CN214205353U - High-integration intelligent power module and air conditioner - Google Patents
High-integration intelligent power module and air conditioner Download PDFInfo
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- CN214205353U CN214205353U CN202022830322.2U CN202022830322U CN214205353U CN 214205353 U CN214205353 U CN 214205353U CN 202022830322 U CN202022830322 U CN 202022830322U CN 214205353 U CN214205353 U CN 214205353U
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Abstract
The utility model discloses a high integrated intelligent power module and air conditioner, this high integrated intelligent power module includes: a mounting substrate, a compressor IPM module and a fan IPM module; the three-phase compressor floating power supply pin and the three-phase compressor output pin are electrically connected with the compressor IPM module respectively; the three-phase fan floating power supply pin and the three-phase fan output pin are electrically connected with the fan IPM module respectively; the floating power supply pin of each phase of compressor is connected with the output pin of the compressor in series; and at least one fan filter capacitor is arranged between each phase of fan floating power supply pin and the fan output pin in series. The utility model discloses can the filtering from the interference that each looks float power supply pin introduces from peripheral circuit, avoid these interference to influence each looks float power supply pin to the electric potential of each looks output pin separately.
Description
Technical Field
The utility model relates to an electronic circuit technical field, in particular to high integrated intelligent power module and air conditioner.
Background
An intelligent Power module (ipm) is a Power driving product combining Power electronics and integrated circuit technology, and is generally applied to an electric control board for driving equipment such as a fan and a compressor. At present, a driving chip in an intelligent power module is mostly powered by a single power supply, a low-voltage side directly uses a direct-current power supply VCC for power supply, a high-voltage side is in a floating state, and power is supplied by a bootstrap circuit formed by discrete devices such as an external diode, a resistor and a capacitor, so that the utilization rate of the power supply is improved. Because the integrated level of intelligent power module is high, also receive external interference simultaneously easily, especially the power supply pin that floats influences intelligent power module's normal work.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high integrated intelligent power module and air conditioner aims at solving the anti-electromagnetic interference ability that improves high integrated intelligent power module.
In order to achieve the above object, the utility model provides a high integrated intelligent power module, high integrated intelligent power module includes:
the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;
the compressor IPM module and the fan IPM module are respectively arranged at the corresponding installation positions;
the three-phase compressor floating power supply pin and the three-phase compressor output pin are arranged on the strong current pin mounting side, and the three-phase compressor floating power supply pin and the three-phase compressor output pin are respectively and electrically connected with the compressor IPM module;
the three-phase fan floating power supply pin and the three-phase fan output pin are arranged on the strong current pin mounting side, and the three-phase fan floating power supply pin and the three-phase fan output pin are respectively and electrically connected with the fan IPM module;
the compressor filter capacitors are arranged at the mounting positions corresponding to the mounting substrate, and at least one compressor filter capacitor is arranged between the floating power supply pin and the compressor output pin of each phase in series; and the number of the first and second groups,
and the fan filter capacitors are arranged at the installation positions corresponding to the installation substrate, and at least one of the fan filter capacitors is arranged between the floating power supply pin and the fan output pin of each phase in series.
Optionally, the compressor IPM module includes:
the compressor inversion power module and the compressor driving chip are arranged at the corresponding mounting positions and electrically connected with the compressor driving chip.
Optionally, the number of the filter capacitors arranged in series between the floating power supply pin of the compressor and the output pin of the compressor in each phase is two, the two filter capacitors are respectively a first filter capacitor and a second filter capacitor, and the first filter capacitor and the second filter capacitor are arranged in parallel.
Optionally, the first filter capacitor is arranged close to the fan floating power supply pin and the fan output pin;
the second filter capacitor is arranged close to the compressor driving chip.
Optionally, the distance between the first filter capacitor and the fan floating power supply pin and the fan output pin is less than 5 mm;
the distance between the second filter capacitor and the compressor driving chip is less than 10 mm.
Optionally, the fan IPM module includes:
the fan inversion power module and the wind driving chip are arranged at the corresponding installation positions, and the compressor inversion power module is electrically connected with the fan driving chip.
Optionally, the filter capacitor arranged in series between the floating power supply pin and the fan output pin of each phase is arranged close to the floating power supply pin and the fan output pin of the fan;
and/or, the fan driving chip is arranged close to the fan driving chip.
Optionally, the high-integration smart power module further comprises:
the PFC inductor connecting end is connected with one end of an external inductor;
the bus capacitor connecting end is connected with an external bus capacitor;
the PFC power module comprises a PFC power switch tube and a PFC diode, the input end of the PFC power switch tube is interconnected with the PFC inductance connecting end and the anode of the PFC diode, and the output end of the PFC power switch tube is connected with the PFC inductance connecting negative end; and the cathode of the PFC diode is connected with the connecting end of the bus capacitor.
Optionally, the high-integration smart power module further comprises:
and the output end of the rectifier bridge is connected with the PFC inductor.
The utility model also provides an air conditioner, include as above high integrated intelligent power module.
The utility model discloses an all place at least one filter capacitance between the three-phase compressor floating power supply pin of compressor contravariant power module and the three-phase compressor output pin to the filtering is from the interference that each looks compressor floating power supply pin introduced from peripheral circuit, avoids these interferences to influence the electric potential of each looks compressor floating power supply pin to each looks compressor output pin separately. And meanwhile, a fan filter capacitor is arranged between a three-phase fan floating power supply pin and a three-phase fan output pin of the fan inversion power module to filter interference introduced from a peripheral circuit from each phase fan floating power supply pin and avoid the interference from influencing the potential of each phase fan floating power supply pin to each phase fan output pin. This embodiment can also be through the electromagnetic interference that the inside lead wire of this filter capacitor filtering high integrated intelligent power module produced to influence the electric potential of each looks compressor floating power supply pin to each looks compressor output pin on avoiding adjacent electromagnetic interference coupling of walking between the line to the looks compressor floating power supply pin, be favorable to improving intelligent power module's reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a functional module schematic diagram of an embodiment of the highly integrated intelligent power module of the present invention;
fig. 2 is a schematic diagram of an internal circuit structure of an embodiment of the highly integrated intelligent power module according to the present invention;
fig. 3 is a schematic diagram of a circuit structure of an embodiment of the electronic control assembly to which the highly integrated intelligent power module of the present invention is applied;
fig. 4 is a schematic structural diagram of another embodiment of the electronic control assembly of the present invention.
The reference numbers illustrate:
| 10 | compressor IPM module | UVW- | Low-voltage reference pin of |
| 20 | Fan IPM module | ITRIP | Current detection pin of |
| 30 | PFC power module | FUVW- | Low-voltage reference pin of |
| 40 | Rectifier bridge | FITRIP | Fan current detection pin |
| C1～C6 | Filter capacitor of compressor | VSS3 | Single-point grounding pin |
| CF1～CF3 | Fan filter capacitor |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a high integrated intelligent power module.
Referring to fig. 1 to 4, in an embodiment of the present invention, the high-integrated smart power module includes:
a mounting substrate (not shown) having a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged at two sides along the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;
the compressor IPM module 10 and the fan IPM module 20 are respectively installed on the corresponding installation positions;
the three-phase compressor floating power supply pins VB1, VB2, VB3 and the three-phase compressor output pin U, V, W are installed at the strong electric pin installation side, and the three-phase compressor floating power supply pins VB1, VB2, VB3 and the three-phase compressor output pin U, V, W are respectively and electrically connected with the compressor IPM module 10;
three-phase fan floating power supply pins FVB1, FVB2, FVB3 and three-phase fan output pins FU, FV, FW are mounted on the strong current pin mounting side, and the three-phase fan floating power supply pins FVB1, FVB2, FVB3 and the three-phase fan output pins FU, FV, FW are respectively electrically connected to the fan IPM module 20; and the number of the first and second groups,
the compressor filter capacitors (C1-C6 and CF 1-CF 3) are arranged on the mounting substrate, and at least one of the compressor filter capacitors C1-C6 is arranged between the floating power supply pin and the compressor output pin of each phase in series;
and at least one fan filter capacitor CF 1-CF 3 is arranged between the fan floating power supply pin and the fan output pin of each phase in series.
In this embodiment, the mounting substrate may be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate. The mounting substrate is a mounting carrier for the power switching tube and the driving device, and the shape of the mounting substrate can be determined according to the specific position, number and size of the power switching tube, and can be square, but is not limited to square. The circuit wiring layer is formed on the mounting substrate, and corresponding lines and mounting positions, namely bonding pads, for mounting electronic elements in the power switch tube are formed on the mounting substrate according to the circuit design of the high-integration intelligent power module.
When the mounting substrate is realized by using an aluminum nitride ceramic mounting substrate, the aluminum nitride ceramic mounting substrate includes an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When the mounting substrate made of a metal material is used, the mounting substrate includes a heat dissipation layer, an insulating layer laid on the heat dissipation layer, and a circuit wiring layer formed on the insulating layer. In this embodiment, the mounting substrate may be a single-sided wiring board. The insulating layer is sandwiched between the circuit wiring layer and the metal mounting substrate. The insulating layer is used for realizing electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate and reflecting external electromagnetic interference, so that the power switch tube is prevented from being interfered by external electromagnetic radiation to normally work, and the interference influence of the electromagnetic radiation in the surrounding environment on electronic elements in the high-integration intelligent power module is reduced. The insulating layer can be made of materials such as thermoplastic glue or thermosetting glue, so that the mounting substrate and the circuit wiring layer are fixedly connected and insulated. The insulating layer can be realized by a high-heat-conductivity insulating layer which is realized by mixing one or more materials of epoxy resin, aluminum oxide and high-heat-conductivity filling material. In the process of manufacturing the mounting substrate, after an insulating layer is provided on the mounting substrate, a copper foil may be laid on the insulating layer, and the copper foil may be etched according to a predetermined circuit design, thereby forming a circuit wiring layer.
The elements in the high-integration intelligent power module can be patch-type electronic elements and can also be bare die wafers. The circuit wiring layer is provided with a plurality of mounting areas according to the requirements of function setting, and a plurality of mounting positions are formed in each mounting area. Specifically, the circuit wiring layer includes circuit wirings forming a current loop, and pads formed from the circuit wirings, elements of the highly integrated smart power module are disposed on the corresponding pads, and the compressor IPM module 1030 and the fan IPM module 20 may be electrically connected by the circuit wirings, metal binding wires, or the like. It is understood that when the electronic component is mounted on the mounting substrate 100, the entire wiring of the mounting substrate 100 may be copper-plated to meet the standard of disturbance voltage and the capability of interference resistance.
The compressor IPM module 10 is used for driving the compressor to work, and the fan IPM module 20 is used for driving the fan to work. Wherein, the compressor IPM module 10 includes:
the compressor inverter power module 11 and the compressor driving chip IC1 are mounted on the corresponding mounting positions, and the compressor inverter power module 11 is electrically connected with the compressor driving chip IC 1;
the fan IPM module 20 includes:
the fan inverter power module 21 and the fan driving chip IC2 are mounted on the corresponding mounting positions, and the fan inverter power module 21 is electrically connected with the fan driving chip IC 2.
In this embodiment, the compressor IPM module 10 is further provided with a compressor driver IC1, the number of the compressor driver ICs 1 may be one, for example, an HVIC driver chip, and the compressor driver IC1 is an integrated chip, in which four, six or seven driver circuits for driving the power switch tubes are integrated, and the integrated configuration may be specifically performed according to the number of the driven power switch tubes. The number of the compressor driving chips IC1 may also correspond to the number of the power switch tubes, that is, each compressor driving chip IC1 correspondingly drives one power switch tube to operate. When the intelligent power module works, the compressor driving chip IC1 outputs a corresponding control signal to control the conduction of the power switching tubes in the PFC power module 30 and the compressor inverter power module 11, so as to output driving power to drive the motor and other loads to work.
The compressor inverter power module 11 is provided with a plurality of power switching tubes, and the power switching tubes may be gallium nitride (GaN) power switching tubes, Si-based power switching tubes, or SiC-based power switching tubes. In practical application, the number of the power switch tubes may be four, or a multiple of four, or six, or a multiple of six, and the six power switch tubes (T1-T6) form an inverter circuit to drive the compressor to work.
In the compressor driving chip IC1, a high-side driving unit and a low-side driving circuit, a high-side driving unit and a low-side driving unit are each included. The input end of the compressor driving chip IC1 is connected to a main controller, that is, an MCU, in which a logic controller, a memory, a data processor, etc. and a software program and/or module stored in the memory and operable on the data processor are integrated, the MCU outputs a corresponding control signal to the compressor driving chip IC1 by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so as to drive the power switch tube in the compressor inverter power module 11 to turn on/off according to the control signal of the main controller, thereby driving the compressor to operate.
The fan IPM module 20 is further provided with a fan driving chip IC2, the number of the fan driving chips IC2 may be one, for example, an HVIC driving chip, and the fan driving chip IC2 is an integrated chip, in which four, six or seven driving circuits for driving the power switching tubes are integrated, and the integrated configuration may be specifically performed according to the number of the driven power switching tubes. The number of the fan driving chips IC2 may also correspond to the number of the power switch tubes, that is, each fan driving chip IC2 correspondingly drives one power switch tube to operate. When the intelligent power module works, the fan driving chip IC2 outputs a corresponding control signal to control the conduction of the power switch tube in the fan inverter power module 21, so as to output driving electric energy to drive the motor and other loads to work.
The fan inverter power module 21 is provided with a plurality of power switching tubes, and the power switching tubes may be gallium nitride (GaN) power switching tubes, Si-based power switching tubes, or SiC-based power switching tubes. In practical application, the number of the power switch tubes can be four, or a multiple of four, or six, or a multiple of six, and the six power switch tubes (TF 1-TF 6) form an inverter circuit to drive the fan to work.
In the fan drive chip IC2, a high-side drive unit and a low-side drive circuit, a high-side drive unit and a low-side drive unit are included. The input end of the fan driving chip IC2 is connected to a main controller, that is, an MCU, in which a logic controller, a memory, a data processor, etc. and a software program and/or module stored in the memory and operable on the data processor are integrated, the MCU outputs a corresponding control signal to the fan driving chip IC2 by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so as to drive the power switching tube in the fan inverter power module 21 to be turned on/off according to the control signal of the main controller, thereby driving the fan to operate.
The main controller can be independent from the intelligent power module 100 to the outside, and in practical application, the main controller and the highly integrated intelligent power module are arranged on the electric control board and are electrically connected through circuit wiring or a lead. Of course, in other embodiments, the main controller may be disposed in the smart power module 100 to improve the integration of the smart power module.
Referring to fig. 3, in the present embodiment, the power switching tubes in the compressor inverter power module 11 are all IGBTs, and the driver chip 101 is an HVIC chip. A VCC end of the HVIC tube IC1 is used as a positive end VDD of a low-voltage power supply of the high-integration intelligent power module, and the VDD is generally 15V; the HIN1 end of the HVIC tube IC1 is used as the U-phase upper bridge arm input end HIN1 of the high-integration intelligent power module; the HIN2 end of the HVIC tube IC1 is used as a V-phase upper bridge arm input end HIN2 of the high-integration intelligent power module; the HIN3 end of the HVIC tube IC1 is used as a W-phase upper bridge arm input end HIN3 of the high-integration intelligent power module; the LIN1 end of the HVIC tube IC1 is used as the LIN1 of the U-phase lower bridge arm input end of the high-integration intelligent power module; the LIN2 end of the HVIC tube IC1 is used as the V-phase lower bridge arm input end VLIN of the high-integration intelligent power module; the LIN3 end of the HVIC tube IC1 is used as the W-phase lower bridge arm input end LIN3 of the high-integration intelligent power module; the U, V, W three-phase six-path input of the high-integration intelligent power module receives 0-5V input signals; the VSS end of the HVIC tube IC1 is used as a low-voltage area power supply negative end VSS1 and VSS3 of the high-integrated intelligent power module, wherein a VSS1 pin is at a logic end and is adjacent to low-voltage pins such as VDD and the like, and a VSS3 pin is at a high-voltage side and is adjacent to UVW and ITRIP pins; an ITRIP end of the HVIC tube IC1 is used as an overcurrent protection detection end VSS3 of the high-integration intelligent power module; the VB1 end of the HVIC tube IC1 is used as a positive end UVB of a power supply source of a U-phase high-voltage area of the high-integration intelligent power module; the HO1 end of the HVIC tube IC1 is connected with the grid electrode of a U-phase upper bridge arm IGBT tube T1; the VS1 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T1, the anode of the FRD tube D1, the collector of the U-phase lower bridge arm IGBT tube T4 and the cathode of the FRD tube 1T4 and serves as the negative terminal UVS of the U-phase high-voltage area power supply of the high-integration intelligent power module; the VB2 end of the HVIC tube IC1 is used as a power supply positive end VVB of a U-phase high-voltage area power supply of the high-integration intelligent power module; the HO3 end of the HVIC tube IC1 is connected with the grid electrode of a V-phase upper bridge arm IGBT tube T3; the VS2 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T2, the anode of the FRD tube D2, the collector of the V-phase lower bridge arm IGBT tube T5 and the cathode of the FRD tube D5 and serves as the power supply negative end VVS of the W-phase high-voltage area of the high-integration intelligent power module; the VB3 end of the HVIC tube IC1 is used as a W-phase high-voltage area power supply positive end WVB of the high-integration intelligent power module; the HO3 end of the HVIC tube IC1 is connected with the grid electrode of the W-phase upper bridge arm IGBT tube T3; the VS3 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T3, the anode of the FRD tube D3, the collector of the W-phase lower bridge arm IGBT tube T6 and the cathode of the FRD tube T6 and serves as the negative end WVS of the W-phase high-voltage area power supply of the high-integration intelligent power module; the LO1 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube T4; the LO2 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube T5; the LO3 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube T6; the LO3 end of the HVIC tube IC1 is connected with the grid electrode of the IGBT tube 126; the emitter of the IGBT tube T4 is connected with the anode of the FRD tube T4 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube T5 is connected with the anode of the FRD tube D5 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube T6 is connected with the anode of the FRD tube T6 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the collector of the IGBT tube T1, the cathode of the FRD tube D1, the collector of the IGBT tube T2, the cathode of the FRD tube D2, the collector of the IGBT tube T3 and the cathode of the FRD tube D3 are connected and used as a high-voltage input end P of the high-integration intelligent power module, and the P is generally connected with 300V. The HVIC tube IC1 has the following functions: and respectively transmitting 0-5V logic signals of input terminals HIN1, HIN2, HIN3, LIN1, FLIN2 and FLIN3 to output terminals FHO1, FHO2, FHO3, FLO1, FLO2 and FLO3, wherein FHO1, FHO2 and FHO3 are logic signals of VS-VS +15V, and FLO1, FLO2 and FLO3 are logic signals of 0-15V. Overcurrent protection is realized by detecting current output by UVW through ITRIP.
In the above embodiment, a path of RC filter circuit is further disposed between each input end of the compressor IPM module 10 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current limiting resistor and a pull-up resistor are further arranged between the temperature feedback pin TH of the compressor IPM module 10 and the MCU. A current limiting resistor and a pull-up resistor are also arranged between the fault feedback pin and the MCU. A compressor filter capacitor is disposed between the power terminal of the compressor driver IC1 and the ground terminal to filter out electromagnetic interference between an external power source and the power terminal of the compressor driver IC 1.
In this embodiment, the power switching tubes in the fan inverter power module 21 are all IGBTs, and the fan driving chip IC2 is an FHVIC chip. A VCC end of a fan HVIC tube IC2 is used as a positive end FVDD of a low-voltage area power supply of the high-integration intelligent power module, and the FVDD is generally 15V; the HIN1 end of the HVIC tube IC2 is used as the U-phase upper bridge arm input end FHIN1 of the high-integration intelligent power module; the HIN2 end of the fan HVIC tube IC2 is used as the V-phase upper bridge arm input end VFHIN of the high-integration intelligent power module; the HIN3 end of the fan HVIC pipe IC2 is used as the HIN2 end of the W-phase upper bridge arm of the high-integration intelligent power module; the LIN1 end of the blower HVIC tube IC2 is used as the U-phase lower bridge arm input end FLIN1 of the high-integration intelligent power module; the LIN2 end of the blower HVIC tube IC2 is used as the V-phase lower bridge arm input end FLIN2 of the high-integration intelligent power module; the LIN3 end of the blower HVIC tube IC2 is used as the W-phase lower bridge arm input end FLIN3 of the high-integration intelligent power module; the U, V, W three-phase six-path input of the high-integration intelligent power module receives 0-5V input signals; the GND end of the blower HVIC tube IC2 is used as a low-voltage area power supply negative end VSS2 of the high-integration intelligent power module, wherein a VSS2 pin is at a logic end and is adjacent to low-voltage pins such as FVDD and the like, a VSS3 pin is at a high-voltage side and is adjacent to UVW and FIRIP pins; an ITRIP end of the blower HVIC tube IC2 is used as an overcurrent protection detection end FITIP of the high-integration intelligent power module; the VB1 end of the HVIC tube IC1 is used as a positive end UVB of a power supply source of a U-phase high-voltage area of the high-integration intelligent power module; the HO1 end of the HVIC2 is connected with the grid electrode of a U-phase upper bridge arm IGBT tube FT 1; the VS1 end of the HVIC2 is connected with the emitter of the IGBT tube FT1, the anode of the FRD tube D1, the collector of the U-phase lower bridge arm IGBT tube FT4 and the cathode of the FRD tube FT4 and serves as the negative end UVS of the U-phase high-voltage area power supply of the high-integration intelligent power module; the VB2 end of the fan HVIC tube IC2 is used as the positive end VVB of the power supply of the U-phase high-voltage area of the high-integration intelligent power module; the HO3 end of the fan HVIC tube IC2 is connected with the grid electrode of a V-phase upper bridge arm IGBT tube FT 3; the VS2 end of the HVIC2 is connected with the emitter of the IGBT tube FT2, the anode of the FRD tube, the collector of the V-phase lower bridge arm IGBT tube FT5 and the cathode of the FRD tube and serves as the negative end VVS of the W-phase high-voltage area power supply of the high-integration intelligent power module; the VB3 end of the fan HVIC tube IC2 is used as the positive end WVB of the power supply of the W-phase high-voltage area of the high-integration intelligent power module; the HO3 end of the fan HVIC tube IC2 is connected with the grid electrode of the W-phase upper bridge arm IGBT tube FT 3; the VS3 end of the fan HVIC tube IC2 is connected with the emitter of the IGBT tube FT3, the anode of the FRD tube, the collector of the W-phase lower bridge arm IGBT tube FT6 and the cathode of the FRD tube FT6 and serves as the negative end WVS of the power supply of the W-phase high-voltage area of the high-integration intelligent power module; the LO1 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 4; the LO2 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 5; the LO3 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 6; the LO3 end of the blower HVIC tube IC2 is connected with the grid electrode of the IGBT tube FT 6; the emitter of the IGBT tube FT4 is connected with the anode of the FRD tube FT4 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube FT5 is connected with the anode of the FRD tube and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the emitter of the IGBT tube FT6 is connected with the anode of the FRD tube FT6 and is used as a three-phase low-voltage reference pin UVW-of the high-integration intelligent power module; the collector electrode of the IGBT tube FT1, the cathode of the FRD tube, the collector electrode of the IGBT tube FT2, the cathode of the FRD tube, the collector electrode of the IGBT tube FT3 and the cathode of the FRD tube are connected and used as a high-voltage input end P of the high-integration intelligent power module, and the high-voltage input end P is generally connected with 300V. The blower HVIC pipe IC2 has the following functions: the logic signals of 0-5V of input terminals FKIN 1, FKIN 2, FKIN 3, FLIN1, FLIN2 and LIN3 are respectively transmitted to output terminals HO1, HO2, HO3, LO1, LO2 and LO3, wherein HO1, HO2 and HO3 are the logic signals of VS-VS +15V, and LO1, LO2 and LO3 are the logic signals of 0-15V. Overcurrent protection is realized by detecting current output by UVW through ITRIP.
In the above embodiment, a path of RC filter circuit is further disposed between each input end of the fan IPM module 20 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current limiting resistor and a pull-up resistor are further arranged between the temperature feedback pin TH of the fan IPM module 20 and the MCU. A current limiting resistor and a pull-up resistor are also arranged between the fault feedback pin and the MCU. A fan filter capacitor is arranged between the power supply end of the fan driving chip IC2 and the grounding end to filter out electromagnetic interference between an external power supply and the power supply end of the fan driving chip IC 2. A fan filter capacitor is arranged between the power supply end of the fan driving chip IC2 and the grounding end to filter out electromagnetic interference between an external power supply and the power supply end of the fan driving chip IC 2.
The pins of the highly integrated intelligent power module can be implemented by gull-wing pins or direct-insert pins, and the embodiment is preferably direct-insert pins, and the pins correspond to the pad positions on the mounting positions and are electrically connected with the compressor driving chip IC1 and the fan driving chip IC2 through metal wires.
It should be noted that, as a microelectronic device, considering the application environment of microelectronics, the area of the mounting substrate is not suitable to be set large, that is, in a limited area, the compressor IPM module 10 and the fan IPM module 20 are disposed on the mounting substrate, there are many circuit wirings, signal interference between the compressor IPM module 10 and the fan IPM module 20, avoidance between the circuit wirings, strong and weak electrical isolation between the driving IC in the compressor IPM module 10 and the fan IPM module 20 and the power switch tube in the inverter module, and isolation between the heat source of the high-power device and the non-heat source such as the driving IC are considered. Therefore, when manufacturing the high-integration intelligent power module, the size of the high-integration intelligent power module, the isolation between strong and weak current between devices, the isolation between a heat source and a non-heat source, and the line distance and the line width between lines are considered to meet the requirements of safety specifications. Because the lines are dense, and a longer distance exists between the device and the pins, the wires are necessarily bent to avoid other parts on the wires, the distance is further increased, parasitic inductance is easily formed on the leads, and parasitic capacitance is easily formed between the dense lines.
The compressor driving chip IC1 and the fan driving chip IC2 in the intelligent power module are mostly powered by a single power supply, the low-voltage side directly uses a direct-current power supply for power supply, and the high-voltage side is in a floating state, so that the high-voltage side driving circuit is powered by a floating power supply mode mostly, and the common floating power supply mode has two modes of bootstrap capacitor power supply and charge pump power supply. The bootstrap capacitor supplies power through a bootstrap circuit formed by externally connected elements such as a diode, a resistor and a capacitor, so as to improve the utilization rate of a power supply.
For example, when a lower arm power tube of a half-bridge structure in the power inverter module is turned on and an upper arm power tube is turned off, the high-side floating power supply drops with the drop of the high-side floating ground voltage, and when the high-side floating power supply drops below the direct-current power supply voltage and the voltage difference between the high-side floating power supply and the direct-current power supply exceeds the conduction voltage drop of the bootstrap diode, the direct-current power supply charges the bootstrap capacitor through the bootstrap diode. When the upper bridge arm power tube is turned on and the lower bridge arm power tube is turned off, the high-side floating power supply rises along with the rise of the high-side floating ground voltage, the voltage of the high-side floating power supply far exceeds the voltage of the direct-current power supply, the bootstrap diode is turned off, and the bootstrap capacitor supplies power to the high-side circuit. Bootstrap floating power supply pin VB is used for supplying power for the upper bridge IGBT grid, if it receives the interference, leads to IGBT spurious triggering easily, can burn out high integrated intelligent power module when serious. In addition, in the highly integrated smart power module, since the power density is increased, the number of circuit wirings is increased, the electromagnetic interference is increased, and VB is particularly susceptible to interference.
Therefore, in this embodiment, at least one compressor filter capacitor is disposed between the floating power supply pins VB1, VB2, VB3 of the three-phase compressor of the compressor inverter power module 11 and the output pin U, V, W of the three-phase compressor to filter the interference introduced from the peripheral circuit by the floating power supply pins of each phase of compressor, so as to prevent the interference from affecting the potential of the floating power supply pins of each phase of compressor to the output pins of each phase of compressor, and a fan filter capacitor is disposed between the floating power supply pins FVB1, FVB2, FVB3 of the three-phase fan of the fan inverter power module 21 and the output pins FU, FV, FW of the three-phase fan, so as to filter the interference introduced from the peripheral circuit by the floating power supply pins of each phase of fan, so as to prevent the interference from affecting the potential of the floating power supply pins of each phase of fan to the output pins of each phase of fan. This embodiment can also be through the electromagnetic interference that each filter capacitance filtering high integrated intelligent power module internal lead produced to influence the electric potential of each looks compressor floating power supply pin to each looks compressor output pin on avoiding adjacent electromagnetic interference coupling of walking between the line to the looks compressor floating power supply pin, be favorable to improving intelligent power module's reliability.
Referring to fig. 2 and 3, in order to further improve filtering capability, in the above embodiment, the number of the compressor filter capacitors serially connected between the floating power supply pin of the compressor and the output pin of the compressor of each phase is two, the two compressor filter capacitors are respectively a first filter capacitor C1, C2, C3 and a second filter capacitor C4, C5, C6, and the first filter capacitors C1, C2, C3 and the second filter capacitors C4, C5, C6 are arranged in parallel.
The first filter capacitors C1, C2 and C3 are arranged on the mounting substrate close to the fan floating power supply pins VB1, VB2, VB3 and a fan output pin U, V, W;
in this embodiment, one of the two filter capacitors serially connected between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pin U, V, W of each phase is disposed close to the fan floating power supply pins VB1, VB2, VB3 and the fan output pin U, V, W, and the other of the two filter capacitors serially connected between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pin U, V, W of each phase is close to the compressor driver IC 1.
The first filter capacitor is arranged at a position close to the pins, and the distance between the first filter capacitor and the pins of the compressor floating power supply and the pins of the compressor output pin is less than 5 mm; the second filter capacitor is arranged close to the compressor driving chip IC1, and the distance between the second filter capacitor and the compressor driving chip IC1 is less than 10 mm. The filter capacitor is positioned beside the pin and used for filtering interference from a peripheral circuit, which is transmitted from the pin, and avoiding the interference from influencing the potential of the floating power supply pin of the compressor to the output pin of the compressor or interfering adjacent wiring; because there is a longer wiring distance from the compressor floating power supply pin and the compressor output pin to the compressor driving chip IC1, the wiring may be subject to electromagnetic interference from peripheral wiring, resulting in unstable voltage, so that the filter capacitor located beside the compressor driving chip IC1 is used for filtering out these interferences, and it is ensured that the normal operation of the compressor driving chip IC1 is not affected. The second smoothing capacitors C4, C5, C6 are disposed on the mounting substrate adjacent to the compressor driving chip IC 1. Specifically, filter capacitors C1 and C4 are arranged between a U-phase compressor floating power supply pin VB1 and a U-phase compressor output pin U in series, a first filter capacitor C1 is arranged close to the U-phase compressor floating power supply pin VB1 and the U-phase compressor output pin, and a second filter capacitor C4 is arranged close to a compressor driving chip IC 1; filter capacitors C2 and C5 are arranged between a V-phase compressor floating power supply pin B1 and a V-phase compressor output pin V in series, a second filter capacitor C2 is arranged close to the V-phase compressor floating power supply pin VB2 and the V-phase compressor output pin, and a second filter capacitor C5 is arranged close to a compressor driving chip IC 1; a filter capacitor C3 and a filter capacitor C6 are arranged between a W-phase compressor floating power supply pin VB3 and a W-phase compressor output pin V in series, a first filter capacitor C3 is arranged close to the W-phase compressor floating power supply pin VB3 and the W-phase compressor output pin, and a second filter capacitor C4 is arranged close to a compressor driving chip IC 1.
Referring to fig. 2 and 3, in an embodiment, the fan filter capacitors CF1, CF2 and CF3 arranged in series between the fan floating power supply pins FVB1, FVB2, FVB3 and the fan output pins FU, FV and FW of each phase are arranged near the fan floating power supply pins FVB1, FVB2, FVB3 and the fan output pins U, FV and FW; and/or disposed proximate to the fan drive chip IC 2. Namely, a fan filter capacitor CF1 is arranged between a U-phase fan floating power supply pin FVB1 and a U-phase fan output pin U in series; a fan filter capacitor CF2 is arranged between a V-phase fan floating power supply pin FVB2 and a V-phase fan output pin U in series; a fan filter capacitor CF3 is arranged between the W-phase fan floating power supply pin FVB3 and the W-phase fan output pin W in series.
In this embodiment, it can be understood that the power of the compressor motor is greater than that of the fan motor, so when the compressor and the fan are driven to operate, the power of the power device in the compressor IPM module 10 is greater than that of the power device in the fan IPM module 20, and compared with the compressor inverter power module 11, the driving current of the fan inverter power module 21 is also smaller, that is, the working current is smaller, so that the generated interference is relatively less, and therefore, only one set of fan filter capacitors may be provided. The group of fan filter capacitors can be arranged beside the pins to filter the interference from peripheral circuits transmitted from the pins, and avoid the interference from influencing the potential of the fan floating power supply pins to the fan output pins or interfering adjacent wiring; because there is a longer distance of routing from the floating power supply pin of the fan and the fan output pin to the fan driving chip IC2, this section of routing may receive the electromagnetic interference of peripheral routing, resulting in unstable voltage, and the fan filter capacitor may also be disposed on the fan driving chip IC2 to filter these interferences and ensure that the normal operation of the compressor driving chip IC1 is not affected.
Referring to fig. 2 and 3, in an embodiment, the highly integrated smart power module further includes:
the PFC inductance connection end PFC + is connected with one end of an external inductor;
the bus capacitor connecting end P is connected with an external bus capacitor;
the PFC power module 30 includes a PFC power switching tube and a PFC diode, an input end of the PFC power switching tube is interconnected with the PFC inductor connection end and an anode of the PFC diode, and an output end of the PFC power switching tube is connected with the PFC inductor connection negative end; and the cathode of the PFC diode is connected with the connecting end of the bus capacitor.
In this embodiment, one end of the external inductor is connected to the positive output terminal DC + of the rectifier bridge 10, and the other end of the external inductor is connected to the negative output terminal DC-of the rectifier bridge 10 through the PFC power switch tube T7. The external inductor, the bus capacitor, the rectifier bridge 10, the PFC diode D8, and the PFC power switch tube T7 form a complete PFC circuit. The PFC circuit may be a boost PFC circuit, or a buck PFC circuit, or a boost PFC circuit. The present embodiment may be a boost PFC circuit, that is, the PFC diode D8 is a boost diode. In the PFC power switch module 30, only the PFC power switch tube T7 and the PFC diode D8 may be integrated in the smart power module, or PFC circuits including other components such as a bus capacitor and an inductor may be integrated in the smart power module. The present embodiment is not integrated in the smart power module due to volume and the like. The PFC circuit performs power factor adjustment on the direct current, and the adjusted direct current is output to the power input end of the inverter bridge circuit 10, so that each power module drives a corresponding load to operate. The regulated direct current can also generate working voltage of 5V and other driving chips so as to provide working voltage for circuit modules such as a main controller.
In the working process of the PFC power module 30, two working processes of boosting and energy storage are provided, and when boosting is performed, the PFC power switch tube T7 is cut off, the external inductor outputs the electric energy output by the rectifier bridge 10 and the stored electric energy to the compressor inverter power module 11 and the fan inverter power module 21 through the PFC diode D8, so that electric energy is released to charge the bus capacitor, and boosting is achieved. When the PFC power switch tube T7 is turned on, the external inductor is connected to the negative output terminal of the rectifier bridge 10 through the PFC power switch tube T7 to store energy.
In the above embodiment, the PFC power switch T7 is disposed close to the rectifier bridge 10, and the PFC diode D8 is disposed close to the IPM module 30, so that the length of the lead between the PFC power switch T7 and the rectifier bridge 10 and the length of the lead between the PFC diode D8 and the compressor inverter power module 11 can be shortened, and the electromagnetic interference of the PFC power switch T7 to the compressor inverter power module 11 can be avoided.
Referring to fig. 2 and 3, in an embodiment, the output terminal of the PFC power switch is electrically connected to the single-point ground pin VSS 3;
and/or the output end of the PFC power switch tube is electrically connected with the grounding end of the compressor driving chip IC 1.
In this embodiment, an output terminal pin of the PFC power switch tube, that is, an emitter of the PFC IGBT (T7), is disposed at a strong current pin mounting side, the output terminal of the PFC power switch tube may be electrically connected to the single-point ground pin VSS3 through an internal trace, and the output terminal of the PFC power switch tube may also be directly electrically connected to the ground terminal VSS1 of the compressor driving chip IC1 through an internal trace, so that a trace distance between the PFC power switch tube and the weak current ground pin of the compressor driving chip IC1 may be shortened, thereby reducing parasitic inductance on the trace. Meanwhile, the driving loop of the driving circuit from the HVIC to the IGBT grid electrode to the emitter electrode and back to the HVIC ground end can be made to be shortest, and therefore the switching speed of the PFC power switching tube is improved.
Referring to fig. 2 and 3, in an embodiment, the highly integrated smart power module further includes:
and the output end of the rectifier bridge 40 is connected with the PFC inductor.
In this embodiment, the rectifier bridge 40 includes a first diode D9, a second diode D10, a third diode D11 and a fourth diode D12, wherein the first diode D9 and the second diode D10 are disposed on a sub-mounting location; the third diode D11 and the fourth diode D12 are respectively arranged on two different mounting positions; the anode of the first diode D9 is electrically connected with the cathode of the third diode D11, and the cathode of the first diode D9 is electrically connected with the cathode of the second diode D10; an anode of the second diode D10 is electrically connected to a cathode of the fourth diode D12. In this embodiment, the first diode D9 and the second diode D10 are two diodes sharing a cathode, and the third diode D12 and the fourth diode D12 are two diodes sharing an anode. The two diodes sharing the anode are arranged on one sub-mounting position and are electrically connected through the mounting position, and the two diodes sharing the cathode are respectively arranged on two different sub-mounting positions and are electrically connected through the other mounting position. Thus, the number of mounting positions can be reduced, so that the area of the rectifier bridge 40 on the mounting substrate 100 is reduced, the structure of the highly integrated intelligent power module is compact, and the overall area is reduced. And simultaneously, the steps of wiring and wire bonding can be reduced.
It can be understood that, when the intelligent power module is applied to a refrigeration device, such as an air conditioner, a refrigerator, etc., the IPM module 30 can be used to drive a fan, a compressor, etc. to work, that is, the rectifier bridge 40, the compressor IPM module 10 and the PFC power module 30 are integrated into a whole in this embodiment, so as to form a three-in-one compressor intelligent power module. Or, the rectifier bridge 40, the fan IPM module 20 and the PFC power module 30 are integrated into a whole to form a three-in-one fan intelligent power module. Of course, in other embodiments, the rectifier bridge 40, the PFC power module 30, the compressor IPM module 10 and the fan IPM module 20 may be integrated into a whole to form a four-in-one high-integration intelligent power module. An inrush current protection circuit is further disposed between the output end of the rectifier bridge 40 and the PFC power module 30 to absorb an inrush current output from the rectifier bridge 40 to the PFC power module 30, so as to avoid damaging a PFC diode in the PFC power module 30.
Referring to fig. 2 and 3, it should be noted that, in order to avoid damage to the motor and the high-integrated intelligent power module when the motor is in overcurrent, an overcurrent protection function is integrated in the high-integrated intelligent power module, specifically, a compressor overcurrent detection pin (abbreviated as ITRIP or ITRIP) and a fan overcurrent detection pin FITRIP are respectively provided on a mounting substrate of the high-integrated intelligent power module for a compressor and a fan to detect a voltage drop across an external current detection resistor, when the voltage drop exceeds a certain threshold, levels on the compressor overcurrent detection pin and the fan overcurrent detection pin FITRIP are inverted, for example, from a high level to a low level, or from a low level to a high level, so as to trigger a protection function of an IC inside the IPM, and the module stops working to perform a protection function. In addition, when the high-integration intelligent power module is applied to an electrical apparatus such as an air conditioner, a refrigerator, a washing machine, or an inverter, the high-integration intelligent power module and the external sampling resistor are both mounted on an electronic control board (e.g., a PCB), and in consideration of the application environment of microelectronics, the area of the mounting substrate is not suitable to be set large, that is, in a limited area, the compressor IPM module 10 and the fan IPM module 20 are mounted on the mounting substrate, and signal interference between the compressor IPM module 10 and the fan IPM module 20, avoidance between circuit wirings, strong and weak electrical isolation between a driving IC in the compressor IPM module 10 and the fan IPM module 20 and a power switch tube in the inverter module, and isolation between a heat source of a high-power device and a non-heat source such as the driving IC are required to be considered. Therefore, in the wiring of the electronic control board PCB, it is necessary to connect to the ground at one point as much as possible, and particularly, a strong ground (output of the lower bridge IGBT emitter) and a weak ground (VSS or COM pin of IPM and ground of MCU) should be connected by one point. In addition, in actual wiring, parasitic inductance is introduced into the line, and in current detection, the parasitic inductance greatly affects detection. However, the lower bridge emitter pin of the compressor IPM and fan IPM module 20 is generally placed together with the high voltage pin in order to make the high voltage and high current routing shorter; the compressor current sense pin ITRIP, the logic ground pin, is typically placed together with other low voltage logic pins to shorten the distance of the other logic pins to logic ground. In addition, the lower bridge emitter pin between the compressor IPM and the fan IPM module 20 is usually set far away, and the ground pin is not usually set on the high voltage side, so that the pin is set for the high integrated intelligent power module, and on the electrical control board PCB wiring, the wiring distance between the high integrated intelligent power module and the external device and the wiring distance are increased, which easily increases parasitic inductance, resulting in inaccurate overcurrent protection, or logically easily affected by high voltage.
Therefore, in the embodiment, the compressor low-voltage reference pin UVW-, the fan low-voltage reference pin FUVW-, the compressor current detection pin itrp, the fan current detection pin FITRIP and the single-point ground pin VSS3 are all arranged on the strong current pin mounting side, and the compressor current detection pin itrp is electrically connected with the current feedback end of the compressor driving chip IC1 through wiring and binding wires on the internal circuit wiring layer of the high-integration intelligent power module. Two ground terminals VSS are provided on the compressor driver IC1, and a strong-side single-point ground pin and a weak-side weak-current ground pin VSS1 are electrically connected to each other inside the compressor driver IC 1. Thus, the single-point grounding pin VSS3 can be electrically connected with the low-voltage power supply of the compressor driving chip IC1 through wiring and binding wires on the internal circuit wiring layer of the high-integration intelligent power module, and when the external power supply supplies power to the compressor driving chip IC1, the low-voltage power supply 302 arranged on the weak current pin installation side can be electrically connected with the single-point grounding pin VSS 3. When the compressor low-voltage reference pin UVW-is electrically connected with the high-voltage power supply 301 of the external power supply through the external current detection resistor 201, the compressor low-voltage reference pin UVW-is also electrically connected with the single-point grounding pin VSS3 through the external current detection resistor 201. Similarly, the fan current detection pin FITRIP is electrically connected with the current feedback end of the fan driving chip IC2 through routing wires and binding wires on the wiring layer of the internal circuit of the high-integration intelligent power module, and two grounding terminals VSS are arranged on the fan driving chip IC2, so that the single-point grounding pin on the strong current side and the weak current grounding pin VSS2 on the weak current side are electrically connected inside the fan driving chip IC 2. Therefore, the single-point grounding pin VSS3 can be electrically connected with the low-voltage power supply of the fan driving chip IC2 through wiring and binding wires on the wiring layer of the internal circuit of the high-integration intelligent power module, and when the external power supply supplies power to the fan driving chip IC2, the low-voltage power supply 302 arranged on the weak current pin installation side can be electrically connected with the single-point grounding pin VSS 3. When the low-voltage reference pin FUVW-of the fan is electrically connected with the high-voltage power supply 301 of the external power supply through the external current detection resistor 201, the low-voltage reference pin FUVW-is electrically connected with the single-point grounding pin VSS3 through the external current detection resistor 201. That is, the strong ground (lower bridge IGBT emitter output) and the weak ground (VSS1, VSS2 pins) of the external power supply realize single-point grounding on the single-point grounding pin VSS3 of the highly integrated smart power module, and the wiring distance between the strong ground and the weak ground can be shortened without providing a separate single-point grounding point on the electronic control board. And, when carrying out the wiring of automatically controlled board PCB, external current detection resistance 201 sets up the periphery at the forceful electric power pin installation side of high integrated intelligent power module, and compressor current detection foot ITRIP also sets up at forceful electric power pin installation side, can shorten the line distance of walking between compressor current detection foot ITRIP and fan current detection foot FITIRIP and external current detection resistance 201 to reduce the parasitic inductance on walking the line, because the reduction of parasitic inductance, can solve the problem that high integrated intelligent power module triggers by mistake.
It can be understood that the driving current of the compressor inverter power module 11 flows from the driving terminal of the compressor driving chip IC1 to the compressor low voltage reference pin UVW of the compressor inverter power module 11, then flows from the compressor low voltage reference pin UVW to the single point ground pin VSS3 outside the smart power module, and then flows back to the gate from the single point ground pin on the high voltage side of the compressor driving chip IC1, thereby forming a driving loop. Similarly, the driving current of the fan inverter power module 21 flows from the driving end of the fan driving chip IC2 to the fan low-voltage reference pin FUVW-, then flows from the fan low-voltage reference pin FUVW-to the single-point grounding pin VSS3 outside the intelligent power module, and then flows back to the gate from the single-point grounding pin on the high-voltage side of the fan driving chip IC2 to form a driving loop.
The utility model discloses can also shorten the line of walking of drive current return circuit to reduce and walk the parasitic inductance on the line, and improve the switching speed of switch tube among the power module 20, and because the reduction of parasitic inductance, can also solve the problem that intelligent power module triggered by mistake. In addition, in this embodiment, the grounding end of the power module 20 on the strong current installation side is directly inside the high-integration intelligent power module without external wiring (specifically, the compressor driving chip IC1 may be connected to the compressor weak current grounding pin VSS1 on the weak current installation side, or the blower driving chip IC2 may be connected to the blower weak current grounding pin VSS2 on the weak current installation side), and the wiring requirement of the wiring is not considered, so that the peripheral electronic control wiring of the intelligent power module may be facilitated, and the wiring difficulty of the electronic control board of the electrical equipment is reduced.
Referring to fig. 2 and 3, in an embodiment, the compressor low voltage reference pin UVW-, the compressor current detection pin ITRIP, the single point ground pin VSS3, and the blower low voltage reference pin FUVW-, the blower current detection pin FITRIP are adjacently disposed at the strong electric pin mounting side.
Referring to fig. 4, Ls1 to Ls4 in the drawing indicate equivalent parasitic inductances in the lines, and when the connection between the compressor current detection pin ITRIP and the external compressor current detection resistor 201 and the compressor low voltage reference pin UVW- (lower bridge emitter pin) is connected at point a (near the lower bridge emitter pin), the voltage of the compressor current detection pin ITRIP is affected by Ls1 above the track resistor. Similarly, when the connection between the fan current detection pin FITRIP and the external fan current detection resistor 201 and the fan low voltage reference pin FUVW- (lower bridge emitter pin) is connected at point a (near the lower bridge emitter pin), the voltage of the fan current detection pin FITRIP is affected by Ls1 above the routing resistor. The resistance of the trace causes the transition level to drop because it corresponds to adding a series resistance to the shunt resistance (current sense resistor 201). Ls1 generates voltage spike when reverse recovery current flows, which is easy to cause false triggering, so the connection point needs to be set at point B in the figure, that is, close to (external current detection resistor 201), at this time Ls1 is equivalent to a filter with a large time constant, which can filter the voltage spike, and reduce the noise influence of Ls1 to the maximum extent through the ITRIP wiring of the compressor current detection pin. Therefore, in this embodiment, the compressor lower bridge emitter pin (UVW-), the compressor current detection pin itrp (ITRIP or ITRIP), the fan low voltage reference pin FUVW-, the fan current detection pin FITRIP, the single-point grounding pin VSS3 are disposed as close as possible, so that the routing distance on the IPM external electrical control wiring can be shortened as much as possible, that is, when peripheral electrical control wiring is performed, the routing distances from the compressor lower bridge emitter pin UVW- (fan lower bridge emitter pin FUVW-) to the sampling resistor, from the external sampling resistor to the compressor current detection pin itrp (fan current detection pin FITRIP), from the compressor current detection pin itrp (fan current detection pin FITRIP) to the ground, and from the external current detection resistor 201 to the ground are all shortened to the shortest. The Ls 2-Ls 4 are reduced as much as possible, so that the influence of parasitic inductance on current detection is reduced, the current detection is ensured not to be interfered, and reliable current protection and measurement performance are obtained. Meanwhile, the single-point grounding point is reduced, the compressor low-voltage reference pin UVW-, the compressor current detection pin ITRIP and the fan low-voltage reference pin FUVW-, the fan current detection pin FITIRIP are arranged close to each other as much as possible, and the internal wiring distance can be reduced. Because the three pins of the low-voltage reference pin UVW-, the compressor current detection pin ITRIP and the single-point grounding pin VSS3 are adjacent, the wiring distances from the low-voltage reference pin UVW-to the external current detection resistor 201, from the external current detection resistor 201 to the compressor current detection pin ITRIP, from the compressor current detection pin ITRIP to the single-point grounding pin VSS3 and from the external current detection resistor 201 to the single-point grounding pin are all shortened to be shortest, the influence of parasitic inductance can be reduced, and the current detection is ensured not to be interfered.
Referring to fig. 2 and 3, in an embodiment, the weak current pin mounting side is provided with a first low voltage power supply positive terminal pin VDD, a second low voltage power supply positive terminal pin FVDD, a first low voltage power supply negative terminal pin VSS1 and a second low voltage power supply negative terminal pin VSS 2;
the power supply end of the compressor driving chip IC1 is electrically connected with the first low-voltage power supply positive terminal pin VDD;
the power supply end of the fan driving chip IC2 is electrically connected with the second low-voltage power supply positive terminal pin FVDD;
the grounding end of the compressor driving chip IC1 is electrically connected with the first low-voltage power supply negative terminal pin VSS 1;
the ground terminal of the fan driving chip IC2 is electrically connected to the second low voltage power supply negative terminal pin VSS 2.
It can be understood that, the driving voltages of the two driving chips can be set to be the same, or can be set to be different, and the present embodiment sets two sets of low-voltage power supply positive terminal pins and low-voltage power supply negative terminal pins on the weak current pin mounting side, that is, the compressor driving chip IC1 and the fan driving chip IC2 are respectively connected to different power pins and the same weak current grounding pin. So, can shorten two driver chip to the distance of low pressure power supply positive terminal pin and low pressure power supply negative terminal pin, shorten lead wire length, can also reduce the complexity of external circuit wiring simultaneously. The low-voltage power supply and the strong-current power supply are grounded in a single point by arranging two weak-current grounding pins to be connected with the low-voltage power supply, the circuit wiring complexity of the high-integration intelligent power module can be reduced,
further, in the above embodiment, the single-point ground pin VSS3 is respectively connected to the ground terminals of the compressor driver IC1 and the fan driver IC 2.
In this embodiment, the single-point grounding pin VSS3 and the first low-voltage power supply negative terminal pin (compressor weak current grounding pin) VSS1 are both connected to the ground terminal of the compressor driver IC1, and the single-point grounding pin VSS3 and the second low-voltage power supply negative terminal pin (fan weak current grounding pin) VSS2 can be electrically connected through the fan driver IC 2. The common point for realizing single-point grounding is arranged on the high-integration intelligent power module, the high-voltage side ground passes through the single-point grounding pin VSS3 and passes through the interior of the module (particularly the interior of a driving chip) to reach the low-voltage side compressor weak current grounding pin VSS1 and the fan weak current grounding pin VSS2, so that convenient single-point grounding is formed, and the length of the ground wire is reduced. So, can shorten the line of walking when strong electric ground and weak electric ground realize single-point ground connection, can realize the electricity between the earthing terminal of strong electric installation side and the compressor weak electric grounding pin VSS1 and the fan weak electric grounding pin VSS2 of weak electric installation side and connect on high integrated intelligent power module, thereby need not to set up the earth point again on automatically controlled board and connect, and then need not to consider the ann rule requirement of walking the line, the peripheral automatically controlled wiring of high integrated intelligent power module of can being convenient for, thereby reduce electrical equipment's automatically controlled board wiring degree of difficulty, be favorable to improving high integrated intelligent power module's reliability. The utility model provides a high integrated intelligent power module overcurrent protection false triggering easily, lead to the poor problem of high integrated intelligent power module reliability.
The utility model discloses still provide an automatically controlled subassembly.
Referring to fig. 3, the electronic control assembly includes a main controller, a low voltage power supply (not shown), a high voltage power supply (not shown), a compressor current detection resistor SR1, a fan current detection resistor SR2, and the high integrated smart power module as described above, wherein,
one end of the compressor current detection resistor SR1 is interconnected with a compressor low-voltage reference pin and a compressor current detection pin of the high-integration intelligent power module, and the other end of the compressor current detection resistor SR1 is connected with a single-point grounding pin of the high-integration intelligent power module;
the compressor low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the compressor current detection resistor SR 1;
one end of the fan current detection resistor SR2 is interconnected with a fan low-voltage reference pin and a fan current detection pin of the high-integrated intelligent power module, and the other end of the fan current detection resistor SR2 is connected with a single-point grounding pin of the high-integrated intelligent power module;
the fan low-voltage reference pin is also connected with the negative end of the high-voltage power supply through the fan current detection resistor SR 2.
In this embodiment, the compressor current detection resistor SR1 is serially connected between the compressor low voltage reference pin UVW-and the single-point ground pin VSS3, and can detect the current flowing through the three-phase lower bridge arm switching tube of the compressor and convert the current into a voltage signal, thereby implementing the current detection of the motor. The fan current detection resistor SR2 is serially connected between a fan low voltage reference pin UVW-and a single-point grounding pin VSS3, and can detect the current flowing through the three-phase lower bridge arm switch tube of the compressor and convert the current into a voltage signal, so that the current detection of the motor is realized.
Referring to fig. 3, in some embodiments, the electronic control assembly further comprises:
the electronic control board (not shown) is provided with a circuit wiring layer, the current detection resistor 201 and the high-integration intelligent power module are installed on the electronic control board, and the current detection resistor 201 and the high-integration intelligent power module are electrically connected through a lead corresponding to the circuit wiring layer.
In this embodiment, a pad of the rectifier bridge stack, the PFC circuit, the dc bus capacitor, and the highly integrated intelligent power module may be formed on the electric control board, and the rectifier bridge stack, the PFC circuit, the dc bus capacitor, and the highly integrated intelligent power module are electrically connected to each other through a lead on the circuit wiring layer. The current detection resistor 201 is arranged on the same side of the installation side of a strong current pin of the high-integration intelligent power module, so that in the high-integration intelligent power module, when the low-voltage reference pin UVW-is connected with a single-point grounding pin through the external current detection resistor 201, the distance between the low-voltage reference pin UVW-and the single-point grounding pin can be shortened, and the compressor current detection pin ITRIP is also arranged on the installation side of the strong current pin, so that the distance between the low-voltage reference pin UVW-and the compressor current detection pin ITRIP can be shortened.
The utility model also provides an air conditioner, which comprises the high-integration intelligent power module;
the detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the utility model discloses used above-mentioned high integrated intelligent power module in the air conditioner, consequently, the utility model discloses the embodiment of air conditioner includes all technical scheme of the whole embodiments of above-mentioned high integrated intelligent power module, and the technological effect that reaches is also identical, no longer gives unnecessary details here.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A highly integrated smart power module, comprising:
the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;
the compressor IPM module and the fan IPM module are respectively arranged at the corresponding installation positions;
the three-phase compressor floating power supply pin and the three-phase compressor output pin are arranged on the strong current pin mounting side, and the three-phase compressor floating power supply pin and the three-phase compressor output pin are respectively and electrically connected with the compressor IPM module;
the three-phase fan floating power supply pin and the three-phase fan output pin are arranged on the strong current pin mounting side, and the three-phase fan floating power supply pin and the three-phase fan output pin are respectively and electrically connected with the fan IPM module;
the compressor filter capacitors are arranged at the mounting positions corresponding to the mounting substrate, and at least one compressor filter capacitor is arranged between the floating power supply pin and the compressor output pin of each phase in series; and the number of the first and second groups,
and the fan filter capacitors are arranged at the installation positions corresponding to the installation substrate, and at least one of the fan filter capacitors is arranged between the floating power supply pin and the fan output pin of each phase in series.
2. The high integrated smart power module of claim 1, wherein said compressor IPM module comprises:
the compressor inversion power module and the compressor driving chip are arranged at the corresponding mounting positions and electrically connected with the compressor driving chip.
3. The high-integrated intelligent power module according to claim 2, wherein the number of the filter capacitors arranged in series between the compressor floating power supply pin and the compressor output pin of each phase is two, the two filter capacitors are respectively a first filter capacitor and a second filter capacitor, and the first filter capacitor and the second filter capacitor are arranged in parallel.
4. The high integrated smart power module of claim 3, wherein the first filter capacitor is disposed proximate to the fan floating supply pin and a fan output pin;
the second filter capacitor is arranged close to the compressor driving chip.
5. The high integrated smart power module of claim 4, wherein the first filter capacitance is less than 5mm from the fan floating supply pin and fan output pin;
the distance between the second filter capacitor and the compressor driving chip is less than 10 mm.
6. The high integrated smart power module of claim 5, wherein the fan IPM module comprises:
the fan inversion power module and the fan driving chip are arranged at the corresponding mounting positions and electrically connected with the fan driving chip.
7. The high integrated smart power module of claim 6, wherein the filter capacitors disposed in series between the fan floating supply pin and the fan output pin of each phase are disposed proximate to the fan floating supply pin and the fan output pin;
and/or, the fan driving chip is arranged close to the fan driving chip.
8. The highly integrated smart power module of claim 3, further comprising:
the PFC inductor connecting end is connected with one end of an external inductor;
the bus capacitor connecting end is connected with an external bus capacitor;
the PFC power module comprises a PFC power switch tube and a PFC diode, the input end of the PFC power switch tube is interconnected with the PFC inductance connecting end and the anode of the PFC diode, and the output end of the PFC power switch tube is connected with the PFC inductance connecting negative end; and the cathode of the PFC diode is connected with the connecting end of the bus capacitor.
9. The highly integrated smart power module of any of claims 1 to 8, further comprising:
and the output end of the rectifier bridge is connected with the PFC inductor.
10. An air conditioner characterized by comprising the highly integrated smart power module as recited in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022830322.2U CN214205353U (en) | 2020-11-30 | 2020-11-30 | High-integration intelligent power module and air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022830322.2U CN214205353U (en) | 2020-11-30 | 2020-11-30 | High-integration intelligent power module and air conditioner |
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| CN214205353U true CN214205353U (en) | 2021-09-14 |
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| CN202022830322.2U Active CN214205353U (en) | 2020-11-30 | 2020-11-30 | High-integration intelligent power module and air conditioner |
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Effective date of registration: 20240524 Address after: 400064 plant 1, No. 70, Meijia Road, Nan'an District, Chongqing Patentee after: Meiken Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 400060 No. 4, Rongying Building, No. 4, No. 8 Yuma Road, Nanan District, Chongqing Patentee before: CHONGQING MIDEA REFRIGERATION EQUIPMENT Co.,Ltd. Country or region before: China Patentee before: GD MIDEA AIR-CONDITIONING EQUIPMENT Co.,Ltd. |
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