CN114669544A - Single crystal groove type alkali polishing cleaning machine - Google Patents
Single crystal groove type alkali polishing cleaning machine Download PDFInfo
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- CN114669544A CN114669544A CN202210321489.7A CN202210321489A CN114669544A CN 114669544 A CN114669544 A CN 114669544A CN 202210321489 A CN202210321489 A CN 202210321489A CN 114669544 A CN114669544 A CN 114669544A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 53
- 238000005498 polishing Methods 0.000 title claims abstract description 23
- 239000013078 crystal Substances 0.000 title claims abstract description 22
- 239000003513 alkali Substances 0.000 title claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims abstract description 81
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005192 partition Methods 0.000 claims abstract description 17
- 238000005406 washing Methods 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 241000252254 Catostomidae Species 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 abstract description 31
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 17
- 239000007921 spray Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a single crystal groove type alkali polishing cleaning machine, and relates to the technical field of solar cell production equipment. The cleaning machine body comprises a cleaning area and a placing area, wherein the cleaning area is separated by a partition plate, the placing area is used for placing cleaned wafers, the cleaning area comprises a cleaning water tank arranged at the bottom, a bearing piece connected to the partition plate in a sliding manner is arranged above the cleaning water tank, a flushing piece is arranged on the inner side wall of the machine body, and the flushing piece is connected to the machine body in a sliding manner along the extending direction of the bearing piece and comprises a top flushing rod and a bottom flushing rod. In addition, the wafers can be automatically transferred into the wafer grooves on the other side to be collected and dried, so that the mechanization degree and the automation degree are improved, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of solar cell production equipment, in particular to a single crystal groove type alkali polishing cleaning machine.
Background
The solar cell is a photoelectric semiconductor sheet which directly generates electricity by using sunlight, is also called as a solar chip or a photovoltaic cell, and can output voltage instantly and generate current under the condition of a loop as long as the solar cell is illuminated under a certain illumination condition.
Diffusion is an extremely important step in the production of solar cells, and in the process flow of manufacturing solar cells, etching is usually performed after diffusion. During the diffusion process, the peripheral surface of the silicon wafer also forms a diffusion layer. The peripheral diffusion layer shorts the upper and lower electrodes of the cell, which must be removed. The process is an essential step in the manufacture of the solar cell, and any tiny local short circuit at the periphery can reduce the parallel resistance of the cell, so that the cell becomes a waste product.
Etching is the process of selectively removing unwanted material from the surface of a semiconductor material by chemical or physical means. Generally, etching techniques are classified into wet etching and dry etching. After the etching is completed, the wafer needs to be cleaned for a second time in order to remove phosphorosilicate glass formed by reaction of phosphorus and silicon dioxide during the diffusion process, silicon oxide film generated during the diffusion process, silicon debris generated during the etching process, and the like.
The cleaning process generally uses polishing cleaning equipment, and the Chinese patent with the current publication number of CN102496560A discloses wet etching cleaning equipment and a wet etching cleaning method, which comprise a chemical tank liquid flow distribution plate, wherein the chemical tank liquid flow distribution plate comprises a first closed area R, a second closed area S and a hole arrangement area, and a plurality of holes are arranged on the hole arrangement area, and the wet etching cleaning equipment is characterized in that a row of holes is arranged between every two wafer arrangement positions in the hole arrangement area of the chemical tank liquid flow distribution plate, and the number of the holes in each row is not less than 8.
The cleaning device improves the problems of inter-wafer uniformity, intra-wafer uniformity and undercutting in the wet etching process of an etched layer by optimizing the design of the chemical tank liquid splitter plate, but the cleaning of the wafer by the cleaning device is not uniform enough, the whole wafer is difficult to clean, and residues are easy to leave on the surface of the wafer.
Disclosure of Invention
Aiming at the technical problems, the invention overcomes the defects of the prior art and provides a single crystal groove type alkali polishing and cleaning machine.
In order to solve the technical problems, the invention provides a single crystal groove type alkali polishing cleaning machine.
The technical effects are as follows: carry out twice process to the washing of wafer, firstly soak the wafer, soak the most residue on wafer surface and clear away, secondly wash the wafer surface, can carry out more complete washing to the wafer surface, wash clean with its surface and the interior residue of inslot, reach better clean effect, can also collect the wafer inslot that shifts the wafer automatically to the opposite side in addition and dry, promoted mechanization and degree of automation, improved production efficiency.
The invention further defines the technical scheme that: the utility model provides a single crystal slot type alkali polishing cleaning machine, which comprises a bod, the organism includes the clean district that places through the baffle separation and the district of placing that is used for placing clean back wafer, the clean district is including the clean pond of locating the bottom position, clean pond top is equipped with the carrier of connection on the baffle that slides, it is clean to be used for bearing the weight of the wafer and sink the wafer to soak in the clean pond, be equipped with the flushing part on the organism internal side wall, the flushing part slides along carrier extending direction and connects on the organism, including the bottom flushing rod that is used for washing the top flushing rod of wafer top surface and is used for washing the wafer bottom surface, still be equipped with on the organism and be used for with the wafer material loading with shift the transfer piece of placing the district.
Furthermore, the bearing piece comprises a bearing plate which is arranged in a hollow manner and is used for bearing and placing the wafer, the bearing plate is composed of a plurality of bearing pieces which are arranged in a vertical crossing manner, the bearing pieces are arranged perpendicular to the plane of the bearing plate, the same bearing pieces are arranged on the side faces of the bearing plate, and a water drainage groove is formed between the bearing pieces.
The single crystal groove type alkali polishing cleaning machine comprises a bearing piece, a movable block, a driving motor and a driving screw rod, wherein the bearing piece comprises a movable block connected to a partition plate in a sliding mode, the movable block and the bearing plate are fixed to each other, the partition plate is located on one side face of a placement area and connected with the sliding block in a sliding mode along the vertical direction, the driving motor is fixed to the partition plate, the driving screw rod is arranged on an output shaft of the driving motor and penetrates through the sliding block and is in threaded connection with the sliding block.
The single crystal trough type alkali polishing cleaning machine is characterized in that the movable block is connected with the sliding block through the middle rod, the middle rod is integrally arranged in an n shape, two ends of the bottom of the middle rod are fixed to the sliding block and the movable block respectively, the middle position of the middle rod spans over the partition plate, and the bearing plate is arranged downwards relative to the horizontal plane.
The single crystal trough type alkali polishing cleaning machine is characterized in that the flushing part comprises sliding tracks arranged on two inner side surfaces of the machine body, the sliding tracks are provided with two groups of parallel arrangement, a top flushing rod and a bottom flushing rod are connected in the sliding tracks in a sliding mode, a plurality of parallel arrangement spray heads are arranged on the bottom flushing rod, and the spray heads are arranged towards the bottom surface of the bearing plate.
The single crystal tank type alkali polishing cleaning machine is characterized in that the top flushing rod and the bottom flushing rod are identical in structure, a spray head on the top flushing rod is arranged towards the top surface of the bearing plate, a movable motor arranged parallel to the horizontal plane is arranged on the machine body, a movable lead screw is arranged on an output shaft of the movable motor, an adjusting block is connected to the machine body in a sliding mode, two ends of the adjusting block are fixed to the bottom flushing rod and the top flushing rod respectively, and the movable lead screw penetrates through the adjusting block and is in threaded connection with the adjusting block.
The single crystal groove type alkali polishing cleaning machine comprises a transfer piece, a cross sliding table is fixed on the movable frame, an adjusting cylinder perpendicular to the horizontal plane is fixed on a sliding block of the cross sliding table, a transfer plate is fixed on an output shaft of the adjusting cylinder, and a plurality of suckers arranged in an array mode are arranged on the transfer plate and used for adsorbing and carrying wafers.
The single crystal groove type alkali polishing cleaning machine is characterized in that a feeding area is arranged on one side of the machine body, which is far away from the placing area, and used for storing wafers after the diffusion step is completed, and a movable trolley is arranged in the placing area and used for placing and transferring the cleaned wafers.
The invention has the beneficial effects that:
(1) in the invention, a cleaning area and a placing area are separated by a partition board, when cleaning is carried out, a wafer can be placed on a bearing piece through a transfer piece, the bearing piece is sunk into a cleaning water tank at the moment, most of residues on the surface of the bearing piece are removed after soaking for a preset time, the bearing piece is lifted to the position above the cleaning water tank and is positioned in the middle of a flushing piece, the flushing piece starts to work, a top flushing rod and a bottom flushing rod synchronously slide on the inner side wall of a machine body, the top surface of the wafer and the bottom surface of the wafer are respectively flushed, after flushing is finished, the wafer is transferred into the placing area through the transfer piece to be placed and dried, and finally the wafer is transferred to the next procedure;
(2) according to the invention, the bearing plate is hollow, the wafers are borne and placed by the bearing frame, the obstruction and the influence of the bearing frame on water flow in the washing process can be reduced to the greatest extent, the bearing frame is composed of a plurality of bearing sheets, the water flow can penetrate through the bearing plates while the wafers are borne, the water flow can wash the wafers through gaps among the bearing sheets, and a water drainage groove formed among the bearing sheets on the side surface of the bearing plate can quickly drain the washed water flow, so that residues in water are prevented from being accumulated and condensed on the wafers;
(3) according to the invention, the driving screw rod is driven to rotate by the driving motor, the whole sliding block can be driven to slide up and down under the action of threads, the sliding block is connected with the movable block through the middle rod, the sliding block can be movably linked with the middle rod to slide, so that the lifting of the bearing plate is realized, similarly, the movable screw rod is driven to rotate by the movable motor, the adjusting block can be driven to slide under the action of the threads, the adjusting block is linked with the two bottom flushing rods and the top flushing rod to synchronously slide on the inner side surface of the machine body, and the wafer is flushed;
(4) according to the wafer lifting device, the movable frame is arranged on the machine body, the cross sliding table is fixed on the movable frame and can drive the adjusting cylinder and the transfer plate to move on a horizontal plane, the adjusting cylinder can drive the transfer plate to lift, the arranged sucking disc can avoid scratching the surface of a wafer, and the safety of wafer carrying is ensured;
(5) according to the invention, the wafer is cleaned by two procedures, wherein the first procedure is to soak the wafer to soak and remove most of residues on the surface of the wafer, the second procedure is to rinse the surface of the wafer to more completely rinse the surface of the wafer and to rinse the surface of the wafer and residues in the groove completely, so that a better cleaning effect is achieved, and in addition, the wafer can be automatically transferred into the wafer groove on the other side to be collected and dried, so that the mechanization degree and the automation degree are improved, and the production efficiency is improved.
Drawings
FIG. 1 is a structural view of example 1;
FIG. 2 is a structural view of a transfer member in example 1;
figure 3 is a block diagram of the carrier and the flushing member of example 1.
Wherein: 1. a body; 11. a cleaning zone; 111. cleaning the pool; 12. a placement area; 121. a movable trolley; 13. a feeding area; 2. a carrier; 21. a carrier plate; 22. a carrier; 23. a carrier sheet; 24. a water discharge tank; 25. a movable block; 26. a sliding block; 27. a drive motor; 28. driving a lead screw; 29. an intermediate lever; 3. a flushing member; 31. a sliding track; 32. a bottom flushing rod; 33. a top rinse rod; 34. a spray head; 35. a movable motor; 36. a movable lead screw; 37. a regulating block; 4. a transfer member; 41. a movable frame; 42. a cross sliding table; 43. an adjusting cylinder; 44. a transfer plate; 45. and (4) sucking discs.
Detailed Description
The single crystal tank type alkali polishing and cleaning machine provided by the embodiment has a structure shown in fig. 1-3, and comprises a machine body 1, wherein the machine body 1 comprises a cleaning area 11 and a placing area 12, which are separated by a partition plate, for placing a cleaned wafer, a feeding area 13 is arranged on one side of the machine body 1, which is far away from the placing area 12, for storing the wafer after the diffusion step is completed, and a movable trolley 121 is arranged in the placing area 12 for placing and transferring the cleaned wafer.
As shown in fig. 1-3, the cleaning area 11 includes a cleaning water tank 111 disposed at the bottom, a carrier 2 slidably connected to the partition is disposed above the cleaning water tank 111 for carrying the wafer and sinking the wafer into the cleaning water tank 111 for soaking and cleaning, a rinsing part 3 is disposed on the inner sidewall of the machine body 1, the rinsing part 3 is slidably connected to the machine body 1 along the extending direction of the carrier 2, and includes a top rinsing rod 33 for rinsing the top surface of the wafer and a bottom rinsing rod 32 for rinsing the bottom surface of the wafer, and a transfer part 4 for loading and transferring the wafer to the placement area 12 is further disposed on the machine body 1.
As shown in fig. 1-3, the carrier 2 includes a carrier plate 21, the carrier plate 21 is hollow, a carrier 22 for carrying and placing a wafer is disposed in the carrier 21, the carrier 22 is composed of a plurality of vertically crossed carrier sheets 23, the carrier sheets 23 are disposed perpendicular to the plane of the carrier plate 21, the same carrier sheets 23 are disposed on the lateral surfaces of the carrier plate 21, and a drainage channel 24 is formed between the carrier sheets 23.
As shown in fig. 1-3, the supporting member 2 includes a movable block 25 slidably connected to a partition, the movable block 25 and the supporting plate 21 are fixed to each other, the partition is located on one side of the placing area 12 and slidably connected to a sliding block 26 along a vertical direction, a driving motor 27 is fixed to the partition, a driving screw 28 is provided on an output shaft of the driving motor 27, and the driving screw 28 penetrates through the sliding block 26 and is in threaded connection with the sliding block 26.
As shown in fig. 1-3, the movable block 25 is connected to the sliding block 26 via an intermediate rod 29, the intermediate rod 29 is integrally disposed in an "n" shape, two ends of the bottom of the intermediate rod are respectively fixed to the sliding block 26 and the movable block 25, the intermediate position crosses over the partition, and the bearing plate 21 is disposed in a downward inclination relative to the horizontal plane. The flushing part 3 comprises a sliding track 31 arranged on two inner side surfaces of the machine body 1, the sliding track 31 is provided with two groups of parallel arrangement, a top flushing rod 33 and a bottom flushing rod 32 are connected in the sliding track 31 in a sliding mode, a plurality of spray heads 34 arranged in parallel are arranged on the bottom flushing rod 32, and the spray heads 34 are arranged towards the bottom surface of the bearing plate 21.
As shown in fig. 1-3, the top rinse rod 33 and the bottom rinse rod 32 have the same structure, the spray head 34 is disposed toward the top surface of the loading plate 21, the machine body 1 is provided with a movable motor 35 disposed parallel to the horizontal plane, an output shaft of the movable motor 35 is provided with a movable lead screw 36, the machine body 1 is slidably connected with an adjusting block 37, two ends of the adjusting block 37 are respectively fixed on the bottom rinse rod 32 and the top rinse rod 33, and the movable lead screw 36 penetrates through the adjusting block 37 and is in threaded connection with the adjusting block 37.
As shown in fig. 1-3, the transferring member 4 includes a movable frame 41 fixed on the top of the machine body 1, a cross sliding table 42 is fixed on the movable frame 41, an adjusting cylinder 43 arranged vertically and horizontally is fixed on a sliding block of the cross sliding table 42, a transferring plate 44 is fixed on an output shaft of the adjusting cylinder 43, and a plurality of suckers 45 arranged in an array are arranged on the transferring plate 44 for sucking and carrying wafers.
During operation, separate clean district 11 and place district 12 through the baffle, when cleaning, can arrange the wafer in on carrier 2 through transfer 4, carrier 2 sinks to clean water tank 111 this moment, after carrying out the soaking of preset time, clear away most residues on its surface, rise carrier 2 to clean water tank 111 top again, be located the position in the middle of 3 washes, wash 3 and begin work, top wash rod 33 and bottom wash rod 32 slide in step on organism 1 inside wall, wash the top surface of wafer and the bottom surface of wafer respectively, wash the completion back, the rethread transfer 4 shifts the wafer to place and dry in placing district 12, shift it to next process at last.
The wafer cleaning device carries out two procedures on cleaning of the wafer, wherein the first procedure is to soak the wafer to soak and remove most of residues on the surface of the wafer, the second procedure is to rinse the surface of the wafer to more completely rinse the surface of the wafer and rinse the residues in the wafer surface and the wafer groove completely to achieve a better cleaning effect, and in addition, the wafer can be automatically transferred into the wafer groove on the other side to be collected and dried, so that the mechanization degree and the automation degree are improved, and the production efficiency is improved.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.
Claims (8)
1. The utility model provides a single crystal slot type alkali polishing cleaning machine, includes organism (1), its characterized in that: organism (1) is including the clean district (11) that separates through the baffle and the district (12) of placing that is used for placing clean back wafer, clean district (11) is including clean pond (111) of locating the bottom position, clean pond (111) top is equipped with bearing piece (2) of connection on the baffle of sliding, be used for bearing the weight of the wafer and sink to the clean pond (111) in soak clean, be equipped with on organism (1) inside wall and wash piece (3), it slides and connects on organism (1) along bearing piece (2) extending direction to wash piece (3), including top wash rod (33) that is used for washing the wafer top surface and bottom wash rod (32) that are used for washing the wafer bottom surface, still be equipped with on organism (1) and be used for wafer material loading and shift to place transfer piece (4) of district (12).
2. The single crystal trough alkaline polishing cleaning machine of claim 1, wherein: the bearing piece (2) comprises a bearing plate (21), the bearing plate (21) is arranged in a hollow mode, a bearing piece (22) used for bearing and placing wafers is arranged in the bearing plate (21), the bearing piece (22) is composed of a plurality of bearing pieces (23) which are arranged in a vertical cross mode, the bearing pieces (23) are arranged perpendicular to the plane of the bearing plate (21), the same bearing pieces (23) are arranged on the side face of the bearing plate (21), and a water drainage groove (24) is formed between the bearing pieces (23).
3. The single crystal tank alkaline polishing cleaning machine of claim 2, wherein: the bearing piece (2) comprises a movable block (25) connected to the partition plate in a sliding mode, the movable block (25) and the bearing plate (21) are fixed to each other, the partition plate is located on one side face of the placement area (12) and connected with the sliding block (26) in a sliding mode along the vertical direction, a driving motor (27) is fixed to the partition plate, a driving lead screw (28) is arranged on an output shaft of the driving motor (27), and the driving lead screw (28) penetrates through the sliding block (26) and is in threaded connection with the sliding block (26).
4. The single crystal tank alkaline polishing cleaning machine of claim 3, wherein: the movable block (25) is connected with the sliding block (26) through an intermediate rod (29), the intermediate rod (29) is integrally arranged in an n shape, two ends of the bottom of the intermediate rod are fixed to the sliding block (26) and the movable block (25) respectively, the middle of the intermediate rod spans across the partition plate, and the bearing plate (21) is arranged downwards relative to the horizontal plane.
5. The single crystal tank alkaline polishing cleaning machine of claim 1, wherein: washing piece (3) including locating slide rail (31) of two medial surfaces of organism (1), slide rail (31) are equipped with parallel arrangement's two sets ofly, and top washing pole (33) and bottom washing pole (32) are all slided and are connected in slide rail (31), are equipped with a plurality of parallel arrangement's shower nozzle (34) on bottom washing pole (32), and shower nozzle (34) set up towards loading board (21) bottom surface.
6. The single crystal tank alkaline polishing cleaning machine of claim 5, wherein: the structure of top wash rod (33) and bottom wash rod (32) is the same, shower nozzle (34) on it sets up towards loading board (21) top surface, be equipped with movable motor (35) that are on a parallel with the horizontal plane setting on organism (1), be equipped with movable lead screw (36) on the output shaft of movable motor (35), it is connected with regulating block (37) to slide on organism (1), regulating block (37) both ends are fixed in bottom wash rod (32) and top wash rod (33) respectively, movable lead screw (36) pierce through regulating block (37) and threaded connection with it.
7. The single crystal tank alkaline polishing cleaning machine of claim 1, wherein: the wafer transfer device is characterized in that the transfer piece (4) comprises a movable frame (41) fixed to the top of the machine body (1), a cross sliding table (42) is fixed to the movable frame (41), an adjusting cylinder (43) arranged in a vertical horizontal plane is fixed to a sliding block of the cross sliding table (42), a transfer plate (44) is fixed to an output shaft of the adjusting cylinder (43), and a plurality of suckers (45) arranged in an array mode are arranged on the transfer plate (44) and used for adsorbing and carrying wafers.
8. The single crystal tank alkaline polishing cleaning machine of claim 7, wherein: a feeding area (13) is arranged on one side, far away from the placing area (12), of the machine body (1) and used for storing the wafers after the diffusion step is completed, and a movable trolley (121) is arranged in the placing area (12) and used for placing and transferring the cleaned wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210321489.7A CN114669544A (en) | 2022-03-30 | 2022-03-30 | Single crystal groove type alkali polishing cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210321489.7A CN114669544A (en) | 2022-03-30 | 2022-03-30 | Single crystal groove type alkali polishing cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114669544A true CN114669544A (en) | 2022-06-28 |
Family
ID=82077208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210321489.7A Pending CN114669544A (en) | 2022-03-30 | 2022-03-30 | Single crystal groove type alkali polishing cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114669544A (en) |
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| JP2001234399A (en) * | 2000-02-24 | 2001-08-31 | Electroplating Eng Of Japan Co | Cleaner for cup type plating device |
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| CN210995606U (en) * | 2019-11-01 | 2020-07-14 | 无锡乐东微电子有限公司 | Ultrasonic monocrystalline silicon wafer cleaning tank |
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| CN112077069A (en) * | 2020-07-06 | 2020-12-15 | 大同新成新材料股份有限公司 | Cleaning equipment for cleaning semiconductor graphite and cleaning method thereof |
| CN213033204U (en) * | 2020-08-27 | 2021-04-23 | 广东力威环境发展有限公司 | Pool cleaning device |
| CN213124395U (en) * | 2020-11-10 | 2021-05-04 | 深圳鼎晶科技有限公司 | Intelligent device integrating feeding and binding |
| CN215299195U (en) * | 2021-06-03 | 2021-12-24 | 四川晶美硅业科技有限公司 | Silicon chip cleaning and drying device |
-
2022
- 2022-03-30 CN CN202210321489.7A patent/CN114669544A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001234399A (en) * | 2000-02-24 | 2001-08-31 | Electroplating Eng Of Japan Co | Cleaner for cup type plating device |
| CN207615278U (en) * | 2017-11-27 | 2018-07-17 | 苏州德瑞姆超声科技有限公司 | A kind of silicon wafer stripping cleaning equipment |
| CN209049872U (en) * | 2018-11-23 | 2019-07-02 | 江苏科林泰电子有限公司 | A loading attachment for full-automatic silicon chip cleaning machine |
| CN210995606U (en) * | 2019-11-01 | 2020-07-14 | 无锡乐东微电子有限公司 | Ultrasonic monocrystalline silicon wafer cleaning tank |
| CN212041708U (en) * | 2020-03-25 | 2020-12-01 | 扬州荣兴达光电科技有限公司 | Reciprocating type silicon chip belt cleaning device of circulation |
| CN112077069A (en) * | 2020-07-06 | 2020-12-15 | 大同新成新材料股份有限公司 | Cleaning equipment for cleaning semiconductor graphite and cleaning method thereof |
| CN213033204U (en) * | 2020-08-27 | 2021-04-23 | 广东力威环境发展有限公司 | Pool cleaning device |
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| CN215299195U (en) * | 2021-06-03 | 2021-12-24 | 四川晶美硅业科技有限公司 | Silicon chip cleaning and drying device |
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Application publication date: 20220628 |