CN114615815A - 一种多层柔性电路板刻蚀组合装置及其使用方法 - Google Patents
一种多层柔性电路板刻蚀组合装置及其使用方法 Download PDFInfo
- Publication number
- CN114615815A CN114615815A CN202210320282.8A CN202210320282A CN114615815A CN 114615815 A CN114615815 A CN 114615815A CN 202210320282 A CN202210320282 A CN 202210320282A CN 114615815 A CN114615815 A CN 114615815A
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- Prior art keywords
- circuit board
- etching
- plate
- stirring
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005530 etching Methods 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052742 iron Inorganic materials 0.000 claims abstract description 14
- 238000003756 stirring Methods 0.000 claims description 49
- 238000003825 pressing Methods 0.000 claims description 21
- 230000009471 action Effects 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000000712 assembly Effects 0.000 claims description 10
- 238000000429 assembly Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 7
- 230000001174 ascending effect Effects 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 230000000087 stabilizing effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210320282.8A CN114615815B8 (zh) | 2022-03-29 | 2022-03-29 | 一种多层柔性电路板刻蚀组合装置及其使用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210320282.8A CN114615815B8 (zh) | 2022-03-29 | 2022-03-29 | 一种多层柔性电路板刻蚀组合装置及其使用方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
CN114615815A true CN114615815A (zh) | 2022-06-10 |
CN114615815B CN114615815B (zh) | 2024-03-19 |
CN114615815B8 CN114615815B8 (zh) | 2024-04-09 |
Family
ID=81866122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210320282.8A Active CN114615815B8 (zh) | 2022-03-29 | 2022-03-29 | 一种多层柔性电路板刻蚀组合装置及其使用方法 |
Country Status (1)
Country | Link |
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CN (1) | CN114615815B8 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115449799A (zh) * | 2022-08-12 | 2022-12-09 | 信丰正天伟电子科技有限公司 | 一种用于电镀后铜板的保护剂溶液浸入结构 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6179954B1 (en) * | 1994-02-16 | 2001-01-30 | Fujitsu Limited | Apparatus and method for etching printed circuit board |
JP2003073861A (ja) * | 2001-08-31 | 2003-03-12 | Fuji Kiko:Kk | エッチング装置およびエッチングシステム |
JP2004342980A (ja) * | 2003-05-19 | 2004-12-02 | Meiko Kaku | 直立型薄板エッチングマシンの搬送装置 |
JP2005246417A (ja) * | 2004-03-03 | 2005-09-15 | Mikado Technos Kk | 真空プレス貼着装置 |
JP2008085119A (ja) * | 2006-09-28 | 2008-04-10 | Tokyo Kakoki Kk | 薬液処理装置 |
JP2019171696A (ja) * | 2018-03-28 | 2019-10-10 | 日本メクトロン株式会社 | ラミネート装置およびフレキシブルプリント基板の製造方法 |
CN210514527U (zh) * | 2019-07-10 | 2020-05-12 | 苏州鑫镁晨电子科技有限公司 | 一种新型智能型电路板检测设备 |
CN211164103U (zh) * | 2019-11-21 | 2020-08-04 | 江西众达泰科技有限公司 | 一种柔性线路板冲切装置 |
CN112087879A (zh) * | 2020-10-22 | 2020-12-15 | 东阳杏泊电子科技有限公司 | 一种电路板喷淋式自动蚀刻设备 |
CN112230024A (zh) * | 2020-11-04 | 2021-01-15 | 江西众达泰科技有限公司 | 一种柔性电路板检测用夹持装置 |
-
2022
- 2022-03-29 CN CN202210320282.8A patent/CN114615815B8/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6179954B1 (en) * | 1994-02-16 | 2001-01-30 | Fujitsu Limited | Apparatus and method for etching printed circuit board |
JP2003073861A (ja) * | 2001-08-31 | 2003-03-12 | Fuji Kiko:Kk | エッチング装置およびエッチングシステム |
JP2004342980A (ja) * | 2003-05-19 | 2004-12-02 | Meiko Kaku | 直立型薄板エッチングマシンの搬送装置 |
JP2005246417A (ja) * | 2004-03-03 | 2005-09-15 | Mikado Technos Kk | 真空プレス貼着装置 |
JP2008085119A (ja) * | 2006-09-28 | 2008-04-10 | Tokyo Kakoki Kk | 薬液処理装置 |
JP2019171696A (ja) * | 2018-03-28 | 2019-10-10 | 日本メクトロン株式会社 | ラミネート装置およびフレキシブルプリント基板の製造方法 |
CN210514527U (zh) * | 2019-07-10 | 2020-05-12 | 苏州鑫镁晨电子科技有限公司 | 一种新型智能型电路板检测设备 |
CN211164103U (zh) * | 2019-11-21 | 2020-08-04 | 江西众达泰科技有限公司 | 一种柔性线路板冲切装置 |
CN112087879A (zh) * | 2020-10-22 | 2020-12-15 | 东阳杏泊电子科技有限公司 | 一种电路板喷淋式自动蚀刻设备 |
CN112230024A (zh) * | 2020-11-04 | 2021-01-15 | 江西众达泰科技有限公司 | 一种柔性电路板检测用夹持装置 |
Non-Patent Citations (1)
Title |
---|
杨继平;向东;高鹏;汪劲松;段广洪;杨继荣;: "印制电路板拆解技术与拆解工艺综述", 机械工程学报, no. 09, 15 September 2009 (2009-09-15), pages 132 - 141 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115449799A (zh) * | 2022-08-12 | 2022-12-09 | 信丰正天伟电子科技有限公司 | 一种用于电镀后铜板的保护剂溶液浸入结构 |
CN115449799B (zh) * | 2022-08-12 | 2023-06-23 | 信丰正天伟电子科技有限公司 | 一种用于电镀后铜板的保护剂溶液浸入结构 |
Also Published As
Publication number | Publication date |
---|---|
CN114615815B (zh) | 2024-03-19 |
CN114615815B8 (zh) | 2024-04-09 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240306 Address after: 518000 block a, east area, 3rd floor, building 77, Yanggang Industrial Road, Rentian community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Pengyu Xingye Technology Co.,Ltd. Country or region after: China Address before: 343400 Yongxin County Industrial Development Zone, Ji'an City, Jiangxi Province Patentee before: JIANGXI ZHONGDATAI TECHNOLOGY Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right | ||
CI03 | Correction of invention patent |
Correction item: Patentee|Address|Patent agency|Patent Agent Correct: Shenzhen Pengyu Xingye Technology Co., Ltd.|518000 block a, east area, 3rd floor, building 77, Yanggang Industrial Road, Rentian community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province|Beijing Tianxia Innovation Intellectual Property Agency (General Partnership) 16044|Li Wei False: Jiangxi Zhongda Tai Technology Co., Ltd.|343400 Yongxin County Industrial Development Zone, Ji'an City, Jiangxi Province|Nanchang Zhuoer Jingcheng Patent Agency (General Partnership) 36133|Liu Wenbin Number: 12-01 Page: The title page Volume: 40 Correction item: Patentee|Address|Patent agency|Patent Agent Correct: Shenzhen Pengyu Xingye Technology Co., Ltd.|518000 block a, east area, 3rd floor, building 77, Yanggang Industrial Road, Rentian community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province|Beijing Tianxia Innovation Intellectual Property Agency (General Partnership) 16044|Li Wei False: Jiangxi Zhongda Tai Technology Co., Ltd.|343400 Yongxin County Industrial Development Zone, Ji'an City, Jiangxi Province|Nanchang Zhuoer Jingcheng Patent Agency (General Partnership) 36133|Liu Wenbin Number: 12-01 Volume: 40 |
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CI03 | Correction of invention patent | ||
OR01 | Other related matters | ||
OR01 | Other related matters |