CN114624245B - 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法 - Google Patents

实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法 Download PDF

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CN114624245B
CN114624245B CN202210514315.2A CN202210514315A CN114624245B CN 114624245 B CN114624245 B CN 114624245B CN 202210514315 A CN202210514315 A CN 202210514315A CN 114624245 B CN114624245 B CN 114624245B
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prism
angle
image
optical axis
imaging lens
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CN114624245A (zh
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廖廷俤
颜少彬
林晓丹
郑恒
段亚凡
黄衍堂
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Quanzhou Normal University
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/22—Telecentric objectives or lens systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Lenses (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN202210514315.2A 2022-05-12 2022-05-12 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法 Active CN114624245B (zh)

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CN202210514315.2A CN114624245B (zh) 2022-05-12 2022-05-12 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
PCT/CN2022/137093 WO2023216573A1 (fr) 2022-05-12 2022-12-07 Dispositif optique et procédé de mise en œuvre de détection d'imagerie asynchrone à chemin optique égal entre deux faces d'extrémité et deux faces latérales d'un dé semi-conducteur

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115561128B (zh) * 2022-12-06 2023-03-24 泉州师范学院 实现半导体晶粒两端面非同步成像检测装置与方法

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CN110987964A (zh) * 2019-12-26 2020-04-10 泉州师范学院 获得半导体晶粒相对两面光学检测完全等照度照明的方法
CN111157535A (zh) * 2020-03-01 2020-05-15 泉州师范学院 基于合像光学元件的晶粒双面同时等光程成像且等照度照明的检测装置及方法

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JPH10170237A (ja) * 1996-12-06 1998-06-26 Toshiba Corp 周辺部外観検査方法及びその装置
FR3015677B1 (fr) * 2013-12-23 2016-01-29 Commissariat Energie Atomique Procede et dispositif de preparation et d'analyse optique d'un echantillon solide soumis a un environnement controle, par spectrometrie infrarouge a reflexions internes multiples
KR20210099172A (ko) * 2015-06-05 2021-08-11 케이엘에이 코포레이션 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품
CN109100366A (zh) * 2018-08-10 2018-12-28 武汉盛为芯科技有限公司 半导体激光器芯片端面外观的检测系统及方法
CN111157543A (zh) * 2020-03-18 2020-05-15 泉州师范学院 基于时间差分辨的晶粒双面完全等光程共焦成像检测方法
CN114951037A (zh) * 2022-04-13 2022-08-30 泉州师范学院 半导体晶粒四面同时等光程成像检测装置与方法
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法

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* Cited by examiner, † Cited by third party
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JPH10261573A (ja) * 1997-03-19 1998-09-29 Toshiba Corp 光学式位置測定器を搭載した露光装置及び加工装置
CN110987964A (zh) * 2019-12-26 2020-04-10 泉州师范学院 获得半导体晶粒相对两面光学检测完全等照度照明的方法
CN111157535A (zh) * 2020-03-01 2020-05-15 泉州师范学院 基于合像光学元件的晶粒双面同时等光程成像且等照度照明的检测装置及方法

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Feature extraction based on Gabor filter and Support Vector Machine classifier in defect analysis of Thermoelectric Cooler Component;Zhao Ming 等;《Computers & Electrical Engineering》;20210515;第92卷;第107188页 *

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