CN210668341U

CN210668341U - Heat radiation structure

Info

Publication number: CN210668341U
Application number: CN201922194384.6U
Authority: CN
Inventors: 吴政财
Original assignee: Jiadong Electronics Co ltd
Current assignee: Jiadong Electronics Co ltd
Priority date: 2019-12-10
Filing date: 2019-12-10
Publication date: 2020-06-02
Anticipated expiration: 2029-12-10

Abstract

A heat dissipation structure comprises a ceramic substrate, wherein the surface of the ceramic substrate is provided with a plurality of inwards sunken pores; a metal coating layer is combined and coated on the surface of the ceramic substrate, and part of the metal coating layer is infiltrated into the plurality of pores; the heat dissipation layer comprises a plurality of metal protruding parts which are positioned on the same plane and are arranged at intervals, and the metal protruding parts respectively extend outwards in the direction far away from one end face of the metal coating layer, so that when the metal coating layer is heated, heat can be quickly dissipated through the heat dissipation layer, and the ceramic substrate and the metal coating layer are tightly combined to prevent high-temperature deformation.

Description

Heat radiation structure

Technical Field

The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation device that can dissipate heat quickly after being heated and keep the appearance stable and non-deformable, and is suitable for computers, electronic devices, or other heat generating electrical components.

Background

Because modern electronic devices and computers have advanced information, the operation speed of the heating element of the cpu is increasing, and the high temperature generated is required to be reduced by the high-performance heat dissipation device to maintain the normal operation temperature. The conventional heat dissipation structure mainly comprises an aluminum extruded base and a plurality of fins arranged on one surface of the base, so that when the base is combined above the central processing unit, heat generated by the operation of the central processing unit can be conducted to the plurality of fins through the base, and then air is circulated by the aid of a fan to cool.

However, in practical applications, when the cpu is operated faster and generates high temperature, the conventional heat sink is made by aluminum extrusion, and if the high temperature cannot be effectively reduced, the cpu may be burned out, and the susceptor may be distorted, so that the contact surface between the susceptor and the cpu is reduced, thereby reducing the heat transfer efficiency. Accordingly, it is desirable to provide a structure that is different from the prior art and improves the above-mentioned disadvantages.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat radiation structure, can solve the easy distortion of current radiator when high temperature and reduce the problem of heat conduction efficiency, and can be through with a metal coating cladding in a ceramic substrate's surface, let among the metal coating part infiltration a plurality of holes, and extend the structure of a plurality of metal bulges on a terminal surface of metal coating, can let the metal coating can quick heat dissipation after being heated, and keep the appearance of metal coating stable, in order to ensure the operating efficiency who uses safety and maintain the type heat-generating body of central processing unit.

In order to achieve the above purpose, the heat dissipation structure of the present invention comprises a ceramic substrate, a metal coating layer and a heat dissipation layer, wherein the surface of the ceramic substrate has a plurality of inwardly recessed pores; the metal coating layer is combined and coated on the surface of the ceramic substrate, and part of the metal coating layer permeates into the plurality of pores; the heat dissipation layer comprises a plurality of metal protruding parts which are positioned on the same plane and are arranged at intervals, and the plurality of metal protruding parts respectively extend outwards in the direction far away from one end face of the metal coating layer.

When the ceramic substrate is implemented, the metal coating layer comprises an outer layer and a permeable layer, the outer layer is coated on the surface of the ceramic substrate, and the permeable layer extends inwards from the inner surface of the outer layer and permeates into the plurality of pores.

In practice, the metal protrusion is a vertical column, and the metal protrusion can also be a vertical plate.

In order to facilitate the further understanding of the present invention, the detailed description is given later.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a perspective view of the preferred embodiment of the present invention.

Fig. 2 is a cross-sectional view of the preferred embodiment of the present invention.

Fig. 3 is a usage status diagram of the preferred embodiment of the present invention.

Description of the reference numerals

Heat radiation structure 1 ceramic substrate 2

Pore 21 metal cladding 3

Tip surface 311 of outer layer 31

Bottom end surface 312 permeable layer 32

Metal projection 41 of heat dissipation layer 4

The heating element 9 is a fan 91.

Detailed Description

The technical solution in the embodiment of the present invention is clearly and completely described below with reference to the drawings in the embodiment of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

The utility model discloses a heat dissipation structure, which comprises a ceramic substrate, wherein the outer surface of the ceramic substrate is combined and coated with a metal coating layer, and the permeable layer of the metal coating layer permeates into a plurality of pores on the surface of the ceramic substrate, so that the metal coating layer is tightly combined with the ceramic substrate and can prevent deformation when being heated at high temperature; and a plurality of metal convex parts of a heat dissipation layer respectively extend outwards in the direction far away from one end face of the metal coating layer, so that when the metal coating layer is heated, heat can be quickly dissipated through the heat dissipation layer.

Please refer to fig. 1 and fig. 2, which illustrate a preferred embodiment of a heat dissipation structure 1 of the present invention, comprising a ceramic substrate 2, a metal cladding layer 3 and a heat dissipation layer 4. The ceramic substrate 2 is mainly formed by preparing silicon carbide powder into a flat-plate-shaped silicon carbide blank body with reserved pores, and then sintering the blank body at high pressure and high temperature, wherein the formed ceramic substrate 2 is a quadrilateral plate body, and a plurality of inwards-recessed pores 21 are mainly formed on the upper surface and the lower surface of the ceramic substrate 2.

The metal clad 3 is made of an aluminum metal material, and in practice, the metal clad 3 may be made of a metal material having high thermal conductivity and low melting point, such as aluminum alloy or copper. The metal coating layer 3 comprises an outer layer 31 and a permeable layer 32, wherein the outer layer 31 is formed by melting aluminum metal by a die casting method and then coating and combining the metal coating layer 3 on the outer surface of the ceramic substrate 2, and the formed outer layer 31 is a rectangular frame body and has a top end surface 311 and a bottom end surface 312 opposite to the top end surface 311; the penetration layer 32 is formed by extruding with positive pressure so that a part of the molten aluminum material extends from the inner surface of the outer layer 31 to the inside and penetrates into the pores 21 of the ceramic substrate 2, and the inner surface of the outer layer 31 and the ceramic substrate 2 are tightly bonded by the penetration layer 32 penetrating into the pores 21 of the ceramic substrate 2.

The heat dissipation layer 4 includes a plurality of upright columns, the upright columns are located on the top end surface 311 of the outer layer 31 of the metal cladding layer 3, and the upright columns respectively extend upwards in a direction away from the top end surface 311 of the outer layer 31, so that the upright columns are parallel to each other and are arranged at intervals in a rectangular array, the upright columns serve as the metal protrusions 41, and the metal protrusions 41 are integrally manufactured with the outer layer 31 in a die-casting process. In practice, the metal protrusions 41 may be upright plate pieces and arranged on the top end surface 311 of the outer layer 31 at intervals in parallel with each other.

Thus, as shown in fig. 3, when the outer layer 31 of the metal coating layer 3 is coated on the outer surface of the ceramic substrate 2 and the penetration layer 32 of the metal coating layer 3 penetrates into the plurality of pores 21 of the ceramic substrate 2, the inner surface of the outer layer 31 is tightly bonded to the ceramic substrate 2. When the bottom end surface 312 of the metal cladding layer 3 is adhered to the upper side of the heating element 9 of a central processing unit and high temperature is generated due to operation, the combination of the high heat conduction characteristic of the metal cladding layer 3 and the low thermal expansion characteristic of the ceramic substrate 2 can effectively prevent the metal cladding layer 3 from bending deformation and prevent the outer layer 31 of the metal cladding layer 3 from being partially separated from the ceramic substrate 2. In addition, since the top end surface 311 of the outer layer 31 of the metal covering layer 3 is provided with the plurality of metal protrusions 41 integrally formed with the outer layer 31, when the outer layer 31 of the metal covering layer 3 is heated, heat can be rapidly conducted to the plurality of metal protrusions 41, and heat on the surfaces of the plurality of metal protrusions 41 is dissipated under the driving air flow of the fan 91, so as to achieve the effect of rapid cooling.

In summary, according to the disclosure above, the present invention provides a heat dissipation structure that not only can tightly combine the metal coating layer and the ceramic substrate, but also can keep the shape of the metal coating layer stable at high temperature, and can quickly dissipate heat after being heated, so as to ensure the safety of use and maintain the operation efficiency of the heat-generating body of the cpu.

Although the present invention has been described with reference to the preferred embodiments for achieving the above objects, it is not intended to limit the structural features of the present invention, and any changes or modifications that can be easily conceived are possible and are all covered by the scope of the present invention.

Claims

1. A heat dissipation structure, comprising:

a ceramic substrate, the surface of which is provided with a plurality of pores which are sunken inwards;

a metal coating layer combined and coated on the surface of the ceramic substrate, wherein part of the metal coating layer is penetrated into the plurality of pores; and

and the heat dissipation layer comprises a plurality of metal bulges which are positioned on the same plane and are arranged at intervals, and the plurality of metal bulges extend outwards in the direction away from one end surface of the metal coating layer respectively.

2. The heat dissipating structure of claim 1, wherein the metal coating comprises an outer layer covering the surface of the ceramic substrate and a permeable layer extending inwardly from the inner surface of the outer layer and penetrating into the plurality of pores.

3. The heat dissipating structure of claim 1, wherein the metal protrusion is an upright post.

4. The heat dissipating structure of claim 1, wherein the metal protrusion is an upstanding plate.