CN114576837A - High-integration intelligent power module, electric control assembly and air conditioner - Google Patents

High-integration intelligent power module, electric control assembly and air conditioner Download PDF

Info

Publication number
CN114576837A
CN114576837A CN202011392857.4A CN202011392857A CN114576837A CN 114576837 A CN114576837 A CN 114576837A CN 202011392857 A CN202011392857 A CN 202011392857A CN 114576837 A CN114576837 A CN 114576837A
Authority
CN
China
Prior art keywords
pin
compressor
fan
power module
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011392857.4A
Other languages
Chinese (zh)
Inventor
苏宇泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GD Midea Air Conditioning Equipment Co Ltd
Chongqing Midea Refrigeration Equipment Co Ltd
Original Assignee
GD Midea Air Conditioning Equipment Co Ltd
Chongqing Midea Refrigeration Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GD Midea Air Conditioning Equipment Co Ltd, Chongqing Midea Refrigeration Equipment Co Ltd filed Critical GD Midea Air Conditioning Equipment Co Ltd
Priority to CN202011392857.4A priority Critical patent/CN114576837A/en
Publication of CN114576837A publication Critical patent/CN114576837A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/89—Arrangement or mounting of control or safety devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)

Abstract

The invention discloses a high-integration intelligent power module, an electric control assembly and an air conditioner, wherein the high-integration intelligent power module comprises: a mounting substrate; the compressor IPM module and the fan IPM module are respectively arranged at corresponding installation positions, and a compressor low-voltage reference pin, a compressor current detection pin, a fan low-voltage reference pin, a fan current detection pin and a single-point grounding pin; the compressor low-voltage reference pin is connected with the output end of the compressor IPM module and is also used for being connected with a single-point grounding pin through an external compressor current detection resistor; the compressor current detection pin is electrically connected with the compressor low-voltage reference pin; the fan low-voltage reference pin is connected with the output end of the fan IPM module and is also used for being connected with the single-point grounding pin through an external fan current detection resistor; the fan current detection pin is electrically connected with the fan low-voltage reference pin. The invention is beneficial to improving the reliability of the high-integration intelligent power module.

Description

High-integration intelligent power module, electric control assembly and air conditioner
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a high-integration intelligent power module, an electric control assembly and an air conditioner.
Background
In a highly integrated smart power module, only one ground pin of the driver chip is usually provided and is usually located on the low voltage side, and the ground terminal of the power switch tube is usually located on the high voltage side. On the other hand, since the emitters of the switching tubes of the power module, such as IGBTs, are arranged on the high-voltage side, the low-voltage side and the high-voltage side are far apart from each other when single-point grounding is realized. In addition, in the highly integrated intelligent power module provided with the current detection pin, the current detection pin is arranged on the low-voltage side, and an external lead is required to be connected with an emitter of the IGBT, so that wiring is too long, parasitic inductance is increased, and even false triggering occurs.
Disclosure of Invention
The invention mainly aims to provide a high-integration intelligent power module, an electric control assembly and an air conditioner, and aims to improve the reliability of the high-integration intelligent power module.
To achieve the above object, the present invention provides a highly integrated smart power module, which includes:
the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;
a compressor IPM module and a fan IPM module respectively installed at the corresponding installation positions, and,
the compressor low-voltage reference pin, the compressor current detection pin, the fan low-voltage reference pin, the fan current detection pin and the single-point grounding pin are arranged on the strong current pin mounting side; wherein the content of the first and second substances,
the compressor low-voltage reference pin is connected with the output end of the compressor IPM module, and is also used for being connected with the single-point grounding pin through an external compressor current detection resistor; the compressor current detection pin is electrically connected with the compressor low-voltage reference pin;
the fan low-voltage reference pin is connected with the output end of the fan IPM module and is also used for being connected with the single-point grounding pin through an external fan current detection resistor; the fan current detection pin is electrically connected with the fan low-voltage reference pin.
Optionally, the compressor low-voltage reference pin, the compressor current detection pin, the single-point ground pin, and the fan low-voltage reference pin and the fan current detection pin are disposed adjacent to each other on the strong current pin mounting side.
Optionally, the compressor IPM module includes:
the compressor inversion power module and the compressor driving chip are arranged on the corresponding mounting positions and are electrically connected with the compressor driving chip;
the fan IPM module comprises:
and the fan inversion power module and the wind driving chip are arranged on the corresponding mounting positions, and the compressor inversion power module is electrically connected with the fan driving chip.
Optionally, a first low-voltage power supply positive terminal pin, a second low-voltage power supply positive terminal pin, a first low-voltage power supply negative terminal pin and a second low-voltage power supply negative terminal pin are arranged on the weak current pin mounting side;
the power supply end of the compressor driving chip is electrically connected with the first low-voltage power supply positive end pin;
the power supply end of the fan driving chip is electrically connected with the second low-voltage power supply positive end pin;
the grounding end of the compressor driving chip is electrically connected with the first low-voltage power supply negative terminal pin;
and the grounding end of the fan driving chip is electrically connected with the pin of the second low-voltage power supply negative end.
Optionally, the single-point ground pin is connected to the ground terminals of the compressor driver chip and the fan driver chip, respectively.
Optionally, the high-integration smart power module further comprises:
the PFC inductor is connected with the negative end and is connected with the negative end of the PFC power supply;
the PFC inductor is connected with the positive end and is interconnected with the positive end of the PFC power supply and one end of the external inductor;
the PFC inductor connecting end is connected with the other end of the external inductor;
the bus capacitor connecting end is connected with an external bus capacitor;
the PFC power module comprises a PFC power switch tube and a PFC diode, the input end of the PFC power switch tube is interconnected with the PFC inductance connecting end and the anode of the PFC diode, and the output end of the PFC power switch tube is connected with the PFC inductance connecting negative end; and the cathode of the PFC diode is connected with the connecting end of the bus capacitor.
Optionally, the output end of the PFC power switch tube is electrically connected to the single-point ground pin;
and/or the output end of the PFC power switch tube is electrically connected with the grounding end of the compressor driving chip.
Optionally, the high-integration smart power module further comprises:
and the output end of the rectifier bridge is connected with the PFC inductor.
The invention also provides an electric control assembly, which comprises a low-voltage power supply, a high-voltage power supply, a compressor current detection resistor, a fan current detection resistor and the high-integration intelligent power module, wherein,
one end of the compressor current detection resistor is connected with a compressor low-voltage reference pin and a compressor current detection pin of the high-integration intelligent power module, and the other end of the compressor current detection resistor is connected with a single-point grounding pin of the high-integration intelligent power module;
the compressor low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the compressor current detection resistor;
one end of the fan current detection resistor is connected with a fan low-voltage reference pin and a fan current detection pin of the high-integration intelligent power module, and the other end of the fan current detection resistor is connected with a single-point grounding pin of the high-integration intelligent power module;
the fan low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the fan current detection resistor.
The invention also provides an air conditioner, which comprises the high-integration intelligent power module;
or alternatively, an electrically controlled assembly as described above.
According to the technical scheme, the compressor low-voltage reference pin, the fan low-voltage reference pin, the compressor current detection pin, the fan current detection pin and the single-point grounding pin are all arranged on the strong current pin mounting side, and the compressor current detection pin is electrically connected with the current feedback end of the compressor driving chip through wiring and binding wires on the internal circuit wiring layer of the high-integration intelligent power module. And two grounding ends are arranged on the compressor driving chip, and the electric connection between the single-point grounding pin on the strong current side and the weak current grounding pin on the weak current side is realized in the compressor driving chip. The invention can shorten the wiring when the strong electric ground and the weak electric ground realize single-point grounding, the grounding end of the inversion power module at the strong electric installation side does not need to be connected with the weak electric grounding pin at the weak electric installation side without finding a grounding point on the electric control board, and further does not need to consider the safety regulation requirement of the wiring, and can facilitate the peripheral electric control wiring of the high-integration intelligent power module, thereby reducing the wiring difficulty of the electric control board of the electrical equipment and being beneficial to improving the reliability of the high-integration intelligent power module. The invention solves the problem that the reliability of the high-integration intelligent power module is poor due to the fact that overcurrent protection of the high-integration intelligent power module is easy to trigger by mistake.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a functional block diagram of an embodiment of a highly integrated smart power module according to the present invention;
FIG. 2 is a schematic diagram of an internal circuit structure of an embodiment of the highly integrated smart power module according to the present invention;
FIG. 3 is a schematic diagram of a circuit structure of an embodiment of the highly integrated intelligent power module of the present invention applied to an electronic control assembly;
fig. 4 is a schematic structural diagram of an electrical control assembly according to another embodiment of the present invention.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
10 Compressor IPM module UVW- Low-voltage reference pin of compressor
20 Fan IPM module ITRIP Current detection pin of compressor
30 PFC power module FUVW- Low-voltage reference pin of fan
40 Rectifier bridge FITRIP Fan current detection pin
C1～C6 Filter capacitor of compressor VSS3 Single-point grounding pin
CF1～CF3 Fan filter capacitor
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a high-integration intelligent power module.
Referring to fig. 1 to 4, in an embodiment of the present invention, the highly integrated smart power module includes:
the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;
a compressor IPM module and a fan IPM module respectively mounted on the corresponding mounting positions, and,
the compressor low-voltage reference pin, the compressor current detection pin, the fan low-voltage reference pin, the fan current detection pin and the single-point grounding pin are arranged on the strong current pin mounting side; wherein the content of the first and second substances,
the compressor low-voltage reference pin is connected with the output end of the compressor IPM module, and is also used for being connected with the single-point grounding pin through an external compressor current detection resistor; the compressor current detection pin is electrically connected with the compressor low-voltage reference pin;
the fan low-voltage reference pin is connected with the output end of the fan IPM module and is also used for being connected with the single-point grounding pin through an external fan current detection resistor; the fan current detection pin is electrically connected with the fan low-voltage reference pin.
In this embodiment, the mounting substrate may be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate. The mounting substrate is a mounting carrier for the power switching tube and the driving device, and the shape of the mounting substrate can be determined according to the specific position, number and size of the power switching tube, and can be square, but is not limited to square. The circuit wiring layer is formed on the mounting substrate, and corresponding lines and mounting positions, namely bonding pads, for mounting electronic elements in the power switch tube are formed on the mounting substrate according to the circuit design of the high-integration intelligent power module.
When the mounting substrate is realized by using an aluminum nitride ceramic mounting substrate, the aluminum nitride ceramic mounting substrate includes an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When the mounting substrate made of a metal material is used, the mounting substrate includes a heat dissipation layer, an insulating layer laid on the heat dissipation layer, and a circuit wiring layer formed on the insulating layer. In this embodiment, the mounting substrate may be a single-sided wiring board. The insulating layer is sandwiched between the circuit wiring layer and the metal mounting substrate. The insulating layer is used for realizing electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate and reflecting external electromagnetic interference, so that the power switch tube is prevented from being interfered by external electromagnetic radiation to normally work, and the interference influence of the electromagnetic radiation in the surrounding environment on electronic elements in the high-integration intelligent power module is reduced. The insulating layer can be made of materials such as thermoplastic glue or thermosetting glue, so that the mounting substrate and the circuit wiring layer are fixedly connected and insulated. The insulating layer can be realized by a high-heat-conductivity insulating layer which is realized by mixing one or more materials of epoxy resin, aluminum oxide and high-heat-conductivity filling material. In the process of manufacturing the mounting substrate, after an insulating layer is provided on the mounting substrate, a copper foil may be laid on the insulating layer, and the copper foil may be etched according to a predetermined circuit design, thereby forming a circuit wiring layer.
The elements in the high-integration intelligent power module can be patch-type electronic elements and can also be bare die wafers. The circuit wiring layer is provided with a plurality of mounting areas according to the requirements of function setting, and a plurality of mounting positions are formed in each mounting area. Specifically, the circuit wiring layer includes circuit wirings forming a current loop, and pads formed from the circuit wirings, elements of the highly integrated smart power module are disposed on the corresponding pads, and the compressor IPM module 10 and the fan IPM module 20 may be electrically connected by the circuit wirings, metal binding wires, or the like. It is understood that when the electronic component is mounted on the mounting substrate 100, the entire wiring of the mounting substrate 100 may be copper-plated to meet the standard of disturbance voltage and the capability of interference resistance.
The compressor IPM module 10 is used for driving the compressor to work, and the fan IPM module 20 is used for driving the fan to work. Wherein, the compressor IPM module 10 includes:
the compressor inverter power module 11 and the compressor driving chip IC1 are mounted on the corresponding mounting positions, and the compressor inverter power module 11 is electrically connected with the compressor driving chip IC 1;
the fan IPM module 20 includes:
the fan inverter power module 21 and the fan driving chip IC2 are mounted on the corresponding mounting positions, and the fan inverter power module 21 is electrically connected with the fan driving chip IC 2.
In this embodiment, the compressor IPM module 10 is further provided with a compressor driving chip IC1, the number of the compressor driving chips IC1 may be one, for example, an HVIC driving chip, and the compressor driving chip IC1 is an integrated chip, in which four, six or seven driving circuits for driving the power switching tubes are integrated, and the integrated configuration may be specifically performed according to the number of the driven power switching tubes. The number of the compressor driving chips IC1 may also correspond to the number of the power switch tubes, that is, each compressor driving chip IC1 correspondingly drives one power switch tube to operate. When the intelligent power module works, the compressor driving chip IC1 outputs a corresponding control signal to control the conduction of the power switching tubes in the PFC power module 3030 and the compressor inverter power module 11, so as to output driving power to drive the motor and other loads to work.
The compressor inverter power module 11 is provided with a plurality of power switching tubes, and the power switching tubes may be gallium nitride (GaN) power switching tubes, Si-based power switching tubes, or SiC-based power switching tubes. In practical application, the number of the power switch tubes may be four, or a multiple of four, or six, or a multiple of six, and the six power switch tubes (T1-T6) form an inverter circuit to drive the compressor to work.
In the compressor driving chip IC1, a high-side driving unit and a low-side driving circuit, a high-side driving unit and a low-side driving unit are each included. The input end of the compressor driving chip IC1 is connected to a main controller, that is, an MCU, in which a logic controller, a memory, a data processor, etc. and a software program and/or module stored in the memory and operable on the data processor are integrated, the MCU outputs a corresponding control signal to the compressor driving chip IC1 by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so as to drive the power switch tube in the compressor inverter power module 11 to turn on/off according to the control signal of the main controller, thereby driving the compressor to operate.
The fan IPM module 20 is further provided with a fan driving chip IC2, the number of the fan driving chips IC2 may be one, for example, an HVIC driving chip, and the fan driving chip IC2 is an integrated chip, in which four, six or seven driving circuits for driving the power switching tubes are integrated, and may be specifically integrated according to the number of the driven power switching tubes. The number of the fan driving chips IC2 may also correspond to the number of the power switch tubes, that is, each fan driving chip IC2 correspondingly drives one power switch tube to operate. When the intelligent power module works, the fan driving chip IC2 outputs a corresponding control signal to control the conduction of the power switch tube in the fan inverter power module 21, so as to output driving electric energy to drive the motor and other loads to work.
The fan inverter power module 21 is provided with a plurality of power switching tubes, and the power switching tubes may be gallium nitride (GaN) power switching tubes, Si-based power switching tubes, or SiC-based power switching tubes. In practical application, the number of the power switch tubes can be four, or a multiple of four, or six, or a multiple of six, and the six power switch tubes (TF 1-TF 6) form an inverter circuit to drive the fan to work.
In the fan drive chip IC2, a high-side drive unit and a low-side drive circuit, a high-side drive unit and a low-side drive unit are included. The input end of the fan driving chip IC2 is connected to a main controller, that is, an MCU, in which a logic controller, a memory, a data processor, etc. and a software program and/or module stored in the memory and operable on the data processor are integrated, the MCU outputs a corresponding control signal to the fan driving chip IC2 by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so as to drive the power switching tube in the fan inverter power module 21 to be turned on/off according to the control signal of the main controller, thereby driving the fan to operate.
The main controller can be independent from the intelligent power module 100 to the outside, and in practical application, the main controller and the highly integrated intelligent power module are arranged on the electric control board and are electrically connected through circuit wiring or a lead. Of course, in other embodiments, the main controller may be highly integrated in the smart power module 100 to increase the integration of the smart power module.
Referring to fig. 2, in the present embodiment, the power switching tubes in the compressor inverter power module 11 are all IGBTs, and the driver chip 101 is an HVIC chip. A VCC end of the HVIC tube IC1 is used as a positive end VDD of a low-voltage power supply of the high-integration intelligent power module, and the VDD is generally 15V; the HIN1 end of the HVIC tube IC1 is used as the U-phase upper bridge arm input end HIN1 of the high-integration intelligent power module; the HIN2 end of the HVIC tube IC1 is used as a V-phase upper bridge arm input end HIN2 of the high-integration intelligent power module; the HIN3 end of the HVIC tube IC1 is used as the HIN3 of the W-phase upper bridge arm input end of the high-integration intelligent power module; the LIN1 end of the HVIC tube IC1 is used as the LIN1 of the U-phase lower bridge arm of the high-integration intelligent power module; the LIN2 end of the HVIC tube IC1 is used as the V-phase lower bridge arm input end VLIN of the high-integration intelligent power module; the LIN3 end of the HVIC tube IC1 is used as the LIN3 of the W-phase lower bridge arm of the high-integration intelligent power module; the U, V, W three-phase six-path input of the high-integration intelligent power module receives 0-5V input signals; a VSS end of the HVIC tube IC1 is used as negative terminals VSS1 and VSS3 of a low-voltage power supply of the high-integration intelligent power module, wherein a pin VSS1 is at a logic end and is adjacent to low-voltage pins such as VDD and the like, and a pin VSS3 is at a high-voltage side and is adjacent to pins UVW and ITRIP; an ITRIP end of the HVIC tube IC1 is used as an overcurrent protection detection end VSS3 of the high-integration intelligent power module; the VB1 end of the HVIC tube IC1 is used as a positive end UVB of a power supply source of a U-phase high-voltage area of the high-integration intelligent power module; the HO1 end of the HVIC tube IC1 is connected with the grid electrode of the U-phase upper bridge arm IGBT tube T1; the VS1 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T1, the anode of the FRD tube D1, the collector of the U-phase lower bridge arm IGBT tube T4 and the cathode of the FRD tube 1T4 and serves as the negative terminal UVS of the U-phase high-voltage area power supply of the high-integration intelligent power module; the VB2 end of the HVIC tube IC1 is used as a power supply positive end VVB of a U-phase high-voltage area power supply of the high-integration intelligent power module; the HO3 end of the HVIC tube IC1 is connected with the grid electrode of a V-phase upper bridge arm IGBT tube T3; the VS2 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T2, the anode of the FRD tube D2, the collector of the V-phase lower bridge arm IGBT tube T5 and the cathode of the FRD tube D5 and serves as the power supply negative end VVS of the W-phase high-voltage area of the high-integration intelligent power module; the VB3 end of the HVIC tube IC1 is used as a W-phase high-voltage area power supply positive end WVB of the high-integration intelligent power module; the HO3 end of the HVIC tube IC1 is connected with the grid electrode of the W-phase upper bridge arm IGBT tube T3; the VS3 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T3, the anode of the FRD tube D3, the collector of the W-phase lower bridge arm IGBT tube T6 and the cathode of the FRD tube T6 and serves as the negative end WVS of the W-phase high-voltage area power supply of the high-integration intelligent power module; the LO1 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube T4; the LO2 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube T5; the LO3 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube T6; the LO3 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube 126; the emitter of the IGBT tube T4 is connected with the anode of the FRD tube T4 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube T5 is connected with the anode of the FRD tube D5 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube T6 is connected with the anode of the FRD tube T6 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the collector of the IGBT tube T1, the cathode of the FRD tube D1, the collector of the IGBT tube T2, the cathode of the FRD tube D2, the collector of the IGBT tube T3 and the cathode of the FRD tube D3 are connected and used as a high-voltage input end P of the high-integration intelligent power module, and the P is generally connected with 300V. The HVIC tube IC1 has the following functions: and respectively transmitting 0-5V logic signals of input ends HIN1, HIN2, HIN3, LIN1, FLIN2 and FLIN3 to output ends FHO1, FHO2, FHO3, FLO1, FLO2 and FLO3, wherein FHO1, FHO2 and FHO3 are logic signals of VS-VS +15V, and FLO1, FLO2 and FLO3 are logic signals of 0-15V. Overcurrent protection is realized by detecting current output by UVW through ITRIP.
In the above embodiment, a path of RC filter circuit is further disposed between each input end of the compressor IPM module 10 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current limiting resistor and a pull-up resistor are further arranged between the temperature feedback pin TH of the compressor IPM module 10 and the MCU. A current limiting resistor and a pull-up resistor are also arranged between the fault feedback pin and the MCU. A filter capacitor is disposed between the power terminal of the compressor driver IC1 and the ground terminal to filter out electromagnetic interference between an external power source and the power terminal of the compressor driver IC 1.
In this embodiment, the power switching tubes in the fan inverter power module 21 are all IGBTs, and the fan driving chip IC2 is an FHVIC chip. A VCC end of a fan HVIC tube IC2 is used as a positive end FVDD of a low-voltage area power supply of the high-integration intelligent power module, and the FVDD is generally 15V; the HIN1 end of the HVIC tube IC2 is used as the U-phase upper bridge arm input end FYIN 1 of the high-integration intelligent power module; the HIN2 end of the fan HVIC tube IC2 is used as the V-phase upper bridge arm input end VFHIN of the high-integration intelligent power module; the HIN3 end of the fan HVIC tube IC2 is used as the HIN2 of the W-phase upper bridge arm input end of the high-integration intelligent power module; the LIN1 end of the blower HVIC tube IC2 is used as the U-phase lower bridge arm input end FLIN1 of the high-integration intelligent power module; the LIN2 end of the blower HVIC tube IC2 is used as the V-phase lower bridge arm input end FLIN2 of the high-integration intelligent power module; the LIN3 end of the blower HVIC tube IC2 is used as the W-phase lower bridge arm input end FLIN3 of the high-integration intelligent power module; the U, V, W three-phase six-path input of the high-integration intelligent power module receives 0-5V input signals; a GND end of the blower HVIC tube IC2 is used as a negative end VSS2 of a low-voltage power supply of the high-integration intelligent power module, wherein a pin VSS2 is at a logic end and is adjacent to low-voltage pins such as FVDD, a pin VSS3 is at a high-voltage side and is adjacent to pins UVW and ITRIP; an ITRIP end of the blower HVIC tube IC2 is used as an overcurrent protection detection end FITIP of the high-integration intelligent power module; the VB1 end of the HVIC tube IC1 is used as a positive end UVB of a power supply source of a U-phase high-voltage area of the high-integration intelligent power module; the HO1 end of the HVIC2 is connected with the grid electrode of a U-phase upper bridge arm IGBT tube FT 1; the VS1 end of the HVIC2 is connected with the emitter of the IGBT tube FT1, the anode of the FRD tube D1, the collector of the U-phase lower bridge arm IGBT tube FT4 and the cathode of the FRD tube FT4 and serves as the negative end UVS of the U-phase high-voltage area power supply of the high-integration intelligent power module; the VB2 end of the fan HVIC tube IC2 is used as the positive end VVB of the power supply of the U-phase high-voltage area of the high-integration intelligent power module; the HO3 end of the fan HVIC tube IC2 is connected with the grid electrode of a V-phase upper bridge arm IGBT tube FT 3; the VS2 end of the HVIC2 is connected with the emitter of the IGBT tube FT2, the anode of the FRD tube, the collector of the V-phase lower bridge arm IGBT tube FT5 and the cathode of the FRD tube, and is used as the negative end VVS of the W-phase high-voltage area power supply of the high-integration intelligent power module; the VB3 end of the fan HVIC tube IC2 is used as a W-phase high-voltage area power supply positive end WVB of the high-integration intelligent power module; the HO3 end of the fan HVIC tube IC2 is connected with the grid electrode of the W-phase upper bridge arm IGBT tube FT 3; the VS3 end of the blower HVIC tube IC2 is connected with the emitter of the IGBT tube FT3, the anode of the FRD tube, the collector of the W-phase lower bridge arm IGBT tube FT6 and the cathode of the FRD tube FT6 and serves as the negative end WVS of the W-phase high-voltage area power supply of the high-integration intelligent power module; the LO1 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 4; the LO2 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 5; the LO3 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 6; the LO3 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 6; the emitter of the IGBT tube FT4 is connected with the anode of the FRD tube FT4 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube FT5 is connected with the anode of the FRD tube and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube FT6 is connected with the anode of the FRD tube FT6 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the collector electrode of the IGBT tube FT1, the cathode of the FRD tube, the collector electrode of the IGBT tube FT2, the cathode of the FRD tube, the collector electrode of the IGBT tube FT3 and the cathode of the FRD tube are connected and used as a high-voltage input end P of the high-integration intelligent power module, and the high-voltage input end P is generally connected with 300V. The blower HVIC pipe IC2 has the following functions: the logic signals of 0-5V of input terminals FKIN 1, FKIN 2, FKIN 3, FLIN1, FLIN2 and LIN3 are respectively transmitted to output terminals HO1, HO2, HO3, LO1, LO2 and LO3, wherein HO1, HO2 and HO3 are the logic signals of VS-VS +15V, and LO1, LO2 and LO3 are the logic signals of 0-15V. Overcurrent protection is realized by detecting current output by UVW through ITRIP.
In the above embodiment, a path of RC filter circuit is further disposed between each input end of the fan IPM module 20 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current limiting resistor and a pull-up resistor are further arranged between the temperature feedback pin TH of the fan IPM module 20 and the MCU. A current limiting resistor and a pull-up resistor are also arranged between the fault feedback pin and the MCU. A filter capacitor is arranged between the power supply end of the fan driving chip IC2 and the ground end to filter out electromagnetic interference between an external power supply and the power supply end of the fan driving chip IC 2. A filter capacitor is arranged between the power supply end of the fan driving chip IC2 and the ground end to filter out electromagnetic interference between an external power supply and the power supply end of the fan driving chip IC 2.
The pins of the highly integrated intelligent power module can be implemented by gull-wing pins or direct-insert pins, and the embodiment is preferably direct-insert pins, and the pins correspond to the pad positions on the mounting positions and are electrically connected with the compressor driving chip IC1 and the fan driving chip IC2 through metal wires.
Referring to fig. 2 or fig. 3, it should be noted that, in order to avoid damage to the motor and the high-integrated intelligent power module when the motor is overcurrent, an overcurrent protection function is integrated in the high-integrated intelligent power module, specifically, a compressor overcurrent detection pin (abbreviated as ITRIP or ITRIP) and a fan overcurrent detection pin FITRIP are respectively provided on a mounting substrate of the high-integrated intelligent power module for the compressor and the fan to detect a voltage drop across an external current detection resistor 201, and when the voltage drop exceeds a certain threshold, levels on the compressor overcurrent detection pin and the fan overcurrent detection pin FITRIP are inverted, for example, from a high level to a low level, or from a low level to a high level, so as to trigger a protection function of an IC inside the IPM, and the module stops working to perform a protection function. In addition, when the high-integration intelligent power module is applied to an electrical apparatus such as an air conditioner, a refrigerator, a washing machine, or an inverter, the high-integration intelligent power module and the external sampling resistor are both mounted on an electronic control board (e.g., a PCB), and in consideration of the application environment of microelectronics, the area of the mounting substrate is not suitable to be set large, that is, in a limited area, the compressor IPM module 10 and the fan IPM module 20 are mounted on the mounting substrate, and signal interference between the compressor IPM module 10 and the fan IPM module 20, avoidance between circuit wirings, strong and weak electrical isolation between a driving IC in the compressor IPM module 10 and the fan IPM module 20 and a power switch tube in the inverter module, and isolation between a heat source of a high-power device and a non-heat source such as the driving IC are required to be considered. Therefore, in the wiring of the electronic control board PCB, it is necessary to connect to the ground at one point as much as possible, and particularly, a strong ground (output of the lower bridge IGBT emitter) and a weak ground (VSS or COM pin of IPM and ground of MCU) should be connected by one point. In addition, in actual wiring, parasitic inductance is introduced into the line, and in current detection, the parasitic inductance greatly affects detection. However, the lower bridge emitter pin of the compressor IPM and fan IPM module 20 is generally placed together with the high voltage pin in order to make the high voltage and high current routing shorter; the compressor current sense pin ITRIP, the logic ground pin, is typically placed together with other low voltage logic pins to shorten the distance of the other logic pins to logic ground. In addition, the lower bridge emitter pin between the compressor IPM and the fan IPM module 20 is usually set far away, and the grounding pin is not usually set on the high-voltage side, so that the pin is set for the high-integrated intelligent power module, and the wiring distance between the high-integrated intelligent power module and an external device can be increased on the wiring of the electric control board PCB, so that the parasitic inductance is easily increased, and the overcurrent protection is inaccurate, or the logic ground is easily affected by the high voltage ground.
Therefore, in the embodiment, the compressor low-voltage reference pin UVW-, the fan low-voltage reference pin FUVW-UVW-, the compressor current detection pin ITRIP, the fan current detection pin FITRIP and the single-point grounding pin VSS3 are all arranged on the strong current pin mounting side, and the compressor current detection pin ITRIP is electrically connected with the current feedback end of the compressor driving chip IC1 through wiring and binding wires on the internal circuit wiring layer of the high-integration intelligent power module. Two ground terminals VSS are provided on the compressor driver IC1, and a single-point ground pin on the strong current side and a weak current ground pin VSS1 on the weak current side are electrically connected to each other inside the compressor driver IC 1. Thus, the single-point grounding pin VSS3 can be electrically connected with the low-voltage power supply of the compressor driving chip IC1 through wiring and binding wires on the internal circuit wiring layer of the high-integration intelligent power module, and when the external power supply supplies power to the compressor driving chip IC1, the low-voltage power supply 302 arranged on the weak current pin installation side can be electrically connected with the single-point grounding pin VSS 3. When the compressor low-voltage reference pin UVW-is electrically connected with the high-voltage power supply 301 of the external power supply through the external current detection resistor 201, the compressor low-voltage reference pin UVW-is also electrically connected with the single-point grounding pin VSS3 through the external current detection resistor 201. Similarly, the fan current detection pin FITRIP is electrically connected with the current feedback end of the fan driving chip IC2IC1 through routing wires and binding wires on the internal circuit wiring layer of the high-integration intelligent power module, and two grounding ends VSS are arranged on the fan driving chip IC2, so that the single-point grounding pin on the strong current side and the weak current grounding pin VSS2 on the weak current side are electrically connected inside the fan driving chip IC 2. Therefore, the single-point grounding pin VSS3 can be electrically connected with the low-voltage power supply of the fan driving chip IC2 through wiring and binding wires on the internal circuit wiring layer of the high-integration intelligent power module, and when the external power supply supplies power to the fan driving chip IC2, the low-voltage power supply 302 arranged on the weak current pin installation side can be electrically connected with the single-point grounding pin VSS 3. When the low-voltage reference pin FUVW-UVW-of the fan is electrically connected with the high-voltage power supply 301 of the external power supply through the external current detection resistor 201, the low-voltage reference pin FUVW-UVW-of the fan is electrically connected with the single-point grounding pin VSS3 through the external current detection resistor 201. That is, the strong ground (lower bridge IGBT emitter output) and the weak ground (COM pin) of the external power supply realize single-point grounding at the single-point grounding pin VSS3 of the highly integrated smart power module, and the routing distance between the strong ground and the weak ground can be shortened without additionally providing a single-point grounding point on the electronic control board. And, when carrying out the wiring of automatically controlled board PCB, external current detection resistance 201 sets up the periphery at the forceful electric power pin installation side of high integrated intelligent power module, and compressor current detection foot ITRIP also sets up at forceful electric power pin installation side, can shorten the line distance of walking between compressor current detection foot ITRIP and fan current detection foot FITIRIP and external current detection resistance 201 to reduce the parasitic inductance on walking the line, because the reduction of parasitic inductance, can solve the problem that high integrated intelligent power module triggers by mistake.
It can be understood that the driving current of the compressor inverter power module 11 flows from the driving terminal of the compressor driving chip IC1 to the compressor low voltage reference pin UVW of the compressor inverter power module 11, then flows from the compressor low voltage reference pin UVW to the single point ground pin VSS3 outside the smart power module, and then flows back to the gate from the single point ground pin on the high voltage side of the compressor driving chip IC1, thereby forming a driving loop. Similarly, the driving current of the fan inverter power module 21 flows from the driving end of the fan driving chip IC2 to the fan low-voltage reference pin FUVW-, then from the fan low-voltage reference pin FUVW-to the single-point grounding pin VSS3 outside the intelligent power module, and then from the single-point grounding pin on the high-voltage side of the fan driving chip IC2 back to the gate, so as to form a driving loop.
The invention can also shorten the wiring of the driving current loop, thereby reducing the parasitic inductance on the wiring, improving the switching speed of the switching tube in the power module 20, and solving the problem of false triggering of the intelligent power module due to the reduction of the parasitic inductance. In addition, in this embodiment, the grounding end of the power module 20 on the strong current installation side is directly inside the high-integration intelligent power module without external wiring (specifically, the compressor driving chip IC1 may be connected to the compressor weak current grounding pin VSS1 on the weak current installation side, or the fan driving chip IC2 may be connected to the fan weak current grounding pin VSS2 on the weak current installation side), and the wiring requirement of the wiring is not required to be considered, so that the peripheral electronic control wiring of the intelligent power module may be facilitated, and the wiring difficulty of the electronic control board of the electrical equipment may be reduced.
Referring to fig. 2 or 3, in an embodiment, the compressor low voltage reference pin UVW-, the compressor current detection pin ITRIP, the single point ground pin VSS3, and the blower low voltage reference pin FUVW-, the blower current detection pin FITRIP are adjacently disposed at the strong current pin installation side.
Referring to fig. 4, Ls1 to Ls4 in the drawing indicate equivalent parasitic inductances in the lines, and when the connection between the compressor current detection pin ITRIP and the external compressor current detection resistor 201 and the compressor low voltage reference pin UVW- (lower bridge emitter pin) is connected at point a (near the lower bridge emitter pin), the voltage of the compressor current detection pin ITRIP is affected by Ls1 above the track resistor. Similarly, when the connection between the fan current detection pin FITRIP and the external fan current detection resistor 201 and the fan low voltage reference pin FUVW- (lower bridge emitter pin) is connected at point a (near the lower bridge emitter pin), the voltage of the fan current detection pin FITRIP is affected by Ls1 above the routing resistor. The resistance of the trace causes the trip level to drop because it corresponds to adding a series resistance to the shunt resistance (current sense resistor 201). Ls1 generates voltage spike when reverse recovery current flows, which is easy to cause false triggering, so the connection point needs to be set at point B in the figure, that is, close to (the external current detection resistor 201), at this time Ls1 is equivalent to a filter with a large time constant, which can filter the voltage spike, and reduce the noise influence of Ls1 to the maximum extent through the ITRIP wiring of the compressor current detection pin. Therefore, in this embodiment, the compressor under-bridge emitter pin (UVW-), the compressor current detection pin itrp (ITRIP or ITRIP), the fan low voltage reference pin FUVW-, the fan current detection pin FITRIP, the single-point ground pin VSS3 are disposed as close as possible, so that the routing distance on the IPM external electrical control wiring can be shortened as much as possible, that is, when peripheral electrical control wiring is performed, the routing distances from the compressor under-bridge emitter pin UVW- (fan under-bridge emitter pin vw-) to the sampling resistor, from the external sampling resistor to the compressor current detection pin itrp (fan current detection pin FITRIP), from the compressor current detection pin itrp (fan current detection pin FITRIP) to the ground, and from the external current detection resistor 201 to the ground are all shortened to the shortest. The Ls 2-Ls 4 are reduced as much as possible, so that the influence of parasitic inductance on current detection is reduced, the current detection is ensured not to be interfered, and reliable current protection and measurement performance are obtained. Meanwhile, the single-point grounding point is reduced, and meanwhile, the compressor low-voltage reference pin UVW-, the compressor current detection pin ITRIP and the fan low-voltage reference pin FUVW-, the fan current detection pin FITIRIP are arranged close to each other as much as possible, so that the internal wiring distance can be reduced. Because the three pins of the low-voltage reference pin UVW-, the compressor current detection pin ITRIP and the single-point grounding pin VSS3 are adjacent, the wiring distances from the low-voltage reference pin UVW-to the external current detection resistor 201, from the external current detection resistor 201 to the compressor current detection pin ITRIP, from the compressor current detection pin ITRIP to the single-point grounding pin VSS3 and from the external current detection resistor 201 to the single-point grounding pin are all shortened to be shortest, the influence of parasitic inductance can be reduced, and the current detection is ensured not to be interfered.
Referring to fig. 2 or 3, in an embodiment, the weak current pin mounting side is provided with a first low voltage power supply positive terminal pin VDD, a second low voltage power supply positive terminal pin FVDD, a first low voltage power supply negative terminal pin VSS1 and a second low voltage power supply negative terminal pin VSS 2;
the power supply end of the compressor driving chip IC1 is electrically connected with the first low-voltage power supply positive terminal pin VDD;
the power supply end of the fan driving chip IC2 is electrically connected with the second low-voltage power supply positive terminal pin FVDD;
the grounding end of the compressor driving chip IC1 is electrically connected with the first low-voltage power supply negative terminal pin VSS 1;
the ground terminal of the fan driving chip IC2 is electrically connected to the second low voltage power supply negative terminal pin VSS 2.
It can be understood that, the driving voltages of the two driving chips can be set to be the same, or can be set to be different, and the present embodiment sets two sets of low-voltage power supply positive terminal pins and low-voltage power supply negative terminal pins on the weak current pin mounting side, that is, the compressor driving chip IC1 and the fan driving chip IC2 are respectively connected to different power pins and the same weak current grounding pin. So, can shorten two driver chip to the distance of low pressure power supply positive terminal pin and low pressure power supply negative terminal pin, shorten lead wire length, can also reduce the complexity of external circuit wiring simultaneously. The low-voltage power supply and the strong-current power supply are grounded in a single point by arranging two weak-current grounding pins to be connected with the low-voltage power supply, the circuit wiring complexity of the high-integration intelligent power module can be reduced,
further, in the above embodiments, the single-point ground pin VSS3 is respectively connected to the ground terminals of the compressor driver IC1 and the fan driver IC 2.
In this embodiment, the single-point grounding pin VSS3 and the first low-voltage power supply negative terminal pin (compressor weak current grounding pin) VSS1 are both connected to the ground terminal of the compressor driver IC1, and the single-point grounding pin VSS3 and the second low-voltage power supply negative terminal pin (fan weak current grounding pin) VSS2 can be electrically connected through the fan driver IC 2. The common point for realizing single-point grounding is arranged on the high-integration intelligent power module, the high-voltage side ground passes through the single-point grounding pin VSS3 and passes through the interior of the module (specifically, the interior of a driving chip) to reach the low-voltage side compressor weak current grounding pin VSS1 and the fan weak current grounding pin VSS2, so that convenient single-point grounding is formed, and the length of the ground wire is reduced. So, can shorten the line of walking when strong electric ground and weak electric ground realize single-point ground connection, can realize the electricity between the earthing terminal of strong electric installation side and the compressor weak electric grounding pin VSS1 and the fan weak electric grounding pin VSS2 of weak electric installation side and connect on high integrated intelligent power module, thereby need not to set up the earth point again on automatically controlled board and connect, and then need not to consider the ann rule requirement of walking the line, the peripheral automatically controlled wiring of high integrated intelligent power module of can being convenient for, thereby reduce electrical equipment's automatically controlled board wiring degree of difficulty, be favorable to improving high integrated intelligent power module's reliability. The invention solves the problem that the high-integration intelligent power module is poor in reliability due to the fact that overcurrent protection of the high-integration intelligent power module is easy to trigger by mistake.
Referring to fig. 2 or 3, in an embodiment, the highly integrated smart power module further includes:
the PFC inductance connection end PFC + is connected with one end of an external inductor;
the bus capacitor connecting end P is connected with an external bus capacitor;
the PFC power module 30 comprises a PFC power switch tube and a PFC diode, wherein the input end of the PFC power switch tube is interconnected with the connection end of the PFC inductor and the anode of the PFC diode, and the output end of the PFC power switch tube is connected with the connection negative end of the PFC inductor; and the cathode of the PFC diode is connected with the connecting end of the bus capacitor.
In this embodiment, one end of the external inductor is connected to the positive output terminal DC + of the rectifier bridge 10, and the other end of the external inductor is connected to the negative output terminal DC-of the rectifier bridge 10 through the PFC power switch tube T7. The external inductor, the bus capacitor, the rectifier bridge 10, the PFC diode D8, and the PFC power switch tube T7 form a complete PFC circuit. The PFC circuit may be a boost PFC circuit, or a buck PFC circuit, or a boost PFC circuit. The present embodiment may be a boost PFC circuit, that is, the PFC diode D8 is a boost diode. In the PFC power switch module 30, only the PFC power switch tube T7 and the PFC diode D8 may be integrated in the smart power module, or PFC circuits including other components such as a bus capacitor and an inductor may be integrated in the smart power module. The present embodiment is not integrated in the smart power module due to volume and the like. The PFC circuit performs power factor adjustment on the direct current, and the adjusted direct current is output to the power input terminal of the inverter bridge circuit 10, so that each power module drives a corresponding load to operate. The regulated direct current can also generate working voltage of 5V and other driving chips so as to provide working voltage for circuit modules such as a main controller.
In the working process of the PFC power module 30, two working processes of boosting and energy storage are provided, and when boosting is performed, the PFC power switch tube T7 is cut off, the external inductor outputs the electric energy output by the rectifier bridge 10 and the stored electric energy to the compressor inverter power module 11 and the fan inverter power module 21 through the PFC diode D8, so that electric energy is released to charge the bus capacitor, and boosting is achieved. When the PFC power switch tube T7 is turned on, the external inductor is connected to the negative output terminal of the rectifier bridge 10 through the PFC power switch tube T7 to store energy.
In the above embodiment, the PFC power switch T7 is disposed close to the rectifier bridge 10, and the PFC diode D8 is disposed close to the IPM module 30, so that the length of the lead between the PFC power switch T7 and the rectifier bridge 10 and the length of the lead between the PFC diode D8 and the compressor inverter power module 11 can be shortened, and the PFC power switch T7 can be prevented from generating electromagnetic interference on the compressor inverter power module 11.
Referring to fig. 2 or fig. 3, in an embodiment, the output terminal of the PFC power switch is electrically connected to the single-point ground pin VSS 3;
and/or the output end of the PFC power switch tube is electrically connected with the grounding end of the compressor driving chip IC 1.
In this embodiment, an output terminal pin of the PFC power switch tube, that is, an emitter of the PFC IGBT (T7), is disposed on a strong current pin mounting side, the output terminal of the PFC power switch tube may be electrically connected to a single-point ground pin VSS3 through an internal trace, and the output terminal of the PFC power switch tube may also be electrically connected to the ground terminal VSS1 of the compressor driving chip IC1 through an internal trace, so that a trace distance between the PFC power switch tube and the weak current ground pin of the compressor driving chip IC1 may be shortened, thereby reducing parasitic inductance on the trace. Meanwhile, the driving loop of the driving circuit from the HVIC to the IGBT grid electrode to the emitter electrode and back to the HVIC ground end can be made to be shortest, and therefore the switching speed of the PFC power switching tube is improved.
Referring to fig. 2 or 3, in an embodiment, the highly integrated smart power module further includes:
and the output end of the rectifier bridge 40 is connected with the PFC inductor.
In this embodiment, the rectifier bridge 40 includes a first diode D9, a second diode D10, a third diode D11, and a fourth diode D12, and the first diode D9 and the second diode D10 are disposed on a sub-mounting location; the third diode D11 and the fourth diode D12 are respectively arranged on two different mounting positions; the anode of the first diode D9 is electrically connected with the cathode of the third diode D11, and the cathode of the first diode D9 is electrically connected with the cathode of the second diode D10; an anode of the second diode D10 is electrically connected to a cathode of the fourth diode D12. In this embodiment, the first diode D9 and the second diode D10 are two diodes sharing a cathode, and the third diode D12 and the fourth diode D12 are two diodes sharing an anode. The two diodes sharing the anode are arranged on one sub-mounting position and are electrically connected through the mounting position, and the two diodes sharing the cathode are respectively arranged on two different sub-mounting positions and are electrically connected through the other mounting position. Thus, the number of mounting positions can be reduced, so that the area of the rectifier bridge 40 on the mounting substrate 100 is reduced, the structure of the highly integrated intelligent power module is compact, and the overall area is reduced. And simultaneously, the steps of wiring and wire bonding can be reduced.
It can be understood that, when the intelligent power module is applied to a refrigeration device, such as an air conditioner, a refrigerator, etc., the IPM module 30 can be used to drive a fan, a compressor, etc. to work, that is, the rectifier bridge 40, the compressor IPM module 10 and the PFC power module 30 are integrated into a whole to form a three-in-one compressor intelligent power module in this embodiment. Or, the rectifier bridge 40, the fan IPM module 20 and the PFC power module 30 are integrated into a whole to form a three-in-one fan intelligent power module. Of course, in other embodiments, the rectifier bridge 40, the PFC power module 30, the compressor IPM module 10 and the fan IPM module 20 may be integrated into a whole to form a four-in-one high-integration intelligent power module. An inrush current protection circuit is further disposed between the output end of the rectifier bridge 40 and the PFC power module 30 to absorb an inrush current output from the rectifier bridge 40 to the PFC power module 30, so as to avoid damaging a PFC diode in the PFC power module 30.
It should be noted that, as a microelectronic device, considering the application environment of microelectronics, the area of the mounting substrate is not suitable to be set large, that is, in a limited area, the compressor IPM module 10 and the fan IPM module 20 are disposed on the mounting substrate, there are many circuit wirings, signal interference between the compressor IPM module 10 and the fan IPM module 20, avoidance between the circuit wirings, strong and weak electrical isolation between the driving IC in the compressor IPM module 10 and the fan IPM module 20 and the power switch tube in the inverter module, and isolation between the heat source of the high-power device and the non-heat source such as the driving IC are considered. Therefore, when manufacturing the high-integration intelligent power module, the size of the high-integration intelligent power module, the isolation between strong and weak current between devices, the isolation between a heat source and a non-heat source, and the line distance and the line width between lines are considered to meet the requirements of safety specifications. Because the lines are dense, and a longer distance exists between the device and the pins, the wires are necessarily bent to avoid other parts on the wires, the distance is further increased, parasitic inductance is easily formed on the leads, and parasitic capacitance is easily formed between the dense lines.
The compressor driving chip IC1 and the fan driving chip IC2 in the intelligent power module are mostly powered by a single power supply, the low-voltage side directly uses a direct-current power supply for power supply, and the high-voltage side is in a floating state, so that the high-voltage side driving circuit is powered by a floating power supply mode mostly, and the common floating power supply mode has two modes of bootstrap capacitor power supply and charge pump power supply. The bootstrap capacitor supplies power through a bootstrap circuit formed by externally connected elements such as a diode, a resistor and a capacitor, so as to improve the utilization rate of a power supply.
For example, when a lower arm power tube of a half-bridge structure in the power inverter module is turned on and an upper arm power tube is turned off, the high-side floating power supply drops with the drop of the high-side floating ground voltage, and when the high-side floating power supply drops below the direct-current power supply voltage and the voltage difference between the high-side floating power supply and the direct-current power supply exceeds the conduction voltage drop of the bootstrap diode, the direct-current power supply charges the bootstrap capacitor through the bootstrap diode. When the upper bridge arm power tube is turned on and the lower bridge arm power tube is turned off, the high-side floating power supply rises along with the rise of the high-side floating ground voltage, the voltage of the high-side floating power supply far exceeds the voltage of the direct-current power supply, the bootstrap diode is turned off, and the bootstrap capacitor supplies power to the high-side circuit. Bootstrap floating power supply pin VB is used for supplying power for the upper bridge IGBT grid, if it receives the interference, leads to IGBT spurious triggering easily, can burn out high integrated intelligent power module when serious. In addition, in the highly integrated smart power module, since the power density is increased, the number of circuit wirings is increased, the electromagnetic interference is increased, and VB is particularly susceptible to interference.
Therefore, in this embodiment, at least one filter capacitor is disposed between the floating power supply pin of the three-phase compressor of the compressor inverter power module 11 and the output pin of the three-phase compressor, so as to filter the interference introduced from the peripheral circuit from the floating power supply pin of each phase of compressor, and avoid the interference from affecting the potential of the floating power supply pin of each phase of compressor to the output pin of each phase of compressor.
Referring to fig. 2 or fig. 3, in order to further improve the filtering capability, in the above embodiment, the number of the filter capacitors serially connected between the floating power supply pin of the compressor and the output pin of the compressor in each phase is two, the two filter capacitors are respectively a first filter capacitor and a second filter capacitor, and the first filter capacitor C1, C2, C3 and the second filter capacitor C4, C5, C6 are arranged in parallel.
The first filter capacitors C1, C2 and C3 are arranged on the mounting substrate and close to the fan floating power supply pin and the fan output pin;
in this embodiment, one of the two filter capacitors serially connected between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pin U, V, W of each phase is disposed close to the fan floating power supply pins VB1, VB2, VB3 and the fan output pin U, V, W, and the other of the two filter capacitors serially connected between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pin U, V, W of each phase is close to the compressor driving chip IC 1.
The first filter capacitor is arranged at a position close to the pins, and the distance between the first filter capacitor and the pins of the compressor floating power supply and the pins of the compressor output pin is less than 5 mm; the second filter capacitor is arranged close to the compressor driving chip IC1, and the distance between the second filter capacitor and the compressor driving chip IC1 is less than 10 mm. The filter capacitor is positioned beside the pin and used for filtering interference from a peripheral circuit, which is transmitted from the pin, and avoiding the interference from influencing the potential of the floating power supply pin of the compressor to the output pin of the compressor or interfering adjacent wiring; because there is a longer routing distance from the compressor floating power supply pin and the compressor output pin to the compressor driving chip IC1, and this routing may be subject to electromagnetic interference from peripheral routing, resulting in unstable voltage, the filter capacitor located beside the compressor driving chip IC1 is used to filter out these interferences, ensuring that the normal operation of the compressor driving chip IC1 is not affected. The second filter capacitors C4, C5, C6 are disposed on the mounting substrate adjacent to the compressor driver chip IC 1. Specifically, filter capacitors C1 and C4 are arranged between a U-phase compressor floating power supply pin VB1 and a U-phase compressor output pin U in series, a first filter capacitor C1 is arranged close to the U-phase compressor floating power supply pin VB1 and the U-phase compressor output pin, and a second filter capacitor C4 is arranged close to a compressor driving chip IC 1; filter capacitors C2 and C5 are arranged between a V-phase compressor floating power supply pin B1 and a V-phase compressor output pin V in series, a second filter capacitor C2 is arranged close to the V-phase compressor floating power supply pin VB2 and the V-phase compressor output pin, and a second filter capacitor C5 is close to a compressor driving chip IC 1; a filter capacitor C3 and a filter capacitor C6 are arranged between a floating power supply pin VB3 of the W-phase compressor and an output pin V of the W-phase compressor in series, a first filter capacitor C3 is arranged close to the floating power supply pin VB3 of the W-phase compressor and the output pin of the W-phase compressor, and a second filter capacitor C4 is arranged close to a compressor driving chip IC 1.
Referring to fig. 2 or 3, in an embodiment, the filter capacitors CF1, CF2 and CF3 serially connected between the floating power supply pins FVB1, FVB2, FVB3 and the fan output pins FU, FV and FW of each phase are disposed close to the floating power supply pins FVB1, FVB2, FVB3 and the fan output pins U, FV and FW of the fan; and/or disposed proximate to the fan drive chip IC 2. Namely, a filter capacitor CF1 is arranged between the U-phase fan floating power supply pin FVB1 and the U-phase fan output pin U in series; a filter capacitor CF2 is arranged between a V-phase fan floating power supply pin FVB2 and a V-phase fan output pin U in series; and a filter capacitor CF3 is arranged between the W-phase fan floating power supply pin FVB3 and the W-phase fan output pin W in series.
In this embodiment, it can be understood that the power of the compressor motor is greater than that of the fan motor, so when the compressor and the fan are driven to operate, the power of the power device in the compressor IPM module 10 is greater than that of the power device in the fan IPM module 20, and compared with the compressor inverter power module 11, the driving current of the fan inverter power module 21 is also smaller, that is, the working current is smaller, so that the generated interference is relatively less, and therefore, only one set of filter capacitors may be provided. The group of filter capacitors can be arranged beside the pins to filter the interference from peripheral circuits, which is transmitted from the pins, and avoid the interference from influencing the potential of the fan floating power supply pins to the fan output pins or interfering adjacent wiring; because there is also longer line distance from fan power supply pin and fan output pin to fan driver chip IC2 that floats, this section is walked and probably is received the electromagnetic interference of peripheral line, leads to the voltage unstability, also can set up filter capacitance in fan driver chip IC2 to the normal work of compressor driver chip IC1 is guaranteed not to influence by filtering these interference.
The invention further provides an electronic control assembly, which comprises a low-voltage power supply (not shown), a high-voltage power supply (not shown), a compressor current detection resistor SR1, a fan current detection resistor SR2 and the high-integration intelligent power module, wherein,
one end of the compressor current detection resistor SR1 is interconnected with a compressor low-voltage reference pin and a compressor current detection pin of the high-integration intelligent power module, and the other end of the compressor current detection resistor SR1 is connected with a single-point grounding pin of the high-integration intelligent power module;
the compressor low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the compressor current detection resistor SR 1;
one end of the fan current detection resistor SR2 is interconnected with a fan low-voltage reference pin and a fan current detection pin of the high-integration intelligent power module, and the other end of the fan current detection resistor SR2 is connected with a single-point grounding pin of the high-integration intelligent power module;
the fan low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the fan current detection resistor SR 2.
In this embodiment, the compressor current detection resistor SR1 is serially connected between the compressor low voltage reference pin UVW-and the single-point ground pin VSS3, and can detect the current flowing through the three-phase lower bridge arm switching tube of the compressor and convert the current into a voltage signal, thereby implementing the current detection of the motor. The fan current detection resistor SR2 is serially connected between a fan low voltage reference pin UVW-and a single-point grounding pin VSS3, and can detect the current flowing through the three-phase lower bridge arm switch tube of the compressor and convert the current into a voltage signal, so that the current detection of the motor is realized.
Referring to fig. 2 or 3, in some embodiments, the electronic control assembly further comprises:
the electronic control board (not shown) is provided with a circuit wiring layer, the current detection resistor 201 and the high-integration intelligent power module are installed on the electronic control board, and the current detection resistor 201 and the high-integration intelligent power module are electrically connected through a lead corresponding to the circuit wiring layer.
In this embodiment, a pad of the rectifier bridge stack, the PFC circuit, the dc bus capacitor, and the highly integrated intelligent power module may be formed on the electric control board, and the rectifier bridge stack, the PFC circuit, the dc bus capacitor, and the highly integrated intelligent power module may be electrically connected to each other through a lead on the circuit wiring layer. The current detection resistor 201 is arranged on the same side of the installation side of a strong current pin of the high-integration intelligent power module, so that in the high-integration intelligent power module, when the low-voltage reference pin UVW-is connected with a single-point grounding pin through the external current detection resistor 201, the distance between the low-voltage reference pin UVW-and the single-point grounding pin can be shortened, and the compressor current detection pin ITRIP is also arranged on the installation side of the strong current pin, so that the distance between the low-voltage reference pin UVW-and the compressor current detection pin ITRIP can be shortened.
The invention also provides an air conditioner, which comprises the high-integration intelligent power module;
the detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the air conditioner of the present invention uses the above-mentioned high-integration intelligent power module, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A highly integrated smart power module, comprising:
the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;
a compressor IPM module and a fan IPM module respectively installed at the corresponding installation positions, and,
the compressor low-voltage reference pin, the compressor current detection pin, the fan low-voltage reference pin, the fan current detection pin and the single-point grounding pin are arranged on the strong current pin mounting side; wherein the content of the first and second substances,
the compressor low-voltage reference pin is connected with the output end of the compressor IPM module, and is also used for being connected with the single-point grounding pin through an external compressor current detection resistor; the compressor current detection pin is electrically connected with the compressor low-voltage reference pin;
the fan low-voltage reference pin is connected with the output end of the fan IPM module and is also used for being connected with the single-point grounding pin through an external fan current detection resistor; the fan current detection pin is electrically connected with the fan low-voltage reference pin.
2. The high integrated smart power module of claim 1 wherein said compressor low voltage reference pin, compressor current sense pin, single point ground pin and fan low voltage reference pin, fan current sense pin are disposed adjacent said high current pin mounting side.
3. The high integrated smart power module of claim 1, wherein said compressor IPM module comprises:
the compressor inversion power module and the compressor driving chip are arranged on the corresponding mounting positions and are electrically connected with the compressor driving chip;
the fan IPM module comprises:
and the fan inversion power module and the wind driving chip are arranged on the corresponding mounting positions, and the compressor inversion power module is electrically connected with the fan driving chip.
4. The highly integrated smart power module according to claim 3 wherein said weak current pin mounting side is provided with a first low voltage power supply positive terminal pin, a second low voltage power supply positive terminal pin, a first low voltage power supply negative terminal pin and a second low voltage power supply negative terminal pin;
the power supply end of the compressor driving chip is electrically connected with the first low-voltage power supply positive end pin;
the power supply end of the fan driving chip is electrically connected with the second low-voltage power supply positive end pin;
the grounding end of the compressor driving chip is electrically connected with the first low-voltage power supply negative terminal pin;
and the grounding end of the fan driving chip is electrically connected with the pin of the second low-voltage power supply negative end.
5. The high-integrated smart power module according to claim 4, wherein the single-point ground pin is connected to ground terminals of the compressor driver chip and the fan driver chip, respectively.
6. The highly integrated smart power module of claim 3, further comprising:
the PFC inductor is connected with the negative end and is connected with the negative end of the PFC power supply;
the PFC inductor is connected with the positive end and is interconnected with the positive end of the PFC power supply and one end of the external inductor;
the PFC inductor connecting end is connected with the other end of the external inductor;
the bus capacitor connecting end is connected with an external bus capacitor;
the PFC power module comprises a PFC power switch tube and a PFC diode, the input end of the PFC power switch tube is interconnected with the PFC inductance connecting end and the anode of the PFC diode, and the output end of the PFC power switch tube is connected with the PFC inductance connecting negative end; and the cathode of the PFC diode is connected with the connecting end of the bus capacitor.
7. The highly integrated smart power module of claim 6, wherein the output of the PFC power switch tube is electrically connected to the single point ground pin;
and/or the output end of the PFC power switch tube is electrically connected with the grounding end of the compressor driving chip.
8. The highly integrated smart power module of any of claims 1 to 7, further comprising:
and the output end of the rectifier bridge is connected with the PFC inductor.
9. An electronic control assembly comprising a low voltage power supply, a high voltage power supply, a compressor current sensing resistor, a fan current sensing resistor, and a highly integrated intelligent power module as claimed in any one of claims 1 to 8,
one end of the compressor current detection resistor is connected with a compressor low-voltage reference pin and a compressor current detection pin of the high-integration intelligent power module, and the other end of the compressor current detection resistor is connected with a single-point grounding pin of the high-integration intelligent power module;
the compressor low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the compressor current detection resistor;
one end of the fan current detection resistor is connected with a fan low-voltage reference pin and a fan current detection pin of the high-integration intelligent power module, and the other end of the fan current detection resistor is connected with a single-point grounding pin of the high-integration intelligent power module;
the fan low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the fan current detection resistor.
10. An air conditioner comprising the highly integrated smart power module of any one of claims 1 to 8;
or, comprising an electrically controlled assembly according to claim 9.
CN202011392857.4A 2020-11-30 2020-11-30 High-integration intelligent power module, electric control assembly and air conditioner Pending CN114576837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011392857.4A CN114576837A (en) 2020-11-30 2020-11-30 High-integration intelligent power module, electric control assembly and air conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011392857.4A CN114576837A (en) 2020-11-30 2020-11-30 High-integration intelligent power module, electric control assembly and air conditioner

Publications (1)

Publication Number Publication Date
CN114576837A true CN114576837A (en) 2022-06-03

Family

ID=81767605

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011392857.4A Pending CN114576837A (en) 2020-11-30 2020-11-30 High-integration intelligent power module, electric control assembly and air conditioner

Country Status (1)

Country Link
CN (1) CN114576837A (en)

Similar Documents

Publication Publication Date Title
CN110138249B (en) Intelligent power module and air conditioner
CN110085581B (en) High-integration intelligent power module and air conditioner
CN115995952B (en) High-voltage integrated circuit and intelligent power module
CN213713453U (en) High-integration intelligent power module, electric control assembly and air conditioner
CN214205353U (en) High-integration intelligent power module and air conditioner
CN110085579B (en) High-integration intelligent power module, manufacturing method thereof and air conditioner
Son et al. Integrated MOSFET inverter module for low-power drive system
CN114576837A (en) High-integration intelligent power module, electric control assembly and air conditioner
CN114583976A (en) High-integration intelligent power module and air conditioner
CN216290724U (en) Semiconductor circuit having a plurality of transistors
CN209823637U (en) Intelligent power module and air conditioner
CN110601552A (en) High-integration intelligent power module and electrical equipment
CN110601581A (en) Intelligent power module, electric control device and air conditioner
CN212413040U (en) Intelligent power module and air conditioner
CN213959964U (en) Intelligent power module, electric control assembly and air conditioner
CN213519937U (en) Intelligent power module semiconductor device
CN110148594B (en) Intelligent power module and air conditioner
CN110940069B (en) Intelligent power module and air conditioner
CN112087151A (en) Intelligent power module and air conditioner
CN218387286U (en) Intelligent power module, electric control assembly and air conditioner
CN214205303U (en) Intelligent power module, electric control assembly and air conditioner
CN112968622A (en) Intelligent power module and intelligent power module structure adopting same
CN114695333A (en) Intelligent power module and manufacturing method thereof, frequency converter and air conditioner
CN114598165A (en) Intelligent power module, electric control assembly and air conditioner
CN213717862U (en) Intelligent power module, frequency converter and air conditioner

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination