CN114643394A - Ball welding current control method, controller and EFO system - Google Patents
Ball welding current control method, controller and EFO system Download PDFInfo
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- CN114643394A CN114643394A CN202210544587.7A CN202210544587A CN114643394A CN 114643394 A CN114643394 A CN 114643394A CN 202210544587 A CN202210544587 A CN 202210544587A CN 114643394 A CN114643394 A CN 114643394A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/095—Monitoring or automatic control of welding parameters
- B23K9/0953—Monitoring or automatic control of welding parameters using computing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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Abstract
The invention discloses a ball welding current control method, a controller and an EFO system, wherein the ball welding current control method comprises the following steps: acquiring a current control request, wherein the current control request comprises current control parameters corresponding to at least two ball bonding control stages; judging whether the current control parameter corresponding to each ball bonding control stage meets the target control condition; if the current control parameter corresponding to the ball bonding control stage meets the target control condition, determining a current control signal corresponding to the ball bonding control stage according to the first control logic; if the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, determining a current control signal corresponding to the ball bonding control stage according to a second control logic; and controlling the ball bonding equipment to output target current for ball bonding according to the current control signal corresponding to the ball bonding control stage. The technical scheme can lead the ball bonding equipment to carry out ball bonding according to an optimal mode, thereby ensuring the quality of the ball bonding.
Description
Technical Field
The invention relates to the technical field of ball bonding, in particular to a ball bonding current control method, a controller and an EFO system.
Background
The chip ball bonding technology is the most basic and dominant interconnection technology for realizing chips in electronic packaging. In the chip ball bonding technology, the process of gold wire balling occupies an important link in the process of bonding a wire bonding machine. The size, shape, surface oxidation pollution condition, hardness and the like of the ball formed in the gold wire balling process directly determine the bonding quality and reliability of the ball bonding point, so that obtaining a smooth ball with good sphericity and consistent size without oxidation in the ball bonding process is one of important conditions for obtaining a welding point with excellent performance.
However, the current cannot be well controlled in the current gold wire ball forming process, so that the ball size of the gold wire ball is not uniform or the ball hardness is not proper, and the quality of the whole ball bonding is affected.
Disclosure of Invention
The embodiment of the invention provides a ball welding current control method, a controller and an EFO system, which aim to solve the problem of poor ball welding quality.
A ball bonding current control method comprising:
obtaining a current control request, wherein the current control request comprises current control parameters corresponding to at least two ball bonding control stages;
judging whether the current control parameter corresponding to each ball bonding control stage meets a target control condition;
if the current control parameter corresponding to the ball bonding control stage meets the target control condition, determining a current control signal corresponding to the ball bonding control stage according to a first control logic;
if the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, determining a current control signal corresponding to the ball bonding control stage according to a second control logic;
and controlling the ball bonding equipment to output target current for ball bonding according to the current control signal corresponding to the ball bonding control stage.
Furthermore, the current control parameters corresponding to each ball bonding control stage comprise a starting current value, an ending current value and a control duration;
the determining the target linearity according to the current control parameter comprises:
determining a stage current difference according to the starting current value and the ending current value;
and determining the target linearity according to the stage current difference and the control duration.
Further, the determining whether the current control parameter meets a target control condition includes:
determining target linearity according to the current control parameter;
if the target linearity is zero, determining that the current control parameter meets a target control condition;
and if the target linearity is not zero, determining that the current control parameter does not meet the target control condition.
Further, determining a current control signal according to the first control logic includes:
determining a control current value and a control time based on the current control parameter;
determining the current control signal based on the control current value and the control time.
Further, determining the current control signal according to the second control logic includes:
determining a current output equation based on the target linearity;
a current control signal is determined based on the current output equation.
Further, the current control parameter further comprises an early warning current threshold; the ball bonding current control method further comprises the following steps:
acquiring a target sampling current;
judging whether the target sampling current is abnormal or not based on the early warning current threshold value;
if the target sampling current is abnormal, generating abnormal alarm information;
and if the target sampling current is not abnormal, controlling the ball welding equipment to output the target current for ball welding according to the current control signal corresponding to the ball welding control stage.
Further, the at least two ball bonding control phases include a first control phase, a second control phase, a third control phase and a fourth control phase;
the step of controlling the ball bonding equipment to output the target current for ball bonding according to the current control signal corresponding to the ball bonding control stage comprises the following steps:
if the ball bonding control stage is the first control stage, controlling the ball bonding equipment to output a first current to bond a first solder ball;
if the ball bonding control stage is the second control stage, controlling the ball bonding equipment to linearly decrease the first current to a second current so as to cool the first solder ball to obtain a second solder ball;
if the ball bonding control stage is the third control stage, controlling the ball bonding equipment to output the second current to bond the second solder ball to form a third solder ball;
and if the ball bonding control stage is the fourth control stage, controlling the ball bonding equipment to linearly decrease the second current to a third current so as to cool the third solder ball to form a target solder ball.
A current controller comprises a memory, a processor and a current control program which is stored in the memory and can run on the processor, and the processor realizes the ball welding current control method when executing the current control program.
An EFO system comprises the current controller and the ball bonding equipment;
and the ball welding equipment receives the current control signal and outputs a target current according to the current control signal to carry out ball welding.
Further, the ball bonding device comprises a DAC module and a switch control module;
the DAC module is used for performing conversion processing on the current control signal and outputting a current conversion signal;
and the switch control module is used for outputting corresponding target current based on the current conversion signal.
The ball bonding current control method, the controller and the EFO system are characterized in that the current controller obtains a current control request, the current control request comprises current control parameters corresponding to at least two ball bonding control stages to control the ball bonding equipment to perform ball bonding according to different stages and judge whether the current control parameter corresponding to each ball bonding control stage meets a target control condition or not to determine a control logic corresponding to each ball bonding control stage, when the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, the current control signal corresponding to the ball bonding control stage is determined according to a second control logic, when the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, the current control signal corresponding to the ball bonding control stage is determined according to the second control logic, and according to the current control signal corresponding to the ball bonding control stage, and controlling the ball bonding equipment to output the target current for ball bonding, so that the ball bonding equipment performs ball bonding according to an optimal mode, thereby ensuring the quality of the ball bonding.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a flow chart of a ball bonding current control method according to an embodiment of the present invention;
FIG. 2 is a flowchart of step S102 of FIG. 1 according to the present invention;
FIG. 3 is a flowchart of step S201 in FIG. 2 according to the present invention;
FIG. 4 is a flowchart of step S104 of FIG. 1 according to the present invention;
FIG. 5 is a flowchart of step S103 of FIG. 1 according to the present invention;
FIG. 6 is another flow chart of a ball bonding current control method according to an embodiment of the present invention;
FIG. 7 is a flowchart of step S105 of FIG. 1 according to the present invention;
FIG. 8 is a schematic view of an EFO system in accordance with an embodiment of the present invention;
FIG. 9 is a diagram of a current controller according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The ball bonding current control method provided by the embodiment of the invention can be applied to an EFO (Electronic Flame-off, EFO for short) system shown in fig. 8, the EFO system includes a current controller 10, a ball bonding device 20 and a target terminal 30, the current controller 10 is connected to the target terminal 30 and the ball bonding device 20, and is used for controlling the ball bonding device 20 to perform ball bonding, so as to improve the ball bonding quality. The target terminal 10 includes, but is not limited to, various personal computers, notebook computers, smart phones, tablet computers, and portable wearable devices.
In one embodiment, as shown in fig. 1, a ball bonding current control method is provided, which is described by taking the current controller 10 in fig. 8 as an example, and includes the following steps:
s101: and acquiring a current control request, wherein the current control request comprises current control parameters corresponding to at least two ball bonding control stages.
The current control request is a request for controlling a target current output from the ball bonding apparatus 20. The ball bonding control stage is a stage of controlling a target current in the ball bonding process. The current control parameter refers to a parameter set by self definition and is used for controlling the target current.
As an example, a user may custom configure at least two ball bond control phases based on the target terminal 30, each ball bond control phase corresponding to a current control parameter. The target terminal 30 forms a current control request according to the current control parameters corresponding to at least two ball bonding control stages, and sends the current control request to the current controller 10. Alternatively, the current controller 10 may communicate with the target terminal 30 via a high-speed internet protocol to obtain the current control request.
As an example, the current control parameter includes a current value for controlling the target current and a time period for controlling the target current. Since the overall trend of the target current is reduced until zero in the whole ball bonding process, the preset current values in the current control parameters corresponding to at least two ball bonding control stages are also reduced overall.
In general, the current controller 10 needs to output a current control signal to the ball bonding device 20, and the ball bonding device 20 converts the current control signal to output a target current, and performs gold wire ball bonding according to the target current. However, in the related art, the switching of the target current and the on-off control of the target current by the ball bonding apparatus 20 are not timely, resulting in a large time error in the switching of the target current and the on-off control, and thus the ball size of the formed solder ball is not uniform or the hardness is not appropriate, affecting the quality of the ball bonding. In this example, since the current control parameter is a parameter set by a user, that is, the user can set the current control parameter corresponding to at least two ball bonding control stages by the user according to actual experience, so that the current controller 10 controls the ball bonding device 20 to perform ball bonding according to the current control parameter corresponding to at least two ball bonding control stages in the current control request, in the subsequent step, different target currents are used in different ball bonding control stages, thereby avoiding the situation that the size of the formed ball bond is not uniform or the hardness is not proper, and ensuring the quality of the ball bond.
S102: and judging whether the current control parameter corresponding to each ball bonding control stage meets the target control condition.
The target control condition is a condition for determining each current control parameter.
As an example, after obtaining the current control request, the current controller 10 determines whether the current control parameter corresponding to each ball bonding control stage satisfies the preset target control condition according to the preset target control condition, so as to select different control logics in the subsequent steps according to the determination result of the target control condition, and determine the target current of the ball bonding apparatus 20. The target control condition is a condition capable of determining a control logic corresponding to each ball bonding control stage according to the current control parameter corresponding to each ball bonding control stage.
In this example, after obtaining the current control request, the current controller 10 determines the control logic corresponding to each ball bonding control stage by determining whether the current control parameter corresponding to each ball bonding control stage meets the target control condition, so as to ensure that the ball bonding apparatus 20 performs ball bonding in an optimal manner, thereby improving the quality of ball bonding.
S103: and if the current control parameter corresponding to the ball bonding control stage meets the target control condition, determining a current control signal corresponding to the ball bonding control stage according to the first control logic.
The first control logic is the control logic which determines the current control signal corresponding to the ball bonding control stage when the current control parameter corresponding to the ball bonding control stage meets the target control condition.
As an example, when the current control parameter corresponding to the ball bonding control stage satisfies the target control condition, the current controller 10 determines the control logic corresponding to the ball bonding control stage as the first control logic, determines the current control signal corresponding to the ball bonding control stage according to the first control logic, and sends the current control signal to the ball bonding apparatus 20, and controls the ball bonding apparatus 20 to output the target current according to the current control signal for ball bonding. Alternatively, the first control logic may control the ball bonding device 20 to output a constant target current at a constant current value.
S104: and if the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, determining a current control signal corresponding to the ball bonding control stage according to the second control logic.
The second control logic is the control logic which determines the current control signal corresponding to the ball bonding control stage when the current control parameter corresponding to the ball bonding control stage does not meet the target control condition.
As an example, when the current control parameter corresponding to the ball bonding control stage does not satisfy the target control condition, the current controller 10 determines the control logic corresponding to the ball bonding control stage as the second control logic, determines the current control signal corresponding to the ball bonding control stage according to the second control logic, and sends the current control signal to the ball bonding apparatus 20, and controls the ball bonding apparatus 20 to output the target current according to the current control signal for ball bonding. Alternatively, the second control logic may be in a linear manner, controlling the ball bonding device 20 to output the target current in a linear decreasing manner.
S105: and controlling the ball bonding equipment 20 to output a target current for ball bonding according to the current control signal corresponding to the ball bonding control stage.
The target current is a current for ball bonding.
As an example, the current controller 10 controls the ball bonding apparatus 20 to output a target current for ball bonding according to a current control signal corresponding to each ball bonding control stage. In this example, the current controller 10 can determine the control logic corresponding to each ball bonding control stage according to different ball bonding control stages in the ball bonding process, so as to determine the current control signal according to the control logic corresponding to each ball bonding control stage, and then control the ball bonding apparatus 20 to output the target current for ball bonding according to the current control signal, thereby ensuring the quality of ball bonding.
In this embodiment, the current controller 10 obtains a current control request, the current control request includes current control parameters corresponding to at least two ball bonding control stages, and can be divided into different ball bonding control stages to control the ball bonding apparatus 20 to perform ball bonding, and determines whether the current control parameter corresponding to each ball bonding control stage satisfies a target control condition to determine a control logic corresponding to each ball bonding control stage, when the current control parameter corresponding to the ball bonding control stage does not satisfy the target control condition, the current control signal corresponding to the ball bonding control stage is determined according to the second control logic, and according to the current control signal corresponding to the ball bonding control stage, the ball bonding device 20 is controlled to output the target current for ball bonding, so that the ball bonding device 20 performs ball bonding in an optimal manner, thereby ensuring the quality of ball bonding.
In one embodiment, as shown in fig. 2, the step S102 of determining whether the current control parameter corresponding to each ball bonding control stage satisfies the target control condition includes:
s201: and determining the target linearity according to the current control parameter.
The target linearity refers to the linearity determined according to the current control parameter. Alternatively, the target linearity may or may not be zero. When the target linearity is zero, the target current does not need to be linearly output, and the target current is controlled by adopting a first control logic. And when the target linearity is not zero and the target current needs linear output, calling a current output equation corresponding to the target linearity by adopting a second control logic, wherein the current output equation is a linearly decreasing output equation.
As an example, the current controller 10 determines a target linearity corresponding to each ball bonding control stage according to a current control parameter corresponding to each current stage, so as to determine whether the current control parameter satisfies a target control condition according to the target linearity corresponding to each ball bonding control stage, thereby determining a control logic corresponding to each ball bonding control stage according to a determination result of the target control condition.
S202: and if the target linearity is zero, determining that the current control parameter meets the target control condition.
As an example, when the target linearity is zero, the current control parameter is deemed to satisfy the target control condition. In this example, when the target linearity is zero, the target current does not need to be linearly output, and the current control signal corresponding to the ball bonding control stage is determined using the first control logic, i.e., the ball bonding apparatus 20 is controlled to constantly output the target current at a constant current value.
S203: and if the target linearity is not zero, determining that the current control parameter does not meet the target control condition.
As an example, when the target linearity is not zero, the current control parameter is assumed to satisfy the target control condition. In this example, when the target linearity is zero, the target current needs to be linearly output, the current output equation is called to control the target current of the ball bonding apparatus 20, and the second control logic is adopted to determine the current control signal corresponding to the ball bonding control stage, that is, the ball bonding apparatus 20 is controlled to linearly and progressively output the target current in a linear manner.
In this embodiment, the current controller 10 determines the target linearity according to the current control parameter, so as to determine whether the current control parameter meets the target control condition according to the target linearity corresponding to each ball bonding control stage, when the target linearity is zero, the current control parameter is determined to meet the target control condition, at this time, the current controller 10 determines that the target current does not need to be linearly output, and then the current control signal corresponding to the ball bonding control stage is determined by using the first control logic, so as to control the ball bonding apparatus 20 to constantly output the target current in a constant current value manner. When the target linearity is not zero, the current control parameter is determined not to meet the target control condition, at this time, the current controller 10 judges that the target current needs to be linearly output, and then a second control logic is adopted to determine a current control signal corresponding to the ball bonding control stage, and the ball bonding equipment 20 is controlled to linearly and progressively output the target current in a linear output mode, so that the ball bonding equipment 20 is controlled to perform ball bonding by adopting different control logics at different ball bonding control stages, the condition that the size of the formed ball is uneven or the hardness of the formed ball is not proper is avoided, and the quality of the ball bonding is ensured.
In an embodiment, as shown in fig. 3, the current control parameters corresponding to each ball bonding control phase include a start current value, an end current value and a control duration, and in step S201, determining the target linearity according to the current control parameters includes:
s301: a stage current difference is determined based on the starting current value and the ending current value.
The initial current value is the current value for controlling the target current at the initial moment in each ball bonding control stage. The end current value is a current value for controlling the target current at the end time in each ball bonding control stage. The control time is the time period for controlling the target current in each ball bonding control stage. Wherein the phase current difference is a difference between the ending current value and the starting current value.
Alternatively, the starting current value and the ending current value may be the same or different, and may be specifically set according to practical experience. Illustratively, when the starting current value and the ending current value are the same, the target linearity corresponding to the ball bonding control stage is zero, and when the starting current value and the ending current value are different, the target linearity corresponding to the ball bonding control stage is not zero. It should be noted that, since the overall trend of the target current is reduced to zero during the whole ball bonding process, the ending current value of the current control parameter corresponding to each ball bonding control stage is smaller than or equal to the starting current value. The ending current values of the current control parameters corresponding to at least two ball welding control stages are in a descending trend in sequence.
Optionally, the control period is less than or equal to 2 milliseconds, so that the control period of each ball bonding control phase is shorter, thereby controlling the target current more accurately.
As an example, the at least two ball bonding control phases may include a first control phase, a second control phase, a third control phase, and a fourth control phase. As an example. A first control stage for controlling the ball bonding device 20 to bond the first solder ball; a second control stage, configured to control the ball bonding device 20 to cool the first solder ball, so as to obtain a second solder ball; a third control stage, configured to control the ball bonding apparatus 20 to bond the second solder ball to form a third solder ball; and a fourth control stage for controlling the ball bonding device 20 to cool the third solder ball to form a target solder ball. In the example, the ball welding process is divided into a first control stage, a second control stage, a third control stage and a fourth control stage, and the problem that the formed solder ball is rapidly cooled to form an oxide layer or is hardened due to the fact that the target current is directly reduced to zero is avoided through a mode of welding and cooling for multiple times, so that the quality of target ball welding is improved.
As an example, the current control parameters corresponding to the first control phase include a start current value I1, an end current value I2, and a control duration T1; the current control parameters corresponding to the second control phase comprise a starting current value I3, an ending current value I4 and a control duration T2; the current control parameters corresponding to the third control phase comprise a starting current value I5, an ending current value I6 and a control duration T3; the current control parameters corresponding to the fourth control phase include a starting current value I7, an ending current value I8, and a control duration T4.
Illustratively, the current controller 10 determines the phase current difference according to the start current value and the end current value corresponding to each ball bonding control phase, for example, the phase current difference corresponding to the first control phase is (I2-I1), the phase current difference corresponding to the second control phase is (I4-I3), the phase current difference corresponding to the third control phase is (I6-I5), and the phase current difference corresponding to the fourth control phase is (I8-I7). It should be noted that, in order to ensure the continuity of the adjacent ball bonding control stages, the starting current value of the current ball bonding control stage is the same as the ending current value of the previous ball bonding control stage, and the ending current value of the current ball bonding control stage is the same as the starting current value of the next ball bonding control stage. For example, I2 equals I3, I4 equals I5, and I6 equals I7. The ending current values of the current control parameters corresponding to at least two ball bonding control stages are in a descending trend in sequence, for example, I2 is larger than I4, I4 is larger than T6, and I6 is larger than I8.
S302: and determining the target linearity according to the stage current difference and the control duration.
As an example, the current controller 10 determines a target linearity based on the phase current difference and the control time period. Illustratively, a target linearity is determined using linearity calculation logic based on the phase current difference and the control duration. Preferably, the linearity calculation logic may determine the target linearity by dividing the phase current difference by the control duration.
As an example, the target linearity corresponding to the first control stage is (I2-I1)/T1, the target linearity corresponding to the second control stage is (I4-I3)/T2, the target linearity corresponding to the third control stage is (I6-I5)/T3, and the target linearity corresponding to the fourth control stage is (I8-I7)/T4.
In this embodiment, the current controller 10 determines the stage current difference according to the starting current value and the ending current value, and determines the target linearity according to the stage current difference and the control duration to determine whether the current control parameter corresponding to each ball bonding control stage meets the target control condition, so as to select the corresponding control logic to control the target current, thereby improving the ball bonding quality.
In one embodiment, as shown in fig. 4, in step S104, if the current control parameter corresponding to the ball bonding control phase satisfies the target control condition, determining the current control signal corresponding to the ball bonding control phase according to the first control logic includes:
s401: based on the current control parameter, a control current value and a control time are determined.
The control current value is used for controlling the current value of the target current in the first control logic. The control time is a time period for controlling the target current in the first control logic.
As an example, when the current control parameter corresponding to the ball bonding control stage satisfies the target control condition, i.e., the target linearity is zero, the control current value and the control time are determined based on the current control parameter. In this example, since the target linearity is a linearity determined according to the stage current difference and the control time length, when the target linearity is zero, the stage current difference is zero, the start current value in the current control parameter is equal to the end current value, the start current value or the end current value in the current control parameter is determined as the control current value, and the control time length in the current control parameter is determined as the control time. For example, if the target linearity in the first control phase is zero, and the starting current value I1 in the current control parameter corresponding to the first control phase is equal to the ending current value I2, I1 or I2 is determined as the control current value, and the control duration T1 in the current control parameter corresponding to the first control phase is determined as the control time.
S402: the current control signal is determined based on the control current value and the control time.
As an example, the current controller 10 determines the current control signal based on the control current value and the control time. In the present example, the current controller 10 forms a current control signal for controlling the current value and the control time, that is, controls the ball bonding apparatus 20 to perform ball bonding at a constant current value. For example, the current controller 10 converts the control current value and the control time into a current control signal in the form of a digital signal and transmits it to the ball bonding apparatus 20, and the ball bonding apparatus 20 converts the current control signal in the form of a digital signal into a current control signal in the form of an analog signal and outputs the target current according to the current control signal in the form of an analog signal.
In this embodiment, the current controller 10 determines a control current value and a control time based on the current control parameter, and then determines a current control signal according to the control current value and the control time, so as to determine the corresponding current control signal when the current control parameter corresponding to the ball bonding control stage meets the target control condition, thereby avoiding the situation that the size of the formed ball is uneven or the hardness is not appropriate, and thus ensuring the quality of the ball bonding.
In one embodiment, as shown in fig. 5, in step S103, if the current control parameter corresponding to the ball bonding control stage does not satisfy the target control condition, determining the current control signal corresponding to the ball bonding control stage according to the second control logic includes:
s501: based on the target linearity, a current output equation is determined.
As an example, since the ending current values of the current control parameters corresponding to the at least two ball bonding control stages are less than or equal to the starting current value, and the ending current values of the current control parameters corresponding to the at least two ball bonding control stages sequentially show a decreasing trend, the current output equation is a linearly decreasing output equation. In this example, the current controller 10 can determine a linearly decreasing current output equation corresponding to the target linearity based on the determined target linearity.
S502: a current control signal is determined based on the current output equation.
As an example, when the current control parameter corresponding to the ball bonding control stage does not satisfy the target control condition, the current controller 10 determines the current output equation according to the target linearity, and then determines the current control signal according to the current output equation, so as to control the ball bonding apparatus 20 to perform ball bonding according to the current control signal.
In the embodiment, when the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, the control target current is linearly reduced, so that the energy acting on the solder ball is also linearly reduced, the process is equivalent to a quenching process of metal melting, the problem that the solder ball is rapidly cooled to form an oxide layer or is hardened due to the fact that the target current is directly reduced to zero is avoided, and the ball bonding quality is improved.
In one embodiment, as shown in fig. 6, the current control parameter further includes an early warning current threshold, that is, according to the current control parameter, the ball bonding current control method further includes:
s601: and acquiring a target sampling current.
The target sampling current is a target current collected from the ball bonding apparatus 20.
In this example, the current controller 10 obtains a target sampling current to determine whether the target current output by the ball bonding apparatus 20 meets the user's requirements.
S602: and judging whether the target sampling current is abnormal or not based on the early warning current threshold value.
The early warning current threshold is a current value set by a user, is used for judging whether the target sampling current is abnormal or not, and can be specifically set according to the actual requirement of the user.
As an example, the current controller 10 determines whether the target sampling current is abnormal based on the warning current threshold. For example, it is determined whether the target sampling current is greater than the warning current threshold value, thereby determining whether the target current output by the ball bonding apparatus 20 meets the user's requirements.
S603: and if the target sampling current is abnormal, generating abnormal alarm information.
The abnormal alarm information refers to information used for alarming when the target sampling current is abnormal.
As an example, the current controller 10 generates an abnormality alarm message when the target sampling current is abnormal, and then prompts a user that the target sampling current is abnormal, so as to improve the consistency of the ball shape of the solder ball. In this example, if the target sampling current is greater than or equal to the early warning current threshold, the target sampling current is abnormal; and if the target sampling current is smaller than the early warning current threshold value, the target sampling current is not abnormal.
S604: if the target sampling current is not abnormal, the ball bonding device 20 is controlled to output the target current for ball bonding according to the current control signal corresponding to the ball bonding control stage.
As an example, when the target sampling current is not abnormal, that is, the target sampling current is smaller than the warning current threshold, the current controller 10 controls the ball bonding apparatus 20 to output the target current for ball bonding according to the current control signal corresponding to the ball bonding control stage, for example, step S105, which is not described herein again.
In this embodiment, the current controller 10 first obtains a target sampling current, then determines whether the target sampling current is abnormal according to an early warning current threshold, and generates an abnormal alarm message when the target sampling current is abnormal, and controls the ball bonding device 20 to output the target current for ball bonding according to a current control signal corresponding to a ball bonding control stage when the target sampling current is not abnormal, and timely reminds a user that the target sampling current is abnormal, so as to improve the spherical consistency of the solder balls.
In one embodiment, as shown in fig. 7, the at least two ball bonding control stages include a first control stage, a second control stage, a third control stage and a fourth control stage, and in step S105, controlling the ball bonding apparatus 20 to output a target current for ball bonding according to a current control signal corresponding to the ball bonding control stage includes:
s701: if the ball bonding control stage is the first control stage, the ball bonding apparatus 20 is controlled to output the first current for bonding the first solder ball.
Wherein the first current is a target current outputted by the first control stage control ball bonding device 20. The first solder balls are solder balls formed in the first control stage.
As an example, if the ball bonding control phase is the first control phase, the current controller 10 outputs the current control signal corresponding to the first control phase, and controls the ball bonding apparatus 20 to output the first current for bonding the first solder ball, that is, in the first control phase, the current controller 10 controls the ball bonding apparatus 2020 to constantly output the first current for bonding the first solder ball at a constant current value. For example, the user may configure the current control parameter corresponding to the first control stage through the target terminal 30, so that the target linearity corresponding to the first control stage is zero, even if the target linearity corresponding to the first control stage meets the target control condition, so that the current controller 10 can determine the current control signal corresponding to the first control stage through the first control logic, for example, steps S401 to S402, which is not described herein again.
As an example, the current controller 10 may control the ball bonding apparatus 20 to output the first current for bonding the first solder ball when the ball bonding control phase is the first control phase by configuring the starting current value, the ending current value and the control duration in the current control parameters corresponding to the first control phase. For example, if the starting current value is equal to the ending current value, the target linearity corresponding to the first control stage is set to zero, for example, steps S301 to S302, which are not described herein again. The first current value is determined according to the sizes of the starting current value and the ending current value, and can be specifically set according to actual requirements.
It should be noted that the first current in the first control stage should be relatively large, so that the tip of the gold wire is heated and melted rapidly, and the gold wire is solidified in a very short time under the action of gravity and surface tension to form the first solder ball.
S702: if the ball bonding control stage is the second control stage, the ball bonding apparatus 20 is controlled to linearly decrease the first current to the second current to cool the first solder ball and obtain the second solder ball.
The second current is a target current obtained by linearly decreasing the first current. The second solder balls are solder balls formed in the second control stage. The second current is less than the first current.
As an example, if the ball bonding control stage is the second control stage, the current controller 10 outputs the current control signal corresponding to the second control stage, and controls the ball bonding apparatus 20 to linearly decrease the first current to the second current, so as to cool the first solder ball in the second control stage to obtain the second solder ball, that is, in the first control stage, the current controller 10 controls the ball bonding apparatus 2020 to linearly decrease the first current to the second current in a linearly decreasing manner. For example, the user may configure the current control parameter corresponding to the second control stage through the target terminal 30, so that the target linearity corresponding to the second control stage is not zero, even if the target linearity corresponding to the second control stage does not satisfy the target control condition, so that the current controller 10 can determine the current control signal corresponding to the second control stage through the second control logic, for example, steps S501 to S502, which is not described herein again.
S703: if the ball bonding control stage is the third control stage, the ball bonding apparatus 20 is controlled to output the second current to bond the second solder ball to form the third solder ball.
Wherein the second current is the target current outputted by the ball bonding apparatus 20 controlled by the third control stage. The third solder balls are solder balls formed in the third control stage.
As an example, if the ball bonding control stage is the third control stage, the current controller 10 outputs the current control signal corresponding to the third control stage, and controls the ball bonding apparatus 20 to output the second current to bond the third solder ball, that is, in the third control stage, the current controller 10 controls the ball bonding apparatus 2020 to constantly output the second current to bond the third solder ball at a constant current value. For example, the user may configure the current control parameter corresponding to the third control stage through the target terminal 30, so that the target linearity corresponding to the third control stage is zero, even if the target linearity corresponding to the third control stage meets the target control condition, so that the current controller 10 can determine the current control signal corresponding to the third control stage through the first control logic, for example, steps S401 to S402, which is not described herein again.
It should be noted that the second current in the third control stage should be relatively small, that is, the second current is smaller than the first current, so as to perform secondary welding on the third solder ball, thereby avoiding the problem that the target current is directly reduced to zero, which causes the solder ball to rapidly cool to form an oxide layer or to harden, and improving the ball welding quality.
S704: if the ball bonding control stage is the fourth control stage, the ball bonding apparatus 20 is controlled to linearly decrease the second current to the third current to cool the third solder ball to form the target solder ball.
And the third current is the target current obtained after the second current is linearly decreased. The target solder ball is the solder ball formed in the fourth control stage.
As an example, if the ball bonding control stage is the fourth control stage, the current controller 10 outputs the current control signal corresponding to the fourth control stage, and controls the ball bonding apparatus 20 to linearly decrease the second current to the third current, so as to cool the third solder ball in the fourth control stage, i.e., in the fourth control stage, the current controller 10 controls the ball bonding apparatus 2020 to linearly decrease the second current to the third current in a linearly decreasing manner. For example, the user may configure the current control parameter corresponding to the fourth control stage through the target terminal 30, so that the target linearity corresponding to the fourth control stage is not zero, even if the target linearity corresponding to the fourth control stage does not satisfy the target control condition, so that the current controller 10 can determine the current control signal corresponding to the second control stage through the second control logic, for example, steps S501 to S502, which is not described herein again.
It should be noted that the target linearity corresponding to the second control stage may be the same as or different from the target linearity corresponding to the second control stage, and the target linearity corresponding to the current control parameter configuration corresponding to each ball bonding control stage may be configured by self-definition, for example, steps S401 to S402, which may be specifically configured according to actual requirements and will not be described herein again.
In the present embodiment, by controlling the ball bonding equipment 2020 by different control logics at different ball bonding control stages to perform ball bonding, the situation that the size of the formed ball is not uniform or the hardness is not proper is avoided, thereby ensuring the quality of ball bonding.
The present embodiment provides a current controller 10, as shown in fig. 9, which includes a memory, a processor, and a current control program stored in the memory and capable of being executed on the processor, and when the processor executes the current control program, the ball bonding current control method in the above embodiments is implemented, for example, in steps S101 to S105. To avoid repetition, further description is omitted here.
Optionally, the current controller 10 further includes an ADC module 11 for converting the control current value and the control time into the current control signal in the form of a digital signal, thereby improving the conversion efficiency of the current control signal.
The present embodiment provides an EFO system, as shown in fig. 8, including the current controller 10 and the ball bonding apparatus 20 in the above-described embodiments; the ball bonding device 20 receives the current control signal and outputs a target current according to the current control signal to perform ball bonding. In the present embodiment, the ball bonding apparatus 20 outputs the target current to perform ball bonding according to the current control signal, so that the ball bonding apparatus 20 performs ball bonding in an optimal manner, thereby ensuring the quality of ball bonding.
In one embodiment, the ball bonding apparatus 20 includes a DAC module 21 and a switch control module 22; the DAC module 21 is configured to perform conversion processing on the current control signal and output a current conversion signal; and the switch control module 22 is used for outputting a corresponding target current based on the current conversion signal.
The current conversion signal is a signal obtained by performing conversion processing on the current control signal. Specifically, since the current control signal is a digital signal output by the current controller 10, the DAC module 21 needs to perform conversion processing on the current control signal to obtain a current conversion signal, so that the switch control module 22 can output a corresponding target current according to the current conversion signal. Optionally, the DAC module 21 is a high-speed DAC module 21. In the embodiment, the current control signal is converted by the high-speed DAC module 21, so that the conversion efficiency of the current control signal is improved.
In one embodiment, a computer readable storage medium is provided, having a current control program stored thereon, the current control program when executed by a processor implementing the ball bonding current control method of the above method embodiments. To avoid repetition, further description is omitted here.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include non-volatile and/or volatile memory. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A ball welding current control method is characterized by comprising the following steps:
obtaining a current control request, wherein the current control request comprises current control parameters corresponding to at least two ball bonding control stages;
judging whether the current control parameter corresponding to each ball bonding control stage meets a target control condition;
if the current control parameter corresponding to the ball bonding control stage meets the target control condition, determining a current control signal corresponding to the ball bonding control stage according to a first control logic;
if the current control parameter corresponding to the ball bonding control stage does not meet the target control condition, determining a current control signal corresponding to the ball bonding control stage according to a second control logic;
and controlling the ball bonding equipment to output target current for ball bonding according to the current control signal corresponding to the ball bonding control stage.
2. The ball bonding current control method of claim 1, wherein said determining whether the current control parameter satisfies a target control condition comprises:
determining target linearity according to the current control parameter;
if the target linearity is zero, determining that the current control parameter meets a target control condition;
and if the target linearity is not zero, determining that the current control parameter does not meet the target control condition.
3. The ball bonding current control method of claim 2 wherein the current control parameters for each of the ball bonding control phases include a start current value, an end current value, and a control duration;
the determining the target linearity according to the current control parameter comprises:
determining a stage current difference according to the starting current value and the ending current value;
and determining the target linearity according to the stage current difference and the control duration.
4. The ball bond current control method of claim 1 wherein determining the current control signal based on the first control logic comprises:
determining a control current value and a control time based on the current control parameter;
determining the current control signal based on the control current value and the control time.
5. The ball bond current control method of claim 2 wherein determining the current control signal based on the second control logic comprises:
determining a current output equation based on the target linearity;
a current control signal is determined based on the current output equation.
6. The ball bonding current control method of claim 1 wherein the current control parameters further include an early warning current threshold; the ball bonding current control method further comprises:
acquiring a target sampling current;
judging whether the target sampling current is abnormal or not based on the early warning current threshold value;
if the target sampling current is abnormal, generating abnormal alarm information;
and if the target sampling current is not abnormal, controlling the ball welding equipment to output the target current for ball welding according to the current control signal corresponding to the ball welding control stage.
7. The ball bond current control method of claim 1 wherein at least two of the ball bond control phases include a first control phase, a second control phase, a third control phase, and a fourth control phase;
the step of controlling the ball bonding equipment to output the target current for ball bonding according to the current control signal corresponding to the ball bonding control stage comprises the following steps:
if the ball bonding control stage is the first control stage, controlling the ball bonding equipment to output a first current to bond a first solder ball;
if the ball bonding control stage is the second control stage, controlling the ball bonding equipment to linearly decrease the first current to a second current so as to cool the first solder ball to obtain a second solder ball;
if the ball bonding control stage is the third control stage, controlling the ball bonding equipment to output the second current to bond the second solder ball to form a third solder ball;
and if the ball bonding control stage is the fourth control stage, controlling the ball bonding equipment to linearly decrease the second current to a third current so as to cool the third solder ball and form a target solder ball.
8. A current controller comprising a memory, a processor and a current control program stored in the memory and executable on the processor, wherein the processor implements the ball bonding current control method of any one of claims 1 to 7 when executing the current control program.
9. An EFO system comprising the current controller of claim 8 and a ball bonding apparatus;
and the ball welding equipment receives the current control signal and outputs a target current according to the current control signal to carry out ball welding.
10. The EFO system of claim 9 wherein the ball bonding apparatus comprises a DAC module and a switch control module;
the DAC module is used for performing conversion processing on the current control signal and outputting a current conversion signal;
and the switch control module is used for outputting corresponding target current based on the current conversion signal.
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