CN213763018U - Wafer cleaning equipment for wafer manufacturing - Google Patents
Wafer cleaning equipment for wafer manufacturing Download PDFInfo
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- CN213763018U CN213763018U CN202021673496.6U CN202021673496U CN213763018U CN 213763018 U CN213763018 U CN 213763018U CN 202021673496 U CN202021673496 U CN 202021673496U CN 213763018 U CN213763018 U CN 213763018U
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- wafer
- telescopic rod
- cleaning equipment
- fixed
- semicircular rings
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- 238000004140 cleaning Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000003814 drug Substances 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000011012 sanitization Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 235000013358 Solanum torvum Nutrition 0.000 description 1
- 240000002072 Solanum torvum Species 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to the technical field of wafer cleaning equipment, in particular to wafer cleaning equipment for wafer manufacturing, which comprises a bottom plate, wherein the left side and the right side of the upper end of the bottom plate are respectively fixed with a support plate, a pair of semicircular rings which are symmetrically distributed left and right are arranged between the left support plate and the right support plate, the two semicircular rings are contacted, the inner walls of the semicircular rings are provided with dents, a support block is arranged between the semicircular rings and the support plates, a wafer is clamped into the dents of the semicircular rings, the two semicircular rings are gradually drawn together by an electric telescopic rod, the wafer can be clamped in the semicircular rings by the dents, the wafer can be stably clamped by the semicircular rings, a first waterproof motor drives a first rotating shaft to rotate, the wafer drives a disk brush to rotate, the surface of the wafer is cleaned by the disk brush, cleaning liquid medicine is provided for a nozzle by a hose, and the wafer is cleaned, the problem of present wafer cleaning equipment be not convenient for carry out centre gripping and upset to the wafer in the cleaning process is solved.
Description
Technical Field
The utility model relates to a wafer cleaning equipment technical field especially relates to a disk cleaning equipment for wafer manufacturing.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the original material thereof is silicon. The high-purity polysilicon is dissolved and doped into silicon crystal seed crystals, then the silicon crystal seed crystals are slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer. Before the wafer is processed into a finished product, the surface of the wafer must be cleaned for subsequent manufacturing.
The conventional wafer cleaning equipment is inconvenient for clamping a wafer, so that the wafer may fall off in the cleaning process, the front and back surfaces of the wafer are cleaned, and meanwhile, the wafer is not convenient to turn over to clean the front and back surfaces of the wafer.
SUMMERY OF THE UTILITY MODEL
The utility model provides a disk cleaning equipment for wafer manufacturing to the wafer cleaning equipment who solves above-mentioned background art and provide is not convenient for carry out the problem of centre gripping and upset to the wafer in the cleaning process.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
wafer cleaning equipment for wafer manufacturing comprises a base plate:
the left side and the right side of the upper end of the bottom plate are respectively fixed with a supporting plate, a pair of semicircular rings which are bilaterally symmetrically distributed are arranged between the left supporting plate and the right supporting plate, the two semicircular rings are contacted, dents are formed in the inner walls of the semicircular rings, supporting blocks are arranged between the semicircular rings and the supporting plates, an electric telescopic rod is installed at one end, close to the semicircular rings, of each supporting block, the tail end of the electric telescopic rod is fixedly connected with the semicircular rings, second sliding rods are fixed at one ends, close to the supporting blocks, of the semicircular rings and positioned on the front side and the rear side of the electric telescopic rod, one end, close to the supporting blocks, of each second sliding rod penetrates through the supporting blocks and is connected with the supporting blocks in a sliding mode, a pair of connecting rods which are distributed front and back are fixed between the left supporting blocks and the right supporting blocks, and the connecting rods are positioned on the front and back sides of the semicircular rings;
the utility model discloses a waterproof motor, including backup pad, supporting plate, roof, telescopic rod, lifter plate lower extreme, roof lower extreme middle mounting has electronic jar, the power take off end sliding connection of electronic jar has the telescopic rod, the telescopic rod lower extreme is fixed with the lifter plate, first waterproof motor is installed to the lifter plate lower extreme, the power take off end of first waterproof motor rotates and is connected with first pivot, first pivot lower extreme is fixed with the disk, the disk lower extreme has the disk brush through screwed connection, the inside through-hole that has a plurality of to be cyclic annular distribution of evenly opening of disk.
Furthermore, the supporting shoe is close to the one end of backup pad and is located two around being fixed with the second pivot between the second slide bar, the second pivot is made by nickel-plated iron rod, the right-hand member the backup pad left end is installed the waterproof motor of second, and the left end the backup pad right-hand member is installed the tip cone, and the right-hand member the second pivot right-hand member is connected with the power take off end of the waterproof motor of second, and the left end the second pivot left end is connected with the tip cone right-hand member rotation.
Further, the bottom plate upper end just is located the semicircle ring below and installs the drainage pond, the drainage pond is located the backup pad inboard, the bottom plate upper end just is located the drainage pond around both sides and all installs a pair of waterproof electric jar that is left right distribution, the power take off end sliding connection of waterproof electric jar has spacing stick, spacing stick upper end contacts with the supporting shoe lower extreme.
Further, shower nozzle is all installed to lifter plate lower extreme and the both sides of being located first waterproof motor left and right sides, the water source input end of shower nozzle meets has the hose, the shower nozzle is located the disk top.
Furthermore, the through hole is positioned between the outer side of the telescopic rod and the inner side of the disc brush.
Furthermore, the upper end of the lifting plate and the left and right sides of the telescopic rod are respectively fixed with a first sliding rod, the lower end of the top plate and the left and right sides of the electric cylinder are respectively fixed with a support sheet, the support sheets are in a shape of a Chinese character 'ji', and the upper end of the first sliding rod extends out of the upper surface of the support sheet and is in sliding connection with the support sheets.
Compared with the prior art, the utility model discloses the beneficial effect who realizes:
the wafer is clamped into the dents of the semicircular rings, the two semicircular rings are gradually drawn together through the stretching of the electric telescopic rod, the wafer can be clamped in the semicircular rings through the dents, the wafer can be stably clamped through the semicircular rings, the cleaning of the disc brush is facilitated, the first waterproof motor is started to drive the first rotating shaft to rotate, the disc is driven to rotate by the disc, the surface of the wafer is cleaned through the disc brush, cleaning liquid medicine is provided for the spray head through the hose, the spray head sprays the cleaning liquid medicine on the wafer, the cleaning liquid medicine permeates the wafer through the through holes in the disc, the cleaning liquid medicine can perform chemical reaction with the surface of the wafer along with the rotation of the disc brush, the wafer is cleaned, and the wafer is cleaned more thoroughly through the disc brush;
after one of them face sanitization of wafer, drive the rotation of second pivot through second waterproof motor to overturn the semicircle ring, thereby be convenient for wash another face of wafer, just so need not overturn the wafer through artifical manual, also avoided artifical upset and lead to the wafer surface to be infected with the filth again, treat after another face sanitization, start electric telescopic handle and stretch and can part two blocks of semicircle rings about with, thereby can take out the wafer.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic top view of the semicircular ring of the present invention;
fig. 3 is a schematic bottom view of the wafer of the present invention;
fig. 4 is a schematic top view of a wafer according to the present invention;
fig. 5 is a partial enlarged view of the structure a of the present invention.
In the figure: 1-bottom plate, 2-drainage pool, 3-support plate, 4-support rod, 5-top plate, 6-electric cylinder, 7-support plate, 8-first slide rod, 9-lifting plate, 10-spray head, 11-hose, 12-first waterproof motor, 13-first rotating shaft, 14-round plate, 15-round plate brush, 16-second waterproof motor, 17-tip cone, 18-support block, 19-electric telescopic rod, 20-second slide rod, 21-second rotating shaft, 22-semicircular ring, 23-connecting rod, 24-dent, 25-through hole, 26-telescopic rod, 27-waterproof electric cylinder and 28-limit rod.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 5:
the utility model provides a disk cleaning equipment for wafer manufacturing, including bottom plate 1, following each part to a disk cleaning equipment for wafer manufacturing carries out the detailed description:
the left side and the right side of the upper end of the bottom plate 1 are respectively fixed with a supporting plate 3, a pair of semicircular rings 22 which are symmetrically distributed left and right are arranged between the left supporting plate 3 and the right supporting plate 3, the two semicircular rings 22 are contacted, the inner wall of the semicircular ring 22 is provided with an indent 24, a supporting block 18 is arranged between the semicircular ring 22 and the supporting plate 3, one end of the supporting block 18 close to the semicircular ring 22 is provided with an electric telescopic rod 19, the tail end of the electric telescopic rod 19 is fixedly connected with the semicircular ring 22, the semicircular ring 22 is close to one end of the supporting block 18 and is fixed with a second sliding rod 20 at the front side and the rear side of the electric telescopic rod 19, one end of the second sliding rod 20, which is close to the supporting block 18, penetrates through the supporting block 18 and is in sliding connection with the supporting block 18, a pair of connecting rods 23 which are distributed front and back are fixed between the left supporting block 18 and the right supporting block 18, and the connecting rods 23 are positioned in the front and back of the semicircular ring 22; a second rotating shaft 21 is fixed between the front and rear second sliding rods 20 at one end of the supporting block 18 close to the supporting plate 3, the second rotating shaft 21 is made of nickel-plated iron rods, a second waterproof motor 16 is installed at the left end of the supporting plate 3 at the right end, a tip cone 17 is installed at the right end of the supporting plate 3 at the left end, the right end of the second rotating shaft 21 at the right end is connected with the power output end of the second waterproof motor 16, and the left end of the second rotating shaft 21 at the left end is rotatably connected with the right end of the tip cone 17; a drainage pool 2 is arranged at the upper end of the bottom plate 1 and below the semicircular ring 22, the drainage pool 2 is arranged at the inner side of the supporting plate 3, a pair of left and right distributed waterproof electric cylinders 27 are arranged at the upper end of the bottom plate 1 and at the front and the rear sides of the drainage pool 2, the power output end of each waterproof electric cylinder 27 is connected with a limiting rod 28 in a sliding mode, and the upper end of each limiting rod 28 is in contact with the lower end of the supporting block 18;
specifically, the left and right semicircular rings 22 are gradually separated through contraction of the electric telescopic rod 19, the semicircular rings 22 are provided with second sliding rods 20 to slide in the supporting blocks 18 along with contraction of the electric telescopic rod 19, the wafer is clamped into the dent 24 of one of the semicircular rings 22, the left and right semicircular rings 22 are gradually folded through the stretching of the electric telescopic rod 19, the wafer is clamped in the dent 24 of the semicircular ring 22, when the wafer needs to be taken down, the wafer is held by two hands, the electric telescopic rod 19 is only required to be started to contract again to gradually separate the left and right semicircular rings 22, and then the wafer can be taken out from the dent 24 of the semicircular rings 22;
a pair of supporting rods 4 distributed front and back are fixed at the upper ends of the supporting plates 3, a top plate 5 is fixed between the upper ends of the supporting rods 4, an electric cylinder 6 is installed in the middle of the lower end of the top plate 5, a telescopic rod 26 is slidably connected to the power output end of the electric cylinder 6, a lifting plate 9 is fixed at the lower end of the telescopic rod 26, a first waterproof motor 12 is installed at the lower end of the lifting plate 9, the power output end of the first waterproof motor 12 is rotatably connected with a first rotating shaft 13, a wafer 14 is fixed at the lower end of the first rotating shaft 13, a disk brush 15 is connected to the lower end of the wafer 14 through screws, and a plurality of through holes 25 distributed annularly are uniformly formed in the wafer 14; the lower end of the lifting plate 9 and the left and right sides of the first waterproof motor 12 are both provided with a spray head 10, the water source input end of the spray head 10 is connected with a hose 11, and the spray head 10 is positioned above the wafer 14; the through hole 25 is positioned between the outer side of the telescopic rod 26 and the inner side of the disc brush 15; first sliding rods 8 are fixed at the upper end of the lifting plate 9 and positioned on the left side and the right side of the telescopic rod 26, supporting pieces 7 are fixed at the lower end of the top plate 5 and positioned on the left side and the right side of the electric cylinder 6, the supporting pieces 7 are L-shaped, and the upper end of the first sliding rod 8 extends out of the upper surface of the supporting piece 7 and is connected with the supporting piece 7 in a sliding mode;
specifically, the waterproof electric cylinder 27 moves the limit rod 28 upwards to extend out of the waterproof electric cylinder 27, the upper end of the limit rod 28 abuts against the lower end of the supporting block 18, so that the semicircular ring 22 is kept stable, the first waterproof motor 12 is started to drive the first rotating shaft 13 to rotate, the wafer 14 rotates along with the rotation of the first rotating shaft 13, the wafer 14 drives the disk brush 15 to rotate, the telescopic rod 26 moves downwards through the electric cylinder 6 to extend out of the electric cylinder 6, the telescopic rod 26 moves downwards to drive the lifting plate 9 to move downwards, the lifting plate 9 can move downwards along with the telescopic rod 26 to slide the first sliding rod 8 and the supporting plate 7, so that the lifting plate 9 moves the first waterproof motor 12 and the lifting plate 9 downwards, the first waterproof motor 12 drives the disk brush 15 to move downwards through the first rotating shaft 13, the disk brush 15 cleans the surface of the wafer, the hose 11 is externally connected with a medicine box to introduce cleaning liquid medicine, the hose 11 provides cleaning liquid medicine for the spray head 10, the cleaning liquid medicine is sprayed on the wafer 14 by the spray head 10, the cleaning liquid medicine flows through the disk brush 15 through the through hole 25 on the wafer 14, the cleaning liquid medicine permeates to the wafer along the disk brush 15 and contacts with the surface of the wafer, the rotation of the disk brush 15 is beneficial to uniformly coating the cleaning liquid medicine on the surface of the wafer, so that the wafer is cleaned, the waste water generated by cleaning can drop into the drainage pool 2, as the right end of the drainage pool 2 is provided with a drainage pipe, the waste water is drained through the drainage pipe of the drainage pool 2, when one surface of the wafer is cleaned, the limiting rod 28 moves downwards and contracts into the waterproof electric cylinder 27 through the waterproof electric cylinder 27, the upper end of the limiting rod 28 is separated from the lower end of the supporting block 18, the telescopic rod 26 moves upwards and contracts into the electric cylinder 9 through the electric cylinder 9, the electric cylinder 26 moves upwards, the electric cylinder 9 drives the disk brush 15 to be separated from the wafer in the semicircular ring 22 by the electric cylinder 9, drive the second pivot 21 rotation one hundred eighty degrees of right-hand member through second waterproof motor 16, the second pivot 21 of right-hand member makes supporting shoe 18 and connecting rod 23 overturn, supporting shoe 18 takes semicircle ring 22 to overturn through second slide bar 20, the second pivot 21 of left end centers on apex cone 17 and rotates, thereby overturn one hundred eighty degrees with semicircle ring 22, again through waterproof electric cylinder 27 with stopper rod 28 rebound and withstand supporting shoe 18 lower extreme, make semicircle ring 22 steady once more, again through electronic jar 6 with telescopic rod 26 lapse, wafer 14 once more with the contact of the wafer in disc brush 15 and the semicircle ring 22, thereby wash another face of wafer.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. Wafer cleaning equipment for wafer manufacturing, comprising a base plate (1), characterized in that:
the left side and the right side of the upper end of the bottom plate (1) are respectively fixed with a support plate (3), a pair of semicircular rings (22) which are bilaterally symmetrically distributed is arranged between the left support plate and the right support plate (3), the two semicircular rings (22) are contacted, the inner wall of each semicircular ring (22) is provided with a dent (24), a support block (18) is arranged between each semicircular ring (22) and the support plate (3), one end of each support block (18) close to each semicircular ring (22) is provided with an electric telescopic rod (19), the tail end of each electric telescopic rod (19) is fixedly connected with each semicircular ring (22), one end of each semicircular ring (22) close to each support block (18) is fixedly provided with a second sliding rod (20) at the front side and the rear side of each electric telescopic rod (19), one end of each second sliding rod (20) close to each support block (18) penetrates through each support block (18) to be connected with each support block (18) in a sliding manner, a pair of connecting rods (23) which are distributed front and back are fixed between the left supporting block and the right supporting block (18), and the connecting rods (23) are positioned in the front and back of the semicircular ring (22);
backup pad (3) upper end all is fixed with a pair of bracing piece (4) that are the front and back distribution, be fixed with roof (5) between bracing piece (4) upper end, roof (5) lower extreme mid-mounting has electronic jar (6), the power take off sliding connection of electronic jar (6) has telescopic rod (26), telescopic rod (26) lower extreme is fixed with lifter plate (9), first waterproof motor (12) are installed to lifter plate (9) lower extreme, the power take off of first waterproof motor (12) rotates and is connected with first pivot (13), first pivot (13) lower extreme is fixed with disk (14), disk (14) lower extreme has disk brush (15) through the screwed connection, disk (14) inside evenly opens has a plurality of through-hole (25) that are cyclic annular distribution.
2. Wafer cleaning equipment for wafer manufacturing as claimed in claim 1, characterized in that: the one end that supporting shoe (18) are close to backup pad (3) and be located two around being fixed with second pivot (21) between second slide bar (20), second pivot (21) are made by the iron bar of nickel plating, the right-hand member backup pad (3) left end is installed second waterproof motor (16), the left end backup pad (3) right-hand member is installed and is pressed from both sides awl (17), the right-hand member second pivot (21) right-hand member is connected with the power take off end of second waterproof motor (16), the left end second pivot (21) left end is connected with the right-hand member rotation of pressed from both sides awl (17).
3. Wafer cleaning equipment for wafer manufacturing as claimed in claim 1, characterized in that: bottom plate (1) upper end just is located semicircle ring (22) below and installs drainage pool (2), drainage pool (2) are located backup pad (3) inboardly, bottom plate (1) upper end just is located drainage pool (2) front and back both sides and all installs a pair of waterproof electric jar (27) that are left right distribution, the power take off end sliding connection of waterproof electric jar (27) has spacing stick (28), spacing stick (28) upper end contacts with supporting shoe (18) lower extreme.
4. Wafer cleaning equipment for wafer manufacturing as claimed in claim 1, characterized in that: shower nozzle (10) are all installed to lifter plate (9) lower extreme and the both sides of being located first waterproof motor (12), the water source input end of shower nozzle (10) meets hose (11), shower nozzle (10) are located disk (14) top.
5. Wafer cleaning equipment for wafer manufacturing as claimed in claim 1, characterized in that: the through hole (25) is positioned between the outer side of the telescopic rod (26) and the inner side of the disc brush (15).
6. Wafer cleaning equipment for wafer manufacturing as claimed in claim 1, characterized in that: lifting plate (9) upper end just is located telescopic rod (26) and all is fixed with first slide bar (8) in both sides about, roof (5) lower extreme just is located electronic jar (6) left and right sides and all is fixed with backing sheet (7), backing sheet (7) are the L font, backing sheet (7) upper surface and backing sheet (7) sliding connection are extended to first slide bar (8) upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021673496.6U CN213763018U (en) | 2020-08-12 | 2020-08-12 | Wafer cleaning equipment for wafer manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021673496.6U CN213763018U (en) | 2020-08-12 | 2020-08-12 | Wafer cleaning equipment for wafer manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213763018U true CN213763018U (en) | 2021-07-23 |
Family
ID=76902457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021673496.6U Active CN213763018U (en) | 2020-08-12 | 2020-08-12 | Wafer cleaning equipment for wafer manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213763018U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115732313A (en) * | 2022-01-30 | 2023-03-03 | 江苏亚电科技有限公司 | Cleaning method of horizontal wafer cleaning device |
| WO2024187738A1 (en) * | 2023-03-14 | 2024-09-19 | 上海陛通半导体能源科技股份有限公司 | Thin film deposition apparatus |
-
2020
- 2020-08-12 CN CN202021673496.6U patent/CN213763018U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115732313A (en) * | 2022-01-30 | 2023-03-03 | 江苏亚电科技有限公司 | Cleaning method of horizontal wafer cleaning device |
| CN115732313B (en) * | 2022-01-30 | 2024-04-05 | 江苏亚电科技股份有限公司 | Cleaning method of wafer horizontal cleaning device |
| WO2024187738A1 (en) * | 2023-03-14 | 2024-09-19 | 上海陛通半导体能源科技股份有限公司 | Thin film deposition apparatus |
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Effective date of registration: 20210917 Address after: 201400 12 / F, building 2, 1919 Baziqiao Road, Nanqiao Town, Fengxian District, Shanghai Patentee after: Ha Wu industry (Shanghai) Co.,Ltd. Address before: 523000 near 33 Yuxing street, Dongguan City, Guangdong Province Patentee before: Wu Qi |
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Effective date of registration: 20211029 Address after: Room 74, Zone D, floor 2, building 16, No. 588, Lane 7548, waiqingsong highway, Qingpu District, Shanghai 201700 Patentee after: Aozhun enterprise development (Shanghai) Co.,Ltd. Address before: 201400 12 / F, building 2, 1919 Baziqiao Road, Nanqiao Town, Fengxian District, Shanghai Patentee before: Ha Wu industry (Shanghai) Co.,Ltd. |
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Effective date of registration: 20211210 Address after: 201404 floor 12, building 2, No. 1919, Baziqiao Road, Nanqiao Town, Fengxian District, Shanghai Patentee after: Shanghai wuchuang Dazhi High Tech Group Co.,Ltd. Address before: Room 74, Zone D, floor 2, building 16, No. 588, Lane 7548, waiqingsong highway, Qingpu District, Shanghai 201700 Patentee before: Aozhun enterprise development (Shanghai) Co.,Ltd. |
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Effective date of registration: 20240422 Address after: 200120 GW002 workstation on the first floor, No. 288 Hongfeng Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Wuchang Industrial Automation Technology (Shanghai) Co.,Ltd. Country or region after: China Address before: Room 74, Zone D, floor 2, building 16, No. 588, Lane 7548, waiqingsong highway, Qingpu District, Shanghai 201700 Patentee before: Aozhun enterprise development (Shanghai) Co.,Ltd. Country or region before: China |
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