CN114598165A

CN114598165A - Intelligent power module, electric control assembly and air conditioner

Info

Publication number: CN114598165A
Application number: CN202011384079.4A
Authority: CN
Inventors: 苏宇泉
Original assignee: GD Midea Air Conditioning Equipment Co Ltd; Chongqing Midea Refrigeration Equipment Co Ltd
Current assignee: GD Midea Air Conditioning Equipment Co Ltd; Chongqing Midea Refrigeration Equipment Co Ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2022-06-07

Abstract

The invention discloses an intelligent power module, an electric control assembly and an air conditioner, wherein the intelligent power module comprises: the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions; the inversion power module and the driving chip are arranged on the corresponding mounting positions and are electrically connected with the driving chip; the low-voltage reference pin, the current detection pin and the single-point grounding pin are arranged on the strong current pin mounting side; the low-voltage reference pin is connected with the output end of the inversion power module and is also used for being connected with the single-point grounding pin through the external current detection resistor; the current detection pin is electrically connected with the low-voltage reference pin; the single-point grounding pin is connected with the grounding end of the driving chip. The invention solves the problem that the intelligent power module is poor in reliability due to the fact that overcurrent protection of the intelligent power module is easy to trigger by mistake.

Description

Intelligent power module, electric control assembly and air conditioner

Technical Field

The invention relates to the technical field of electronic circuits, in particular to an intelligent power module, an electric control assembly and an air conditioner.

Background

In the smart power module, only one ground pin of the driver chip is usually provided and is usually located on the low voltage side, and the ground terminal of the power switch tube is usually located on the high voltage side. On the other hand, since the emitters of the switching tubes of the power module, such as IGBTs, are arranged on the high-voltage side, the low-voltage side and the high-voltage side are far apart from each other when single-point grounding is realized. In addition, in the intelligent power module provided with the current detection pin, the current detection pin is arranged on the low-voltage side, and an external lead is required to be connected with an emitter of the IGBT, so that the wiring is too long, parasitic inductance is increased, and even false triggering occurs.

Disclosure of Invention

The invention mainly aims to provide an intelligent power module, an electric control assembly and an air conditioner, and aims to improve the reliability of the intelligent power module.

To achieve the above object, the present invention provides an intelligent power module, including:

the mounting substrate is provided with a strong current pin mounting side and a weak current pin mounting side which are oppositely arranged along two sides of the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions;

the inversion power module and the driving chip are arranged on the corresponding mounting positions and are electrically connected with the driving chip; and the number of the first and second groups,

the low-voltage reference pin, the current detection pin and the single-point grounding pin are arranged on the strong current pin mounting side; wherein the content of the first and second substances,

the low-voltage reference pin is connected with the output end of the inversion power module, and is also used for being connected with the single-point grounding pin through an external current detection resistor;

the current detection pin is electrically connected with the low-voltage reference pin;

the single-point grounding pin is connected with the grounding end of the driving chip.

Optionally, the low voltage reference pin, the current detection pin and the single-point ground pin are adjacently disposed on the strong current pin mounting side.

Optionally, the mounting substrate has first and second ends opposite in a lengthwise direction thereof;

a weak current grounding pin, a driving chip power supply pin, a UH driving signal pin, a VH driving signal pin, a WH driving signal pin, a UL driving signal pin, a VL driving signal pin and a WL driving signal pin are sequentially arranged on the weak current pin mounting side of the mounting substrate from the first end to the second end;

the strong current pin mounting side of the mounting substrate is provided with a high-voltage power supply positive terminal pin, a W-phase output pin, a W-phase floating power supply pin, a V-phase output pin, a V-phase floating power supply pin, a U-phase output pin, a U-phase floating power supply pin, the low-voltage reference pin, the strong current grounding pin, a current detection pin and a single-point grounding pin in sequence from the first end to the second end.

Optionally, the inverter power module includes a three-phase upper bridge arm switching tube and a three-phase lower bridge arm switching tube, and a plurality of driving ends of the driving chip are connected to the three-phase upper bridge arm switching tube and the three-phase lower bridge arm switching tube in a one-to-one correspondence manner;

the collector of the three-phase upper bridge arm switching tube is used for connecting a direct current bus; the emitting electrodes of the three-phase upper bridge arm switching tubes are connected with the collecting electrodes of the three-phase lower bridge arm switching tubes in a one-to-one correspondence manner; and the emitter of the three-phase lower bridge arm switching tube is connected with the low-voltage reference pin.

The invention also provides an electric control assembly, which comprises a low-voltage power supply, a high-voltage power supply, a current detection resistor and the intelligent power module, wherein,

one end of the current detection resistor is connected with a low-voltage reference pin and a current detection pin of the intelligent power module, and the other end of the current detection resistor is connected with a single-point grounding pin of the intelligent power module;

the low-voltage reference pin is also connected with the negative end of the high-voltage power supply through an external current detection resistor;

the single-point grounding pin is also connected with the negative end of the low-voltage power supply.

Optionally, the electronic control assembly further comprises:

the electric control board is provided with a circuit wiring layer, the current detection resistor and the intelligent power module are installed on the electric control board, and the current detection resistor and the intelligent power module are electrically connected through a lead corresponding to the circuit wiring layer.

Optionally, a length of a lead between the low voltage reference pin and the current sense resistor is no greater than 20 mm.

Optionally, a voltage dropping resistor is further disposed on the electronic control board, and the voltage dropping resistor is serially connected between the low-voltage reference pin and the current detection pin.

Optionally, a length of a lead between the low voltage reference pin and the current sense pin is no greater than 40 mm.

The invention also provides an air conditioner, which comprises the intelligent power module;

or alternatively, an electrically controlled assembly as described above.

According to the technical scheme, the low-voltage reference pin, the current detection pin and the single-point grounding pin are arranged on the strong-current pin installation side, the current detection pin is electrically connected with the driving chip through the wiring and the binding wire on the internal circuit wiring layer of the intelligent power module, the single-point grounding pin is also electrically connected with the low-voltage power supply of the driving chip through the wiring and the binding wire on the internal circuit wiring layer of the intelligent power module, and when the external power supply supplies power to the driving chip, the low-voltage power supply arranged on the weak-current pin installation side can be electrically connected with the single-point grounding pin. When the low-voltage reference pin is electrically connected with a high-voltage power supply of an external power supply through the external current detection resistor, the low-voltage reference pin is electrically connected with the single-point grounding pin through the external current detection resistor. That is, the strong current ground (lower bridge IGBT emitter output) and the weak current ground (COM pin) of the external power supply realize single-point grounding on the single-point grounding pin of the intelligent power module, and a single-point grounding point does not need to be additionally arranged on the electric control board, so that the routing distance between the strong current ground and the weak current ground can be shortened. And, when carrying out automatically controlled board PCB wiring, external current detection resistance sets up the periphery at the forceful electric power pin installation side of intelligent power module, and the electric current detects the foot and also sets up at forceful electric power pin installation side, can shorten the line distance of walking between electric current detection foot and the external current detection resistance to reduce and walk the parasitic inductance on the line, because the reduction of parasitic inductance, can solve the problem that intelligent power module triggers by mistake. In addition, in this embodiment, the common point for realizing single-point grounding is disposed on the intelligent power module, and the high-voltage side ground passes through the single-point grounding pin and reaches the low-voltage side ground through the inside of the module, so as to form convenient single-point grounding and reduce the length of the ground wire. Therefore, wiring in the process of realizing single-point grounding between the strong power ground and the weak power ground can be shortened, the grounding end of the inversion power module on the strong power installation side does not need to be connected with the weak power grounding pin on the weak power installation side without searching a grounding point on the electric control board, the safety regulation requirement of wiring is not needed to be considered, peripheral electric control wiring of the intelligent power module can be facilitated, the wiring difficulty of the electric control board of the electrical equipment is reduced, and the reliability of the intelligent power module is improved. The invention solves the problem that the intelligent power module is poor in reliability due to the fact that overcurrent protection of the intelligent power module is easy to trigger by mistake.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic diagram of an internal circuit structure of an intelligent power module according to an embodiment of the present invention;

FIG. 2 is a schematic circuit diagram of an embodiment of an electrical control assembly according to the present invention;

fig. 3 is a schematic structural diagram of an electrical control assembly according to another embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Intelligent power module	UVW-	Low voltage reference pin
101	Driving chip	Csc	Current detection pin
				102	Inversion power module	COM2	Single-point grounding pin
201	Current detection resistor	301	High-voltage power supply
				202	Voltage reduction resistor	302	Low-voltage power supply
203	Voltage dividing resistor

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides an intelligent power module.

Referring to fig. 1 to 3, in an embodiment of the present invention, the smart power module 100 includes:

a mounting substrate (not shown) having opposite strong and weak current pin mounting sides along both sides in a length direction thereof; the surface of the mounting substrate is provided with a plurality of mounting positions;

the inverter power module 102 and the driving chip 101 are mounted on the corresponding mounting positions, and the inverter power module 102 is electrically connected with the driving chip 101; and (c) a second step of,

the low-voltage reference pin UVW-, the current detection pin Csc and the single-point grounding pin COM2 are arranged on the strong-current pin mounting side; wherein, the first and the second end of the pipe are connected with each other,

the low-voltage reference pin UVW-is connected to the output end of the inverter power module 102, and is further configured to be connected to the single-point ground pin COM2 through an external current detection resistor 201;

the current detection pin Csc is electrically connected with the low voltage reference pin UVW-;

the single-point ground pin COM2 is connected to the ground terminal of the driver chip 101.

In this embodiment, the mounting substrate may be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate. The mounting substrate is a mounting carrier for the power switching tube and the driving device, and the shape of the mounting substrate can be determined according to the specific position, number and size of the power switching tube, and can be square, but is not limited to square. The mounting substrate is provided with a circuit wiring layer, and the circuit wiring layer forms corresponding lines and mounting positions, namely bonding pads, for mounting each electronic element in the power switch tube on the mounting substrate according to the circuit design of the intelligent power module 100.

When the mounting substrate is realized by using an aluminum nitride ceramic mounting substrate, the aluminum nitride ceramic mounting substrate includes an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When the mounting substrate made of a metal material is used, the mounting substrate includes a heat dissipation layer, an insulating layer laid on the heat dissipation layer, and a circuit wiring layer formed on the insulating layer. In this embodiment, the mounting substrate may be a single-sided wiring board. The insulating layer is sandwiched between the circuit wiring layer and the metal mounting substrate. The insulating layer is used for realizing electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate and reflecting external electromagnetic interference, so that the power switch tube is prevented from being interfered by external electromagnetic radiation to work normally, and the interference influence of the electromagnetic radiation in the surrounding environment on electronic elements in the intelligent power module 100 is reduced. The insulating layer can be made of materials such as thermoplastic glue or thermosetting glue, so that the mounting substrate and the circuit wiring layer are fixedly connected and insulated. The insulating layer can be realized by a high-heat-conductivity insulating layer which is realized by mixing one or more materials of epoxy resin, aluminum oxide and high-heat-conductivity filling material. In the process of manufacturing the mounting substrate, after an insulating layer is provided on the mounting substrate, a copper foil may be laid on the insulating layer, and the copper foil may be etched according to a predetermined circuit design, thereby forming a circuit wiring layer.

The power switch tube and the driving chip 101 in the inverter power module 102 may be a patch-type electronic component, or may be a bare die wafer. The circuit wiring layer comprises circuit wiring forming a current loop and bonding pads formed by the circuit wiring, the driving chip 101 and the power switching tubes in the inverter power module 102 are arranged on the corresponding bonding pads, and the driving chip 101 and the power switching tubes can be electrically connected through the circuit wiring, metal binding wires and the like.

The number of the driving chips 101 may be one, for example, the HVIC driving chip 101, where the driving chip 101 is an integrated chip, and four, six, or seven driving circuits for driving the power switching tubes (integrated with PFC driving) are integrated therein, and may be specifically configured integrally according to the number of the driven power switching tubes. The number of the driving chips 101 may also correspond to the number of the power switch tubes, that is, each driving chip 101 drives one power switch tube to work. The driving chip 101 is configured to output a corresponding control signal when the intelligent power module 100 works to control the corresponding power switch to be turned on, so as to output driving power to drive a motor and other loads to work. When the power switch tube is driven to be conducted, the charging current is provided for the power switch tube, so that the gate-source electrode voltage of the power switch tube rapidly rises to a required value, and the power switch tube can be ensured to be rapidly conducted. And the grid-source voltage of the power switch tube is ensured to be maintained stably during the conduction period of the power switch tube, so that the power switch tube is reliably conducted. The driving chip 101 may also be provided with two driving chips 101, namely an upper bridge arm driving chip (HVIC)101 and a lower bridge arm driving chip (LVIC)101, and respectively drive an upper bridge arm power device and a lower bridge arm power device in the inverter power module 102 to work, and the inverter power module 102 and the driving chips 101 may be electrically connected through circuit wiring and metal leads to form a current loop. When the driving chip 101 is used for implementation, the driving chip 101 is integrated with a high-voltage side driving unit and a low-voltage side driving circuit, and the high-voltage side driving unit and the low-voltage side driving unit are respectively used for driving an upper bridge arm power device and a lower bridge arm power device in the inverter power module 102 to work. The input end of the driving chip 101 is connected to a main controller, i.e., an MCU, in the inverter or the air conditioner, wherein the MCU is integrated with a logic controller, a memory, a data processor, etc., and a software program and/or module stored in the memory and operable on the data processor, and the MCU outputs a corresponding control signal to the driving chip 101 by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so as to drive the power switching tube in the inverter power module 102 to be turned on/off according to the control signal of the main controller, thereby driving the loads such as the fan, the compressor, the motor, etc. to operate. The main controller may be independent from the smart power module 100, or may be integrated in the smart power module 100, and in practical applications, the main controller and the smart power module 100 are disposed on the electronic control board and electrically connected through a circuit wiring or a wire. Of course, in other embodiments, the main controller may be integrated into the smart power module 100 to increase the integration of the smart power module 100.

The power module 20 includes a plurality of power devices, which may be gallium nitride (GaN) power devices, Si-based power devices, or SiC-based power devices. The number of the power devices can be one or more, when the number of the power devices is multiple, the inverter circuit can be composed of four power devices or six power devices, and the six power devices are applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment and the like, in particular to variable frequency household appliances. When the intelligent power module 100 works, the driving chip 101 outputs a corresponding PWM control signal to drive and control the corresponding power device to be turned on/off, so as to output driving power to drive a load such as a motor to work. It is understood that, depending on the type of power device, for example, when the power device is implemented with an IGBT, an FRD (Fast Recovery Diode) may also be adaptively provided.

Referring to fig. 3, in the present embodiment, IGBTs are used in all inverter power modules 102, and HVIC chips are used in driver chip 101 for example. A VCC end of the HVIC tube 101 is used as a positive end VDD of a low-voltage power supply of the intelligent power module 100, and the VDD is generally 15V; the HIN1 end of the HVIC pipe 101 is used as the U-phase upper bridge arm input end UHIN of the intelligent power module 100; the HIN2 end of the HVIC pipe 101 is used as a V-phase upper bridge arm input end VHIN of the intelligent power module 100; the HIN3 end of the HVIC pipe 101 is used as the W-phase upper bridge arm input end WHIN of the intelligent power module 100; the LIN1 end of the HVIC tube 101 is used as the U-phase lower bridge arm input end ULIN of the intelligent power module 100; the LIN2 end of the HVIC tube 101 is used as the V-phase lower bridge arm input end VLIN of the intelligent power module 100; the LIN3 end of the HVIC tube 101 is used as the W-phase lower bridge arm input end WLIN of the intelligent power module 100; here, the U, V, W three-phase six-path input of the intelligent power module 100 receives 0-5V input signals; the GND end of the HVIC tube 101 is used as a low-voltage area power supply negative end COM1 and a COM2 of the intelligent power module 100, wherein a COM1 pin is at a logic end and is adjacent to low-voltage pins such as VDD, a COM2 pin is at a high-voltage side and is adjacent to UVW and Csc pins; the Csc end of the HVIC tube 101 is used as an overcurrent protection detection end COM2 of the intelligent power module 100; the VB1 end of the HVIC pipe 101 is used as a U-phase high-voltage area power supply positive end UVB of the intelligent power module 100; the HO1 end of the HVIC tube 101 is connected with the grid electrode of the U-phase upper bridge arm IGBT tube 121; the VS1 end of the HVIC 101 is connected with the emitter of the IGBT tube 121, the anode of the FRD tube 111, the collector of the U-phase lower bridge arm IGBT tube 124 and the cathode of the FRD tube 114, and serves as the negative end UVS of the U-phase high-voltage area power supply of the intelligent power module 100; the VB2 end of the HVIC pipe 101 is used as a power supply positive end VVB of a U-phase high-voltage area power supply of the intelligent power module 100; the HO3 end of the HVIC tube 101 is connected with the grid of the V-phase upper bridge arm IGBT tube 123; the VS2 end of the HVIC tube 101 is connected to the emitter of the IGBT tube 122, the anode of the FRD tube 112, the collector of the V-phase lower bridge arm IGBT tube 125, and the cathode of the FRD tube 115, and serves as the negative end VVS of the W-phase high voltage area power supply of the intelligent power module 100; the VB3 end of the HVIC pipe 101 is used as a W-phase high-voltage area power supply positive end WVB of the intelligent power module 100; the HO3 end of the HVIC tube 101 is connected with the grid of the W-phase upper bridge arm IGBT tube 123; the VS3 end of the HVIC tube 101 is connected to the emitter of the IGBT tube 123, the anode of the FRD tube 113, the collector of the W-phase lower bridge arm IGBT tube 126, and the cathode of the FRD tube 116, and serves as the negative end WVS of the W-phase high voltage area power supply of the intelligent power module 100; the LO1 end of the HVIC tube 101 is connected with the grid electrode of the IGBT tube 124; the LO2 end of the HVIC tube 101 is connected with the grid electrode of the IGBT tube 125; the LO3 end of the HVIC tube 101 is connected with the grid electrode of the IGBT tube 126; the LO3 end of the HVIC tube 101 is connected with the grid electrode of the IGBT tube 126; the emitter of the IGBT tube 124 is connected to the anode of the FRD tube 114, and serves as a three-phase low-voltage reference pin UVW "of the intelligent power module 100; the emitter of the IGBT tube 125 is connected to the anode of the FRD tube 115, and serves as a three-phase low-voltage reference pin UVW "of the intelligent power module 100; the emitter of the IGBT tube 126 is connected to the anode of the FRD tube 116, and is used as a three-phase low-voltage reference pin UVW-of the intelligent power module 100; the collector of the IGBT tube 121, the cathode of the FRD tube 111, the collector of the IGBT tube 122, the cathode of the FRD tube 112, the collector of the IGBT tube 123, and the cathode of the FRD tube 113 are connected to each other, and serve as a high voltage input terminal P of the smart power module 100, where P is generally connected to 300V. The HVIC tube 101 functions to: and respectively transmitting 0-5V logic signals of input terminals HIN1, HIN2, HIN3, LIN1, LIN2 and LIN3 to output terminals HO1, HO2, HO3, LO1, LO2 and LO3, wherein HO1, HO2 and HO3 are logic signals of VS-VS +15V, and LO1, LO2 and LO3 are logic signals of 0-15V. And detecting the current output by the UVW-through the Csc to realize overcurrent protection.

Each pin mounted on the strong current pin mounting side and the weak current pin mounting side can be implemented by a gull-wing pin or a direct-insertion pin, and each pin is welded at a pad position on a mounting position corresponding to the mounting substrate and is electrically connected with the driving chip 101 and the inverter power module 102 through a metal wire and a circuit wiring layer.

It should be noted that, in order to avoid damaging the motor and the intelligent power module 100 when the motor is in an overcurrent state, an overcurrent protection function is integrated in the intelligent power module 100, specifically, an overcurrent detection pin (abbreviated as Itrip or Csc) may be disposed on a mounting substrate of the intelligent power module 100 to detect a voltage drop across the external current detection resistor 201, and when the voltage drop exceeds a certain threshold, a level on the overcurrent detection pin Itrip is inverted, for example, from a high level to a low level, or from the low level to the high level, so as to trigger a protection function of the IC inside the IPM, and the module stops working, so as to perform a protection function. In addition, when the intelligent power module 100 is applied to an electrical apparatus such as an air conditioner, a refrigerator, a washing machine, or an inverter, the intelligent power module 100 and the external sampling resistor are mounted on an electronic control board (e.g., a PCB), and the wiring of the electronic control board PCB requires single-point grounding as much as possible, and particularly, a strong ground (output of an emitter of a lower IGBT) and a weak ground (VSS or COM pin of IPM, and a ground terminal of an MCU) should be connected by a single point, and a single-point grounding point is usually provided on the electronic control board. In addition, in actual wiring, parasitic inductance is introduced into the line, and in current detection, the parasitic inductance greatly affects detection. However, the underbridge emitter pins are typically placed with the high voltage pins to allow for shorter routing of high voltage, high current; the current sense pin Csc, the logic ground pin, is typically placed with other low voltage logic pins to shorten the distance to logic ground for the other logic pins. Therefore, the pins are arranged on the intelligent power module 100, and the wiring distance between the intelligent power module 100 and an external device is increased on the wiring of the electronic control board PCB, so that parasitic inductance is easily increased, and overcurrent protection is inaccurate or logic ground is easily affected by high voltage.

Therefore, in the embodiment, the low-voltage reference pin UVW-, the current detection pin Csc and the single-point ground pin COM2 are arranged on the strong-current pin mounting side, the current detection pin Csc is electrically connected with the driving chip 101 through the routing and the binding wire on the internal circuit wiring layer of the intelligent power module 100, the single-point ground pin COM2 is also electrically connected with the low-voltage power supply of the driving chip 101 through the routing and the binding wire on the internal circuit wiring layer of the intelligent power module 100, and when the external power supply supplies power to the driving chip 101, the low-voltage power supply 302 arranged on the weak-current pin mounting side can be electrically connected with the single-point ground pin COM 2. When the low-voltage reference pin UVW-is electrically connected to the high-voltage power supply 301 of the external power supply through the external current detection resistor 201, the low-voltage reference pin UVW-is also electrically connected to the single-point ground pin COM2 through the external current detection resistor 201. That is, the strong ground (lower bridge IGBT emitter output) and the weak ground (COM pin) of the external power supply realize single-point grounding at the single-point grounding pin COM2 of the smart power module 100, and the routing distance between the strong ground and the weak ground can be shortened without providing a single-point grounding point on the electronic control board. Moreover, when the electric control board PCB is wired, the external current detection resistor 201 is disposed at the periphery of the strong current pin mounting side of the intelligent power module 100, and the current detection pin Csc is also disposed at the strong current pin mounting side, so that the wiring distance between the current detection pin Csc and the external current detection resistor 201 can be shortened, thereby reducing the parasitic inductance on the wiring, and the problem of false triggering of the intelligent power module 100 can be solved due to the reduction of the parasitic inductance. In addition, in the embodiment, the common point for realizing single-point grounding is arranged on the intelligent power module 100, and the high-voltage side passes through the single-point grounding pin COM2 and reaches the low-voltage side COM1 through the inside of the module, so that convenient single-point grounding is formed, and the length of the ground wire is reduced. Therefore, wiring in the case of realizing single-point grounding between a strong electric ground and a weak electric ground can be shortened, the grounding end of the inverter power module 102 on the strong electric installation side does not need to be connected with the weak electric grounding pin COM1 on the weak electric installation side without finding a grounding point on the electric control board, and further the safety regulation requirement of wiring does not need to be considered, so that peripheral electric control wiring of the intelligent power module 100 can be facilitated, the wiring difficulty of the electric control board of the electric equipment is reduced, and the reliability of the intelligent power module is improved. The invention solves the problem that the intelligent power module is poor in reliability due to the fact that overcurrent protection of the intelligent power module is easy to trigger by mistake.

It can be understood that the driving current of the fan inverter power module flows from the driving end of the fan driving chip 30 to the fan low-voltage reference pin of the fan inverter power module, then reaches the single-point grounding pin VSS3 outside the intelligent power module from the fan low-voltage reference pin, and then returns to the gate from the single-point grounding pin on the high-voltage side of the fan driving chip 30 to form a driving loop.

The invention can also shorten the wiring of the driving current loop, thereby reducing the parasitic inductance on the wiring, improving the switching speed of the switching tube in the power module 20, and solving the problem of false triggering of the intelligent power module due to the reduction of the parasitic inductance.

Referring to fig. 1 to 3, in an embodiment, the low voltage reference pin UVW-, the current detection pin Csc and the single point ground pin COM2 are disposed adjacent to each other on the weak current pin mounting side.

Referring to fig. 3, Ls1 to Ls4 represent equivalent parasitic inductances in the lines, and when the current detection pin Csc is connected to the external current detection resistor 201 and the connection line between the current detection pin Csc and the lower bridge emitter pin at a point a (near the lower bridge emitter pin), the voltage of the current detection pin Csc is affected by Ls1 above the trace resistor. The resistance of the trace causes the transition level to drop because it corresponds to adding a series resistance to the shunt resistance (current sense resistor 201). Ls1 generates voltage spike when reverse recovery current flows, which is easy to cause false triggering, so the connection point needs to be set at point B in the figure, that is, close to (the external current detection resistor 201), at this time, Ls1 is equivalent to a filter with a large time constant, which can filter out the voltage spike, and the noise effect of Ls1 is reduced to the maximum extent by the current detection pin Csc wiring. Therefore, in this embodiment, the lower bridge emitter pin (UVW-), the current detection pin (Itrip or Csc), and the logic ground pin (VSS or COM) are disposed close to each other, so that the routing distance on the IPM external electrical control wiring can be shortened as much as possible, that is, when peripheral electrical control wiring is performed, the routing distances from the UVW-to the sampling resistor, the external sampling resistor to the current detection pin Csc, the current detection pin Csc to ground, and the external current detection resistor 201 to ground are all shortened to the shortest. The Ls 2-Ls 4 are reduced as much as possible, so that the influence of parasitic inductance on current detection is reduced, the current detection is ensured not to be interfered, and reliable current protection and measurement performance are obtained.

Referring to fig. 1 to 3, in an embodiment, the mounting substrate has first and second ends opposite in a length direction thereof;

a weak current grounding pin COM1, a driving chip power supply pin VCC, a UH driving signal pin HIN1, a VH driving signal pin HIN2, a WH driving signal pin HIN3, a UL driving signal pin LIN1, a VL driving signal pin LIN2 and a WL driving signal pin LIN3 are sequentially arranged on the weak current pin mounting side of the mounting substrate from the first end to the second end;

the strong current pin mounting side of the mounting substrate is sequentially provided with a high-voltage power supply positive terminal pin, a W-phase output pin, a W-phase floating power supply pin, a V-phase output pin, a V-phase floating power supply pin, a U-phase output pin, a U-phase floating power supply pin, the low-voltage reference pin UVW-, the strong current grounding pin, a current detection pin Csc and a single-point grounding pin COM2 from the first end to the second end.

In this embodiment, the U-phase output pin U, V and the V, W-phase output pins W are respectively used for connecting to three-phase windings of the motor. The UH driving signal pin HIN1, the VH driving signal pin HIN2, the WH driving signal pin HIN3, the UL driving signal pin LIN1, the VL driving signal pin LIN2 and the WL driving signal pin LIN3 are respectively used for being connected with a UH driving signal, a VH driving signal and a WH driving signal input by an external controller, and the UL driving signal, the VL driving signal and the WL driving signal, and converting the logic driving signal into an analog driving signal to drive the corresponding power switching tube to work. Because the three pins of the low-voltage reference pin UVW-, the current detection pin Csc and the single-point grounding pin COM2 are adjacent, the wiring distances from the low-voltage reference pin UVW-to the external current detection resistor 201, from the external current detection resistor 201 to the current detection pin Csc, from the current detection pin Csc to the single-point grounding pin COM2 and from the external current detection resistor 201 to the single-point grounding pin are all shortened to the shortest, the influence of parasitic inductance can be reduced, and the current detection is ensured not to be interfered.

Referring to fig. 1 to 3, in an embodiment, the inverter power module 102 includes three-phase upper bridge arm switching tubes and three-phase lower bridge arm switching tubes, and a plurality of driving terminals of the driving chip 101 are connected to gates of the three-phase upper bridge arm switching tubes and the three-phase lower bridge arm switching tubes in a one-to-one correspondence manner;

the collector of the three-phase upper bridge arm switching tube is used for being connected into a direct current bus; the emitting electrodes of the three-phase upper bridge arm switching tubes are connected with the collecting electrodes of the three-phase lower bridge arm switching tubes in a one-to-one correspondence manner; and the emitter of the three-phase lower bridge arm switching tube is connected with the low-voltage reference pin UVW-.

In the embodiment, the three-phase upper bridge arm switching tubes (and the three-phase lower bridge arm switching tubes are all turned on when receiving a high-level driving signal, and are turned off when receiving a low-level driving signal, and the upper bridge arm switching tubes and the lower bridge arm switching tubes are not simultaneously turned on in the same phase bridge arm circuit, that is, the lower bridge arm switching tubes are turned off when the upper bridge arm switching tubes are turned on, the three-phase upper bridge arm switching tubes (and the three-phase lower bridge arm switching tubes have the common end which is the output end of the intelligent power module 100 and are connected with the corresponding windings of the motor, so that the motor is driven to work, wherein the three-phase upper bridge arm switching tubes (and the three-phase lower bridge arm switching tubes are all or partially realized by adopting the IGBTs, and when the IGBTSs work, emitting electrodes UVW-of the IGBTCOMs and a single-point grounding pin strong current 2 are arranged on the pin installation sides, and the distances between the three-phase upper bridge arm switching tubes and the three-phase upper bridge arm switching tubes are smaller, so that a current loop can be shortened.

The invention further provides an electronic control assembly, which comprises a low-voltage power supply 302, a high-voltage power supply 301, a current detection resistor 201 and the intelligent power module 100. The detailed structure of the intelligent power module 100 can refer to the above embodiments, and is not described herein; it can be understood that, because the intelligent power module 100 is used in the electronic control assembly of the present invention, the embodiment of the electronic control assembly of the present invention includes all technical solutions of all embodiments of the intelligent power module 100, and the achieved technical effects are also completely the same, and are not described herein again. Wherein the content of the first and second substances,

one end of the current detection resistor 201 is interconnected with a low-voltage reference pin UVW-and a current detection pin Csc of the intelligent power module 100, and the other end of the current detection resistor 201 is connected with a single-point ground pin COM2 of the intelligent power module 100;

the low-voltage reference pin UVW-is also connected with the high-voltage power supply 301 through an external current detection resistor 201;

the single-point ground pin COM2 is also connected to the low-voltage power supply 302.

In this embodiment, the current detection resistor 201 is serially connected between the low voltage reference pin UVW-and the single-point ground pin COM2, and can detect the current flowing through the three-phase lower bridge arm switching tube and convert the current into a voltage signal, thereby implementing current detection on the motor.

Referring to fig. 1 to 3, in an embodiment, the electronic control assembly further includes:

the electronic control board (not shown) is provided with a circuit wiring layer, the current detection resistor 201 and the intelligent power module 100 are mounted on the electronic control board, and the current detection resistor 201 and the intelligent power module 100 are electrically connected through a lead corresponding to the circuit wiring layer.

In this embodiment, the electronic control component includes, but is not limited to, a rectifier bridge stack, a PFC circuit, a dc bus capacitor, and an intelligent power module 100, the rectifier bridge stack, the PFC circuit, and the intelligent power module 100 are sequentially connected, the dc bus capacitor is connected in parallel to an output end of the PFC circuit, and the PFC circuit includes a PFC power switch and a PFC inductor. The electric control board can be provided with a rectifier bridge stack, a PFC circuit, a DC bus capacitor and a bonding pad of the intelligent power module 100, and the rectifier bridge stack, the PFC circuit, the DC bus capacitor and the intelligent power module 100 are electrically connected through a lead on a circuit wiring layer. The current detection resistor 201 is arranged on the same side of the installation side of the strong current pin of the intelligent power module 100, so that in the intelligent power module 100, when the low-voltage reference pin UVW is connected with the single-point grounding pin through the external current detection resistor 201, the distance between the low-voltage reference pin UVW and the single-point grounding pin can be shortened, and the current detection pin Csc is also arranged on the installation side of the strong current pin, so that the distance between the low-voltage reference pin UVW and the current detection pin Csc can be shortened.

Referring to fig. 1 to 3, in an embodiment, a length of a wire between the low voltage reference pin UVW-and the current detection resistor 201 is not greater than 20 mm.

In this embodiment, since the three pins UVW-, current detection pin Csc and single-point grounding pin COM2 are adjacent, the distances between the low-voltage reference pin UVW-and the sampling resistor, the sampling resistor and the current detection pin Csc, the current detection pin Csc and the single-point grounding pin, and the distances between the sampling resistor and the single-point grounding pin are all shortened to the shortest, so that the length of the lead between the low-voltage reference pin UVW-and the current detection resistor 201 is not greater than 20mm, and the length of the lead between the low-voltage reference pin UVW-and the current detection pin Csc is not greater than 40 mm. So set up, can shorten the line of walking between electric current detection foot Csc and the external current detection resistance 201 to and thereby reduce the parasitic inductance of walking on the line, because the reduction of parasitic inductance, can solve the problem that intelligent power module 100 triggers by mistake. The UVW-is connected to the high-voltage power supply 301 and the single-point ground pin COM2 through the current detection resistor 201, and the single-point ground pin COM2 is connected to the high-voltage power supply negative pin COM1 inside the smart power module 100 to form a unique connection path between the high-voltage ground and the low-voltage logic ground, thereby realizing the single-point connection.

Referring to fig. 1 to 3, in an embodiment, a voltage dropping resistor 202 is further disposed on the electronic control board, and the voltage dropping resistor 202 is disposed in series between the low voltage reference pin UVW-and the current detection pin Csc.

It can be understood that, in order to avoid the driving chip 101 being burnt out due to the excessive voltage output to the current detection pin Csc, the voltage reduction resistor 202 is serially connected between the low voltage reference pin UVW-and the current detection pin Csc in the present embodiment, and when the current detection resistor 201 detects the current flowing through the low voltage reference pin UVW-and converts the current into the voltage, the current is output to the current detection pin Csc through the voltage reduction resistor 202, thereby realizing the current detection of the motor. In this embodiment, a voltage dividing resistor 203 may be further provided, one end of the voltage dividing resistor 203 is connected to the first dc power supply 302, the first dc power supply 302 may be a power supply of the driver chip 101, and the other end of the voltage dividing resistor 203 is connected to the voltage reducing resistor 202, so as to form a voltage dividing circuit with the voltage reducing resistor 202, and by changing the level of the current detection pin Csc, overcurrent protection triggering is realized. It can be understood that, in this embodiment, the overcurrent protection trigger circuit formed by three discrete resistors, namely the current detection resistor 201, the voltage reduction resistor 202 and the voltage division resistor 203, can implement overcurrent protection of the intelligent power module 100 and the motor through hardware setting, and has a simple circuit and easy implementation. When the driver chip is applied to the smart power module 100, the logic analysis and the signal processing of the driver chip 101 can be reduced, so that the response speed of the over-current protection of the smart power module 100 can be increased.

or alternatively, an electrically controlled assembly as described above.

The detailed structures of the electronic control assembly and the intelligent power module can refer to the above embodiments, and are not described herein again; it can be understood that, because the electric control assembly and the intelligent power module are used in the air conditioner of the present invention, the embodiment of the air conditioner of the present invention includes all technical solutions of all embodiments of the electric control assembly and the intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A smart power module, comprising:

the inversion power module and the driving chip are arranged on the corresponding mounting positions, and the inversion power module is electrically connected with the driving chip; and the number of the first and second groups,

2. The smart power module of claim 1 wherein the low voltage reference pin, current sense pin and single point ground pin are disposed adjacent to the high current pin mounting side.

3. The smart power module of claim 2 wherein the mounting substrate has first and second ends opposite in a lengthwise direction thereof;

4. The intelligent power module according to any one of claims 1 to 3, wherein the inverter power module comprises three-phase upper bridge arm switching tubes and three-phase lower bridge arm switching tubes, and a plurality of driving ends of the driving chip are connected with the gates of the three-phase upper bridge arm switching tubes and the three-phase lower bridge arm switching tubes in a one-to-one correspondence manner;

5. An electronic control assembly, comprising a low voltage power supply, a high voltage power supply, a current sensing resistor and the intelligent power module of any one of claims 1 to 4,

6. An electronic control assembly according to claim 5, further comprising:

7. An electrical control assembly according to claim 6, wherein the length of the lead between the low voltage reference pin and the current sense resistor is no more than 20 mm.

8. The electronic control assembly according to claim 6, wherein a voltage dropping resistor is further disposed on the electronic control board, and the voltage dropping resistor is disposed in series between the low voltage reference pin and the current detection pin.

9. An electrical control assembly according to claim 8, wherein the length of the lead between the low voltage reference pin and the current sense pin is no more than 40 mm.

10. An air conditioner comprising the smart power module of any one of claims 1 to 4;

or, comprising an electrically controlled assembly according to any of claims 5 to 9.