CN114615815B8 - 一种多层柔性电路板刻蚀组合装置及其使用方法 - Google Patents

一种多层柔性电路板刻蚀组合装置及其使用方法 Download PDF

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Publication number
CN114615815B8
CN114615815B8 CN202210320282.8A CN202210320282A CN114615815B8 CN 114615815 B8 CN114615815 B8 CN 114615815B8 CN 202210320282 A CN202210320282 A CN 202210320282A CN 114615815 B8 CN114615815 B8 CN 114615815B8
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Prior art keywords
circuit board
etching
flexible circuit
combination device
multilayer flexible
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CN202210320282.8A
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CN114615815A (zh
CN114615815B (zh
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康海滨
肖华
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Shenzhen Pengyu Xingye Technology Co ltd
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Shenzhen Pengyu Xingye Technology Co ltd
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

本发明公开了一种多层柔性电路板刻蚀组合装置及其使用方法，包括顶部设置有敞口的刻蚀池和位于敞口处的盖板，所述刻蚀池内壁的顶部固定有限位块，还包括电路板夹持机构和驱动机构，所述刻蚀池的底壁上固定有多个铁块，电路板夹持机构位于铁块的上方，进行刻蚀时，电路板夹持机构用于将柔性电路板稳定夹持，驱动机构用于带动柔性电路板转动。本发明将刻蚀液充分的混合，提高刻蚀效果，冲击力小，不会使电路板发生形变，且方便的将电路板固定，在刻蚀过程中，可改变电路板的位置，从而更换电路板被夹持的部位，使电路板可完整均匀的进行刻蚀，大大提高了刻蚀效果。
CN202210320282.8A 2022-03-29 2022-03-29 一种多层柔性电路板刻蚀组合装置及其使用方法 Active CN114615815B8 (zh)

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CN202210320282.8A CN114615815B8 (zh) 2022-03-29 2022-03-29 一种多层柔性电路板刻蚀组合装置及其使用方法

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CN202210320282.8A CN114615815B8 (zh) 2022-03-29 2022-03-29 一种多层柔性电路板刻蚀组合装置及其使用方法

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CN114615815A CN114615815A (zh) 2022-06-10
CN114615815B CN114615815B (zh) 2024-03-19
CN114615815B8 true CN114615815B8 (zh) 2024-04-09

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115449799B (zh) * 2022-08-12 2023-06-23 信丰正天伟电子科技有限公司 一种用于电镀后铜板的保护剂溶液浸入结构

Citations (10)

* Cited by examiner, † Cited by third party
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US6179954B1 (en) * 1994-02-16 2001-01-30 Fujitsu Limited Apparatus and method for etching printed circuit board
JP2003073861A (ja) * 2001-08-31 2003-03-12 Fuji Kiko:Kk エッチング装置およびエッチングシステム
JP2004342980A (ja) * 2003-05-19 2004-12-02 Meiko Kaku 直立型薄板エッチングマシンの搬送装置
JP2005246417A (ja) * 2004-03-03 2005-09-15 Mikado Technos Kk 真空プレス貼着装置
JP2008085119A (ja) * 2006-09-28 2008-04-10 Tokyo Kakoki Kk 薬液処理装置
JP2019171696A (ja) * 2018-03-28 2019-10-10 日本メクトロン株式会社 ラミネート装置およびフレキシブルプリント基板の製造方法
CN210514527U (zh) * 2019-07-10 2020-05-12 苏州鑫镁晨电子科技有限公司 一种新型智能型电路板检测设备
CN211164103U (zh) * 2019-11-21 2020-08-04 江西众达泰科技有限公司 一种柔性线路板冲切装置
CN112087879A (zh) * 2020-10-22 2020-12-15 东阳杏泊电子科技有限公司 一种电路板喷淋式自动蚀刻设备
CN112230024A (zh) * 2020-11-04 2021-01-15 江西众达泰科技有限公司 一种柔性电路板检测用夹持装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6179954B1 (en) * 1994-02-16 2001-01-30 Fujitsu Limited Apparatus and method for etching printed circuit board
JP2003073861A (ja) * 2001-08-31 2003-03-12 Fuji Kiko:Kk エッチング装置およびエッチングシステム
JP2004342980A (ja) * 2003-05-19 2004-12-02 Meiko Kaku 直立型薄板エッチングマシンの搬送装置
JP2005246417A (ja) * 2004-03-03 2005-09-15 Mikado Technos Kk 真空プレス貼着装置
JP2008085119A (ja) * 2006-09-28 2008-04-10 Tokyo Kakoki Kk 薬液処理装置
JP2019171696A (ja) * 2018-03-28 2019-10-10 日本メクトロン株式会社 ラミネート装置およびフレキシブルプリント基板の製造方法
CN210514527U (zh) * 2019-07-10 2020-05-12 苏州鑫镁晨电子科技有限公司 一种新型智能型电路板检测设备
CN211164103U (zh) * 2019-11-21 2020-08-04 江西众达泰科技有限公司 一种柔性线路板冲切装置
CN112087879A (zh) * 2020-10-22 2020-12-15 东阳杏泊电子科技有限公司 一种电路板喷淋式自动蚀刻设备
CN112230024A (zh) * 2020-11-04 2021-01-15 江西众达泰科技有限公司 一种柔性电路板检测用夹持装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
印制电路板拆解技术与拆解工艺综述;杨继平;向东;高鹏;汪劲松;段广洪;杨继荣;;机械工程学报;20090915(第09期);132-141 *

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CN114615815B (zh) 2024-03-19

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Effective date of registration: 20240306

Address after: 518000 block a, east area, 3rd floor, building 77, Yanggang Industrial Road, Rentian community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen Pengyu Xingye Technology Co.,Ltd.

Country or region after: China

Address before: 343400 Yongxin County Industrial Development Zone, Ji'an City, Jiangxi Province

Patentee before: JIANGXI ZHONGDATAI TECHNOLOGY Co.,Ltd.

Country or region before: China

CI03 Correction of invention patent
CI03 Correction of invention patent

Correction item: Patentee|Address|Patent agency|Patent Agent

Correct: Shenzhen Pengyu Xingye Technology Co., Ltd.|518000 block a, east area, 3rd floor, building 77, Yanggang Industrial Road, Rentian community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province|Beijing Tianxia Innovation Intellectual Property Agency (General Partnership) 16044|Li Wei

False: Jiangxi Zhongda Tai Technology Co., Ltd.|343400 Yongxin County Industrial Development Zone, Ji'an City, Jiangxi Province|Nanchang Zhuoer Jingcheng Patent Agency (General Partnership) 36133|Liu Wenbin

Number: 12-01

Page: The title page

Volume: 40

Correction item: Patentee|Address|Patent agency|Patent Agent

Correct: Shenzhen Pengyu Xingye Technology Co., Ltd.|518000 block a, east area, 3rd floor, building 77, Yanggang Industrial Road, Rentian community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province|Beijing Tianxia Innovation Intellectual Property Agency (General Partnership) 16044|Li Wei

False: Jiangxi Zhongda Tai Technology Co., Ltd.|343400 Yongxin County Industrial Development Zone, Ji'an City, Jiangxi Province|Nanchang Zhuoer Jingcheng Patent Agency (General Partnership) 36133|Liu Wenbin

Number: 12-01

Volume: 40

OR01 Other related matters
OR01 Other related matters