CN114566306A - Conductive silver paste and preparation method and application thereof - Google Patents
Conductive silver paste and preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a conductive silver paste and a preparation method and application thereof, and belongs to the technical field of material chemical industry. The conductive silver paste comprises the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent. The conductive silver paste can be prepared by fully grinding and uniformly mixing the components on a three-roller grinder. The silver paste has the characteristics of low silver powder content and high conductivity, greatly reduces the cost and has wide industrial application prospect.
Description
Technical Field
The invention relates to the technical field of material chemical industry, in particular to conductive silver paste and a preparation method and application thereof.
Background
With the development of industrial technology and the rapid development of electronic information industry and solar energy industry, conductive silver paste is widely used as an important material in the leading fields of electronic tags, membrane switches, touch screens, printed circuits, photoelectric conversion and the like. The conductive silver paste is applied to the field of solar photovoltaic power generation in a large scale.
The silver conductive paste is divided into two types, namely polymer silver conductive paste (dried or solidified into a film and taking an organic polymer as a bonding phase); ② sintering type silver conductive slurry (sintering film forming, sintering temperature is more than 500 ℃, and glass powder or oxide is used as bonding phase). The silver powder is classified according to the particle size, and the average particle size is less than 0.1 mu m (100nm) and is nano silver powder; 0.1 μm < Dav (average particle diameter) 10.0 μm is a crude silver powder. The three categories constituting the silver conductor paste require different types or combinations of silver powders as conductive fillers, and even different formulations in each category require different silver powders as conductive functional materials, in order to achieve maximum utilization of silver conductivity and thermal conductivity with the minimum amount of silver powders under a determined formulation or film forming process.
Patent CN112820440 discloses a high-conductivity silver paste and a preparation method thereof, wherein polyvinyl pyrrolidone, ethyl cellulose and the like are used as organic phases, glass powder and the like are used as conductive fillers to obtain the high-conductivity conductive silver paste, a conductive pattern is obtained by screen printing, drying, sintering and the like, and the sheet resistance of the conductive silver paste is tested to be less than 6.0m Ω/□.
Although the traditional conductive silver paste can meet the actual use requirements, the proportion of the silver powder is high, and the silver is difficult to recover noble metal, so that the use cost of the silver powder is high. Therefore, it is highly desirable to prepare conductive silver paste with low silver powder content and high conductivity.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a conductive silver paste and a preparation method and application thereof.
The invention is realized by the following steps:
the invention provides a conductive silver paste which comprises the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent.
The invention also provides a preparation method of the conductive silver paste, which comprises the following steps: and mixing the metal conductive powder, the resin, the curing agent, the auxiliary agent and the solvent according to the proportion to obtain the conductive silver paste.
The invention also provides application of the conductive silver paste prepared by the preparation method in a membrane switch, a flexible printed circuit board, an electromagnetic shield, a potentiometer, a radio frequency identification system or a solar cell.
The invention has the following beneficial effects:
the invention provides conductive silver paste and a preparation method and application thereof. The conductive silver paste comprises the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent. According to the invention, the polyamide-imide resin is used as an organic phase, the characteristic of high N element content in the polyamide-imide resin and silver powder generate a coordination effect, and the polyamide-imide resin is combined on the surface of the metal conductive powder to obtain a structure with P-pi conjugation and the like, so that the conductive silver paste with good dispersibility, low silver powder consumption and high conductivity is obtained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a nuclear magnetic spectrum of a polyamideimide resin PAI-1 synthesized in example 1;
FIG. 2 is a scanning electron microscope image of a resin and silver powder obtained by mixing the polyamideimide resin PAI-1 prepared in example 1 with silver powder to obtain a conductive silver paste, which is cured.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The invention aims to provide conductive silver paste and a preparation method and application thereof.
In order to achieve the above object of the present invention, the following technical solutions are adopted.
In a first aspect, an embodiment of the present invention provides a conductive silver paste, including the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent.
The embodiment of the invention provides conductive silver paste, wherein resin and a curing agent in the conductive silver paste form a curing matrix component, and the loading and uniform dispersion of metal conductive powder are realized. The invention selects polyamide-imide as resin, wherein the polyamide-imide is PAI for short, and refers to a high molecular polymer containing amido bond and imide ring on a main chain. Because the molecular chain simultaneously has strong polar amido bond and imide ring with high heat resistance, the polyamide has excellent mechanical property and processability of polyamide, and also has excellent heat resistance, dielectricity, mechanical property, creep resistance and chemical stability of polyimide. By blending an epoxy resin-based curing agent and/or a polyisocyanate-based curing agent with a polyamideimide resin, the thermal properties, mechanical properties and electrical properties of the polyamideimide resin can be further improved. The stability of the cured conductive silver paste is ensured, and undesirable phenomena such as cracking and the like are avoided.
When the polyamideimide resin is cured by the trimeric isocyanate, hydrogen on amido bonds in the PAI resin and part of carboxyl groups remained in the reaction are reacted with NCO in the trimeric isocyanate, so that a body structure is generated, and the performance is improved. When the PAI resin is solidified by using the epoxy resin as a curing agent, an epoxy group reacts with hydrogen on an amido bond in the PA I resin to form a body-shaped structure. Both curing modes utilize hydrogen on amide bonds in the PAI molecular chain. The PAI resin synthesized by the method has more amido bonds, and the crosslinking degree can be controlled by controlling the adding amount of the curing agent, so that a material with the best performance is expected to be obtained.
The curing agent and the resin component selected by the invention have long storage period before curing treatment, endow the conductive silver paste dispersion system with excellent stability and storage resistance, and have good physical and mechanical properties after curing at a proper baking temperature.
Simultaneously, with the electrically conductive silver thick liquid that above-mentioned component cooperation obtained, can obtain the electrically conductive silver thick liquid that the metal conductive powder quantity is low and the conductivity is higher, the reason lies in:
due to the high N content of the polyamide-imide resin, research shows that the polyamide-imide resin is easy to complex with the surface of the metal conductive powder to form a certain chemical bonding effect, so that the dispersibility of the metal conductive powder in the resin is far higher than that of other types of resin, and the particle agglomeration of the metal conductive powder is not easy to occur. Under the same conductivity, the content of the metal conductive powder in the silver paste formula can be reduced.
In addition, the conductive silver paste provided by the embodiment of the invention takes the polyamide-imide resin and the curing agent thereof as organic phases, utilizes the characteristic of high N element content in the polyamide-imide resin to generate a coordination effect with the metal conductive powder, designs a structure with P-pi conjugation and the like in the synthesis process, can be used as an electronic transmission tool to improve the conductivity of the silver paste, and enables the prepared conductive silver paste to have the characteristic of high conductivity.
In an optional embodiment, the conductive silver paste comprises the following components in parts by mass: 40-75 parts of metal conductive powder, 10-30 parts of resin, 1-5 parts of curing agent, 0.001-0.5 part of auxiliary agent and 10-35 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent.
In an alternative embodiment, the metal conductive powder is silver powder;
preferably, the metal conductive powder is nano powder or flaky powder, the particle size of the flaky powder is 1-20 μm, and the particle size of the nano powder is 0.1-1 μm;
more preferably, the ratio of the amount of the flakes to the amount of the nanopowder is 30-90: 10-70.
In alternative embodiments, the polyamideimide resin is one or more of aromatic, semi-aromatic and aliphatic polyamideimide resins. The synthesis can be carried out by the "diamine dianhydride method" or the "diisocyanate method" or the "acid chloride method".
Preferably, diisocyanate monomers and dicarboxylic monomers are reacted in N-methylpyrrolidone and/or N, N-dimethylformamide according to the functional group ratio of 0.5-1.5 to obtain polyamide-imide resin;
more preferably, the diisocyanate monomer comprises at least one of diphenylmethane diisocyanate, isophorone diisocyanate, toluene diisocyanate and hexamethylene diisocyanate, and the dicarboxylic acid monomer comprises at least one of trimellitic anhydride, pyromellitic anhydride, adipic acid and sebacic acid;
more preferably, the polyamideimide resin is obtained after 4-6 hours of reaction at a temperature of 100-.
In an alternative embodiment, the epoxy resin-based curing agent comprises at least one of bisphenol A epoxy resins E-54, E-51, E-44, E-20, E-14, E-13, E-12, novolac epoxy resins F-51, F-44, and D431;
in an alternative embodiment, the polyisocyanate-based curing agent comprises at least one of kojic N3390, N3300, N3390, N75, blocked 3175, blocked 3370, N75, and asahi chemical 60X.
In an alternative embodiment, the adjuvant comprises: catalyst, flatting agent, dispersant and anti-settling agent;
preferably, the catalyst comprises at least one of dibutyltin dilaurate, stannous octoate, dibutyltin bis (dodecylthio), dibutyltin diacetate and alkyltin dithiols;
preferably, the leveling agent comprises at least one of BYK-358N, BYK-354 and BYK-3550;
preferably, the dispersant comprises at least one of BYK-110, BYK-163, Germany;
preferably, BYK-410 is used as the anti-settling agent.
More preferably, the catalyst, the leveling agent, the dispersant and the anti-settling agent are all used in an amount of 0.001-1 part by weight, based on the amount of the metal conductive powder.
In an alternative embodiment, the solvent comprises at least one of N-methylpyrrolidone and N, N-dimethylformamide.
In an alternative embodiment, the cured conductive silver paste has a conductivity of 1.0 x 102S/cm-1.10*105S/cm。
In a second aspect, an embodiment of the present invention further provides a method for preparing the conductive silver paste, including: and grinding and mixing the metal conductive powder, the resin, the curing agent, the auxiliary agent and the solvent according to the proportion to obtain the conductive silver paste.
In a third aspect, an embodiment of the present invention further provides an application of the conductive silver paste prepared by the above preparation method in a membrane switch, a flexible printed circuit board, an electromagnetic shield, a potentiometer, a radio frequency identification system, or a solar cell.
Therefore, the conductive silver paste provided by the embodiment of the invention adopts the polyamideimide resin and the curing agent thereof as organic phases, and utilizes the characteristic of high N element content in the polyamideimide resin to generate a coordination effect with silver powder, so that the conductive silver paste with good dispersibility and higher conductivity is obtained. The invention has the advantages that:
(1) and the silver powder content is low. Due to the high N content of the polyamide-imide resin, research shows that the polyamide-imide resin is easy to form a certain chemical bonding effect with the surface of silver, so that the dispersibility of the silver powder in the resin is far higher than that of other types of resin, and the agglomeration of silver powder particles is not easy to occur. Under the same conductivity, the silver paste formula can reduce the content of silver powder.
(2) And the conductivity is high. The conductive silver paste disclosed herein uses the polyamideimide resin as the organic phase, and the reason for the high conductivity of the conductive silver paste is related to the structure of the polyamideimide resin, and if the structure with P-pi conjugation and the like is designed in the synthesis process, the conductive silver paste can be used as an electron transport tool to improve the conductivity of the silver paste.
(3) The preparation method is simple. The conductive silver paste disclosed by the invention is simple and convenient in preparation method, and can be prepared by only compounding the synthetic resin with the components and then uniformly mixing the components on a three-roll grinding machine and blending the components to a proper viscosity.
(4) And the cost is low. The silver powder used in the formula has low content, generally only accounts for 50-70 of the content of the total formula, and can obtain good conductivity under the formula, and the synthesis cost of an organic phase is far lower than that of noble metal silver, so that the formula has qualified conductivity, and can also greatly reduce the cost, which is also the advantage of the invention.
The features and properties of the present invention are described in further detail below with reference to examples.
The embodiment of the invention provides a conductive silver paste which comprises the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent. Wherein:
the metal conductive powder is silver powder;
preferably, the metal conductive powder is nano silver powder and/or flaky powder, the particle size of the flaky silver powder is 1-20 μm, and the particle size of the nano silver powder is 0.1-1 μm;
more preferably, the ratio of the silver flakes to the silver nanoparticles is 30 to 90: 10-70.
The polyamide-imide resin is one or more of aromatic, semi-aromatic and aliphatic polyamide-imide resins. The synthesis can be carried out by the "diamine dianhydride method" or the "diisocyanate method" or the "acid chloride method".
The epoxy resin curing agent comprises at least one of bisphenol A epoxy resin E-54, E-51, E-44, E-20, E-14, E-13, E-12, novolac epoxy resin F-51, F-44 and D431;
the polyisocyanate curing agent comprises at least one of Koskan N3390, N3300, N3390, N75, blocked 3175, blocked 3370, N75, and Asahi chemical compound 60X.
The auxiliary agent comprises: catalyst, flatting agent, dispersant and anti-settling agent;
preferably, the catalyst comprises at least one of dibutyltin dilaurate, stannous octoate, dibutyltin bis (dodecylthio), dibutyltin diacetate and alkyltin dithiols;
preferably, the leveling agent comprises at least one of BYK-358N, BYK-354 and BYK-3550;
preferably, the dispersant comprises at least one of BYK-110, BYK-163, Germany;
preferably, BYK-410 is used as the anti-settling agent.
More preferably, the catalyst, the leveling agent, the dispersant and the anti-settling agent are all used in an amount of 0.001-1 part by weight, based on the amount of the metal conductive powder.
The solvent includes at least one of N-methylpyrrolidone (NMP) and N, N-Dimethylformamide (DMF).
Meanwhile, the embodiment of the invention also provides a preparation method of the conductive silver paste, which comprises the following steps:
step 1, preparation of organic phase resin: putting diisocyanate monomers and dicarboxylic acid monomers into a four-mouth bottle according to the ratio of 0.5-1.5 of functional groups, putting a certain mass of DMF/NMP mixed solution as a solvent, and reacting at the temperature of 100-;
step 2, silver paste preparation: and (2) adding the polyamide-imide resin prepared in the step (1) and the mixed silver powder, curing agent, catalyst, flatting agent, anti-settling agent, dispersing agent and the like into the resin solution, and fully grinding and mixing on a three-roll grinder to prepare the conductive silver paste.
The embodiment of the invention provides two curing modes, wherein one is the trimeric isocyanate curing system shown in the embodiment 1, and the other is the epoxy resin curing system shown in the embodiment 2.
Example 1
89.2g of diphenylmethane diisocyanate, 60.8g of trimellitic anhydride and 350 g of NMP are taken to be placed in a four-neck flask, the materials are uniformly mixed by mechanical stirring, the temperature is raised to 160 ℃, the heating is stopped after the mechanical stirring is carried out for 4 hours, the resin is poured out after being cooled, and reddish brown wholly aromatic PAI-1 resin is obtained, the viscosity of the resin is tested to be 1200 mPas, and the resin is reserved.
The silver paste is prepared by mixing PAI-1 resin, silver powder, curing agent 3175, auxiliary agent, solvent and the like according to the proportion shown in the formula in the table.
| Categories | PAI-1 | Silver powder | 3175 | Stannous octoate | BYK-190 | BYK-333 | BYK-410 | DMF | NMP |
| Content g | 11.25 | 50.00 | 1.25 | 0.05 | 0.05 | 0.05 | 0.05 | 8.13 | 29.17 |
According to the table, 100.00g of conductive silver paste is prepared, the silver paste is printed on a polyimide film substrate in a screen printing mode, and the conductivity of the cured silver paste is tested after the silver paste is baked for 1 hour at 160 ℃. The test results are: 1.10*105S/cm。
The nuclear magnetic spectrum of the polyamideimide resin PAI-1 synthesized in example 1 is shown in FIG. 1, which demonstrates the structure of the synthetic resin.
The resin prepared in example 1 and silver powder are mixed to obtain conductive silver paste, and then a scanning electron microscope image of the resin and the silver powder after the conductive silver paste is cured is shown in fig. 2, and as can be seen from fig. 2, the resin and the silver powder are uniformly distributed, no obvious agglomeration phenomenon is found in silver particles, and no agglomeration occurs in the resin, which indicates that the compatibility and the dispersibility of the resin and the silver powder are good, and the conductive silver paste is also a decisive factor for good conductivity.
Example 2
The silver paste is prepared by mixing PAI-1 resin, silver powder, curing agent 3175, auxiliary agent, solvent and the like according to the proportion shown in the formula in the table.
| Categories | PAI-1 | Silver powder | D431 | Stannous octoate | BYK-190 | BYK-333 | BYK-410 | DMF | NMP |
| Content g | 11.25 | 50.00 | 1.25 | 0.05 | 0.05 | 0.05 | 0.05 | 8.13 | 29.17 |
According to the table, 100.00g of conductive silver paste is prepared, the silver paste is printed on a polyimide film substrate in a screen printing mode, and the conductivity of the cured silver paste is tested after the silver paste is baked for 1 hour at 160 ℃. The test results are: 0.90*105S/cm。
Comparative example 1
The PAI-1 resin was replaced with a commercially available polycarbonate diol resin (molecular weight 1000) and a hydroxyl-terminated polyester resin (number average molecular weight 800), respectively. The conductive silver paste was prepared according to the following formulation.
137.4g of conductive silver paste was prepared separately as shown in the above table, and both silver pastes were screen printed on a polyimide film and similarly tested for conductivity after baking at 160 ℃ for 1 hour. The test results are: the conductivity of the polyester system was 0.0045 x 105S/cm, the polycarbonate diol system is not conductive.
This comparative example illustrates that polyester resins and polycarbonate resins are much less conductive in silver paste than PA I-1 resin at the same silver powder content and curing system conditions.
Comparative example 2
The organic phase resin is replaced by polyester resin, and the silver powder content is continuously improved to obtain higher conductivity. Silver powder was prepared according to the following formulation.
According to the table, 100.00g of conductive silver paste is prepared, the silver paste is printed on a polyimide film substrate in a screen printing mode, and the conductivity of the cured silver paste is tested after the silver paste is baked for 1 hour at 160 ℃. The test results are: 0.99*105S/cm。
Comparative example 2 the results show that when the silver powder content was increased to 59.14, the conductivity value was 0.99 x 10 using the polyester resin as the organic phase resin5S/cm, namely, if other types of resins different from those provided by the embodiment of the invention are used, the silver powder content required by the other types of resins is higher if the same or similar conductivity is achieved, namely, the resin provided by the embodiment of the invention is used for preparing the conductive silver paste, so that the using amount of the silver powder can be greatly reduced.
Comparative example 3
68.1g of diphenylmethane diisocyanate, 19.6g of hexamethylene diisocyanate, 62.25g of trimellitic anhydride and 350 g of NMP are put into a four-neck flask, and are uniformly mixed by mechanical stirring, the temperature is raised to 160 ℃, the heating is stopped after stirring for 4 hours, the resin is poured out after being cooled to obtain reddish brown PAI-2 resin, and the viscosity of the resin is 1023 mPas for standby application.
The silver paste is prepared by mixing PAI-2 resin, silver powder, curing agent 3175, auxiliary agent, solvent and the like according to the proportion shown in the formula in the table.
| Categories | PAI-2 | Silver powder | 3175 | Stannous octoate | BYK-190 | BYK-333 | BYK-410 | DMF | NMP |
| Content g | 11.25 | 50.00 | 1.25 | 0.05 | 0.05 | 0.05 | 0.05 | 8.13 | 29.17 |
According to the table above, 100.00g of conductive silver paste was prepared, which was printed on a polyimide film substrate by screen printing and baked at 160 ℃ for 1 hour to test the conductivity of the cured silver paste. The test results are: 1.00*105S/cm。
This comparative example demonstrates that the performance of the wholly aromatic PAI resin in conductive silver paste is superior to that of the semi-aromatic PA I resin in conductive silver paste.
Comparative example 4
A certain amount of PAI-1 resin, curing agent 3175, auxiliary agent, solvent and the like are taken to prepare silver paste according to the formula shown in the table.
Two kinds of conductive silver pastes were prepared respectively as shown in the above table, and the silver pastes were printed on a polyimide film by screen printing and were baked at 160 ℃ for 1 hour to test the conductivity of the silver pastes. The test results were 1.02 × 10 respectively5S/cm，1.07*105S/cm。
The above results demonstrate that the optimum ratio of PAI-1 resin to curing agent 3175 formulation is 90: 10.
similarly, silver pastes were prepared according to the formulations shown in the tables, taking certain amounts of PAI-1 resin and epoxy curing agent D431, auxiliaries, solvents, etc.
Two kinds of conductive silver pastes were prepared respectively as shown in the above table, and the silver pastes were printed on a polyimide film by screen printing and were baked at 160 ℃ for 1 hour to test the conductivity of the silver pastes. The test results were 0.82 x 10, respectively5S/cm，0.84*105S/cm。
The above results demonstrate that the optimum ratio of PAI-1 resin to epoxy curing agent D431 formulation is 90: 10.
from the experimental results of the above examples and comparative examples, it can be seen that the conductive silver paste provided by the embodiment of the invention can achieve higher conductivity by using less silver powder. The resin type and curing agent type are the primary factors affecting conductivity, and the optimum ratio of PAI-1 resin to curing agent 3175 is 90: 10, the ratio of the PAI-1 resin to the curing agent 3175 has no obvious change in conductivity within a small variation range, and the optimal ratio of the PAI-1 resin to the curing agent D431 is 90: 10, the ratio of PAI-1 resin to curing agent D431 in a small variation range leads to a more significant decrease in the electrical conductivity.
In summary, the embodiment of the invention provides a conductive silver paste with high conductivity and low silver powder content, and a preparation method and application thereof. The conductive silver paste comprises the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent. The conductive silver paste can be prepared by fully grinding and uniformly mixing the components on a three-roller grinding machine. The silver paste has the characteristic of low silver powder content, greatly reduces the cost, and has the advantage of high conductivity, so that the silver paste has wide industrial application prospect.
The present invention has been described in terms of the preferred embodiment, and it is not intended to be limited to the embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The conductive silver paste is characterized by comprising the following components in parts by mass: 40-90 parts of metal conductive powder, 5-60 parts of resin, 0-10 parts of curing agent, 0.001-2 parts of auxiliary agent and 5-50 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent.
2. The conductive silver paste of claim 1, comprising the following components in parts by mass: 40-75 parts of metal conductive powder, 10-30 parts of resin, 1-5 parts of curing agent, 0.001-0.5 part of auxiliary agent and 10-35 parts of solvent, wherein the resin is polyamide-imide resin, and the curing agent is at least one of epoxy resin curing agent and polyisocyanate curing agent.
3. The conductive silver paste of claim 1, wherein the metal conductive powder is silver powder;
preferably, the metal conductive powder is nano silver powder and/or flake silver powder, the particle size of the flake silver powder is 1-20 μm, and the particle size of the nano silver powder is 0.1-1 μm;
more preferably, the ratio of the silver flakes to the silver nanoparticles is 30-90: 10-70.
4. The conductive silver paste of claim 1, wherein the polyamideimide resin is one or more of aromatic, semi-aromatic and aliphatic polyamideimide resins;
preferably, diisocyanate monomers and dicarboxylic acid monomers are reacted in N-methylpyrrolidone and/or N, N-dimethylformamide according to the functional group ratio of 0.5-1.5 to obtain the polyamide-imide resin;
more preferably, the diisocyanate monomer comprises at least one of diphenylmethane diisocyanate, isophorone diisocyanate, toluene diisocyanate and hexamethylene diisocyanate, and the dicarboxylic acid monomer comprises at least one of trimellitic anhydride, pyromellitic anhydride, adipic acid and sebacic acid;
more preferably, the polyamide-imide resin is obtained after 4-6 hours of reaction at the temperature of 100-160 ℃, and is a red brown viscous liquid with the viscosity of 30-30000 mPas.
5. The conductive silver paste of claim 1, wherein the epoxy resin curing agent comprises at least one of bisphenol a epoxy resins E-54, E-51, E-44, E-20, E-14, E-13, E-12, novolac epoxy resins F-51, F-44, and D431;
preferably, the polyisocyanate-based curing agent includes at least one of koshichu N3390, N3300, N3390, N75, block 3175, block 3370, N75, and asahi chemical 60X.
6. The conductive silver paste of claim 1, wherein the additive comprises: catalyst, flatting agent, dispersant and anti-settling agent;
preferably, the catalyst comprises at least one of dibutyltin dilaurate, stannous octoate, dibutyltin bis (dodecylthio), dibutyltin diacetate and alkyltin dithiols;
preferably, the leveling agent comprises at least one of BYK-358N, BYK-354 and BYK-3550;
preferably, the dispersant comprises at least one of BYK-110 and BYK-163 of Germany;
preferably, the anti-settling agent uses BYK-410;
more preferably, the catalyst, the leveling agent, the dispersant and the anti-settling agent are all used in an amount of 0.001-1 part by reference to the amount of the metal conductive powder.
7. The conductive silver paste of claim 1, wherein the solvent comprises at least one of N-methylpyrrolidone and N, N-dimethylformamide.
8. The conductive silver paste of any one of claims 1-7, wherein the cured conductive silver paste has a conductivity of 1.0 x 102S/cm-1.10*105S/cm。
9. The method for preparing the conductive silver paste according to any one of claims 1 to 7, wherein the method comprises the following steps: and grinding and mixing the metal conductive powder, the resin, the curing agent, the auxiliary agent and the solvent according to the proportion to obtain the conductive silver paste.
10. Use of the conductive silver paste according to any one of claims 1-7 in membrane switches, flexible printed circuit boards, electromagnetic shielding, potentiometers, radio frequency identification systems or solar cells.
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