CN114545197A - Testing device for semiconductor laser chip assembly - Google Patents

Testing device for semiconductor laser chip assembly Download PDF

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Publication number
CN114545197A
CN114545197A CN202210057146.4A CN202210057146A CN114545197A CN 114545197 A CN114545197 A CN 114545197A CN 202210057146 A CN202210057146 A CN 202210057146A CN 114545197 A CN114545197 A CN 114545197A
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CN
China
Prior art keywords
pressing block
chip carrier
semiconductor laser
rod
tested
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Pending
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CN202210057146.4A
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Chinese (zh)
Inventor
王泰山
刘文斌
蓝清锋
程珠敏
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Shenzhen Raybow Optoelectronics Co ltd
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Shenzhen Raybow Optoelectronics Co ltd
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Application filed by Shenzhen Raybow Optoelectronics Co ltd filed Critical Shenzhen Raybow Optoelectronics Co ltd
Priority to CN202210057146.4A priority Critical patent/CN114545197A/en
Publication of CN114545197A publication Critical patent/CN114545197A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The application discloses semiconductor laser chip assembly's testing arrangement, this testing arrangement includes: the chip carrier is used for placing a semiconductor laser chip assembly to be tested; the power supply electrode is used for providing a test signal for the semiconductor laser chip assembly to be tested; the transmission mechanism is arranged on one side of the chip carrier, the power supply electrode is arranged on one side of the transmission mechanism close to the chip carrier, and the transmission mechanism is used for driving the power supply electrode to move relative to the chip carrier; and the pressing rod is arranged on the transmission mechanism, is positioned on one side of the power feeding electrode, which is deviated from the chip carrier, and is used for pressing the power feeding electrode and the semiconductor laser chip component to be tested. The testing device of the semiconductor laser chip component can enable the power supply electrode to be in reliable elastic contact with the semiconductor laser chip component to be tested by arranging the independent pressure rod structure, and enables the semiconductor laser chip component to be tested to be in good contact with the chip carrier platform to guarantee heat dissipation so as to achieve lossless injection of large current (larger than 30A).

Description

Testing device for semiconductor laser chip assembly
Technical Field
The application relates to the technical field of semiconductors, in particular to a testing device for a semiconductor laser chip assembly.
Background
With the increasing expansion of the application fields of semiconductor Lasers (LD), such as LD-Pumped Solid-State lasers (DPL), pump sources of various fiber lasers, Laser cutting, welding, medical treatment, Laser military applications, etc., the requirements for the reliability of semiconductor lasers are also increasing. The semiconductor laser chip is a core part of the semiconductor laser and has a name of a semiconductor laser "CPU".
The quality of the semiconductor laser can be guaranteed only by strict performance characterization tests. With the increasing application of semiconductor lasers, the requirements on the output power and reliability of the semiconductor lasers are higher and higher. The high-power semiconductor laser chip can be ensured to be reliably characterized and tested only by realizing lossless and reliable large-current injection and ensuring good heat dissipation. With the increasing output power of the semiconductor laser, the continuous current required to be injected during the characterization test is larger and larger (greater than 30A), and the semiconductor laser is more and more sensitive to whether the heat dissipation performance is good or not. The existing common test device is difficult to realize reliable characterization test, and the injected current is usually less than 30A.
Disclosure of Invention
In view of this, an object of the present application is to provide a testing apparatus for a semiconductor laser chip assembly, which can make a feeding electrode and the semiconductor laser chip assembly realize reliable elastic contact, and make the semiconductor laser chip assembly to be tested and a chip carrier well contact to ensure heat dissipation, so as to realize lossless injection of a large current.
In order to solve the technical problem, the technical scheme provided by the application is as follows: provided is a test apparatus for a semiconductor laser chip assembly, the test apparatus including:
the chip carrier is used for placing a semiconductor laser chip assembly to be tested;
the power supply electrode is used for providing a test signal for the semiconductor laser chip assembly to be tested;
the transmission mechanism is arranged on one side of the chip carrier, the power supply electrode is arranged on one side of the transmission mechanism close to the chip carrier, and the transmission mechanism is used for driving the power supply electrode to move relative to the chip carrier;
and the pressing rod is arranged on the transmission mechanism, is positioned on one side of the power feeding electrode, which is deviated from the chip carrier, and is used for pressing the power feeding electrode and the semiconductor laser chip component to be tested.
Wherein, drive mechanism includes:
the bottom plate is connected with the chip carrier;
the handle is hinged with the bottom plate;
one end of the transmission rod is connected with the handle and moves along the axial direction of the handle under the action of the handle;
the first pressing block is connected with the other end of the transmission rod and is in sliding connection with the bottom plate, and the pressing rod is arranged on one side, close to the chip carrier, of the first pressing block;
the second pressing block is connected with the bottom plate in a sliding mode and is abutted against one side, away from the transmission rod, of the first pressing block, and the feeding electrode is fixedly arranged on one side, close to the chip carrier, of the second pressing block;
the transmission rod drives the first pressing block to be close to the chip carrier platform along the axial direction, the first pressing block pushes the second pressing block to be close to the chip carrier platform along the axial direction, so that the power supply electrode is in contact with the semiconductor laser chip assembly to be tested, and the first pressing block drives the pressing rod to abut against the power supply electrode.
Wherein the transmission mechanism further comprises:
one end of the guide rod is fixedly connected with the second pressing block, and the other end of the guide rod is in sliding connection with the first pressing block;
and the first spring is sleeved outside the guide rod, and two ends of the first spring are respectively abutted to the first pressing block and the second pressing block.
Wherein the transmission mechanism further comprises:
the guide block is fixedly arranged on the first pressing block and is distributed with the first pressing block along the direction perpendicular to the axial direction, a through hole is formed in one side, close to the chip carrier, of the guide block, and one end, away from the chip carrier, of the pressing rod is embedded in the through hole;
the second spring is embedded in one end, deviating from the compression bar, of the through hole;
the limiting plate is fixedly arranged on one side, away from the pressure rod, of the guide block, and the projection of the limiting plate on the guide block covers the through hole.
The inner diameter of the hole section of the through hole for arranging the pressing rod is smaller than the inner diameter of the hole section of the through hole for arranging the second spring.
Wherein, the testing device further comprises:
and the guide assembly is respectively connected with the chip carrier and the transmission mechanism and is used for adjusting the relative position of the transmission mechanism and the chip carrier so as to adjust the relative position of the power supply electrode and the chip carrier.
Wherein the guide assembly comprises:
the first guide plate is connected with the chip carrying platform in a sliding mode along a first direction;
the second guide plate is connected with the first guide plate in a sliding mode along the second direction;
the second guide plate is connected with the bottom plate in a sliding mode along the third direction;
the first direction is perpendicular to the second direction and the third direction, and the third direction is perpendicular to the second direction and parallel to the axial direction.
The first guide plate is provided with a first sliding groove extending along the first direction, the chip carrier is provided with a joint, and the joint is embedded in the first sliding groove;
the second guide plate is provided with a second sliding groove extending along the second direction, and at least part of the first guide plate is embedded in the first sliding groove; the second guide plate is provided with a third sliding groove extending along a third direction, and the bottom plate is at least partially embedded in the third sliding groove.
Wherein, first briquetting is equipped with the opening, drive mechanism further includes:
the other end of the transmission rod extends to one side, away from the handle, of the first pressing block, and the limiting piece is arranged on one side, away from the handle, of the first pressing block and is fixedly connected with the other end of the transmission rod;
wherein the radius of the transmission rod is smaller than the radius of the opening.
The testing device comprises a chip carrier, a chip positioning mechanism, a supporting mechanism and a positioning mechanism, wherein the chip carrier is provided with a positioning hole, the supporting mechanism comprises:
a supporting base;
the positioning pin is fixedly arranged on the supporting seat;
the heat insulation plate is arranged on the support, the chip carrier is arranged on one side of the heat insulation plate, which is far away from the supporting seat, and the positioning pin is matched with the positioning hole so as to fixedly connect the chip carrier with the supporting seat.
The test apparatus according to any of the above, wherein the chip stage comprises:
and the heat dissipation mechanism is provided with a positioning groove for accommodating the semiconductor laser chip assembly to be tested.
The beneficial effect of this application is: the semiconductor laser chip component testing device is characterized in that a testing signal is provided for the semiconductor laser chip component to be tested through the power supply electrode, current injection of the semiconductor laser chip component to be tested is achieved, meanwhile, the power supply electrode and the semiconductor laser chip component to be tested are pressed tightly through a pressure rod arranged on the transmission mechanism after the power supply electrode is contacted with the semiconductor laser chip component to be tested, reliable elastic contact between the power supply electrode and the semiconductor laser chip component to be tested can be achieved, good contact between the semiconductor laser chip component to be tested and a chip carrier can be achieved, heat dissipation is guaranteed, lossless injection current is achieved, and then large current injection (larger than 30A) can be achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of a testing apparatus for a semiconductor laser chip assembly according to the present invention;
FIG. 2 is a schematic structural view of the transmission mechanism, the compression bar and the guide assembly in the embodiment of FIG. 1;
FIG. 3 is a schematic structural diagram of a guide block, a compression bar, a second spring and a limiting plate in the embodiment of FIG. 1;
FIG. 4 is a schematic structural diagram of a chip carrier in the embodiment of FIG. 1;
fig. 5 is a schematic structural diagram of the supporting mechanism in the embodiment of fig. 1.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The present application first provides a testing apparatus for a semiconductor laser chip assembly, as shown in fig. 1, fig. 1 is a schematic structural diagram of an embodiment of the testing apparatus for a semiconductor laser chip assembly according to the present application. The testing device of the semiconductor laser chip assembly comprises a chip carrier 10, a power supply electrode 11, a transmission mechanism 12 and a pressure lever 13; the chip carrier 10 is used for placing a semiconductor laser chip assembly to be tested; the power supply electrode 11 is used for providing a test signal for a semiconductor laser chip assembly to be tested; the transmission mechanism 12 is arranged on one side of the chip carrier 10, the feeding electrode 11 is arranged on one side of the transmission mechanism 12 close to the chip carrier 10, and the transmission mechanism 12 is used for driving the feeding electrode 11 to move relative to the chip carrier 10; the pressing rod 13 is arranged on the transmission mechanism 12 and is located on one side of the feeding electrode 11, which is far away from the chip carrier 10, and is used for pressing the feeding electrode 11 and the semiconductor laser chip component to be tested.
In the present embodiment, the shape and material of the feeding electrode 11 are not limited, but the feeding electrode 11 is preferably formed in a copper bar shape to inject a large current (greater than 30A). Further, the number of the pressing rods 13 is not limited in the embodiment of the present application, and preferably, 4 pressing rods 13 are selected in the embodiment of the present application to press the feeding electrode 11 and the semiconductor laser chip assembly to be tested.
In the embodiment of the present application, a semiconductor laser chip component to be tested is placed on the chip carrier 10, and the transmission mechanism 12 drives the feeding electrode 11 to move so as to make it close to and contact the semiconductor laser chip component to be tested, so as to provide a test signal, i.e., an injection current, to the feeding electrode 11 for the semiconductor laser chip component to be tested. Further, the transmission mechanism 12 can also drive the pressing rod 13 to press the feeding electrode 11 and the semiconductor laser chip component to be tested (after the feeding electrode 11 is contacted with the semiconductor laser chip component to be tested) so as to realize reliable contact between the feeding electrode 11 and the semiconductor laser chip component to be tested.
The embodiment provides a testing device of a semiconductor laser chip assembly, which provides a testing signal for the semiconductor laser chip assembly to be tested through a feeding electrode 11, so as to realize current injection of the semiconductor laser chip assembly to be tested, and simultaneously, after the feeding electrode 11 is contacted with the semiconductor laser chip assembly to be tested through a pressure rod 13 arranged on a transmission mechanism 12, the feeding electrode 11 is pressed with the semiconductor laser chip assembly to be tested, so that not only can the feeding electrode 11 be reliably and elastically contacted with the semiconductor laser chip assembly to be tested, but also the lossless injection current can be realized, and further, the high-current injection (larger than 30A) can be realized.
Alternatively, as shown in fig. 2, fig. 2 is a schematic structural diagram of the transmission mechanism, the pressing rod and the guiding assembly in the embodiment of fig. 1. The transmission mechanism 12 includes a bottom plate 121, a handle 122, a transmission rod 123, a first pressing piece 124, and a second pressing piece 125. Wherein, the bottom plate 121 is connected with the chip carrier 10; the handle 122 is hinged with the bottom plate 121; one end of the transmission rod 123 is connected with the handle 122 and can move along the axial direction thereof under the action of the handle 122; the first pressing block 124 is connected with the other end of the transmission rod 123 and is connected with the bottom plate 121 in a sliding manner, and the pressing rod 13 is arranged on one side of the first pressing block 124 close to the chip carrier 10; the second pressing block 125 is slidably connected to the bottom plate 121, and abuts against a side of the first pressing block 124 away from the transmission rod 123, and the feeding electrode 11 is fixedly disposed on a side of the second pressing block 125 close to the chip carrier 10.
The transmission mechanism 12 of the present embodiment further includes an L-shaped transmission member (not shown), a first end of the handle 122 is hinged to the bottom plate 121, and a first end of the L-shaped transmission member is hinged between the first end of the handle 122 and a second end of the handle 122; the second end of the L-shaped transmission member is hinged to one end of the transmission rod 123, and the first pressing block 124 is connected to the other end of the transmission rod 123.
During use, the handle 122 is operated to move the transmission rod 123 along the axial direction thereof (up and down in this embodiment) under the force of the handle 122.
Because the transmission rod 123 is connected to the first pressing block 124 and the second pressing block 125, and the first pressing block 124 and the second pressing block 125 are slidably connected to the bottom plate 121, the transmission rod 123 can drive the first pressing block 124 to move close to the chip stage 10 along the axial direction, and meanwhile, the first pressing block 124 can push the second pressing block 125 to move close to the chip stage 10 along the axial direction. Wherein, the pressure lever 13 is arranged on one side of the first pressure block 124 close to the chip carrier 10, and the feeding electrode 11 is fixedly arranged on one side of the second pressure block 125 close to the chip carrier 10. Therefore, when the first pressing block 124 and the second pressing block 125 move to a certain distance, the second pressing block 125 can drive the feeding electrode 11 to contact with the semiconductor laser chip assembly to be tested, and the first pressing block 124 can drive the pressing rod 13 to press against the feeding electrode 11.
Under the action of the handle 122, the transmission rod 123 can drive the first pressing block 124 and the second pressing block 125 to move away from the chip carrier 10, so as to lift the feeding electrode 11 and the pressing rod 13, thereby facilitating the replacement of the semiconductor laser chip assembly to be tested.
It should be noted that the material of the first compact 124 and the second compact 125 is not limited in the present application, and preferably, the second compact 125 may be made of an aluminum alloy and is hard anodized for realizing reliable insulation and good heat dissipation.
In the embodiment of the present application, by providing the first pressing block 124 and the second pressing block 125 to which the pressing rod 13 and the feeding electrode 11 are respectively connected, the feeding electrode 11 can be contacted with the semiconductor laser chip assembly to be tested, and simultaneously, the pressing rod 13 can be pressed against the feeding electrode 11, so that the reliable contact between the pressing rod 13 and the feeding electrode 11 can be further realized. Meanwhile, the handle 122 is arranged to drive the transmission rod 123, so that the transmission rod 123 drives the first pressing block 124 and the second pressing block 125 to move.
Optionally, as shown in fig. 2, the transmission mechanism 12 of the present embodiment may further include a guide rod 126 and a first spring 127. One end of the guide rod 126 is fixedly connected with the second pressing block 125, and the other end is slidably connected with the first pressing block 124; the first spring 127 is sleeved outside the guide rod 126, and two ends of the first spring are respectively abutted against the first pressing block 124 and the second pressing block 125. The arrangement can enable the first pressing block 124 to push the second pressing block 125 to move close to the chip carrier 10 along the axial direction, so that the feeding electrode 11 is in contact with the semiconductor laser chip assembly to be tested, and after the feeding electrode 11 is in contact with the semiconductor laser chip assembly to be tested, the first pressing block 124 and the second pressing block 125 are in an elastic tensioning state under the action of the first spring 127, namely when the second pressing block 125 is fixed, the first pressing block 124 can continuously push the pressing rod 13 to press the feeding electrode 11 and the semiconductor laser chip assembly to be tested, and at the moment, the spring is in a compression state.
In the embodiment of the present application, the first pressing block 124 and the second pressing block 125 are connected by providing the guide rod 126 and the first spring 127, so that the first pressing block 124 and the second pressing block 125 are in a tensioned state, that is, the feeding electrode 11 is elastically contacted with the semiconductor laser chip assembly to be tested.
Further, the transmission mechanism 12 further includes a limiting member (not shown), the first pressing block 124 is provided with a through hole, the other end of the guide rod 126 extends from the through hole to a side of the first pressing block 124 away from the first spring 127, and the limiting member is fixedly connected to one end of the guide rod 126 extending from the first pressing block 124, so as to ensure that the first pressing block 124 and the first spring 127 cannot be separated from the guide rod 126.
The first pressing block 124 drives the second pressing block 125 to move away from the chip carrier 10 along the axial direction, so that the feeding electrode 11 and the pressing rod 13 are separated from the semiconductor laser chip assembly to be tested.
Optionally, referring to fig. 2 to 3, fig. 3 is a schematic structural diagram of the guide block, the pressing rod, the second spring and the limiting plate in the embodiment of fig. 1. The transmission mechanism 12 may further include a guide block 128, a second spring 129, and a stopper plate 130. The guide block 128 can be used to connect the first pressing block 124 and the pressing rod 13, specifically, the guide block 128 is fixedly disposed on the first pressing block 124 and is arranged in a direction perpendicular to the axial direction with the first pressing block 124, further, a through hole is disposed on one side of the guide block 128 close to the chip carrier 10, and one end of the pressing rod 13 departing from the chip carrier 10 is embedded in the through hole. The embodiment of the application is further provided with a second spring 129 and a limiting plate 130, wherein the second spring 129 is embedded in one end of the through hole deviating from the pressing rod 13, the limiting plate 130 is fixedly arranged on one side of the guide block 128 deviating from the pressing rod 13, the projection of the limiting plate 130 on the guide block 128 covers the through hole, and the limiting plate 130 can limit the second spring 129 to enable the pressing rod 13 to be in a spring pressing state.
The shape and size of the through hole are not limited in the embodiment of the present application, as long as the through hole can be used for connecting the pressing rod 13 and enabling the pressing rod 13 to be in a tensioned state. Preferably, the through hole has a size that the inner diameter of the hole section of the pressing rod 13 is smaller than the inner diameter of the hole section of the through hole where the second spring 129 is disposed, that is, the through hole is a stepped hole. This structure enables the second spring 129 to be fixed in the guide block 128 and to be always in a compressed state under the limit action of the limit plate 130 to increase the thrust to the pressing rod 13. Through the structure, the elastic contact between the pressing rod 13 and the semiconductor laser chip assembly to be tested can be realized, and the elastic pressure of the pressing rod 13 on the semiconductor laser chip assembly to be tested can be increased.
Optionally, the testing apparatus for a semiconductor laser chip assembly provided by the present application may further include a guiding assembly 15, where the guiding assembly 15 is connected to the chip carrier 10 and the transmission mechanism 12, respectively, and is used to adjust the relative positions of the transmission mechanism 12 and the chip carrier 10, and since the transmission mechanism 12 is provided with the feeding electrode 11 and the pressing rod 13, the guiding assembly 15 may be used to adjust the relative positions of the feeding electrode 11 and the pressing rod 13 and the chip carrier 10, so as to achieve precise alignment between the feeding electrode 11 and the pressing rod 13.
Alternatively, as shown in fig. 2, the guide assembly 15 of the present embodiment includes a first guide plate 151 and a second guide plate 152. Wherein, the first guide plate 151 is connected with the chip carrier 10 in a sliding manner along a first direction; the second guide plate 152 is slidably connected to the first guide plate 151 along the second direction; the second guide plate 152 is slidably coupled to the base plate 121 in the third direction. It should be noted that the first direction is perpendicular to the second direction and the third direction, and the third direction is perpendicular to the second direction and parallel to the axial direction. The three-dimensional positions of the feeding electrode 11 and the pressing rod 13 can be adjusted by the guide assembly 15.
Specifically, the first guide plate 151 and the chip carrier 10 are slidably connected in a first direction, i.e., front-back direction, so that front-back sliding adjustment can be realized; the second guide plate 152 is connected with the first guide plate 151 along a second direction, namely left and right, so that left and right sliding adjustment can be realized; the second guide plate 152 and the bottom plate 121 are slidably connected in the third direction, i.e., up and down, so that up and down adjustment can be achieved, and through the above arrangement, accurate alignment of the electric electrode and the chip carrier 10 can be achieved.
The present application does not limit the sliding connection structure between the guide assemblies 15 or between the guide assemblies 15 and the chip carrier 10 and the base plate 121.
Preferably, the first guide plate 151 is provided with a first sliding slot extending along a first direction, and the chip carrier 10 is provided with a joint (see fig. 4), wherein the joint is embedded in the first sliding slot; the second guide plate 152 is provided with a second sliding slot extending along the second direction, and the first guide plate 151 is at least partially embedded in the first sliding slot; the second guiding plate 152 is provided with a third sliding slot extending along the third direction, and the bottom plate 121 is at least partially embedded in the third sliding slot. In the embodiment of the present application, by providing the chute structure, the connection between the first guide plate 151 and the second guide plate 152, the connection between the first guide plate 151 and the chip stage 10, and the connection between the second guide plate 152 and the bottom plate 121 can be made smoother, and the chute structure can be conveniently used for adjusting the relative positions of the feeding electrode 11 and the pressing rod 13 with respect to the chip stage 10.
In the present application, the shape and number of the sliding grooves are not limited, but are preferable. The sliding groove can be a U-shaped hole and the like.
Optionally, as shown in fig. 2, the first pressing block 124 may further be provided with an opening, and the transmission mechanism 12 may further include a limiting member 131, wherein an outer diameter of the limiting member 131 is larger than a radius of the opening. The other end of the transmission rod 123 extends to one side of the first pressing block 124, which is far away from the handle 122, and the limiting piece 131 is arranged on one side of the first pressing block 124, which is far away from the handle 122, and is fixedly connected with the other end of the transmission rod 123; the radius of drive rod 123 is less than the radius of the opening.
In this way, the transmission rod 123 is not fixedly connected with the first pressing block 124, and the transmission rod 123 can move properly in the opening of the first pressing block 124, so that the jamming phenomenon can be effectively prevented when the first pressing block 124 moves.
Alternatively, referring to fig. 4 and fig. 5, fig. 4 is a schematic structural diagram of a chip carrier in the embodiment of fig. 1, and fig. 5 is a schematic structural diagram of a supporting mechanism in the embodiment of fig. 1. The testing device for the semiconductor laser chip assembly provided by the application can further comprise a supporting mechanism 16, and the chip carrier 10 can also be provided with a positioning hole. The supporting mechanism 16 includes a supporting base 161, a positioning pin 162, and a heat insulation plate 163.
Specifically, the positioning pin 162 is fixed to be arranged on the supporting seat 161, the heat insulation plate 163 is arranged on the supporting seat 161, the chip carrier 10 is arranged on one side of the heat insulation plate 163 deviating from the supporting seat 161, the positioning pin 162 and the positioning hole are matched to be arranged, the chip carrier 10 and the supporting seat 161 can be fixedly connected, and meanwhile, the rapid test switching of the semiconductor laser chip components of different specifications can be achieved.
Further, the supporting mechanism 16 further includes a bottom plate, a vertical plate and a horizontal plate, the vertical plate connects the bottom plate and the horizontal plate, and the chip carrier 10, the positioning pin 162 and the heat insulation plate 163 are disposed on the horizontal plate; and a space is formed under the transverse plate to improve heat dissipation; the supporting mechanism 16 includes two heat insulating plates 163 disposed at intervals to form a space between the chip carrier 10 and the horizontal plate to improve heat dissipation.
Optionally, referring to fig. 4, the chip carrier 10 includes a heat dissipation mechanism 101, wherein the heat dissipation mechanism 101 is provided with a positioning groove 102 for receiving a semiconductor laser chip assembly to be tested, so as to test the semiconductor laser chip assembly.
The heat dissipation mechanism 101 may further include a water tank main body, a water tank sealing plate, a heat dissipation plate, and a joint. Specifically, a sealing ring can be arranged between the water tank main body and the water tank sealing plate structure, and the sealing ring is fastened and connected through screws to form a closed water through tank; the heat dissipation plate can be connected above the water tank sealing plate through screws, and further a refrigeration sheet can be arranged between the heat dissipation plate and the water tank sealing plate and used for controlling the temperature of the heat dissipation plate and preventing the heat dissipation plate from being too high to influence a test result; the joint may be configured to be threadedly coupled to the sink body via a pipe.
The positioning groove 102 is disposed on the heat dissipation plate, and the heat dissipation plate is further provided with an insulating column for supporting the second pressing block 125.
When a semiconductor laser chip component is to be tested, the handle 122 is acted on, the feeding electrode 11 and the pressing rod 13 are lifted by the transmission mechanism 12, and the semiconductor laser chip component to be tested is placed in the positioning groove 102 on the chip stage 10 by using tweezers. Acting on the handle 122, moving the first pressing block 124 and the second pressing block 125 close to the chip carrier 10 along the axial direction through the transmission rod 123, and when the second pressing block 125 contacts with the insulation column of the heat dissipation plate, the feeding electrode 11 contacts with the semiconductor laser chip assembly to be tested; continuously acting on the handle 122, keeping the second pressing block 125 still, and continuously moving the first pressing block 124 close to the chip carrier 10 along the axial direction, wherein the first spring 127 with two ends abutting against the first pressing block 124 and the second pressing block 125 is in a compressed state; when the first pressing block 124 moves until the pressing rod 13 is contacted with the feeding electrode 11, the handle 122 is continuously acted, so that the first pressing block 124 continues to move close to the chip carrier 10 along the axial direction, at the moment, the pressing rod 13 is kept still, the second spring 129 continues to compress, and the pressing rod 13 presses the feeding electrode 11 and the semiconductor laser chip component to be tested.
The semiconductor laser chip component testing device is characterized in that a testing signal is provided for the semiconductor laser chip component to be tested through the power supply electrode, current injection of the semiconductor laser chip component to be tested is achieved, meanwhile, the power supply electrode and the semiconductor laser chip component to be tested are pressed tightly through a pressure rod arranged on the transmission mechanism after the power supply electrode is contacted with the semiconductor laser chip component to be tested, reliable elastic contact between the power supply electrode and the semiconductor laser chip component to be tested can be achieved, good contact between the semiconductor laser chip component to be tested and a chip carrier can be achieved, heat dissipation is guaranteed, lossless injection current is achieved, and then large current injection (larger than 30A) can be achieved.
The semiconductor laser Chip assembly can be a package body in which a semiconductor laser Chip is directly packaged On a heat sink (COS) with a high thermal conductivity.
It should be noted that various optional implementations described in the embodiments of the present application may be implemented in combination with each other or separately, and the embodiments of the present application are not limited thereto.
In the description of the present application, it is to be understood that the terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, and a specific orientation configuration and operation, and thus, are not to be construed as limiting the present application and "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted" connected "and the like are to be construed as meaning, for example, either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, or they may be connected through the inside of two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The embodiments described above are capable of other different forms and embodiments than those described with reference to the drawings and without departing from the principles of the present application, which is therefore not to be construed as limiting the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. In the drawings, the size and relative sizes of components may be exaggerated for clarity. The terms "comprises" and/or "comprising," when used in this specification, are taken merely to specify the presence of stated features, integers, components, and/or components, but do not preclude the presence or addition of one or more other features, integers, components, and/or groups thereof. Unless otherwise indicated, a range of values, when stated, includes the upper and lower limits of the range and any subranges therebetween.
The foregoing description of the preferred embodiments of the present application should be understood to enable those skilled in the art to make and use the teachings herein without departing from the principles of the present application.

Claims (11)

1. A semiconductor laser chip assembly testing apparatus, comprising:
the chip carrier is used for placing a semiconductor laser chip assembly to be tested;
the power supply electrode is used for providing a test signal for the semiconductor laser chip assembly to be tested;
the transmission mechanism is arranged on one side of the chip carrier, the power supply electrode is arranged on one side of the transmission mechanism close to the chip carrier, and the transmission mechanism is used for driving the power supply electrode to move relative to the chip carrier;
and the pressing rod is arranged on the transmission mechanism, is positioned on one side of the power feeding electrode, which is deviated from the chip carrier, and is used for pressing the power feeding electrode and the semiconductor laser chip component to be tested.
2. The testing device of claim 1, wherein the transmission mechanism comprises:
the bottom plate is connected with the chip carrier;
the handle is hinged with the bottom plate;
one end of the transmission rod is connected with the handle and moves along the axial direction of the handle under the action of the handle;
the first pressing block is connected with the other end of the transmission rod and is in sliding connection with the bottom plate, and the pressing rod is arranged on one side, close to the chip carrier, of the first pressing block;
the second pressing block is connected with the bottom plate in a sliding mode and is abutted against one side, away from the transmission rod, of the first pressing block, and the feeding electrode is fixedly arranged on one side, close to the chip carrier, of the second pressing block;
the transmission rod drives the first pressing block to be close to the chip carrier platform along the axial direction, the first pressing block pushes the second pressing block to be close to the chip carrier platform along the axial direction, so that the power supply electrode is in contact with the semiconductor laser chip assembly to be tested, and the first pressing block drives the pressing rod to abut against the power supply electrode.
3. The testing device of claim 2, wherein the transmission mechanism further comprises:
one end of the guide rod is fixedly connected with the second pressing block, and the other end of the guide rod is in sliding connection with the first pressing block;
and the first spring is sleeved outside the guide rod, and two ends of the first spring are respectively abutted to the first pressing block and the second pressing block.
4. The testing device of claim 2, wherein the transmission mechanism further comprises:
the guide block is fixedly arranged on the first pressing block and is distributed with the first pressing block along the direction perpendicular to the axial direction, a through hole is formed in one side, close to the chip carrier, of the guide block, and one end, away from the chip carrier, of the pressing rod is embedded in the through hole;
the second spring is embedded in one end, deviating from the compression bar, of the through hole;
the limiting plate is fixedly arranged on one side, away from the pressure rod, of the guide block, and the projection of the limiting plate on the guide block covers the through hole.
5. The testing device of claim 4, wherein an inner diameter of the through hole of the section of the bore in which the pressure rod is disposed is smaller than an inner diameter of the through hole of the section of the bore in which the second spring is disposed.
6. The testing device of claim 2, further comprising:
and the guide assembly is respectively connected with the chip carrier and the transmission mechanism and is used for adjusting the relative position of the transmission mechanism and the chip carrier so as to adjust the relative position of the power supply electrode and the chip carrier.
7. The testing device of claim 6, wherein the guide assembly comprises:
the first guide plate is connected with the chip carrying platform in a sliding mode along a first direction;
the second guide plate is connected with the first guide plate in a sliding mode along the second direction;
the second guide plate is connected with the bottom plate in a sliding mode along the third direction;
the first direction is perpendicular to the second direction and the third direction, and the third direction is perpendicular to the second direction and parallel to the axial direction.
8. The testing device of claim 7, wherein the first guide plate is provided with a first sliding slot extending along the first direction, and the chip carrier is provided with a joint embedded in the first sliding slot;
the second guide plate is provided with a second sliding groove extending along the second direction, and at least part of the first guide plate is embedded in the first sliding groove; the second guide plate is provided with a third sliding groove extending along a third direction, and the bottom plate is at least partially embedded in the third sliding groove.
9. The testing device of claim 2, wherein the first pressing block is provided with an opening, and the transmission mechanism further comprises:
the other end of the transmission rod extends to one side, away from the handle, of the first pressing block, and the limiting piece is arranged on one side, away from the handle, of the first pressing block and is fixedly connected with the other end of the transmission rod;
wherein the radius of the transmission rod is smaller than the radius of the opening.
10. The test device according to any one of claims 1 to 9, wherein the chip stage is provided with positioning holes, the test device further comprising a support mechanism, the support mechanism comprising:
a supporting seat;
the positioning pin is fixedly arranged on the supporting seat;
the heat insulation plate is arranged on the support, the chip carrier is arranged on one side of the heat insulation plate, which is far away from the supporting seat, and the positioning pin is matched with the positioning hole so as to fixedly connect the chip carrier with the supporting seat.
11. The test apparatus of any of claims 1 to 9, wherein the chip stage comprises:
and the heat dissipation mechanism is provided with a positioning groove for accommodating the semiconductor laser chip assembly to be tested.
CN202210057146.4A 2022-01-18 2022-01-18 Testing device for semiconductor laser chip assembly Pending CN114545197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210057146.4A CN114545197A (en) 2022-01-18 2022-01-18 Testing device for semiconductor laser chip assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210057146.4A CN114545197A (en) 2022-01-18 2022-01-18 Testing device for semiconductor laser chip assembly

Publications (1)

Publication Number Publication Date
CN114545197A true CN114545197A (en) 2022-05-27

Family

ID=81672588

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210057146.4A Pending CN114545197A (en) 2022-01-18 2022-01-18 Testing device for semiconductor laser chip assembly

Country Status (1)

Country Link
CN (1) CN114545197A (en)

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