention, includes base, Workpiece carrier device, work piece cut mechanism, workpiece top
Support mechanism and rotary apparatus, wherein, utilize workpiece to be cut that workpiece top bracing mechanism shores on Workpiece carrier platform to be cut
Cut workpiece and depart from Workpiece carrier platform, utilize rotary apparatus to drive Workpiece carrier device and work piece cut mechanism to rotate against to adjust
Cutting angle, it is achieved that be automatically adjusted the cutting angle needed for described workpiece to be cut, it is thus possible to cutting angle after the adjustment
Workpiece to be cut is proceeded cutting.The rotary multi-thread excavation machine of the present invention, solves existing cutting equipment and is obtaining into
Need to cut the most one by one and make cutting efficiency upset low, artificial cause waste of manpower cost, by auxiliary during block finished product
Help tool easily to there will be the problems such as accident such as interference, collision in moving process to the cutting angle changing workpiece, be greatly promoted
Work efficiency and improve the cut quality of workpiece.
The present invention separately provides a kind of workpiece evolution method, is applied in aforesaid rotary multi-thread excavation machine.Refer to
Fig. 7, it is shown that workpiece evolution method of the present invention schematic flow sheet in one embodiment.Below for being applied to Fig. 1 and Fig. 2
Shown rotary multi-thread excavation machine carries out workpiece evolution operation process in a preferred embodiment and is described in detail.Such as front institute
Stating, workpiece to be cut here is silicon ingot to be cut, and the evolution operation that this silicon ingot to be cut is to be carried out is silicon ingot evolution operation.
In this example, silicon ingot 9 to be cut is block structure, and silicon ingot 9 the most to be cut is rectangular structure.
First, step S701, band is cut work-piece on the Workpiece carrier platform of Workpiece carrier device.Specifically, exist
Under original state, Workpiece carrier device 1 moves the zone line to described base, is put by silicon ingot 9 to be cut in the way of tiling
It is put on the Workpiece carrier platform 12 in Workpiece carrier device 1 so that silicon ingot 9 to be cut is corresponding to cutting in work piece cut mechanism 2
Secant net (includes parallel multiple cutting line segments 290).Now, as it is shown in figure 1, the first cutting in work piece cut mechanism 1 is taken turns
Group 11 and the second cutting wheels 12 are for be oppositely arranged up and down, and first be sequentially wound in the first cutting wheels 11 cuts wheel 110
It is setting up and down with the cutting line segment 100 of the second cutting wheel 120 in the second cutting wheels 12.
Need to remark additionally, now, on the one hand, if finding, cutting line segment 100 is long or too short, then can be by driving
First cutting wheels 21 and being mutually shifted of the second cutting wheels 22 adjust the first cutting wheels 11 and the second cutting wheels 12
Between spacing, thus adjust cutting line segment 290 length so that described cutting line segment 290 adapts to silicon ingot 9 to be cut, can
When guaranteeing follow-up cutting, tension force control stability is high and improves cutting accuracy and cutting speed.On the other hand, according to silicon to be cut
Ingot 9 and cutting technique requirement, adjust the deflection angle between the first cutting wheels 11 and the second cutting wheels 12 so that follow-up cuts
When cutting, the surface, outlet, rear end of silicon ingot 9 to be cut just can stop, avoid at least reducing the situation occurring collapsing limit, maximum journey
Protect the surface, outlet, rear end of silicon ingot 9 to be cut degree, improve the cut quality of silicon ingot 9 to be cut.
Then, step S703, under the first cutting angle, drive that Workpiece carrier device is relative with work piece cut mechanism moves
Dynamic, carry out workpiece to be cut cutting for the first time.Specifically, when cutting, by the line of cut in work piece cut mechanism 2 along work
Cutting on part plummer 12 is stitched 120 and is cut the silicon ingot to be cut 9 carried on Workpiece carrier platform 12.
In the present embodiment, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to Workpiece carrier dress
Putting that 1 is motionless and work piece cut mechanism 2 moves towards Workpiece carrier device 1, specifically, Workpiece carrier device 1 keeps static, i.e.
Workpiece carrier device 1 is positioned the zone line of described base, drives work piece cut mechanism 2 to move towards Workpiece carrier device 1,
Meanwhile, the first cutting wheels 21 in work piece cut mechanism 2 and each cutting wheel 210,220 in the second cutting wheels 22 are driven
Rotating drives the line of cut 29 being wrapped to walk about, cutting line segment 290 be directed at cutting to be cut from silicon ingot 9 to be cut of seam 120
Face enters and cuts.
In other another alternative embodiments, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to
Work piece cut mechanism 2 is motionless and Workpiece carrier device 1 moves towards work piece cut mechanism 2, and specifically, work piece cut mechanism 2 is protected
Hold static, i.e. work piece cut mechanism 2 is positioned the marginal area of described base, drive Workpiece carrier device 1 towards work piece cut
Mechanism 2 moves, and meanwhile, each driving in the in work piece cut mechanism 2 first cutting wheels 21 and the second cutting wheels 22 is cut
Cutting wheel 210,220 rotation drives the line of cut 29 being wrapped to walk about, cutting line segment 290 be directed at cutting seam 120 to be cut
The face to be cut of silicon ingot 9 enters and cuts.
In other yet another alternative embodiment, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to
Work piece cut mechanism 2 and Workpiece carrier device 1 move towards, and specifically, drive Workpiece carrier device 1 towards work piece cut machine
Structure 2 moves (Workpiece carrier device 1 is moved towards marginal area by the zone line of described base), drives work piece cut mechanism 2
(work piece cut mechanism 2 is moved towards zone line) is moved by the marginal area of described base towards Workpiece carrier device 1, with
Time, drive the first cutting wheels 21 in work piece cut mechanism 2 and each cutting wheel 210,220 rotation in the second cutting wheels 22
Transfer and drive the line of cut 29 that is wrapped to walk about, cutting line segment 290 be directed to be cut from silicon ingot 9 to be cut of cutting seam 120
Face enters and cuts.
Specifically, in this for the first time cutting, it is reserved with uncut area at the edge of silicon ingot 9 to be cut.
So, when carrying out cutting for the first time, the line of cut in work piece cut mechanism 2 is right along the cutting seam on Workpiece carrier platform 12
Silicon ingot 9 to be cut cuts, and during until closing on to silicon ingot 9 edge to be cut reserved uncut area, stops driving workpiece
Bogey 1 and the relative movement of work piece cut mechanism 2 so that after cut in silicon ingot 9 to be cut after cutting terminates for the first time
The silicon ingot bar of multiple strips be not kept completely separate, the silicon ingot bar of multiple strips is at end due to described uncut area still
Connect together.
After the first time cutting operation of execution of step S703, also include the position adjusting work piece cut mechanism 2, tool
Body ground, moves work piece cut mechanism 2 in situ so that work piece cut mechanism 2 return back to swivel base 41 in rotary apparatus 4
On.
Then, step S705, after having cut for the first time, by workpiece top bracing mechanism shore on Workpiece carrier platform to be cut
Cut workpiece, make workpiece to be cut depart from Workpiece carrier platform.
On the one hand, for the position of Workpiece carrier platform 12: owing to workpiece top bracing mechanism 3 is the centre being fixedly arranged on described base
Region, and to realize shoring silicon ingot 9 to be cut by workpiece top bracing mechanism 3 and making silicon ingot 9 to be cut depart from Workpiece carrier platform
12, must guarantee that Workpiece carrier platform 12 moves to the zone line of described base and is positioned at the surface of workpiece top bracing mechanism 3.Depend on
For the present embodiment, in first time cutting operation, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to
It is that Workpiece carrier device 1 is motionless and work piece cut mechanism 2 moves towards Workpiece carrier device 1, specifically, Workpiece carrier device 1
It is positioned the zone line of described base.Therefore, in the present embodiment, Workpiece carrier device 1 is located in described base
Between region, it is not necessary to remake movement.But, for the work piece cut device in other alternative embodiments, i.e. either can at another
Select work piece cut mechanism 2 in embodiment motionless and Workpiece carrier device 1 moves or the most optional towards work piece cut mechanism 2
In embodiment, work piece cut mechanism 2 and Workpiece carrier device 1 move towards, and Workpiece carrier device 1 is after having cut for the first time
It is most likely not the zone line being placed exactly in described base, now, it is necessary to adjust the position of lower Workpiece carrier device 1, drive
Dynamic Workpiece carrier device 1 moves the zone line to described base.
On the other hand, for how to realize silicon ingot to be cut 9 that workpiece top bracing mechanism 3 shores on Workpiece carrier platform 12 and make
Obtain silicon ingot 9 to be cut and depart from Workpiece carrier platform 12.In the present embodiment, the Workpiece carrier platform 12 in Workpiece carrier device 1 is logical
Cross the first elevating mechanism 13 to be movably arranged on carrier 11, and workpiece top bracing mechanism 3 is for being fixedly installed.Therefore, in this step
In S705, Workpiece carrier platform 12 moved down by the first elevating mechanism 13, now, cutting seam 120 receipts in Workpiece carrier platform 12
Receive the push rod 35 in workpiece top bracing mechanism 3, the top after Workpiece carrier platform 12 moves down certain distance, in workpiece top bracing mechanism 3
Bar 35 can contact the silicon ingot to be cut 9 on Workpiece carrier platform 12, and Workpiece carrier platform 12 continues to move down one section again, and workpiece is shored
Silicon ingot 9 to be cut can have been shored and make silicon ingot 9 to be cut depart from Workpiece carrier platform 12 by the push rod 35 in mechanism 3.But,
For the work piece cut mechanism 2 in other alternative embodiments and workpiece top bracing mechanism 3: in other another alternative embodiments, if
The lifting platform 33 that Workpiece carrier platform 12 is fixedly arranged on carrier 11 in workpiece top bracing mechanism 3 is located at seat by the second elevating mechanism
On platform 31, then, in this step S705, lifting platform 33 risen by the second elevating mechanism, now, the push rod on lifting platform 33
35 insert the cutting seam 120 in Workpiece carrier platforms 12 and along cutting seam 120 rising, when lifting platform 33 rise certain distance it
After, the push rod 35 on lifting platform 33 can contact the silicon ingot to be cut 9 on Workpiece carrier platform 12, and lifting platform 33 continues to rise again
One section, silicon ingot 9 to be cut can have been shored and make silicon ingot 9 to be cut depart from Workpiece carrier platform by the push rod 35 on lifting platform 33
12.In other yet another alternative embodiment, if Workpiece carrier platform 12 is movably arranged on carrier 11 by the first elevating mechanism 13
And the lifting platform 33 in workpiece top bracing mechanism 3 is located on seat stand 31 by the second elevating mechanism, then, in this step S705, adopt
Take and reasonably combine driving strategy, drive Workpiece carrier platform 12 by the first relative carrier 11 of elevating mechanism 13 move up and down with
And drive lifting platform 33 to be moved up and down relative to seat stand 31 by the second elevating mechanism, utilize the push rod 35 on lifting platform 33 by workpiece
On plummer 12, the silicon ingot to be cut 9 of carrying has been shored and has made silicon ingot 9 to be cut depart from Workpiece carrier platform 12.
Then, step S707, rotary apparatus drive Workpiece carrier device and work piece cut mechanism to carry out rotating to adjust
To the second cutting angle.
In fact, before performing step S707, if desired, the position of Workpiece carrier device 1 must be pre-adjusted down.Such as front institute
State, in the present embodiment, adjust the position of Workpiece carrier device 1, including: drive Workpiece carrier device 1 rollback in situ so that
Workpiece carrier device 1 return back in rotary apparatus 4 on swivel base 41.
In step S707, rotary apparatus Workpiece carrier device 1 and work piece cut mechanism 2 is driven to carry out rotating to adjust
To the second cutting angle, specifically include: utilize the driving motor in rotary apparatus 4 to drive pinion rotation, by described driving
Gear driven rotates with the swivel base 41 of cingulum, so, and the Workpiece carrier device 1 on swivel base 41 and work piece cut machine
Structure 2 also rotates along swivel base 41, it is preferable that swivel base 41 half-twist (or 270 °), so, and Workpiece carrier device 1
Also take advantage of a situation with work piece cut mechanism 2 and rotate 90 °, the first cutting angle be transformed into the second cutting angle, i.e. described first cutting
Angle differs 90 ° of angles with described second cutting angle.
Then, step S709, under the second cutting angle, drive that Workpiece carrier device is relative with work piece cut mechanism moves
Dynamic, workpiece to be cut is carried out second time and cuts, complete the evolution operation of workpiece to be cut.
In the present embodiment, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to Workpiece carrier dress
Putting that 1 is motionless and work piece cut mechanism 2 moves towards Workpiece carrier device 1, specifically, Workpiece carrier device 1 keeps static, i.e.
Workpiece carrier device 1 is positioned the zone line of described base, drives work piece cut mechanism 2 to move towards Workpiece carrier device 1,
Meanwhile, the first cutting wheels 21 in work piece cut mechanism 2 and each cutting wheel 210,220 in the second cutting wheels 22 are driven
Rotating drives the line of cut 29 being wrapped to walk about, cutting line segment 290 be directed at cutting to be cut from silicon ingot 9 to be cut of seam 120
Face enters and cuts.
In other another alternative embodiments, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to
Work piece cut mechanism 2 is motionless and Workpiece carrier device 1 moves towards work piece cut mechanism 2, and specifically, work piece cut mechanism 2 is protected
Hold static, i.e. work piece cut mechanism 2 is positioned the marginal area of described base, drive Workpiece carrier device 1 towards work piece cut
Mechanism 2 moves, and meanwhile, each driving in the in work piece cut mechanism 2 first cutting wheels 21 and the second cutting wheels 22 is cut
Cutting wheel 210,220 rotation drives the line of cut 29 being wrapped to walk about, cutting line segment 290 be directed at cutting seam 120 to be cut
The face to be cut of silicon ingot 9 enters and cuts.
In other yet another alternative embodiment, Workpiece carrier device 1 and work piece cut mechanism 2 relative movement is driven to refer to
Work piece cut mechanism 2 and Workpiece carrier device 1 move towards, and specifically, drive Workpiece carrier device 1 towards work piece cut mechanism
2 move (Workpiece carrier device 1 is moved towards marginal area by the zone line of described base), drive court of work piece cut mechanism 2
Move (work piece cut mechanism 2 is moved towards zone line by the marginal area of described base) to Workpiece carrier device 1, meanwhile,
The first cutting wheels 21 in work piece cut mechanism 2 and each cutting wheel 210,220 in the second cutting wheels 22 is driven to rotate
Drive the line of cut 29 being wrapped to walk about, cutting line segment 290 be directed at cutting seam 120 faces to be cut from silicon ingot 9 to be cut
Enter and cut.
Specifically, in this second time cutting, the line of cut in work piece cut mechanism 2 is along Workpiece carrier platform
Cutting on 12 is stitched and is cut silicon ingot 9 to be cut, until cutting completely so that workpiece to be cut is cut into multiple side
The silicon ingot block of shape, each silicon ingot block is individually separated, completes the evolution of silicon ingot 9 to be cut.
The workpiece evolution method of the present invention, first, under the first cutting angle, drives Workpiece carrier device and work piece cut
Mechanism's relative movement, is carried out cutting for the first time to workpiece to be cut by the line of cut in work piece cut mechanism；In cutting for the first time
After completing, workpiece top bracing mechanism shore workpiece to be cut so that workpiece to be cut departs from Workpiece carrier device；By rotary apparatus
Workpiece carrier device and work piece cut mechanism is driven to carry out rotating to be adjusted by cutting angle to the second cutting angle, it is achieved that from
The dynamic cutting angle regulated needed for described workpiece to be cut；Under the second cutting angle, Workpiece carrier device and workpiece is driven to cut
Cutting mill structure relative movement, is carried out second time by the workpiece to be cut of the line of cut in work piece cut mechanism and cuts, complete described to be cut
Cut the evolution of workpiece.Workpiece evolution method of the present invention, solving existing cutting equipment needs repeatedly when obtaining in bulk finished product
Cut one by one and make cutting efficiency upset low, artificial cause waste of manpower cost, change workpiece by auxiliary fixture
Cutting angle in moving process, easily there will be the problems such as accident such as interference, collision, be greatly improved work efficiency and raising
The cut quality of workpiece.
Obviously, those skilled in the art can carry out various change and the modification essence without deviating from the present invention to the present invention
God and scope.So, if these amendments of the present invention and modification belong to the scope of the claims in the present invention and equivalent technologies thereof
Within, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a rotary multi-thread excavation machine, it is characterised in that including:
Base；
Workpiece carrier device, is movably arranged on described base, includes the Workpiece carrier platform for carrying workpiece to be cut；Described
Workpiece carrier platform offers parallel multiple cutting seams；
Work piece cut mechanism, is located at described base and is oppositely arranged with described Workpiece carrier platform；Described work piece cut mechanism includes
Cutting support, at least one pair of being located on described cutting support cutting wheels and line of cut, described line of cut correspondence is wound in
To form cutting net at least one pair of cutting wheels described；Move when described Workpiece carrier device is relative with described work piece cut mechanism
Time dynamic, the workpiece described to be cut on described Workpiece carrier platform is cut by the described line of cut in described work piece cut mechanism
Cutting, described line of cut is positioned at described cutting seam when cutting described workpiece to be cut；
Workpiece top bracing mechanism, is located at the zone line of described base, described to be cut for shore on described Workpiece carrier platform
Workpiece is so that described workpiece to be cut departs from described Workpiece carrier platform；And
Rotary apparatus, is located on described base, is used for driving described Workpiece carrier device with described work piece cut mechanism relative to institute
State base to rotate to adjust cutting angle.
Rotary multi-thread excavation machine the most according to claim 1, it is characterised in that described base is provided with slipping mechanism,
Described Workpiece carrier device and/or described work piece cut mechanism it is slidably equipped with on described slipping mechanism.
Rotary multi-thread excavation machine the most according to claim 2, it is characterised in that described slipping mechanism include slide rail or
Slideway.
Rotary multi-thread excavation machine the most according to claim 1, it is characterised in that
Also including carrier in described Workpiece carrier device, described Workpiece carrier platform is movably arranged at described by the first elevating mechanism
On carrier；
Described workpiece top bracing mechanism includes: seat stand；Mandrel plate, is located on described seat stand；Push rod, is located on described mandrel plate, uses
In the cutting seam worn in described Workpiece carrier platform to shore the workpiece to be cut being positioned on described Workpiece carrier platform.
Rotary multi-thread excavation machine the most according to claim 1, it is characterised in that
Described Workpiece carrier device also including, carrier, described Workpiece carrier platform are fixedly arranged on described carrier；
Described workpiece top bracing mechanism includes: seat stand；Lifting platform, is movably arranged on described seat stand by the second elevating mechanism；Push rod,
It is located on described lifting platform, is positioned on described Workpiece carrier platform to shore for wearing the cutting seam in described Workpiece carrier platform
Workpiece to be cut.
Rotary multi-thread excavation machine the most according to claim 1, it is characterised in that
Also including carrier in described Workpiece carrier device, described Workpiece carrier platform is movably arranged at described by the first elevating mechanism
On carrier；
Described workpiece top bracing mechanism includes: seat stand；Lifting platform, is movably arranged on described seat stand by the second elevating mechanism；Push rod,
It is located on described lifting platform, is positioned on described Workpiece carrier platform to shore for wearing the cutting seam in described Workpiece carrier platform
Workpiece to be cut.
7. according to the rotary multi-thread excavation machine described in claim 4,5 or 6, it is characterised in that the length of described push rod is more than
The thickness of described Workpiece carrier platform.
Rotary multi-thread excavation machine the most according to claim 1, it is characterised in that described rotary apparatus includes:
Swivel base, is located on described base；Described Workpiece carrier device and described work piece cut branch construction are in described rotation
The opposite sides on chassis；
Drive motor；And
Link gear, is located at the rotation link gear between described driving motor and described swivel base；Described rotation gear
Structure includes the cingulum being located at described swivel base and is engaged in described cingulum and is controlled by the driving gear of described driving motor.
9. a workpiece evolution method, is applied to rotary multi-thread excavation machine according to any one of claim 1 to 8,
It is characterized in that, described workpiece evolution method includes:
Under the first cutting angle, drive Workpiece carrier device and the relative movement of work piece cut mechanism, by described work piece cut machine
Line of cut on structure along on described Workpiece carrier platform cutting seam and to the work to be cut carried on described Workpiece carrier platform
Part carries out cutting for the first time；
After having cut for the first time, workpiece top bracing mechanism shore the workpiece described to be cut on described Workpiece carrier platform so that
Described workpiece to be cut departs from described Workpiece carrier platform；
Described Workpiece carrier device and described work piece cut mechanism is driven to carry out rotating to adjust to the second cutting by rotary apparatus
Angle；And
Under the second cutting angle, drive described Workpiece carrier device and the relative movement of described work piece cut mechanism, by described work
Line of cut on part cutting mechanism along the cutting seam on described Workpiece carrier platform to being carried on described Workpiece carrier platform
Workpiece to be cut carries out second time and cuts, and completes the evolution of described workpiece to be cut.
Workpiece evolution method the most according to claim 9, it is characterised in that
It is reserved with uncut area at the edge of described workpiece to be cut；
When carrying out cutting for the first time, the line of cut in described work piece cut mechanism stitches along the cutting on described Workpiece carrier platform
And described workpiece to be cut is cut, during until closing on to the uncut area that the described edge of work to be cut is reserved, stop
Only drive described Workpiece carrier device and the relative movement of described work piece cut mechanism so that treat described in after cutting terminates for the first time
Cutting workpiece still connects together due to described uncut area at end.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610648706.8A CN106079125A (en) | 2016-08-09 | 2016-08-09 | Rotary multi-thread excavation machine and workpiece evolution method |
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| CN201610648706.8A CN106079125A (en) | 2016-08-09 | 2016-08-09 | Rotary multi-thread excavation machine and workpiece evolution method |
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| CN106976170A (en) * | 2017-04-20 | 2017-07-25 | 大连连城数控机器股份有限公司 | Silicon single crystal rod automated variable square hole gauze cutting head |
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| CN107584687A (en) * | 2017-10-31 | 2018-01-16 | 乐山新天源太阳能科技有限公司 | Annular diamond wire extracting machine |
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