CN114585912A - 校正用面板、面板检查用校正装置以及面板检查装置的校正方法 - Google Patents

校正用面板、面板检查用校正装置以及面板检查装置的校正方法 Download PDF

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Publication number
CN114585912A
CN114585912A CN202080073573.0A CN202080073573A CN114585912A CN 114585912 A CN114585912 A CN 114585912A CN 202080073573 A CN202080073573 A CN 202080073573A CN 114585912 A CN114585912 A CN 114585912A
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China
Prior art keywords
panel
inspection
correction
calibration
present
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Pending
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CN202080073573.0A
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English (en)
Chinese (zh)
Inventor
闵庚勋
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Kemei Technology Co ltd
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Kemei Technology Co ltd
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Publication of CN114585912A publication Critical patent/CN114585912A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
CN202080073573.0A 2019-08-20 2020-06-11 校正用面板、面板检查用校正装置以及面板检查装置的校正方法 Pending CN114585912A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020190101494A KR102220194B1 (ko) 2019-08-20 2019-08-20 보정용 패널, 패널검사용 보정장치 및 패널 검사장치의 보정방법
KR10-2019-0101494 2019-08-20
PCT/KR2020/007575 WO2021033895A1 (ko) 2019-08-20 2020-06-11 보정용 패널, 패널검사용 보정장치 및 패널 검사장치의 보정방법

Publications (1)

Publication Number Publication Date
CN114585912A true CN114585912A (zh) 2022-06-03

Family

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CN202080073573.0A Pending CN114585912A (zh) 2019-08-20 2020-06-11 校正用面板、面板检查用校正装置以及面板检查装置的校正方法

Country Status (3)

Country Link
KR (1) KR102220194B1 (ko)
CN (1) CN114585912A (ko)
WO (1) WO2021033895A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113409290B (zh) * 2021-06-29 2023-12-15 北京兆维电子(集团)有限责任公司 一种液晶屏外观缺陷检测方法、装置及存储介质
KR102457978B1 (ko) * 2022-03-17 2022-10-26 지텍 주식회사 Oled 광학보상장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
KR20060132081A (ko) 2005-06-17 2006-12-21 삼성전자주식회사 웨이퍼 결함 검출 장치
KR20070002249A (ko) 2005-06-30 2007-01-05 삼성전자주식회사 웨이퍼 결함 검출 방법
JP4899560B2 (ja) * 2005-08-11 2012-03-21 富士通セミコンダクター株式会社 欠陥検査装置及びその感度校正方法、欠陥検出感度校正用基板及びその製造方法
KR100952522B1 (ko) 2007-12-20 2010-04-12 주식회사 동부하이텍 웨이퍼 결함 검출 장치 및 이의 방법
KR100984271B1 (ko) * 2008-12-24 2010-10-04 김주환 마스크 검사장치의 캘리브레이션 방법
KR101124567B1 (ko) 2010-02-25 2012-03-20 에이티아이 주식회사 하이브리드 조명부를 포함하는 웨이퍼 검사 장치
JP6546509B2 (ja) * 2015-10-28 2019-07-17 株式会社ニューフレアテクノロジー パターン検査方法及びパターン検査装置
JP6490771B1 (ja) * 2017-09-27 2019-03-27 株式会社アルバック 位置検出装置、位置検出方法、および、蒸着装置

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KR102220194B1 (ko) 2021-02-25
WO2021033895A1 (ko) 2021-02-25

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