CN114585517B - 用于将基底引入辊隙的方法和设备 - Google Patents

用于将基底引入辊隙的方法和设备 Download PDF

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Publication number
CN114585517B
CN114585517B CN202080070929.5A CN202080070929A CN114585517B CN 114585517 B CN114585517 B CN 114585517B CN 202080070929 A CN202080070929 A CN 202080070929A CN 114585517 B CN114585517 B CN 114585517B
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CN
China
Prior art keywords
substrate
nip
web
transport conveyor
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080070929.5A
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English (en)
Chinese (zh)
Other versions
CN114585517A (zh
Inventor
本锡安·兰达
约瑟夫·沙查克
吉沙克·桑德斯
奥菲尔·内格尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumeite Technology Co ltd
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Lumeite Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lumeite Technology Co ltd filed Critical Lumeite Technology Co ltd
Publication of CN114585517A publication Critical patent/CN114585517A/zh
Application granted granted Critical
Publication of CN114585517B publication Critical patent/CN114585517B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J13/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, specially adapted for supporting or handling copy material in short lengths, e.g. sheets
    • B41J13/10—Sheet holders, retainers, movable guides, or stationary guides
    • B41J13/103—Sheet holders, retainers, movable guides, or stationary guides for the sheet feeding section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Advancing Webs (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photovoltaic Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202080070929.5A 2019-10-22 2020-10-22 用于将基底引入辊隙的方法和设备 Active CN114585517B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1915299.0A GB2591723B (en) 2019-10-22 2019-10-22 Method and apparatus for introducing a substrate into a nip
GB1915299.0 2019-10-22
PCT/IB2020/059931 WO2021079309A1 (en) 2019-10-22 2020-10-22 Method and apparatus for introducing a substrate into a nip

Publications (2)

Publication Number Publication Date
CN114585517A CN114585517A (zh) 2022-06-03
CN114585517B true CN114585517B (zh) 2024-02-02

Family

ID=68728383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080070929.5A Active CN114585517B (zh) 2019-10-22 2020-10-22 用于将基底引入辊隙的方法和设备

Country Status (9)

Country Link
US (2) US20220384228A1 (https=)
EP (1) EP4049308A1 (https=)
JP (1) JP7623715B2 (https=)
CN (1) CN114585517B (https=)
AU (1) AU2020369230C1 (https=)
CA (1) CA3158377A1 (https=)
GB (1) GB2591723B (https=)
IL (1) IL291857B2 (https=)
WO (1) WO2021079309A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2605622B (en) 2021-04-07 2023-12-20 Landa Labs 2012 Ltd System for introducing a substrate into a nip
GB2632019B (en) 2023-07-21 2025-09-17 Lumet Tech Ltd Transfer of a pattern to a substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029985A1 (en) * 1996-02-16 1997-08-21 Minnesota Mining And Manufacturing Company Improved apparatus and method for applying coating materials to individual sheet members
CN1367131A (zh) * 2001-01-26 2002-09-04 英诺派克有限公司 传输纸令的方法和装置
CN206537886U (zh) * 2017-03-04 2017-10-03 天津九州大地饲料有限公司 一种饲料包装袋的缝包用下料输送装置
CN107984909A (zh) * 2017-11-26 2018-05-04 武汉朋谊科技有限公司 一种基于物联网的智能打印机及其打印控制方法
AU2019200607A1 (en) * 2016-07-28 2019-02-21 Lumet Technologies Ltd. Apparatus for application of a conductive pattern to a substrate

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Publication number Priority date Publication date Assignee Title
US3984244A (en) * 1974-11-27 1976-10-05 E. I. Du Pont De Nemours And Company Process for laminating a channeled photosensitive layer on an irregular surface
JPS57156915A (en) * 1981-03-23 1982-09-28 Hitachi Ltd Device for positioning conveyed article
JPS6056617U (ja) * 1983-09-24 1985-04-20 ナショナル住宅産業株式会社 搬送装置
JPS60248541A (ja) * 1984-05-24 1985-12-09 Ckd Corp シ−ト状部材の搬送方法およびその装置
JPH01145915A (ja) * 1987-12-01 1989-06-07 Fujitsu Ltd Ｉｃ基板搬送装置
JPH029553U (https=) * 1988-06-23 1990-01-22
US5713674A (en) * 1994-10-06 1998-02-03 Pfu Limited Paper feed method and apparatus for a printer
GB2353532B (en) * 1998-03-23 2001-08-01 Api Foils Ltd Hot dieless foiling
JP2004210440A (ja) 2002-12-27 2004-07-29 Ishikawajima Harima Heavy Ind Co Ltd 板状体の搬送装置
US20110209749A1 (en) * 2010-01-07 2011-09-01 Korea Advanced Institute Of Science And Technology Pattern transfer method and apparatus, flexible display panel, flexible solar cell, electronic book, thin film transistor, electromagnetic-shielding sheet, and flexible printed circuit board applying thereof
US9170532B2 (en) * 2010-09-03 2015-10-27 Xerox Corporation Iterative learning control for motion error reduction
CN103891423B (zh) * 2011-08-29 2017-06-09 有限会社横田技术 搬运装置
JP5931389B2 (ja) * 2011-09-29 2016-06-08 川崎重工業株式会社 搬送システム
WO2013132420A1 (en) * 2012-03-05 2013-09-12 Landa Corporation Limited Printing system
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
DE102017011662A1 (de) * 2017-12-15 2019-06-19 Siempelkamp Maschinen- Und Anlagenbau Gmbh Transportanordnung für Holzfaserplatten und Verfahren zum Transportieren von Holzfaserplatten
MX2021001139A (es) * 2018-08-01 2021-04-12 System Ceramics S P A Dispositivo y metodo para decoracion de la masa de productos ceramicos.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029985A1 (en) * 1996-02-16 1997-08-21 Minnesota Mining And Manufacturing Company Improved apparatus and method for applying coating materials to individual sheet members
CN1367131A (zh) * 2001-01-26 2002-09-04 英诺派克有限公司 传输纸令的方法和装置
AU2019200607A1 (en) * 2016-07-28 2019-02-21 Lumet Technologies Ltd. Apparatus for application of a conductive pattern to a substrate
CN206537886U (zh) * 2017-03-04 2017-10-03 天津九州大地饲料有限公司 一种饲料包装袋的缝包用下料输送装置
CN107984909A (zh) * 2017-11-26 2018-05-04 武汉朋谊科技有限公司 一种基于物联网的智能打印机及其打印控制方法

Also Published As

Publication number Publication date
GB2591723A (en) 2021-08-11
CN114585517A (zh) 2022-06-03
AU2020369230B2 (en) 2025-07-24
JP2022554123A (ja) 2022-12-28
GB2591723B (en) 2022-09-14
WO2021079309A1 (en) 2021-04-29
AU2020369230C1 (en) 2026-01-08
US20220384228A1 (en) 2022-12-01
IL291857B1 (en) 2025-02-01
AU2020369230A1 (en) 2022-04-21
GB201915299D0 (en) 2019-12-04
IL291857A (en) 2022-06-01
JP7623715B2 (ja) 2025-01-29
IL291857B2 (en) 2025-06-01
US20250336701A1 (en) 2025-10-30
WO2021079309A9 (en) 2022-04-28
EP4049308A1 (en) 2022-08-31
CA3158377A1 (en) 2021-04-29

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