CN215299195U

CN215299195U - Silicon chip cleaning and drying device

Info

Publication number: CN215299195U
Application number: CN202121233010.1U
Authority: CN
Inventors: 张晋美
Original assignee: Sichuan Jingmei Silicon Industry Technology Co ltd
Current assignee: Sichuan Jingmei Silicon Industry Technology Co ltd
Priority date: 2021-06-03
Filing date: 2021-06-03
Publication date: 2021-12-24
Anticipated expiration: 2031-06-03

Abstract

The application provides a silicon wafer cleaning and drying device, which belongs to the field of silicon wafer cleaning devices and comprises a cleaning mechanism and a drying mechanism, wherein the cleaning mechanism comprises a cleaning box, a threaded rod, a fixed plate, a motor and a first water pump, one end of the cleaning box is opened, the two ends of the threaded rod are rotatably connected with the inner wall of the cleaning box, the drying mechanism comprises a support, an electric push rod, a cover plate and a hot air blower, the support is fixed on the top surface of the cleaning box, the electric push rod is fixed on one side of the support, the cover plate is fixed at the output end of the electric push rod, the hot air blower is fixed on one side of the cover plate, one end of the hot air blower is connected with an air pipe, the air pipe penetrates through the surface of the cover plate and faces towards the inside of the cleaning box, the silicon wafer cleaning and drying device utilizes a bottom circulating pump to adsorb impurities, so that the cleaning liquid always keeps better clarifying cleaning effect.

Description

Silicon chip cleaning and drying device

Technical Field

The application relates to the field of silicon wafer cleaning devices, in particular to a silicon wafer cleaning and drying device.

Background

The silicon element is a grey, fragile and tetravalent nonmetallic chemical element, a silicon wafer is also called a wafer and is processed from a silicon ingot, millions of transistors can be etched on the silicon wafer through a special process and is widely applied to the manufacture of integrated circuits, the silicon wafer is strictly cleaned in the production of semiconductor devices, the devices can be failed due to trace pollution, the cleaning aims to remove surface pollution impurities, including organic matters and inorganic matters, wherein some impurities exist on the surface of the silicon wafer in an atomic state or an ionic state or in a film form or a particle form, various defects can be caused, and the methods for removing the pollution comprise two types of physical cleaning and chemical cleaning.

When the silicon wafer is cleaned, the dirt cleaned out by entering and exiting the cleaning pool is excited every time, and the dirt is mixed in the cleaning liquid, so that the cleaning effect is poor.

SUMMERY OF THE UTILITY MODEL

In order to make up for above not enough, the application provides a silicon chip washs drying device, has solved the spot and has mixed the problem that leads to the cleaning performance poor in the washing liquid when wasing.

The application is realized as follows:

the application provides a silicon chip washs drying device, including wiper mechanism and stoving mechanism.

The cleaning mechanism comprises a cleaning box, a threaded rod, a fixing plate, a motor and a first water pump, one end of the cleaning box is opened, two ends of the threaded rod are rotatably connected with the inner wall of the cleaning box, threads on two sides of the fixing plate are sleeved on the threaded rod, a plurality of through holes are formed in the surface of the fixing plate, the motor is fixed on the outer side of the cleaning box, the motor is connected with the threaded rod in a transmission manner, the first water pump is fixed inside the cleaning box below the fixing plate, one end of the first water pump is connected with a first water pipe, and the first water pipe penetrates out from one side of the cleaning box and is communicated with the cleaning box.

The drying mechanism comprises a support, an electric push rod, a cover plate and an air heater, the support is fixed on the top surface of the cleaning box, the electric push rod is fixed on one side of the support, the cover plate is fixed at the output end of the electric push rod, the air heater is fixed on one side of the cover plate, one end of the air heater is connected with an air pipe, and the air pipe penetrates through the surface of the cover plate and faces towards the inside of the cleaning box.

In the above-mentioned realization process, put the silicon chip of treating abluent and put into the fixed plate surface from wasing case one end, the motor drives the threaded rod and rotates in with the fixed plate below dip in the washing liquid, first water pump will wash the washing liquid of incasement and take out from wasing the bottom half then return the washing case behind first water pipe this moment, in this circulation, the spot is adsorbed on the fixed plate surface by the adsorption affinity, after the washing finishes the fixed plate and rises, leave the surface of water until wasing the frame, electronic the pushing away at this moment is with the apron pressure at wasing the case surface, the air heater is to wasing the incasement and blast air drying, this silicon chip washs drying device utilizes the bottom circulating pump to adsorb impurity, make the washing liquid keep more clear cleaning performance good throughout.

In a specific embodiment, a bearing seat is installed on the inner wall of the cleaning box, and one end of the threaded rod is fixed in the bearing seat.

In the implementation process, the bearing seat provides a rotation fulcrum.

In a specific embodiment, a connecting sleeve is fixed at one end of the motor, and the connecting sleeve is arranged between the motor and the threaded rod.

In the above implementation process, the connecting sleeve is used for fixing the motor.

In a specific embodiment, the first water pump comprises a water inlet joint and a water outlet joint, the first water pipe is connected with the water outlet joint, the water inlet joint is connected with a deluge pipe, and the deluge pipe surrounds below the fixing plate.

In the implementation process, the surface of the shower pipe is provided with a plurality of holes, and the function is to enlarge the water absorption range.

In a specific embodiment, the surface of the fixing plate is paved with filter cotton, and the filter cotton covers a plurality of through holes.

In the implementation process, the filter cotton is used for adsorbing impurities and is convenient for replacing and cleaning magazines.

In a specific embodiment, a cleaning frame is placed on the surface of the fixing plate, and the cleaning frame is placed on the surface of the filter cotton.

In the implementation process, the cleaning frame is convenient for taking and placing the silicon wafer.

In a specific embodiment, a water tank is installed on one side of the cleaning box, a second water pump is installed in the water tank, the second water pump is connected with a second water pipe, and the second water pipe is communicated with the cleaning box.

In the above implementation process, the water tank and the second water pump are used for supplying the cleaning liquid into the cleaning tank.

In a specific embodiment, the inner wall of the cleaning box is provided with a liquid level switch, and the liquid level switch is electrically connected with the second water pump.

In the implementation process, when the cleaning liquid in the cleaning tank is reduced to a certain degree, the liquid level switch automatically controls the second water pump to supply the cleaning liquid.

In a specific embodiment, one end of the first water pipe far away from the first water pump is provided with a flow switch.

In the above-mentioned realization process, flow switch can the perception filter pulp surface the spot accumulation, and first water pipe flow reduces when the accumulation is too much, closes the water pump this moment, can change.

In a specific embodiment, an indicator light is installed on the outer side of the cleaning box, and the indicator light is electrically connected with the flow switch.

In the implementation process, the indicator light is used for prompting that the filter cotton can be replaced.

Drawings

In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a schematic structural diagram of a silicon wafer cleaning and drying apparatus provided in an embodiment of the present application;

FIG. 2 is a schematic view of a first perspective structure of a cleaning tank according to an embodiment of the present disclosure;

fig. 3 is a structural schematic diagram of a second perspective view of the cleaning tank according to the embodiment of the present application;

fig. 4 is a schematic structural diagram of a fixing plate according to an embodiment of the present disclosure.

In the figure: 100-a cleaning mechanism; 110-a washing tank; 111-a bearing seat; 112-indicator light; 120-threaded rod; 130-a fixed plate; 131-a through hole; 140-a motor; 141-a connecting sleeve; 150-a first water pump; 151-water inlet joint; 1511-deluge pipe; 152-a water outlet joint; 160-a first water pipe; 161-flow switch; 170-filter cotton; 180-cleaning the frame; 190-a water tank; 191-a second water pump; 1911-a second water pipe; 1912-liquid level switch; 200-a drying mechanism; 210-a scaffold; 220-electric push rod; 230-a cover plate; 240-air heater; 241-air pipe.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1, the present application provides a technical solution: a silicon wafer cleaning and drying device comprises a cleaning mechanism 100 and a drying mechanism 200, wherein the drying mechanism 200 is fixed on the top surface of the cleaning mechanism 100.

Referring to fig. 1, 2, 3 and 4, the cleaning mechanism 100 includes a cleaning tank 110, a threaded rod 120, a fixing plate 130, a motor 140 and a first water pump 150, one end of the cleaning tank 110 is opened, a bearing seat 111 is installed on the inner wall of the cleaning tank 110, one end of the threaded rod 120 is fixed in the bearing seat 111, a water tank 190 is installed on one side of the cleaning tank 110, a second water pump 191 is installed in the water tank 190, the second water pump 191 is connected with a second water pipe 1911, the second water pipe 1911 is communicated with the cleaning tank 110, a liquid level switch 1912 is installed on the inner wall of the cleaning tank 110, the liquid level switch 1912 is electrically connected with the second water pump 191, two ends of the threaded rod 120 are rotatably connected to the inner wall of the cleaning tank 110, two sides of the fixing plate 130 are screwed on the threaded rod 120, the surface of the fixing plate 130 is provided with a plurality of through holes 131, a filtering device is required to be laid on the surface of the fixing plate 130, a filter cotton 170 is laid on the surface of the fixing plate 130, the filter cotton 170 covers the plurality of the through holes 131, cleaning frame 180 has been placed on fixed plate 130 surface, cleaning frame 180 is placed on filter pulp 170 surface, motor 140 is fixed in the washing case 110 outside, motor 140 one end is fixed with adapter sleeve 141, adapter sleeve 141 sets up between motor 140 and threaded rod 120, motor 140 is connected with threaded rod 120 transmission, first water pump 150 is fixed in the inside fixed plate 130 below of washing case 110, first water pump 150 includes water supply connector 151 and water outlet connector 152, first water pipe 160 is connected with water outlet connector 152, water supply connector 151 is connected with deluge pipe 1511, deluge pipe 1511 encircles in fixed plate 130 below, first water pump 150 one end is connected with first water pipe 160, first water pipe 160 wears out washing case 110 one side and communicates with washing case 110, first water pipe 160 is kept away from the one end of first water pump 150 and is installed flow switch 161, wash the case 110 outside and install pilot lamp 112, pilot lamp 112 and flow switch 161 electric connection.

Referring to fig. 1, the drying mechanism 200 includes a bracket 210, an electric push rod 220, a cover plate 230 and an air heater 240, the bracket 210 is fixed on the top surface of the washing tank 110, the electric push rod 220 is fixed on one side of the bracket 210, the cover plate 230 is fixed on the output end of the electric push rod 220, the air heater 240 is fixed on one side of the cover plate 230, one end of the air heater 240 is connected to an air pipe 241, and the air pipe 241 penetrates through the surface of the cover plate 230 and faces the inside of the washing tank 110.

Specifically, this silicon chip washs drying device's theory of operation: when the silicon wafer cleaning device works, a silicon wafer to be cleaned is placed into the cleaning frame 180 on the surface of the fixing plate 130 from one end of the cleaning box 110, the motor 140 drives the threaded rod 120 to rotate to immerse the fixing plate 130 into the cleaning liquid downwards, at the moment, the cleaning liquid in the cleaning box 110 is pumped out from the bottom of the cleaning box 110 by the first water pump 150 and then returns to the cleaning box 110 through the first water pipe 160, in the cycle, dirt is adsorbed on the filter cotton 170 on the surface of the fixing plate 130 by the adsorption force, when the dirt on the surface of the filter cotton 170 is excessively accumulated, the flow in the first water pipe 160 is reduced, at the moment, the flow switch 161 turns on the indicator lamp 112 to prompt the replacement of the filter cotton 170, when the cleaning liquid in the cleaning box 110 is reduced, the liquid level switch 1912 controls the second water pump 191 to supplement liquid into the cleaning box 110, when the cleaning is finished, the fixing plate 130 is lifted until the cleaning frame 180 leaves the water surface, at the moment, the electric push rod 220 presses the cover plate 230 on the surface of the cleaning frame 180, the hot air blower 240 blows air into the cleaning frame 180 to dry.

The above embodiments are merely examples of the present application and are not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A silicon wafer cleaning and drying device is characterized by comprising

A cleaning mechanism (100), wherein the cleaning mechanism (100) comprises a cleaning box (110), a threaded rod (120), a fixing plate (130), a motor (140) and a first water pump (150), one end of the cleaning box (110) is opened, the two ends of the threaded rod (120) are rotatably connected with the inner wall of the cleaning box (110), two sides of the fixing plate (130) are sleeved on the threaded rod (120) through threads, the surface of the fixing plate (130) is provided with a plurality of through holes (131), the motor (140) is fixed at the outer side of the cleaning box (110), the motor (140) is in transmission connection with the threaded rod (120), the first water pump (150) is fixed below the fixing plate (130) in the cleaning box (110), one end of the first water pump (150) is connected with a first water pipe (160), and the first water pipe (160) penetrates out of one side of the cleaning box (110) and is communicated with the cleaning box (110);

the drying mechanism (200) comprises a support (210), an electric push rod (220), a cover plate (230) and an air heater (240), wherein the support (210) is fixed on the top surface of the cleaning box (110), the electric push rod (220) is fixed on one side of the support (210), the cover plate (230) is fixed on the output end of the electric push rod (220), the air heater (240) is fixed on one side of the cover plate (230), one end of the air heater (240) is connected with an air pipe (241), and the air pipe (241) penetrates through the surface of the cover plate (230) and faces towards the inside of the cleaning box (110).

2. The silicon wafer cleaning and drying device as claimed in claim 1, wherein a bearing seat (111) is installed on the inner wall of the cleaning box (110), and one end of the threaded rod (120) is fixed in the bearing seat (111).

3. The silicon wafer cleaning and drying device as claimed in claim 1, wherein a connecting sleeve (141) is fixed at one end of the motor (140), and the connecting sleeve (141) is arranged between the motor (140) and the threaded rod (120).

4. The silicon wafer cleaning and drying device according to claim 3, wherein the first water pump (150) comprises a water inlet joint (151) and a water outlet joint (152), the first water pipe (160) is connected with the water outlet joint (152), the water inlet joint (151) is connected with a shower pipe (1511), and the shower pipe (1511) surrounds below the fixing plate (130).

5. The silicon wafer cleaning and drying device as claimed in claim 1, wherein the surface of the fixing plate (130) is paved with filter cotton (170), and the filter cotton (170) covers a plurality of the through holes (131).

6. The silicon wafer cleaning and drying device as claimed in claim 5, wherein a cleaning frame (180) is placed on the surface of the fixing plate (130), and the cleaning frame (180) is placed on the surface of the filter cotton (170).

7. The silicon wafer cleaning and drying device according to claim 1, wherein a water tank (190) is installed on one side of the cleaning tank (110), a second water pump (191) is installed in the water tank (190), the second water pump (191) is connected with a second water pipe (1911), and the second water pipe (1911) is communicated with the cleaning tank (110).

8. The silicon wafer cleaning and drying device as claimed in claim 7, wherein a liquid level switch (1912) is installed on the inner wall of the cleaning tank (110), and the liquid level switch (1912) is electrically connected with the second water pump (191).

9. The silicon wafer cleaning and drying device as claimed in claim 1, wherein a flow switch (161) is installed at one end of the first water pipe (160) far away from the first water pump (150).

10. The silicon wafer cleaning and drying device according to claim 9, wherein an indicator light (112) is installed outside the cleaning box (110), and the indicator light (112) is electrically connected with the flow switch (161).