CN114527856A - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
- Publication number
- CN114527856A CN114527856A CN202210229563.2A CN202210229563A CN114527856A CN 114527856 A CN114527856 A CN 114527856A CN 202210229563 A CN202210229563 A CN 202210229563A CN 114527856 A CN114527856 A CN 114527856A
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- Prior art keywords
- heat
- radiator
- aluminum
- metal layer
- heat dissipation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the technical field of radiators, and discloses a heat dissipation structure. The invention discloses an aluminum-copper radiator structure which comprises an aluminum radiator main body and a metal layer. The main body is the structure of a traditional aluminum heat radiator, and a metal layer ablates metal foil on a base of the aluminum heat radiator by a laser. The invention improves the heat dissipation efficiency of the radiator by improving the heat transfer rate of the process of transferring the temperature from the CPU to the radiator.
Description
Technical Field
The invention belongs to the technical field of radiators, and particularly relates to a heat dissipation structure.
Background
High temperatures are a rival of integrated circuits. The high temperature can not only cause unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the computer components is ensured to be normal. For the heat radiator, the most important thing is that the base can absorb the heat released by the CPU as much as possible in a short time, that is, the instant heat absorption capability, and we most often contact with the heat radiator of the CPU, but most of the heat radiators in the market are made of aluminum, the heat conductivity of aluminum is not good, the rate of absorbing the CPU from the heat radiator is affected, and the heat radiation efficiency of the heat radiator is not good.
Disclosure of Invention
The present invention is directed to a heat dissipation structure, which solves the above problems. The technical scheme of the invention is as follows:
a heat dissipation structure is composed of heat dissipation fins, a heat dissipation base and a metal layer.
The metal layer is formed by laying metal foil on the aluminum radiator base by using a laser marking machine and performing laser ablation.
Preferably, the metal foil is a copper foil, the copper foil has high thermal conductivity, and the heat transfer rate from the CPU to the radiator is accelerated.
Preferably, the copper foil is prepared by a laser scanning method, the laser wavelength is 1.06 microns, and the thickness of the copper foil is 0.01-0.5mm, preferably 0.01-0.1 mm.
Compared with the existing heat dissipation structure, the invention has the beneficial effects that:
compared with the aluminum radiator, the aluminum-copper radiator has the advantages that the metal copper layer is plated on the surface of the aluminum radiator base, the aluminum radiator has higher specific heat capacity, the heat of the radiator is quickly transferred to the air, but the heat conductivity coefficient of the aluminum is low, the process of transferring the temperature of a CPU to the radiator is slow, and the heat conductivity coefficient of the copper is much larger than that of the aluminum, so that the temperature of the CPU is also quickly transferred to the surface of the copper, and finally the temperature is quickly transferred to the air from the surface of the aluminum radiator.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
The numbers in the figure illustrate the following: 1. metal layer, 2, heat dissipation base, 3, radiating fin.
Detailed Description
In order that the manner in which the above-recited objects, features and advantages of the present invention are obtained will be readily understood, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. Unless otherwise specified, the experimental methods adopted by the invention are all conventional methods, and experimental equipment, materials, reagents and the like used in the experimental method can be obtained from commercial sources.
The metal copper layer prepared by the prior art is mechanical physical combination, but the invention is metallurgical combination formed at high temperature, and has high thermal conductivity (more than 100W/ms), strong adhesive force (more than 20MPa), low thermal resistance (less than 0.1 ℃/W cm)2)。
Example 1
Referring to fig. 1, the aluminum-copper heat sink structure of the present invention is composed of heat dissipation fins 3, a heat dissipation base 2, and a metal layer 1. The metal layer 1 is formed by paving a copper foil with the thickness of 0.01mm on the heat dissipation base 2, the laser scanning speed is 100m/s, and the laser marking machine is adopted for laser ablation. Thermal conductivity (120W/ms), adhesion (20MPa), thermal resistance (0.1 deg.C/W cm)2)。
Example 2
The aluminum-copper radiator structure of the invention is composed of radiating fins 3, a radiating base 2 and a metal layer 1. The metal layer 1 is formed by paving a copper foil with the thickness of 0.05mm on the heat dissipation base 2, the laser scanning speed is 80m/s, and the metal layer is formed by laser ablation of a fiber laser marking machine. Thermal conductivity (130W/ms), adhesion (22MPa), thermal resistance (0.2 ℃/W cm)2)。
Example 3
The aluminum-copper radiator structure of the invention is composed of radiating fins 3, a radiating base 2 and a metal layer 1. The metal layer 1 is formed by paving a copper foil with the thickness of 0.1mm on the heat dissipation base 2, the laser scanning speed is 60m/s, and the metal layer is formed by laser ablation of a fiber laser marking machine. Thermal conductivity high thermal conductivity (110)W/ms), adhesion (23MPa), thermal resistance (0.08 ℃/W cm)2)。
Comparative example 1
The common heat radiator adopts mechanical linkage between the copper column and the aluminum radiating fin, the middle of the common heat radiator is provided with a large number of holes and air holes, the heat conductivity of the common heat radiator is obviously reduced, and the thermal resistance is increased, wherein the heat conductivity of the existing common heat radiator is 110W/ms, and the thermal resistance is 2 ℃/W cm2。
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.
Claims (4)
1. A heat dissipation structure comprises an aluminum heat sink, wherein the aluminum heat sink comprises a heat dissipation base (2) and heat dissipation fins (3); the heat dissipation base is characterized by further comprising a metal layer (1), and the metal layer (1) is plated at the lower end of the heat dissipation base (2).
2. A heat-dissipating structure according to claim 1, wherein the metal layer (1) is formed by ablation on the surface of the aluminum heat sink base using a fiber laser marking machine.
3. A heat-dissipating structure according to claim 1, wherein the metal layer (1) is a copper metal layer.
4. A heat dissipating structure according to claim 3, wherein the metallic copper layer has a thickness of 0.001 to 0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210229563.2A CN114527856A (en) | 2022-03-09 | 2022-03-09 | Heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210229563.2A CN114527856A (en) | 2022-03-09 | 2022-03-09 | Heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114527856A true CN114527856A (en) | 2022-05-24 |
Family
ID=81627578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210229563.2A Pending CN114527856A (en) | 2022-03-09 | 2022-03-09 | Heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114527856A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005332A (en) * | 2005-06-21 | 2007-01-11 | Kansai Pipe Kogyo Kk | Heat sink and its manufacturing method |
| CN101245459A (en) * | 2007-02-12 | 2008-08-20 | 杜建伟 | Method for coating on high heat conduction metallic face of such as copper and aluminum |
| CN105676976A (en) * | 2014-11-20 | 2016-06-15 | 江苏维创散热器制造有限公司 | High-performance radiator |
-
2022
- 2022-03-09 CN CN202210229563.2A patent/CN114527856A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005332A (en) * | 2005-06-21 | 2007-01-11 | Kansai Pipe Kogyo Kk | Heat sink and its manufacturing method |
| CN101245459A (en) * | 2007-02-12 | 2008-08-20 | 杜建伟 | Method for coating on high heat conduction metallic face of such as copper and aluminum |
| CN105676976A (en) * | 2014-11-20 | 2016-06-15 | 江苏维创散热器制造有限公司 | High-performance radiator |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination |