CN219678887U - CPU heat conduction shell - Google Patents
CPU heat conduction shell Download PDFInfo
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- CN219678887U CN219678887U CN202320309119.1U CN202320309119U CN219678887U CN 219678887 U CN219678887 U CN 219678887U CN 202320309119 U CN202320309119 U CN 202320309119U CN 219678887 U CN219678887 U CN 219678887U
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- Prior art keywords
- cpu
- shell
- heat
- conductive housing
- heat conductive
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
CPU heat conduction shell relates to electron device technical field, including carbon-based CPU shell, and the outer terminal surface of carbon-based CPU shell is fixed with the radiator through the heat conduction medium layer, is equipped with auxiliary connection recess on the outer terminal surface of carbon-based CPU shell. The utility model solves the problems that the CPU shell in the prior art is limited by the structure when in use, is not beneficial to heat dissipation of the CPU and cannot solve electromagnetic wave shielding.
Description
Technical Field
The utility model relates to the technical field of electronic devices, in particular to a CPU heat conduction shell.
Background
As the technology advances and the CPU operating frequency increases, the performance becomes more powerful and the power increases, which also presents new challenges for thermal management. If the heat generated by the CPU cannot be timely dissipated, the working efficiency of the CPU is reduced and the reliability is reduced due to the too high working temperature, and even the CPU is burnt out when serious. Therefore, improving the heat dissipation efficiency of the CPU is a significant challenge for further development of the CPU.
The heat transfer mode of the CPU comprises heat conduction, convection heat exchange and radiation heat exchange. Conduction of heat mainly occurs between the interior of the early solid and the contact surface, such as the chip transferring heat to the housing.
Convective heat transfer occurs primarily when a moving fluid passes over a solid surface, where the fluid exchanges heat with the solid surface, such as by cooling with a fan. The radiation heat exchange is to transfer heat between objects in a heat radiation mode, and the heat radiation energy ratio is not large in a visible light wave band.
The prior device gradually exposes the defects of the technology along with production and use, and mainly shows the following aspects:
firstly, the current CPU refrigeration method mainly comprises the steps of externally connecting a radiator to a CPU shell, radiating through heat conduction, or radiating through convection heat exchange between the CPU shell and air through an air cooling method, wherein the packaging materials of the CPU shell mainly comprise plastics, ceramics, metals, glass and the like, the plastic packaging is mainly used, the heat conductivity of the plastics, the ceramics and the glass materials is generally low, the heat dissipation of the CPU is not facilitated, and in addition, the problem of electromagnetic wave shielding cannot be solved.
Second, while metallic materials have higher thermal conductivity, they suffer from poor environmental stability and high density.
In summary, it is clear that the prior art has inconvenience and defects in practical use, so that improvement is needed.
Disclosure of Invention
Aiming at the defects in the prior art, the utility model provides a CPU heat conduction shell which is used for solving the problems that the CPU shell in the prior art is limited by the structure when in use, is not beneficial to heat dissipation of the CPU and cannot solve electromagnetic wave shielding.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the CPU heat conducting shell comprises a CPU shell, a radiator is fixed on the outer end surface of the CPU shell through a heat conducting medium layer,
and an auxiliary connecting groove is formed in the outer end face of the CPU shell.
As an optimized scheme, the shape of the auxiliary connection groove comprises a bar shape and a cross shape.
As an optimized scheme, the CPU shell is a carbon-based shell.
As an optimized scheme, the depth of the auxiliary connecting groove is 0.01-1mm.
As an optimized scheme, the thickness of the heat conducting medium layer is 0.01-1mm
As an optimized scheme, the length of the CPU shell is 1-100mm.
As an optimized scheme, the width of the CPU shell is 1-100mm.
As an optimized scheme, the height of the CPU shell is 0.01-10mm.
As an optimized scheme, the lower end part of the CPU shell is provided with an avoidance hole for avoiding the CPU.
Compared with the prior art, the utility model has the beneficial effects that:
compared with the existing CPU shell made of plastics, ceramics, glass and the like, the carbon-based CPU shell has greatly improved heat conductivity, can more rapidly conduct heat generated by the CPU, and can also protect the CPU from external electromagnetic interference.
Compared with the existing metal CPU shell, the carbon-based CPU shell is higher in heat conductivity, lower in density and reduced in overall mass.
The shell surface is provided with the groove for filling the heat-conducting medium layer, so that the contact area between the heat-conducting medium layer and the heat-conducting medium layer is increased, heat generated by the CPU is conducted to the radiator more fully through the heat-conducting medium layer, and the radiating efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic structural view of the auxiliary connecting groove of the present utility model.
In the figure: 1-a CPU housing; 2-a heat conducting medium layer; 3-a heat sink; 4-auxiliary connection grooves.
Detailed Description
Embodiments of the technical scheme of the present utility model will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and thus are merely examples, and are not intended to limit the scope of the present utility model.
As shown in fig. 1 and 2, comprises a CPU housing 1, the outer end surface of the CPU housing 1 is fixed with a radiator 3 through a heat conducting medium layer 2,
an auxiliary connection groove 4 is arranged on the outer end surface of the CPU shell 1.
The shape of the auxiliary coupling groove 4 includes a bar shape and a cross shape.
The CPU housing 1 is a carbon-based housing.
The depth of the auxiliary coupling groove 4 is 0.01-1mm.
The thickness of the heat conducting medium layer 2 is 0.01-1mm
The CPU housing 1 has a length of 1-100mm.
The CPU housing 1 has a width of 1-100mm.
The CPU shell 1 has a height of 0.01-10mm.
The lower end part of the CPU shell 1 is provided with an avoidance hole for avoiding the CPU.
The working principle of the device is as follows:
compared with the traditional CPU housing 1 made of plastics, ceramics, glass and the like, the carbon-based CPU housing 1 has greatly improved heat conductivity, can more rapidly conduct out heat generated by the CPU operation, and can also protect the CPU from external electromagnetic interference.
The carbon-based CPU housing 1 has a smaller density in addition to higher thermal conductivity than the existing metal CPU housing 1, reducing the overall mass of the CPU.
The surface of the shell 1 is provided with grooves for filling the heat conducting medium layer 2, so that the contact area between the heat conducting medium layer 2 and the heat conducting medium layer 2 is increased, heat generated by the CPU is conducted to the radiator 3 more fully through the heat conducting medium layer 2, and the radiating efficiency is improved.
The processing modes of the CPU shell 1 are two, namely:
the CPU shell 1 with the strip-shaped grooves on the surface is prepared through machining, the depth of the grooves is 1mm, and the shell 1 is made of graphite. Mixing 500-mesh copper powder with epoxy resin according to the mass ratio of 10:1, uniformly brushing the surface of the CPU shell 1, and ensuring that the grooves are filled with the viscous heat-conducting medium with the thickness of 1mm.
Alternatively, a CPU housing 1 having a cross-shaped groove on the surface thereof was prepared by machining, the depth of the groove was 1mm, and the material used for the housing 1 was graphite. Mixing 500-mesh graphite powder with silicon rubber according to a mass ratio of 1:1, uniformly brushing the surface of the CPU shell 1, and ensuring that the grooves are filled with the viscous heat-conducting medium with the thickness of 1mm.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model, and are intended to be included within the scope of the appended claims and description.
Claims (9)
- CPU heat conduction shell, its characterized in that: comprises a CPU shell (1), wherein a radiator (3) is fixed on the outer end surface of the CPU shell (1) through a heat conducting medium layer (2),an auxiliary connecting groove (4) is formed in the outer end face of the CPU shell (1).
- 2. The CPU heat conductive housing of claim 1, wherein: the shape of the auxiliary connecting groove (4) comprises a bar shape and a cross shape.
- 3. The CPU heat conductive housing of claim 1, wherein: the CPU shell (1) is a carbon-based shell.
- 4. The CPU heat conductive housing of claim 1, wherein: the depth of the auxiliary connecting groove (4) is 0.01-1mm.
- 5. The CPU heat conductive housing of claim 1, wherein: the thickness of the heat conducting medium layer (2) is 0.01-1mm.
- 6. The CPU heat conductive housing of claim 1, wherein: the length of the CPU shell (1) is 1-100mm.
- 7. The CPU heat conductive housing of claim 1, wherein: the width of the CPU shell (1) is 1-100mm.
- 8. The CPU heat conductive housing of claim 1, wherein: the height of the CPU shell (1) is 0.01-10mm.
- 9. The CPU heat conductive housing of claim 1, wherein: the lower end part of the CPU shell (1) is provided with an avoidance hole for avoiding the CPU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320309119.1U CN219678887U (en) | 2023-02-24 | 2023-02-24 | CPU heat conduction shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320309119.1U CN219678887U (en) | 2023-02-24 | 2023-02-24 | CPU heat conduction shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219678887U true CN219678887U (en) | 2023-09-12 |
Family
ID=87925032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320309119.1U Active CN219678887U (en) | 2023-02-24 | 2023-02-24 | CPU heat conduction shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219678887U (en) |
-
2023
- 2023-02-24 CN CN202320309119.1U patent/CN219678887U/en active Active
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