CN114535219A - Anti-corrosion method and system for welding part of camera module - Google Patents

Anti-corrosion method and system for welding part of camera module Download PDF

Info

Publication number
CN114535219A
CN114535219A CN202210062629.3A CN202210062629A CN114535219A CN 114535219 A CN114535219 A CN 114535219A CN 202210062629 A CN202210062629 A CN 202210062629A CN 114535219 A CN114535219 A CN 114535219A
Authority
CN
China
Prior art keywords
welding
camera module
cleaning
welding part
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210062629.3A
Other languages
Chinese (zh)
Other versions
CN114535219B (en
Inventor
王中华
树林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Q Technology Co Ltd
Original Assignee
Kunshan Q Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Q Technology Co Ltd filed Critical Kunshan Q Technology Co Ltd
Priority to CN202210062629.3A priority Critical patent/CN114535219B/en
Publication of CN114535219A publication Critical patent/CN114535219A/en
Application granted granted Critical
Publication of CN114535219B publication Critical patent/CN114535219B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a method and a system for preventing welding parts of a camera module from being corroded, wherein the method comprises the following steps: obtaining a photosensitive chip and a circuit board for assembling a camera module; welding a bonding pad of the photosensitive chip and a bonding pad of the printed circuit board by using a welding wire to obtain a welding part; performing first plasma cleaning on the welding part by using cleaning gas; and assembling the welding part and other devices to obtain the camera module. According to the method, the reason for corrosion of the welding part is eliminated by canceling the washing process, so that the surface of the welding part is dry and does not have reaction conditions, and even if the welding part enters wrong process flows due to improper transportation, for example, the welding part enters the plasma cleaning process again, the welding part cannot be corroded, and the service life of the camera module is further ensured.

Description

Anti-corrosion method and system for welding part of camera module
Technical Field
The application relates to the field of production and manufacturing, in particular to a method and a system for preventing a camera module from being corroded by a welding part.
Background
At present, the smart device on the market is generally equipped with the module of making a video recording for realize functions such as shooing or making a video recording, greatly richened user's life.
The image pickup module has various types, and is classified into an MF (Manual Focus) module, an FF (Fixed Focus) module, an AF (Auto Focus) module, and the like according to a zoom capability. However, the structure of the camera module is similar and different, for example, the camera module has a lens, a sensor, an infrared filter, a photosensitive chip, a PCB (Printed Circuit Board), a base, a connector, and the like, and the camera module is prepared by welding, assembling, and the like, and is put into practical use.
In actual use, part of welding parts in the camera module have corrosion phenomena, and the corrosion phenomena are caused by errors in the production process flow of the part of welding parts, so that the service life of the camera module is seriously influenced.
Disclosure of Invention
The invention provides a method and a system for preventing a welding part of a camera module from being corroded, which are used for solving the problem of corrosion of the welding part in the camera module and ensuring the service life of the camera module.
In order to solve the technical problem, in a first aspect, the present invention provides a method for preventing a weld assembly of a camera module from being corroded, the method comprising:
obtaining a photosensitive chip and a circuit board for assembling a camera module;
welding the bonding pad of the photosensitive chip and the bonding pad of the printed circuit board by using a welding wire to obtain a welding part;
performing first plasma cleaning on the welding part by using cleaning gas;
and assembling the welding part and other devices to obtain the camera module.
Preferably, the performing a first plasma cleaning of the weldment with a cleaning gas comprises:
performing the first plasma cleaning on the weldment by using mixed gas; or
The weldment is subjected to the first plasma clean with a non-oxidizing gas.
Preferably, after the first plasma cleaning of the weldment with the cleaning gas, the method further comprises:
and cleaning the welding part by using cleaning fluid.
Preferably, after the welding part is cleaned by using the cleaning solution and before the welding part and other devices are assembled, the method further comprises the following steps:
a second plasma clean of the weldment is performed using a non-oxidizing gas.
Preferably, before the second plasma cleaning of the weldment using the non-oxidizing gas, the method further comprises:
detecting whether the cleaning solution remains in the welding part or not;
if so, performing a second plasma cleaning of the weldment using a non-oxidizing gas.
Preferably, the non-oxidizing gas comprises: a single inert gas, a non-oxidizing gas mixture.
Preferably, the single inert gas comprises: and argon gas.
In a second aspect, the present invention provides a weld assembly anticorrosion system for a camera module, including:
the welding device is used for obtaining a photosensitive chip and a circuit board which are used for assembling the camera module; welding the bonding pad of the photosensitive chip and the bonding pad of the printed circuit board by using a welding wire to obtain a welding part;
the cleaning device is used for carrying out first plasma cleaning on the welding part by utilizing cleaning gas;
and the assembling device is used for assembling the welding piece and other devices to obtain the camera module.
Preferably, the cleaning device is specifically configured to:
performing the first plasma cleaning on the weldment by using mixed gas; or
The weldment is subjected to the first plasma clean with a non-oxidizing gas.
Preferably, the system further comprises:
and the water washing device is used for washing the welding parts by using the washing liquid.
Preferably, the cleaning device is specifically configured to:
a second plasma clean of the weldment is performed using a non-oxidizing gas.
Preferably, the cleaning device is specifically configured to:
detecting whether the cleaning solution remains in the welding part or not;
if so, performing a second plasma cleaning of the weldment using a non-oxidizing gas.
Preferably, the non-oxidizing gas comprises: a single inert gas, a non-oxidizing gas mixture.
Preferably, the single inert gas comprises: and argon gas.
In a third aspect, the invention provides a camera module, which is characterized in that the camera module is prepared by using a method for preventing corrosion of a welding part of the camera module in any technical scheme.
In a fourth aspect, the present invention provides an electronic device, including the camera module in the foregoing technical solution.
Through one or more technical schemes of the invention, the invention has the following beneficial effects or advantages:
the invention discloses a method and a system for preventing a welding part of a camera module from being corroded, wherein a photosensitive chip and a printed circuit board are obtained to prepare the welding part, and the welding part is directly assembled with other parts after being subjected to first plasma cleaning by using gas so as to prevent the welding part from entering a water washing process and be subjected to an assembly process under the condition of keeping the welding part dry. This scheme eliminates the welding through cancellation washing technology and produces corroded inducement, makes welding surface drying not possess reaction condition, even if the welding is because the improper technological process who gets into the mistake of transporting, for example do not get into the equipment behind plasma cleaning process, but get into plasma cleaning process once more, also can not produce the corruption, and then has guaranteed the life of the module of making a video recording.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 shows a flowchart of a weld corrosion prevention method of a camera module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an AF module according to one embodiment of the present invention;
3-4 illustrate a pad schematic of a photosensitive chip and a printed circuit board according to one embodiment of the invention;
fig. 5 shows a schematic view of a weld corrosion prevention system of the camera module according to one embodiment of the present invention.
Detailed Description
In order to better understand the technical solutions, the technical solutions of the embodiments of the present specification are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features of the embodiments and embodiments of the present specification are detailed descriptions of the technical solutions of the embodiments of the present specification, and are not limitations of the technical solutions of the present specification, and the technical features of the embodiments and embodiments of the present specification may be combined with each other without conflict.
The applicant finds that the camera module finished product has poor phenomena of unlightness, screen splash, line stripes and the like in use in the practical application of the camera module finished product, and the camera module finished product has a corrosion phenomenon inside after being disassembled. Data such as the corruption position, the corrosion state, the corruption composition to making a video recording in the module finished product are studied the back and are found, and the off-the-shelf corrosion position of making a video recording lies in the bonding pad of sensitization chip and the welding position of printed circuit board's bonding pad, and the off-the-shelf corrosion state of the module of making a video recording is the slice and corrodes, and the off-the-shelf corrosion composition of the module of making a video recording is: AL aluminum corrosion. Therefore, in order to clarify the cause of the corrosion phenomenon of the welding part, the invention re-tests the production process flow of the welding part between WB (wire bonding) and assembly process. Specifically, the sequence of each process flow and the parameters in each process are changed on the basis of the original process flow, and four groups of test modes are designed for retest:
group 1 authentication method: after the WB process forms the weldment, the weldment is placed in a two-fluid for a period of time. Wherein, the two fluids can adopt liquid water, and the standing time can be determined according to the actual condition of a welding piece formed after the WB process.
Group 2 authentication method: after a weld is formed by the WB process, the weld is plasma cleaned (argon + oxygen) and placed in a two-fluid for a period of time.
Group 3 authentication method: after the WB process forms a welded part, the welded part is sequentially subjected to water washing (residual water on the welded part) and plasma washing (argon gas + oxygen gas).
Group 4 authentication method: after a welding part is formed by the WB process, the welding part is subjected to plasma cleaning (argon and oxygen), and then water cleaning (residual water on the welding part) and plasma cleaning (argon and oxygen) are sequentially performed.
See table 1 for the above verification and test results.
Figure BDA0003478860380000051
As can be seen from table 1, the weld corrosion phenomenon in the 4 th group of tests was severe. After comparing the corrosion phenomenon of the welding part in the 4 th group of tests with the corrosion phenomenon of the finished camera module, the corrosion position of the welding part is found to be at the welding position of the welding pad of the photosensitive chip and the welding pad of the printed circuit board, the corrosion state of the welding part is sheet corrosion, carbon in the corrosion component of the welding part is not increased obviously, oxygen is increased obviously due to plasma cleaning, and the aluminum content is reduced by 94% compared with the normal aluminum content. Therefore, the corrosion positions, corrosion states and corrosion components of the welding part and the finished product of the camera module are all consistent.
It was thus determined that the cause of corrosion in the weld was: after the plasma cleaning processAnd a water washing process is carried out and drying is not carried out, so that residual water exists on the surface of the welding part. When residual water exists on the surface of the welded part, the welded part enters the plasma cleaning process again due to improper transportation, and oxygen is contained in the plasma cleaning process, so that oxygen which is not ionized and negative oxygen ions O ionized into high activity exist in the plasma cleaning process2-Due to oxygen and O2-The continuous injection and the residual water action are superposed, so that the AL aluminum in the welding part generates a battery effect, the aluminum is corroded, and the welding part is further corroded. Therefore, in order to solve the corrosion phenomenon caused by the weld material, it is necessary to eliminate the above-mentioned inducement and to solve the corrosion phenomenon caused by the weld material in principle.
Based on the method, the invention discloses a method and a system for preventing corrosion of a welding part of a camera module, wherein a photosensitive chip and a printed circuit board are obtained to prepare the welding part, and the welding part is directly assembled with other parts after being subjected to first plasma cleaning by using gas so as to avoid the welding part from entering a water washing process and be subjected to an assembly process under the condition of keeping the welding part dry. This scheme eliminates the welding through cancellation washing technology and produces corroded inducement, makes welding surface drying not possess reaction condition, even if the welding is because the improper technological process who gets into the mistake of transporting, for example do not get into the equipment behind plasma cleaning process, but get into plasma cleaning process once more, also can not produce the corruption, and then has guaranteed the life of the module of making a video recording.
Referring to fig. 1, the method for preventing corrosion of a welding part of a camera module according to the present embodiment includes the following steps:
and 101, obtaining a photosensitive chip and a printed circuit board for assembling the camera module.
The photosensitive chip and the printed circuit board (i.e., PCB) are all components of the camera module. Since the structures of the camera modules are different, the present embodiment will be described by taking the structural composition of the AF module as an example, but not limiting. Referring to fig. 2, a schematic structural diagram of an AF module includes: the device comprises a protective film 1, a lens 2, a voice coil motor 3, an infrared filter 4, a base 5, a photosensitive chip 6, a PCB 7, a plate 8 and a connector 9. The function of each component is shown in table 2 below.
Figure BDA0003478860380000061
Figure BDA0003478860380000071
The components are assembled together to form the AF camera module.
In some alternative embodiments, after the PCB is obtained, the PCB and the flexible circuit board in the plate material 8 are soldered into a rigid-flex board by using a DB (Die bond) process. The DB process is a process of placing a chip and fixing it by silver paste adhesion. Specifically, gluing is carried out at a position where the PCB needs to be placed, the PCB is placed at the glued position by using a pick-and-place arm to be attached, and the PCB is conveyed to the next process after being cured.
And 102, welding the bonding pad of the photosensitive chip and the bonding pad of the printed circuit board by using a welding wire to obtain a welding part.
Specifically, a plurality of pads 10 are disposed around the photosensitive chip. In contrast, the printed circuit board is provided with pads 11 corresponding to the pads 10 of the photosensitive chip. Referring to fig. 3-4, the bond pads of the photo-sensing chip and the printed circuit board are shown. The welding wire 12 used in welding is a gold wire, a copper wire, an aluminum wire, or the like, but is not limited thereto. In the process of soldering, the bonding wires 12 are used for soldering the bonding pads 10 of the photo chip and the bonding pads 11 of the printed circuit board based on a WB (wire bonding) process, so as to obtain a solder part. In a specific implementation process, firstly, a welding wire 12 exposed out of a chopper is burned by using a striking rod, the chopper is lowered to a bonding pad 10 of a photosensitive chip, and the burned welding wire 12 forms a first welding point on the bonding pad 10 of the photosensitive chip; then, the welding wire 12 is pulled to rise by using a cleaver, and the welding wire 12 is led to the welding pad 11 on the PCB from the first welding point to form a second welding point; and finally, cutting off the welding wire 12 to finish welding to obtain a welding part.
Step 103, performing a first plasma cleaning on the welded part by using cleaning gas.
Wherein, the cleaning gas used for the first plasma cleaning comprises: non-oxidizing gases and mixed gases. In the first plasma cleaning process, the above-mentioned gas may be selectively used as the cleaning gas, specifically as follows:
for the fed weld pieces, the first plasma cleaning is performed on the weld pieces with the mixed gas. Specifically, the mixed gas is a cleaning gas used in conventional plasma cleaning, and includes two or more gases, such as a mixed gas composed of argon and oxygen, and the like, which can be selected according to actual situations.
In this embodiment, the first plasma cleaning is performed using a mixed gas of argon and oxygen. In plasma cleaning, Ar is generated after Ar ionization+After being accelerated by a magnetic field, the surface of the welding piece is physically bombarded to clean physical particles. And O is2After ionization, negative oxygen ion O is generated2-The surface of the welding part is cleaned by chemical reaction, for example, the surface of the welding part reacts with organic pollutants on the surface of the welding part to remove the organic pollutants.
In order to completely avoid the corrosion phenomenon of the welded parts, the fed welded parts are subjected to first plasma cleaning by using non-oxidizing gas regardless of the source or actual condition of the welded parts. The non-oxidizing gas refers to a single gas or a mixed gas having no oxidizing property. Such as a single inert gas, a non-oxidizing gas mixture, and the like. The single inert gas comprises: argon, helium, neon and the like, which can be selected according to actual conditions. In this embodiment, the first plasma cleaning with argon is taken as an example for illustration, but not as a limitation. In plasma cleaning, Ar is generated after ionization by using Ar+And carrying out physical bombardment on the surface of the welding part to clean physical particles.
In some optional embodiments, in order to realize intelligent cleaning, whether liquid residue exists on the welding part or not is detected before the first plasma cleaning. For example, the surfaces of the welding parts are affected by moisture caused by weather or improper protection. If so, a first plasma clean of the weldment is performed using a single inert gas. If not, the welding part is subjected to first plasma cleaning by using mixed gas. Different cleaning modes are selected according to the actual condition of the detected welding part, so that the intelligent anti-corrosion purpose can be achieved.
And 104, assembling the welding piece and other devices to obtain the camera module.
In the process of assembling, the infrared filter is fixed on the base, and the base is fixed on the PCB in the welding part. In addition, the lens and the voice coil motor are assembled and then assembled with the base, and then the camera module is obtained.
Above-mentioned scheme eliminates the welding piece through canceling washing process and produces the inducement of corroding, makes welding piece surface drying not possess the reaction condition, even if the welding piece is because the improper technological process that gets into the mistake of transporting, for example get into plasma cleaning process once more, also can not produce the corruption, consequently solved the welding piece in the module of making a video recording because the technological process makes mistakes the corrosion phenomenon that leads to in principle, guaranteed the life of the module of making a video recording.
In some alternative embodiments, a water wash process is performed after step 103: and cleaning the welding parts by using cleaning fluid. Specifically, the cleaning liquid includes, but is not limited to, liquid water such as distilled water, pure water containing no impurities, and the like. At this time, if the welding part enters a wrong process flow due to improper transportation, for example, enters a plasma cleaning process, oxygen and negative oxygen ions O exist in the plasma cleaning process2-. Will take place chemical reaction with the residual water in the welding piece, produce the hydroxyl ion: o is2-+H2O=2OH-。OH-Will neutralize AL in the weld3+The reaction generates aluminum hydroxide precipitate, and the superposition of oxygen in the plasma cleaning process can lead to excessive hydroxyl ions, thereby accelerating the corrosion phenomenon of the welding parts.
Since the weld member has the corrosion-generating condition, in this embodiment, it is necessary to improve from the plasma cleaning process to prevent the weld member from generating corrosion. Specifically, oxygen and negative oxygen ions O are generated in the plasma cleaning process2-Causing corrosion of the welded partsAnother reason is that in the plasma cleaning process, it is necessary to eliminate the reason and perform a second plasma cleaning of the welded article using a non-oxidizing gas. Wherein the non-oxidizing gas comprises: a single inert gas, a non-oxidizing gas mixture. The single inert gas includes, but is not limited to, argon, helium, neon, and the like, and does not include an oxidizing gas. And the non-oxidizing mixed gas does not contain oxygen. In the present embodiment, the cause of corrosion of the weld material is eliminated in principle by placing the weld material in a non-oxidizing environment. Therefore, the corrosion phenomenon of the welding part in the camera module caused by the error of the process flow is solved in principle, and the corrosion phenomenon of the welding part is prevented.
Further, before the above process is performed, whether the cleaning solution remains in the welded part, for example, whether the liquid water remains in the welded part, is detected. If so, performing a second plasma cleaning of the welded part by using a non-oxidizing gas. And if not, performing secondary plasma cleaning on the welding piece by using the mixed gas. Different cleaning modes are selected according to the actual condition of the detected welding part, so that the intelligent anti-corrosion purpose can be achieved.
In the scheme, if the welding part is subjected to a water washing process and enters a plasma washing process due to improper transportation, the welding part is subjected to plasma washing by using non-oxidizing gas in the process, and the purpose of corrosion prevention is achieved by eliminating another cause of corrosion of the welding part.
In order to verify the effectiveness of the corrosion protection of the above scheme, the above process flow was retested by using a welded part, and the corresponding results were obtained, referring to table 3.
Partial technological process for rechecking welding parts Results
First plasma cleaning-cleaningWashing directly enters the assembly process Is not corroded
First plasma clean-no water wash into second plasma clean (O)2-+Ar) Is not corroded
First plasma cleaning-Water cleaning (residual Water) -second plasma cleaning (Ar) Is not corroded
First plasma cleaning-water cleaning (residual water) -second plasma cleaning (O)2-) Has corrosion phenomenon
First plasma cleaning-water cleaning (residual water) -second plasma cleaning (O)2-+Ar) Has corrosion phenomenon
From the above table 3, after the welded part is cleaned by the first plasma, the welded part is not corroded when the water cleaning process is cancelled and the welded part directly enters the assembly process or enters the second plasma cleaning process. Moreover, even if oxygen is used in the second plasma cleaning process, no corrosion phenomenon is generated. Therefore, the corrosion of the welding parts can be avoided as long as one of the inducers of the corrosion phenomenon is eliminated, such as the water washing process is eliminated. If the welded material is subjected to the water washing process after the first plasma washing, the plasma washing with a non-oxidizing gas (for example, Ar) in the second plasma washing process does not cause the corrosion phenomenon. If oxygen is used in the second plasma cleaning process, corrosion may occur. Therefore, if the water washing process is reserved, oxygen only needs to be eliminated in the plasma cleaning process, and the corrosion of the welding parts can be avoided. The effectiveness of the scheme can be proved through the results.
Based on the same inventive concept as one or more of the above embodiments, the following embodiments describe a system for preventing corrosion of a weld assembly of a camera module according to the present invention, and with reference to fig. 5, the system comprises:
the welding device 501 is used for obtaining a photosensitive chip and a circuit board for assembling the camera module; and welding the bonding pad of the photosensitive chip and the bonding pad of the printed circuit board by using a welding wire to obtain a welding part.
A cleaning device 502 for performing a first plasma cleaning of the weldment with a cleaning gas.
And an assembling device 503, configured to assemble the welding member and the other devices to obtain the camera module.
In the welding part anti-corrosion system of the camera module, all devices can exist independently, and are transferred to all devices by the transfer device to implement corresponding processes. And through the mutual cooperation of each device, can accomplish the equipment of the module of making a video recording. In the implementation process of each device, the reason for corrosion of the welding parts is eliminated by canceling the water washing process, so that the surfaces of the welding parts are dry and do not have reaction conditions, even if the welding parts enter wrong process flows due to improper transportation, for example, the welding parts enter a plasma cleaning process again, corrosion can not occur, the corrosion phenomenon of the welding parts in the camera module due to the error of the process flows is solved in principle, and the service life of the camera module is ensured.
In some optional embodiments, the cleaning device 502 is specifically configured to:
and carrying out the first plasma cleaning on the welding piece by using mixed gas. Or
The weldment is subjected to the first plasma clean with a non-oxidizing gas.
In some optional embodiments, the system further comprises:
and the water washing device is used for washing the welding parts by using the washing liquid.
In some optional embodiments, the cleaning device 502 is specifically configured to:
a second plasma clean of the weldment is performed using a non-oxidizing gas.
In some optional embodiments, the cleaning device 502 is specifically configured to:
and detecting whether the cleaning solution is remained on the welding part.
If so, performing a second plasma cleaning of the weldment using a non-oxidizing gas.
In some alternative embodiments, the non-oxidizing gas comprises: a single inert gas, a non-oxidizing gas mixture.
In some alternative embodiments, the single inert gas comprises: and argon gas.
Based on the same inventive concept as one or more of the above embodiments, the following embodiments describe a camera module prepared by using the method for preventing corrosion of a weld of the camera module in any of the above embodiments. Since the method has been described in detail in the above embodiments, it is not described in detail in this embodiment. In a specific implementation process, the camera module may be a mobile phone camera module, a computer camera module, or the like, which is not limited in the present invention. The welding piece in the camera module can prevent corrosion in the above way, so that the obtained camera module can not generate corrosion, and the service life of the camera module can be ensured.
Based on the same inventive concept as one or more of the above embodiments, the following embodiments describe an electronic device including the camera module in the above technical solution. In a specific implementation process, the electronic device may be a mobile phone, a computer, a tablet, an image detector, a monitor, and the like, which is not limited in the present invention. Because the camera module can not generate corrosion, the obtained electronic equipment can not generate corrosion due to the camera module, and the service life of the electronic equipment can be ensured.
The invention discloses a method and a system for preventing a welding part of a camera module from being corroded, wherein a photosensitive chip and a printed circuit board are obtained to prepare the welding part, and the welding part is directly assembled with other parts after being subjected to first plasma cleaning by using gas so as to prevent the welding part from entering a water washing process and be subjected to an assembly process under the condition of keeping the welding part dry. This scheme eliminates the welding through cancellation washing technology and produces corroded inducement, makes welding surface drying not possess reaction condition, even if the welding is because the improper technological process who gets into the mistake of transporting, for example do not get into the equipment behind plasma cleaning process, but get into plasma cleaning process once more, also can not produce the corruption, and then has guaranteed the life of the module of making a video recording.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents, improvements, etc. that are within the spirit and principle of the present invention should be included in the present invention.

Claims (10)

1. A method for preventing corrosion of a welding part of a camera module is characterized by comprising the following steps:
obtaining a photosensitive chip and a circuit board for assembling a camera module;
welding the bonding pad of the photosensitive chip and the bonding pad of the printed circuit board by using a welding wire to obtain a welding part;
performing first plasma cleaning on the welding part by using cleaning gas;
and assembling the welding piece and other devices to obtain the camera module.
2. The method of claim 1, wherein the first plasma cleaning the weldment with a cleaning gas comprises:
performing the first plasma cleaning on the weldment by using mixed gas; or
The weldment is subjected to the first plasma clean with a non-oxidizing gas.
3. The method of claim 1, wherein after the first plasma cleaning of the weldment with a cleaning gas, the method further comprises:
and cleaning the welding part by using a cleaning solution.
4. The method of claim 3, wherein after the cleaning of the weldment with the cleaning fluid and prior to assembly of the weldment and other components, the method further comprises:
a second plasma clean of the weldment is performed using a non-oxidizing gas.
5. The method of claim 4, wherein prior to the second plasma cleaning of the weldment with the non-oxidizing gas, the method further comprises:
detecting whether the cleaning solution remains in the welding part or not;
if so, performing a second plasma cleaning of the weldment using a non-oxidizing gas.
6. The method of claim 4, wherein the non-oxidizing gas comprises: a single inert gas, a non-oxidizing gas mixture.
7. The method of claim 6, wherein the single inert gas comprises: and argon gas.
8. A welding part anti-corrosion system of a camera module is characterized by comprising:
the welding device is used for obtaining a photosensitive chip and a circuit board which are used for assembling the camera module; welding the bonding pad of the photosensitive chip and the bonding pad of the printed circuit board by using a welding wire to obtain a welding part;
the cleaning device is used for carrying out first plasma cleaning on the welding part by utilizing cleaning gas;
and the assembling device is used for assembling the welding piece and other devices to obtain the camera module.
9. A camera module prepared by the method of any one of claims 1 to 8.
10. An electronic device comprising the camera module of claim 9.
CN202210062629.3A 2022-01-19 2022-01-19 Corrosion prevention method and system for welding part of camera module Active CN114535219B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210062629.3A CN114535219B (en) 2022-01-19 2022-01-19 Corrosion prevention method and system for welding part of camera module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210062629.3A CN114535219B (en) 2022-01-19 2022-01-19 Corrosion prevention method and system for welding part of camera module

Publications (2)

Publication Number Publication Date
CN114535219A true CN114535219A (en) 2022-05-27
CN114535219B CN114535219B (en) 2024-04-05

Family

ID=81672568

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210062629.3A Active CN114535219B (en) 2022-01-19 2022-01-19 Corrosion prevention method and system for welding part of camera module

Country Status (1)

Country Link
CN (1) CN114535219B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102651373A (en) * 2011-02-23 2012-08-29 索尼公司 Manufacturing method of semiconductor device, semiconductor device and electronic apparatus
CN102965626A (en) * 2012-12-17 2013-03-13 中国南方航空工业(集团)有限公司 Nickel plating method of powder metallurgy porous material
CN104658879A (en) * 2013-11-22 2015-05-27 中芯国际集成电路制造(上海)有限公司 Opening method of chip packages
CN105355566A (en) * 2014-08-21 2016-02-24 中芯国际集成电路制造(上海)有限公司 Surface treatment method of bonding pad and manufacturing method of bonding pad
JP2016100343A (en) * 2014-11-18 2016-05-30 株式会社ディスコ Etching method
CN106449371A (en) * 2016-11-24 2017-02-22 广东美的制冷设备有限公司 Plasma cleaning method, packaging method, power module and air conditioner
CN108990304A (en) * 2018-09-03 2018-12-11 嘉善中佳电路板有限公司 A kind of cleaning process of printed circuit board
CN110600388A (en) * 2019-09-30 2019-12-20 上海华力集成电路制造有限公司 Method for improving crystallization defect of aluminum bonding pad

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102651373A (en) * 2011-02-23 2012-08-29 索尼公司 Manufacturing method of semiconductor device, semiconductor device and electronic apparatus
CN102965626A (en) * 2012-12-17 2013-03-13 中国南方航空工业(集团)有限公司 Nickel plating method of powder metallurgy porous material
CN104658879A (en) * 2013-11-22 2015-05-27 中芯国际集成电路制造(上海)有限公司 Opening method of chip packages
CN105355566A (en) * 2014-08-21 2016-02-24 中芯国际集成电路制造(上海)有限公司 Surface treatment method of bonding pad and manufacturing method of bonding pad
JP2016100343A (en) * 2014-11-18 2016-05-30 株式会社ディスコ Etching method
CN106449371A (en) * 2016-11-24 2017-02-22 广东美的制冷设备有限公司 Plasma cleaning method, packaging method, power module and air conditioner
CN108990304A (en) * 2018-09-03 2018-12-11 嘉善中佳电路板有限公司 A kind of cleaning process of printed circuit board
CN110600388A (en) * 2019-09-30 2019-12-20 上海华力集成电路制造有限公司 Method for improving crystallization defect of aluminum bonding pad

Also Published As

Publication number Publication date
CN114535219B (en) 2024-04-05

Similar Documents

Publication Publication Date Title
US10070569B2 (en) Method for manufacturing an electronic device
CN104105350A (en) Selective nickel and gold plating method, PCB and device
US20070095879A1 (en) Methods and apparatus for assembling a printed circuit board
CN1468324A (en) Bath and method of electroless plating of silver on metal surfaces
CN114833491B (en) Copper surface selective organic soldering flux and use method thereof
CN114535219A (en) Anti-corrosion method and system for welding part of camera module
Tegehall Impact of humidity and contamination on surface insulation resistance and electrochemical migration
Weiss AI Detection of Body Defects and Corrosion on Leads in Electronic Components, and a study of their Occurrence
US7867404B2 (en) Method for converting electrical components
JP2006287099A (en) Manufacturing method of printed circuit board with resist
US20080200360A1 (en) Aqueous Solution and Method for Removing Ionic Contaminants from the Surface of a Workpiece
Zhao et al. Mixed flowing gas studies of creep corrosion on plastic encapsulated microcircuit packages with noble metal pre-plated leadframes
JPH03106594A (en) Flux composition for soldering
US20120090880A1 (en) Mitigation and elimination of tin whiskers
Geiger et al. Package stacking in SMT for 3D PCB assembly
JP4814756B2 (en) Solder ball mounting method
CN110933860A (en) Processing method for local electroplating of thick gold product
CN112739045B (en) Adjusting method and cleaning process for Ball Grid Array (BGA) device welding spot cleaning process
JP3463386B2 (en) Circuit board manufacturing method
Capen et al. SIR Glass Test Vehicle Designed to Characterize Process Materials
US6133213A (en) Solution for removing copper salts from a copper surface comprising an alcohol and an ammonium salt
CN117835585B (en) Surface treatment method of circuit board and circuit board manufactured by same
RU2463144C2 (en) Flux for low-temperature soldering
JP4263310B2 (en) Printed wiring board
CA1190662A (en) Cure indicator for dry film solder mask

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant