CA3158377A1 - Method and apparatus for introducing a substrate into a nip - Google Patents

Method and apparatus for introducing a substrate into a nip

Info

Publication number
CA3158377A1
CA3158377A1 CA3158377A CA3158377A CA3158377A1 CA 3158377 A1 CA3158377 A1 CA 3158377A1 CA 3158377 A CA3158377 A CA 3158377A CA 3158377 A CA3158377 A CA 3158377A CA 3158377 A1 CA3158377 A1 CA 3158377A1
Authority
CA
Canada
Prior art keywords
substrate
nip
web
transport conveyor
conveyor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3158377A
Other languages
English (en)
French (fr)
Inventor
Benzion Landa
Yosef SHACHAK
Jitschak SANDERS
Ofir NEGER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumet Technologies Ltd
Original Assignee
Lumet Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumet Technologies Ltd filed Critical Lumet Technologies Ltd
Publication of CA3158377A1 publication Critical patent/CA3158377A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J13/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, specially adapted for supporting or handling copy material in short lengths, e.g. sheets
    • B41J13/10—Sheet holders, retainers, movable guides, or stationary guides
    • B41J13/103—Sheet holders, retainers, movable guides, or stationary guides for the sheet feeding section
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Advancing Webs (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photovoltaic Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CA3158377A 2019-10-22 2020-10-22 Method and apparatus for introducing a substrate into a nip Pending CA3158377A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1915299.0A GB2591723B (en) 2019-10-22 2019-10-22 Method and apparatus for introducing a substrate into a nip
GB1915299.0 2019-10-22
PCT/IB2020/059931 WO2021079309A1 (en) 2019-10-22 2020-10-22 Method and apparatus for introducing a substrate into a nip

Publications (1)

Publication Number Publication Date
CA3158377A1 true CA3158377A1 (en) 2021-04-29

Family

ID=68728383

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3158377A Pending CA3158377A1 (en) 2019-10-22 2020-10-22 Method and apparatus for introducing a substrate into a nip

Country Status (9)

Country Link
US (2) US20220384228A1 (https=)
EP (1) EP4049308A1 (https=)
JP (1) JP7623715B2 (https=)
CN (1) CN114585517B (https=)
AU (1) AU2020369230C1 (https=)
CA (1) CA3158377A1 (https=)
GB (1) GB2591723B (https=)
IL (1) IL291857B2 (https=)
WO (1) WO2021079309A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2605622B (en) 2021-04-07 2023-12-20 Landa Labs 2012 Ltd System for introducing a substrate into a nip
GB2632019B (en) 2023-07-21 2025-09-17 Lumet Tech Ltd Transfer of a pattern to a substrate

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984244A (en) * 1974-11-27 1976-10-05 E. I. Du Pont De Nemours And Company Process for laminating a channeled photosensitive layer on an irregular surface
JPS57156915A (en) * 1981-03-23 1982-09-28 Hitachi Ltd Device for positioning conveyed article
JPS6056617U (ja) * 1983-09-24 1985-04-20 ナショナル住宅産業株式会社 搬送装置
JPS60248541A (ja) * 1984-05-24 1985-12-09 Ckd Corp シ−ト状部材の搬送方法およびその装置
JPH01145915A (ja) * 1987-12-01 1989-06-07 Fujitsu Ltd Ｉｃ基板搬送装置
JPH029553U (https=) * 1988-06-23 1990-01-22
US5713674A (en) * 1994-10-06 1998-02-03 Pfu Limited Paper feed method and apparatus for a printer
EP0881982A1 (en) * 1996-02-16 1998-12-09 Minnesota Mining And Manufacturing Company Improved apparatus and method for applying coating materials to individual sheet members
GB2353532B (en) * 1998-03-23 2001-08-01 Api Foils Ltd Hot dieless foiling
ITTO20010074A1 (it) * 2001-01-26 2002-07-26 Innopack S R L Metodo e dispositivo per il convogliamento di risme di carta.
JP2004210440A (ja) 2002-12-27 2004-07-29 Ishikawajima Harima Heavy Ind Co Ltd 板状体の搬送装置
US20110209749A1 (en) * 2010-01-07 2011-09-01 Korea Advanced Institute Of Science And Technology Pattern transfer method and apparatus, flexible display panel, flexible solar cell, electronic book, thin film transistor, electromagnetic-shielding sheet, and flexible printed circuit board applying thereof
US9170532B2 (en) * 2010-09-03 2015-10-27 Xerox Corporation Iterative learning control for motion error reduction
CN103891423B (zh) * 2011-08-29 2017-06-09 有限会社横田技术 搬运装置
JP5931389B2 (ja) * 2011-09-29 2016-06-08 川崎重工業株式会社 搬送システム
WO2013132420A1 (en) * 2012-03-05 2013-09-12 Landa Corporation Limited Printing system
AU2019200607B2 (en) * 2016-07-28 2019-10-10 Lumet Technologies Ltd. Apparatus for application of a conductive pattern to a substrate
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
CN206537886U (zh) * 2017-03-04 2017-10-03 天津九州大地饲料有限公司 一种饲料包装袋的缝包用下料输送装置
CN107984909B (zh) * 2017-11-26 2019-05-03 永吉纸品有限公司 一种基于物联网的智能打印机及其打印控制方法
DE102017011662A1 (de) * 2017-12-15 2019-06-19 Siempelkamp Maschinen- Und Anlagenbau Gmbh Transportanordnung für Holzfaserplatten und Verfahren zum Transportieren von Holzfaserplatten
MX2021001139A (es) * 2018-08-01 2021-04-12 System Ceramics S P A Dispositivo y metodo para decoracion de la masa de productos ceramicos.

Also Published As

Publication number Publication date
CN114585517B (zh) 2024-02-02
GB2591723A (en) 2021-08-11
CN114585517A (zh) 2022-06-03
AU2020369230B2 (en) 2025-07-24
JP2022554123A (ja) 2022-12-28
GB2591723B (en) 2022-09-14
WO2021079309A1 (en) 2021-04-29
AU2020369230C1 (en) 2026-01-08
US20220384228A1 (en) 2022-12-01
IL291857B1 (en) 2025-02-01
AU2020369230A1 (en) 2022-04-21
GB201915299D0 (en) 2019-12-04
IL291857A (en) 2022-06-01
JP7623715B2 (ja) 2025-01-29
IL291857B2 (en) 2025-06-01
US20250336701A1 (en) 2025-10-30
WO2021079309A9 (en) 2022-04-28
EP4049308A1 (en) 2022-08-31

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US11546999B2 (en) Apparatus for applying of a conductive pattern to a substrate
US20250336701A1 (en) Method and apparatus for introducing a substrate into a nip
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KR100884916B1 (ko) 가열 장치 및 가열 방법
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