CN114586166A - 显示基板及其制作方法、显示装置 - Google Patents
显示基板及其制作方法、显示装置 Download PDFInfo
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- CN114586166A CN114586166A CN202080002164.1A CN202080002164A CN114586166A CN 114586166 A CN114586166 A CN 114586166A CN 202080002164 A CN202080002164 A CN 202080002164A CN 114586166 A CN114586166 A CN 114586166A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本公开提供一种显示基板及其制作方法、显示装置。所述显示基板中，封装胶区包括：位于显示区域的第一侧的拐角封装胶区、进线封装胶区和第一封装胶区，拐角封装胶区设置有封装基底层；非显示区域设置有第二电源线、栅极驱动电路和用于为栅极驱动电路提供信号的多条第一信号线；第二电源线包括电源拐角部分和第一电源部分，第一电源部分与第一封装胶区交叠，第一电源部分沿第一方向延伸；各第一信号线的目标部分至少位于拐角封装胶区，该目标部分沿第二方向延伸；第一方向与第二方向相交；目标部分在显示基板的基底上的正投影，位于封装基底层在基底上的正投影，与第一电源部分在基底上的正投影之间。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/118883 WO2022067522A1 (zh) | 2020-09-29 | 2020-09-29 | 显示基板及其制作方法、显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114586166A true CN114586166A (zh) | 2022-06-03 |
Family
ID=80949308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080002164.1A Pending CN114586166A (zh) | 2020-09-29 | 2020-09-29 | 显示基板及其制作方法、显示装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11974451B2 (zh) |
| CN (1) | CN114586166A (zh) |
| DE (1) | DE112020007186T5 (zh) |
| WO (1) | WO2022067522A1 (zh) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7538488B2 (en) * | 2004-02-14 | 2009-05-26 | Samsung Mobile Display Co., Ltd. | Flat panel display |
| CN201893383U (zh) * | 2010-09-16 | 2011-07-06 | 昆山维信诺显示技术有限公司 | 一种有机电致发光器件、发光模组及移动通信设备 |
| CN105374849B (zh) * | 2015-10-13 | 2018-09-07 | 上海和辉光电有限公司 | 一种amoled面板及其制备方法 |
| US10559644B2 (en) * | 2016-05-17 | 2020-02-11 | Samsung Display Co., Ltd. | Display device |
| KR102601207B1 (ko) * | 2016-07-29 | 2023-11-13 | 삼성디스플레이 주식회사 | 표시장치 |
| CN106876609B (zh) * | 2017-04-20 | 2018-06-01 | 京东方科技集团股份有限公司 | 一种显示面板的制作方法、显示面板及显示装置 |
| CN111627332B (zh) * | 2020-05-20 | 2022-03-08 | 武汉华星光电半导体显示技术有限公司 | 显示基板、显示面板及显示面板制作方法 |
-
2020
- 2020-09-29 WO PCT/CN2020/118883 patent/WO2022067522A1/zh active Application Filing
- 2020-09-29 US US17/432,371 patent/US11974451B2/en active Active
- 2020-09-29 DE DE112020007186.3T patent/DE112020007186T5/de active Pending
- 2020-09-29 CN CN202080002164.1A patent/CN114586166A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022067522A1 (zh) | 2022-04-07 |
| DE112020007186T5 (de) | 2023-04-13 |
| US11974451B2 (en) | 2024-04-30 |
| US20220344616A1 (en) | 2022-10-27 |
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