IL291857B2 - Method and apparatus for introducing a substrate into a nip - Google Patents
Method and apparatus for introducing a substrate into a nipInfo
- Publication number
- IL291857B2 IL291857B2 IL291857A IL29185722A IL291857B2 IL 291857 B2 IL291857 B2 IL 291857B2 IL 291857 A IL291857 A IL 291857A IL 29185722 A IL29185722 A IL 29185722A IL 291857 B2 IL291857 B2 IL 291857B2
- Authority
- IL
- Israel
- Prior art keywords
- substrate
- nip
- web
- transport conveyor
- conveyor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J13/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, specially adapted for supporting or handling copy material in short lengths, e.g. sheets
- B41J13/10—Sheet holders, retainers, movable guides, or stationary guides
- B41J13/103—Sheet holders, retainers, movable guides, or stationary guides for the sheet feeding section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3208—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Advancing Webs (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photovoltaic Devices (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1915299.0A GB2591723B (en) | 2019-10-22 | 2019-10-22 | Method and apparatus for introducing a substrate into a nip |
| PCT/IB2020/059931 WO2021079309A1 (en) | 2019-10-22 | 2020-10-22 | Method and apparatus for introducing a substrate into a nip |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| IL291857A IL291857A (en) | 2022-06-01 |
| IL291857B1 IL291857B1 (en) | 2025-02-01 |
| IL291857B2 true IL291857B2 (en) | 2025-06-01 |
Family
ID=68728383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL291857A IL291857B2 (en) | 2019-10-22 | 2020-10-22 | Method and apparatus for introducing a substrate into a nip |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US20220384228A1 (https=) |
| EP (1) | EP4049308A1 (https=) |
| JP (1) | JP7623715B2 (https=) |
| CN (1) | CN114585517B (https=) |
| AU (1) | AU2020369230C1 (https=) |
| CA (1) | CA3158377A1 (https=) |
| GB (1) | GB2591723B (https=) |
| IL (1) | IL291857B2 (https=) |
| WO (1) | WO2021079309A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2605622B (en) | 2021-04-07 | 2023-12-20 | Landa Labs 2012 Ltd | System for introducing a substrate into a nip |
| GB2632019B (en) | 2023-07-21 | 2025-09-17 | Lumet Tech Ltd | Transfer of a pattern to a substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2019200607A1 (en) * | 2016-07-28 | 2019-02-21 | Lumet Technologies Ltd. | Apparatus for application of a conductive pattern to a substrate |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3984244A (en) * | 1974-11-27 | 1976-10-05 | E. I. Du Pont De Nemours And Company | Process for laminating a channeled photosensitive layer on an irregular surface |
| JPS57156915A (en) * | 1981-03-23 | 1982-09-28 | Hitachi Ltd | Device for positioning conveyed article |
| JPS6056617U (ja) * | 1983-09-24 | 1985-04-20 | ナショナル住宅産業株式会社 | 搬送装置 |
| JPS60248541A (ja) * | 1984-05-24 | 1985-12-09 | Ckd Corp | シ−ト状部材の搬送方法およびその装置 |
| JPH01145915A (ja) * | 1987-12-01 | 1989-06-07 | Fujitsu Ltd | Ｉｃ基板搬送装置 |
| JPH029553U (https=) * | 1988-06-23 | 1990-01-22 | ||
| US5713674A (en) * | 1994-10-06 | 1998-02-03 | Pfu Limited | Paper feed method and apparatus for a printer |
| EP0881982A1 (en) * | 1996-02-16 | 1998-12-09 | Minnesota Mining And Manufacturing Company | Improved apparatus and method for applying coating materials to individual sheet members |
| GB2353532B (en) * | 1998-03-23 | 2001-08-01 | Api Foils Ltd | Hot dieless foiling |
| ITTO20010074A1 (it) * | 2001-01-26 | 2002-07-26 | Innopack S R L | Metodo e dispositivo per il convogliamento di risme di carta. |
| JP2004210440A (ja) | 2002-12-27 | 2004-07-29 | Ishikawajima Harima Heavy Ind Co Ltd | 板状体の搬送装置 |
| US20110209749A1 (en) * | 2010-01-07 | 2011-09-01 | Korea Advanced Institute Of Science And Technology | Pattern transfer method and apparatus, flexible display panel, flexible solar cell, electronic book, thin film transistor, electromagnetic-shielding sheet, and flexible printed circuit board applying thereof |
| US9170532B2 (en) * | 2010-09-03 | 2015-10-27 | Xerox Corporation | Iterative learning control for motion error reduction |
| CN103891423B (zh) * | 2011-08-29 | 2017-06-09 | 有限会社横田技术 | 搬运装置 |
| JP5931389B2 (ja) * | 2011-09-29 | 2016-06-08 | 川崎重工業株式会社 | 搬送システム |
| WO2013132420A1 (en) * | 2012-03-05 | 2013-09-12 | Landa Corporation Limited | Printing system |
| GB201613051D0 (en) | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
| CN206537886U (zh) * | 2017-03-04 | 2017-10-03 | 天津九州大地饲料有限公司 | 一种饲料包装袋的缝包用下料输送装置 |
| CN107984909B (zh) * | 2017-11-26 | 2019-05-03 | 永吉纸品有限公司 | 一种基于物联网的智能打印机及其打印控制方法 |
| DE102017011662A1 (de) * | 2017-12-15 | 2019-06-19 | Siempelkamp Maschinen- Und Anlagenbau Gmbh | Transportanordnung für Holzfaserplatten und Verfahren zum Transportieren von Holzfaserplatten |
| MX2021001139A (es) * | 2018-08-01 | 2021-04-12 | System Ceramics S P A | Dispositivo y metodo para decoracion de la masa de productos ceramicos. |
-
2019
- 2019-10-22 GB GB1915299.0A patent/GB2591723B/en active Active
-
2020
- 2020-10-22 JP JP2022523648A patent/JP7623715B2/ja active Active
- 2020-10-22 CA CA3158377A patent/CA3158377A1/en active Pending
- 2020-10-22 US US17/766,721 patent/US20220384228A1/en not_active Abandoned
- 2020-10-22 EP EP20811715.0A patent/EP4049308A1/en active Pending
- 2020-10-22 AU AU2020369230A patent/AU2020369230C1/en active Active
- 2020-10-22 IL IL291857A patent/IL291857B2/en unknown
- 2020-10-22 WO PCT/IB2020/059931 patent/WO2021079309A1/en not_active Ceased
- 2020-10-22 CN CN202080070929.5A patent/CN114585517B/zh active Active
-
2025
- 2025-07-07 US US19/260,882 patent/US20250336701A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2019200607A1 (en) * | 2016-07-28 | 2019-02-21 | Lumet Technologies Ltd. | Apparatus for application of a conductive pattern to a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114585517B (zh) | 2024-02-02 |
| GB2591723A (en) | 2021-08-11 |
| CN114585517A (zh) | 2022-06-03 |
| AU2020369230B2 (en) | 2025-07-24 |
| JP2022554123A (ja) | 2022-12-28 |
| GB2591723B (en) | 2022-09-14 |
| WO2021079309A1 (en) | 2021-04-29 |
| AU2020369230C1 (en) | 2026-01-08 |
| US20220384228A1 (en) | 2022-12-01 |
| IL291857B1 (en) | 2025-02-01 |
| AU2020369230A1 (en) | 2022-04-21 |
| GB201915299D0 (en) | 2019-12-04 |
| IL291857A (en) | 2022-06-01 |
| JP7623715B2 (ja) | 2025-01-29 |
| US20250336701A1 (en) | 2025-10-30 |
| WO2021079309A9 (en) | 2022-04-28 |
| EP4049308A1 (en) | 2022-08-31 |
| CA3158377A1 (en) | 2021-04-29 |
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