CN114589182B - Horizontal belt cleaning device of wafer - Google Patents
Horizontal belt cleaning device of wafer Download PDFInfo
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- CN114589182B CN114589182B CN202210113718.6A CN202210113718A CN114589182B CN 114589182 B CN114589182 B CN 114589182B CN 202210113718 A CN202210113718 A CN 202210113718A CN 114589182 B CN114589182 B CN 114589182B
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- fixedly connected
- inner cavity
- wafer
- shaped frame
- plate
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- 238000004140 cleaning Methods 0.000 title claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 69
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 230000001680 brushing effect Effects 0.000 claims abstract description 22
- 238000011010 flushing procedure Methods 0.000 claims abstract description 17
- 230000000712 assembly Effects 0.000 claims abstract description 14
- 238000000429 assembly Methods 0.000 claims abstract description 14
- 230000007306 turnover Effects 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
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- B08B1/12—
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- B08B1/32—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of wafer cleaning, and discloses a horizontal wafer cleaning device which comprises a bottom plate, wherein a U-shaped frame and a water tank are fixedly connected to the top of the bottom plate, a turnover mechanism of a foreign language U-shaped frame inner cavity is fixedly connected to the top of the bottom plate, and clamping components meshed with the turnover mechanism are rotatably connected to the left side and the right side of the U-shaped frame inner cavity. According to the horizontal wafer cleaning device and the horizontal wafer cleaning method, after the wafer is clamped and fixed through the clamping assemblies, the wafer is cleaned by simultaneously starting the brushing mechanism and the flushing mechanism, after one surface of the wafer is cleaned, the overturning mechanism is started to drive the two clamping assemblies to rotate, the brushing mechanism is upwards extruded while the clamping assemblies rotate, so that the wafer cannot collide with the brushing mechanism, the overturning mechanism is stopped after the wafer is overturned for 180 degrees, the other surface of the wafer is cleaned through the brushing mechanism and the flushing mechanism again, and the purpose of efficiently cleaning the horizontal wafer cleaning device is achieved.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a horizontal wafer cleaning device.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer.
Impurities on the surface of a wafer need to be cleaned after the wafer is processed, but most horizontal cleaning devices in the current market need to manually take out the wafer to turn over and fix the wafer, and then clean the wafer, so that the method has the problem of cleaning efficiency and is troublesome, and the horizontal cleaning device and the cleaning method for the wafer are provided for solving the problem.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a horizontal wafer cleaning device and a cleaning method, which have the advantages of high-efficiency cleaning and the like, and solve the problem of low cleaning efficiency caused by the fact that most horizontal cleaning devices need to manually take out the wafer to turn over and fix the wafer after cleaning the surface of the wafer.
(II) technical scheme
In order to realize the purpose of high-efficiency cleaning, the invention provides the following technical scheme: a wafer horizontal cleaning device comprises a bottom plate, wherein a U-shaped frame and a water tank are fixedly connected to the top of the bottom plate, a turnover mechanism located in an inner cavity of the U-shaped frame is fixedly connected to the top of the bottom plate, clamping assemblies meshed with the turnover mechanism are rotatably connected to the left side and the right side of the inner cavity of the U-shaped frame, a scrubbing mechanism movably connected with the tops of the clamping assemblies is fixedly connected to the top of the inner cavity of the U-shaped frame, a feed port is communicated with the top of the water tank, a sealing cover is movably connected to the outer surface of the feed port, and a flushing mechanism is fixedly connected to the top of the water tank, the bottom of the flushing mechanism penetrates through the inner cavity of the water tank, and the left side of the flushing mechanism penetrates through the inner cavity of the U-shaped frame;
tilting mechanism includes and just is located the biax motor of U-shaped frame inner chamber with bottom plate top fixed connection, the equal fixedly connected with initiative pivot of two output shafts of biax motor, the surface that biax motor one side was kept away from in the initiative pivot has cup jointed first conical gear, two first conical gear's top has all meshed second conical gear, the driven spindle of being connected is rotated with the bottom plate top to the axle center fixedly connected with of second conical gear department, the surface that bottom plate one side was kept away from in the driven spindle has cup jointed third conical gear.
Preferably, the driven rotating shaft is rotatably connected with the top of the bottom plate through a supporting bearing.
Preferably, two the rotation axis of being connected, two is rotated with the left and right sides of U-shaped frame inner chamber respectively to clamping component the equal fixedly connected with U-shaped plate in one side that the rotation axis is relative, the bottom of U-shaped plate inner chamber is rotated and is connected with the drive shaft that the top runs through to the U-shaped plate outside, the top fixedly connected with handle of drive shaft, the surface threaded connection of drive shaft has two sliders, the surface fixedly connected with of slider runs through the splint to the U-shaped plate outside, the surface of rotation axis has cup jointed the fourth conical gear with third conical gear meshing, the surface of U-shaped plate has cup jointed the cam.
Preferably, the outer surface of the driving shaft is provided with two opposite external threads, and the inner cavity of the sliding block is provided with an internal thread matched with the corresponding external threads.
Preferably, one side fixedly connected with that the splint are kept away from to the slider and U-shaped plate inner chamber wall sliding connection's stopper, two the spacing groove with stopper looks adaptation is all seted up to the inner chamber wall of the relative one side of U-shaped plate.
Preferably, the outer surface of the rotating shaft close to one side of the inner cavity wall of the U-shaped frame is sleeved with an auxiliary bearing, and the rotating shaft is rotatably connected with the inner cavity wall of the U-shaped frame through the auxiliary bearing.
Preferably, the brushing mechanism comprises a telescopic rod fixedly connected with the top of the inner cavity of the U-shaped frame, the bottom of the telescopic rod is fixedly connected with a connecting plate movably connected with the tops of the two cams, a spring sleeved on the outer surface of the telescopic rod is fixedly connected between the U-shaped frame and the connecting plate, a driving motor is fixedly connected with the bottom of the connecting plate, and a cleaning brush is fixedly connected with an output shaft of the driving motor.
Preferably, the telescopic rod comprises a hollow rod fixedly connected with the top of the inner cavity of the U-shaped frame, and the inner cavity of the hollow rod is slidably connected with a solid rod fixedly connected with the top of the connecting plate.
Preferably, the flushing mechanism comprises a water pump fixedly connected with the top of the water tank, the bottom of the water inlet fixedly connected with of the water pump penetrates through the water inlet pipe of the inner cavity of the water tank, the left side of the water outlet fixedly connected with of the water pump penetrates through the water discharge pipe of the inner cavity of the U-shaped frame, and the end, far away from the water pump, of the water discharge pipe is communicated with a spray head.
A cleaning method of a wafer horizontal cleaning device comprises the following steps:
1) Injecting water, opening a sealing cover on the feeding hole, and adding clear water into the inner cavity of the water tank through the feeding hole;
2) Clamping and fixing, namely clamping and fixing the wafer to be cleaned through two clamping components;
3) Cleaning for the first time, starting a cleaning mechanism to clean the wafer, starting a brushing mechanism to brush the surface of the wafer, and stopping an impact mechanism and the brushing mechanism after cleaning;
4) Turning over, wherein the two clamping assemblies drive the wafer to rotate through the starting of the turning mechanism, the clamping assemblies upwards extrude the brushing mechanism, the turning mechanism is stopped until the wafer rotates 180 degrees, and at the moment, the brushing mechanism is reset to be in contact with the surface of the wafer which is not cleaned;
5) And cleaning again, and simultaneously starting the brushing mechanism and the flushing mechanism again to clean the wafer.
(III) advantageous effects
Compared with the prior art, the invention provides a wafer horizontal cleaning device and a cleaning method, which have the following beneficial effects:
the wafer horizontal cleaning device and the cleaning method have the advantages that after the wafer is clamped and fixed through the clamping assemblies, the wafer is cleaned by simultaneously starting the brushing mechanism and the flushing mechanism, after one surface of the wafer is cleaned, the overturning mechanism is started to drive the two clamping assemblies to rotate, the brushing mechanism is upwards extruded while the clamping assemblies rotate, the wafer cannot collide with the brushing mechanism in the overturning process, the overturning mechanism is stopped after the wafer is overturned for 180 degrees, the other surface of the wafer is cleaned through the brushing mechanism and the flushing mechanism again, the purpose of efficient cleaning of the wafer horizontal cleaning device is achieved, manual overturning is not needed, and the wafer horizontal cleaning device is convenient to use.
Drawings
FIG. 1 is a schematic structural diagram of a horizontal wafer cleaning apparatus according to the present invention;
FIG. 2 is a schematic structural diagram of a turnover mechanism of a horizontal wafer cleaning device according to the present invention;
fig. 3 is a schematic structural view of a clamping assembly of a horizontal wafer cleaning apparatus according to the present invention;
FIG. 4 is a schematic structural diagram of a brushing mechanism of a horizontal wafer cleaning apparatus according to the present invention;
fig. 5 is a schematic structural diagram of a flushing mechanism of a horizontal wafer cleaning device according to the present invention.
In the figure: the device comprises a base plate 1, a 2U-shaped frame, a 3-turning mechanism, a 31-double-shaft motor, a 32-driving rotating shaft, a 33-first bevel gear, a 34-first bevel gear, a 35-driven rotating shaft, a 36-third bevel gear, a 4-clamping assembly, a 41-rotating shaft, a 42-U-shaped plate, a 43-driving shaft, a 44-handle, a 45-slider, a 451 limiting block, a 46-clamping plate, a 47-fourth bevel gear, a 48-cam, a 5-brushing mechanism, a 51-telescopic rod, a 52-spring, a 53-connecting plate, a 54-driving motor, a 55-cleaning brush, a 6-water tank, a 7-feeding hole, an 8-sealing cover, a 9-flushing mechanism, a 91-water pump, a 92-inlet pipe, 93-drain pipes and 94-spraying heads.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1-5, a wafer horizontal cleaning device, which comprises a bottom plate 1, a U-shaped frame 2 and a water tank 6 fixedly connected to the top of the bottom plate 1, a turnover mechanism 3 located in the inner cavity of the U-shaped frame 2 and fixedly connected to the top of the bottom plate 1, a clamping component 4 engaged with the turnover mechanism 3 and rotatably connected to the left and right sides of the inner cavity of the U-shaped frame 2, a scrubbing mechanism 5 movably connected to the top of the clamping component 4 and fixedly connected to the top of the inner cavity of the U-shaped frame 2, a feed port 7 communicated to the top of the water tank 6, a sealing cover 8 movably connected to the outer surface of the feed port 7, and a flushing mechanism 9 connected to the bottom of the top of the water tank 6 and the inner cavity of the U-shaped frame 2 and penetrating to the left side of the inner cavity of the water tank 6.
The two clamping assemblies 4 are respectively connected with the rotating shafts 41 rotatably on the left side and the right side of the inner cavity of the U-shaped frame 2, the outer surface of one side, close to the inner cavity wall of the U-shaped frame 2, of each rotating shaft 41 is sleeved with an auxiliary bearing, each rotating shaft 41 is rotatably connected with the inner cavity wall of the U-shaped frame 2 through the auxiliary bearing, the U-shaped plates 42 are fixedly connected on the opposite sides of the two rotating shafts 41, the bottom of the inner cavity of each U-shaped plate 42 is rotatably connected with a driving shaft 43 with the top penetrating to the outer side of the U-shaped plate 42, a handle 44 is fixedly connected to the top of the driving shaft 43, two sliders 45 are in threaded connection with the outer surface of the driving shaft 43, two opposite external threads are formed on the outer surface of the driving shaft 43, internal threads matched with the corresponding external threads are formed in the inner cavity of the sliders 45, a limiting block 451 slidably connected with the inner cavity wall of the U-shaped plates 42 is fixedly connected on the side of the sliders 45 far away from the clamping plates 46, a limiting groove matched with the limiting block 451 is formed in the inner cavity wall of the opposite sides of the two U-shaped plates 42, a clamping plate 45 is fixedly connected with a clamping plate 46 penetrating to the outer surface of the U-shaped plate 42, a fourth bevel gear 47 meshed with the third bevel gear 36 is sleeved on the outer surface of the rotating shaft 41, and a cam 48 is sleeved on the outer surface of the U-shaped plate 42.
The brushing mechanism 5 comprises an expansion link 51 fixedly connected with the top of the inner cavity of the U-shaped frame 2, the bottom of the expansion link 51 is fixedly connected with a connecting plate 53 movably connected with the tops of the two cams 48, the expansion link 51 comprises a hollow rod fixedly connected with the top of the inner cavity of the U-shaped frame 2, the inner cavity of the hollow rod is slidably connected with a solid rod fixedly connected with the top of the connecting plate 53, a spring 52 sleeved on the outer surface of the expansion link 51 is fixedly connected between the U-shaped frame 2 and the connecting plate 53, the bottom of the connecting plate 53 is fixedly connected with a driving motor 54, and an output shaft of the driving motor 54 is fixedly connected with a cleaning brush 55.
The flushing mechanism 9 comprises a water pump 91 fixedly connected with the top of the water tank 6, a water inlet pipe 92 penetrating through the bottom of a water inlet fixedly connected with of the water pump 91 to the inner cavity of the water tank 6, a water outlet 93 penetrating through the left side of a water outlet fixedly connected with of the water pump 91 to the inner cavity of the U-shaped frame 2, and a spray head 94 communicated with one end of the water outlet 93 far away from the water pump 91.
A cleaning method of a wafer horizontal cleaning device comprises the following steps:
1) Injecting water, opening a sealing cover 8 on the feeding hole 7, and adding clean water into the inner cavity of the water tank 6 through the feeding hole 7;
2) Clamping and fixing, namely clamping and fixing the wafer to be cleaned through two clamping components 4;
3) Cleaning for the first time, starting the cleaning mechanism 9 to clean the wafer, starting the brushing mechanism 5 to brush the surface of the wafer, and stopping the impacting mechanism 9 and the brushing mechanism 5 after cleaning;
4) Turning over, wherein the two clamping assemblies 4 drive the wafer to rotate by starting the turning mechanism 3, the clamping assemblies 4 upwards extrude the brushing mechanism 5, the turning mechanism 3 is stopped until the wafer rotates 180 degrees, and the brushing mechanism 5 is reset to be in contact with the surface of the wafer which is not cleaned;
5) And cleaning again, and simultaneously starting the brushing mechanism 5 and the flushing mechanism 9 again to clean the wafer.
To sum up, the horizontal wafer cleaning device and the horizontal wafer cleaning method are characterized in that the sealing cover 8 is opened, water is added into the inner cavity of the water tank 6 through the feed inlet 7, then the sealing cover 8 is closed, a wafer to be cleaned is placed on the two clamping plates 46 at the lower part, the driving shaft 43 is driven to rotate by the rotating handle 44, the two external threads on the driving shaft 43 are opposite in direction, and the rotating direction of the sliding blocks 45 is limited by the U-shaped plate 42 through the limiting blocks 451, so that the two sliding blocks 45 on the same driving shaft 43 move relatively to drive the clamping plates 46 to clamp and fix the wafer, the water pump 91 is started, water in the inner cavity of the water tank 6 is sprayed out from the spray head 94 through the transportation of the water inlet pipe 92 and the water outlet pipe 93 to wash the surface of the wafer, meanwhile, the driving motor 54 is started to drive the cleaning brush 55 to rotate to scrub the surface of the wafer, and after the cleaning is completed, the double-shaft motor 31 is started, the rotation of the driving rotating shafts 32 on two sides is transferred, the driven rotating shaft 35 is driven to rotate through the meshing of the first conical gear 33 and the second conical gear 34, the rotating shaft 41 is driven to rotate through the meshing of the third conical gear 36 and the fourth conical gear 47, the wafer is driven to overturn, meanwhile, the cam 48 rotates the upper connecting plate 53 to enable the telescopic rod 51 and the spring 52 to be compressed, the driving motor 54 and the cleaning brush 55 rise along with the rotation, the double-shaft motor 31 is stopped until the rotating shaft 41 drives the wafer to overturn for 180 degrees, the cleaning brush 55 resets under the elastic action of the spring 52 to be in contact with the surface of the wafer which is not cleaned, and the surface which is not cleaned is cleaned again.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A horizontal belt cleaning device of wafer, includes bottom plate (1), its characterized in that: the cleaning device is characterized in that a U-shaped frame (2) and a water tank (6) are fixedly connected to the top of the bottom plate (1), a turnover mechanism (3) located in an inner cavity of the U-shaped frame (2) is fixedly connected to the top of the bottom plate (1), clamping components (4) meshed with the turnover mechanism (3) are rotatably connected to the left side and the right side of the inner cavity of the U-shaped frame (2), a cleaning mechanism (5) movably connected to the top of the clamping components (4) is fixedly connected to the top of the inner cavity of the U-shaped frame (2), a feeding hole (7) is communicated with the top of the water tank (6), a sealing cover (8) is movably connected to the outer surface of the feeding hole (7), and a flushing mechanism (9) is fixedly connected to the top of the water tank (6), the bottom of the flushing mechanism penetrates through the inner cavity of the water tank (6) and the left side of the flushing mechanism penetrates through the inner cavity of the U-shaped frame (2);
the turnover mechanism (3) comprises a double-shaft motor (31) which is fixedly connected with the top of the bottom plate (1) and is positioned in an inner cavity of the U-shaped frame (2), two output shafts of the double-shaft motor (31) are fixedly connected with driving rotating shafts (32), the outer surface of one side, away from the double-shaft motor (31), of each driving rotating shaft (32) is sleeved with a first bevel gear (33), the tops of the two first bevel gears (33) are respectively meshed with a second bevel gear (34), the axis of each second bevel gear (34) is fixedly connected with a driven rotating shaft (35) which is rotatably connected with the top of the bottom plate (1), and the outer surface of one side, away from the bottom plate (1), of each driven rotating shaft (35) is sleeved with a third bevel gear (36);
the two clamping assemblies (4) respectively comprise rotating shafts (41), the two rotating shafts (41) are respectively connected with the left side and the right side of an inner cavity of the U-shaped frame (2) in a rotating mode, a U-shaped plate (42) is fixedly connected to one opposite side of the two rotating shafts (41), a driving shaft (43) with the top penetrating to the outer side of the U-shaped plate (42) is rotatably connected to the bottom of the inner cavity of the U-shaped plate (42), a handle (44) is fixedly connected to the top of the driving shaft (43), two sliding blocks (45) are in threaded connection with the outer surface of the driving shaft (43), a clamping plate (46) penetrating to the outer side of the U-shaped plate (42) is fixedly connected to the outer surface of each sliding block (45), a fourth bevel gear (47) meshed with a third bevel gear (36) is sleeved on the outer surface of each rotating shaft (41), and a cam (48) is sleeved on the outer surface of each U-shaped plate (42);
the brushing mechanism (5) comprises a telescopic rod (51) fixedly connected with the top of an inner cavity of the U-shaped frame (2), the bottom of the telescopic rod (51) is fixedly connected with a connecting plate (53) movably connected with the tops of the two cams (48), a spring (52) sleeved on the outer surface of the telescopic rod (51) is fixedly connected between the U-shaped frame (2) and the connecting plate (53), the bottom of the connecting plate (53) is fixedly connected with a driving motor (54), and an output shaft of the driving motor (54) is fixedly connected with a cleaning brush (55);
when the cam (48) rotates, the connecting plate (53) acts upwards to compress the telescopic rod (51) and the spring (52), and the driving motor (54) and the cleaning brush (55) rise along with the compression until the rotating shaft (41) drives the wafer to turn over for 180 degrees.
2. The wafer level cleaning apparatus of claim 1, wherein: and the driven rotating shaft (35) is rotatably connected with the top of the bottom plate (1) through a supporting bearing.
3. The wafer level cleaning apparatus of claim 1, wherein: two opposite external threads are formed on the outer surface of the driving shaft (43), and internal threads matched with the corresponding external threads are formed in the inner cavity of the sliding block (45).
4. The wafer level cleaning apparatus of claim 1, wherein: one side fixedly connected with that splint (46) are kept away from in slider (45) and U-shaped plate (42) inner chamber wall sliding connection's stopper (451), two the spacing groove with stopper (451) looks adaptation is all seted up to the inner chamber wall of the relative one side of U-shaped plate (42).
5. The wafer level cleaning apparatus of claim 1, wherein: the outer surface of the rotating shaft (41) close to one side of the inner cavity wall of the U-shaped frame (2) is sleeved with an auxiliary bearing, and the rotating shaft (41) is rotatably connected with the inner cavity wall of the U-shaped frame (2) through the auxiliary bearing.
6. The wafer level cleaning apparatus of claim 1, wherein: the telescopic rod (51) comprises a hollow rod fixedly connected with the top of the inner cavity of the U-shaped frame (2), and the inner cavity of the hollow rod is slidably connected with a solid rod fixedly connected with the top of the connecting plate (53).
7. The wafer level cleaning apparatus of claim 1, wherein: washing mechanism (9) include with water tank (6) top fixed connection's water pump (91), the water inlet fixedly connected with bottom of water pump (91) runs through to inlet tube (92) of water tank (6) inner chamber, the delivery port fixedly connected with left side of water pump (91) runs through to drain pipe (93) of U-shaped frame (2) inner chamber, the one end intercommunication that water pump (91) were kept away from in drain pipe (93) has shower nozzle (94).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210113718.6A CN114589182B (en) | 2022-01-30 | 2022-01-30 | Horizontal belt cleaning device of wafer |
| CN202211429014.6A CN115732313B (en) | 2022-01-30 | 2022-01-30 | Cleaning method of wafer horizontal cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210113718.6A CN114589182B (en) | 2022-01-30 | 2022-01-30 | Horizontal belt cleaning device of wafer |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211429014.6A Division CN115732313B (en) | 2022-01-30 | 2022-01-30 | Cleaning method of wafer horizontal cleaning device |
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| Publication Number | Publication Date |
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| CN114589182A CN114589182A (en) | 2022-06-07 |
| CN114589182B true CN114589182B (en) | 2023-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210113718.6A Active CN114589182B (en) | 2022-01-30 | 2022-01-30 | Horizontal belt cleaning device of wafer |
| CN202211429014.6A Active CN115732313B (en) | 2022-01-30 | 2022-01-30 | Cleaning method of wafer horizontal cleaning device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211429014.6A Active CN115732313B (en) | 2022-01-30 | 2022-01-30 | Cleaning method of wafer horizontal cleaning device |
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| CN115008351A (en) * | 2022-06-27 | 2022-09-06 | 安徽大来机械制造有限公司 | High-efficient shot blasting equipment of nodular cast iron well lid processing usefulness |
| CN115430543A (en) * | 2022-09-15 | 2022-12-06 | 安徽农业大学 | Panel paint spraying apparatus is used in production of intelligence house wardrobe |
| CN115463892B (en) * | 2022-09-16 | 2023-06-20 | 上海申和投资有限公司 | Piece She Shijing round cleaning machine |
| CN116344407B (en) * | 2023-04-16 | 2023-09-29 | 苏州冠礼科技有限公司 | Drying equipment after wafer etching and cleaning |
| CN117594510B (en) * | 2023-11-27 | 2024-04-16 | 苏州赛美达半导体科技有限公司 | Wafer conveying device with accurate positioning |
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Also Published As
| Publication number | Publication date |
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| CN115732313A (en) | 2023-03-03 |
| CN114589182A (en) | 2022-06-07 |
| CN115732313B (en) | 2024-04-05 |
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