CN114509166B - High-transient high-temperature plasma temperature measurement system - Google Patents
High-transient high-temperature plasma temperature measurement system Download PDFInfo
- Publication number
- CN114509166B CN114509166B CN202210100935.1A CN202210100935A CN114509166B CN 114509166 B CN114509166 B CN 114509166B CN 202210100935 A CN202210100935 A CN 202210100935A CN 114509166 B CN114509166 B CN 114509166B
- Authority
- CN
- China
- Prior art keywords
- temperature
- speed camera
- narrow
- band filter
- emissivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 39
- 238000012545 processing Methods 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 239000010453 quartz Substances 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 6
- 239000013307 optical fiber Substances 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 6
- 238000001228 spectrum Methods 0.000 claims description 6
- 230000035945 sensitivity Effects 0.000 claims description 4
- 230000003595 spectral effect Effects 0.000 claims description 4
- 238000000295 emission spectrum Methods 0.000 claims description 3
- 238000004861 thermometry Methods 0.000 claims description 3
- 230000001052 transient effect Effects 0.000 abstract description 13
- 210000002381 plasma Anatomy 0.000 description 34
- 238000000034 method Methods 0.000 description 14
- 238000005259 measurement Methods 0.000 description 10
- 230000004044 response Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000012804 iterative process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000005457 Black-body radiation Effects 0.000 description 1
- 238000004616 Pyrometry Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003721 gunpowder Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0014—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation from gases, flames
- G01J5/0018—Flames, plasma or welding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
- G01J5/601—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature using spectral scanning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0092—Temperature by averaging, e.g. by scan
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a high-transient high-temperature plasma temperature measurement system, which comprises an optical system, a high-speed camera, a spectrometer and a data processing system, wherein the optical system is connected with the high-speed camera; a quartz lens is arranged at the temperature measuring end of the optical system, a light splitting sheet with an angle of 45 degrees is arranged at the other end of the optical system, and the mirror surfaces of the light splitting sheet correspond to the first high-speed camera and the second high-speed camera respectively; a first narrow-band filter and a second narrow-band filter are respectively arranged in front of the first high-speed camera and the second high-speed camera; the first high-speed camera, the second high-speed camera and the spectrograph are connected with the data processing system through data lines; the front end of the spectrometer is connected with a glass optical fiber. The invention can iteratively solve the emissivity of the plasma, accurately measure the high transient temperature of the plasma and improve the temperature measurement precision by more than 10 percent.
Description
Technical Field
The invention relates to the technical field of temperature measurement, in particular to a high-transient high-temperature plasma temperature measurement system.
Background
The plasma is a fourth state of matter other than solids, liquids, and gases. Also called plasma, is widely used in the disciplines of materials, energy, space physics, environmental space, etc. In industrial production and in the scientific field, for example, tokamak devices for performing nuclear fusion, the operation of automotive plasma engines, steelmaking, the combustion of coal and electricity in power plants, explosion of explosives, plasma thermal spraying can generate high-temperature plasmas of 1000 to 3000 k. The above high temperature plasma is characterized in that it exists for only a few tens of nanoseconds or a few microseconds, or the high temperature state of the target is sharply increased or decreased in a short time. In order to fully develop relevant equipment for subsequent research on the reliability of relevant experiments/production, it is necessary to measure such high transient high temperature.
At present, the devices for measuring the high temperature at home and abroad are divided into: thermocouple method and radiation thermometry. The thermocouple method has the advantages of high measurement accuracy and convenient measurement; the defects are that the temperature measuring range is low, the temperature measuring response speed is low, and the state of the measured object can be influenced when the temperature measuring device contacts with the measured object; and is not applicable at all to transient pyrometry for measuring the gaseous high temperature plasma mentioned in the present invention; the basic principle of radiation temperature measurement is based on the Planckian law of blackbody radiation, and the radiation temperature measurement method mainly comprises an infrared temperature measurement method and a colorimetric temperature measurement method. The infrared temperature measurement method has the advantages of high temperature measurement sensitivity and high reaction speed; however, the infrared camera is expensive, and the exposure time can not reach microsecond level; according to planck's law, as the temperature increases, the maximum radiation wavelength of a high temperature target moves toward the visible band. Therefore, in the field of high-temperature measurement in recent years, researchers have studied related high-temperature measurement devices mainly according to a colorimetric method in radiation temperature measurement. The current colorimetric temperature measuring device has high response speed and can achieve millisecond-level response; the temperature measuring range can be up to 1000-3000 k, and most basic experiment or production requirements can be well met. However, there are problems such as that the time resolution and the temperature measurement accuracy of the colorimetric temperature measuring device are not satisfactory, and there are few methods for solving the plasma emissivity.
CN201811463395.3 discloses a transient temperature field measuring method based on high-speed imaging and a system thereof, the method measures the transient temperature field by a high-speed camera, but the time resolution is only 10 -5 s, it is difficult to meet the requirement of high transient state, so that the temperature change rule of the high temperature plasma cannot be observed and analyzed, and the transient temperature measuring device does not quantitatively analyze and correct the relation between the exposure time and the image gray level under the transient state (also called as exposure time) condition. In addition, the system does not measure and analyze the emissivity of the plasma, so that the system is easy to have the characteristic of large error.
CN202011004422.8 discloses a colorimetric-based high-temperature and high-temperature thermometer with a time resolution of only 10 -3 s, the emissivity was not measured either. In addition, the method can only measure a little temperature, and finally the temperature measuring wave band used by the method is 1.58 to 2.5 mu m in infrared, and according to the expression of the radiation temperature measuring method, after the temperature reaches 1200k, the wave band with stronger spectral radiation is transferred to be less than 1 mu m. Thus for measurements at temperatures above 1200k, the operating wavelength of the colorimetric thermometry method is typically selected to be in the 500nm-900nm band.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a high-transient high-temperature plasma temperature measurement system, which solves the problems that the existing temperature measurement system ignores the emissivity of plasma, seriously influences the temperature measurement precision and is difficult to meet the high-transient temperature measurement requirement.
In order to solve the technical problems, the invention adopts the following technical scheme:
a high-transient high-temperature plasma temperature measurement system comprises an optical system, a high-speed camera, a spectrometer and a data processing system; a quartz lens is arranged at the temperature measuring end of the optical system, a light splitting sheet with an angle of 45 degrees is arranged at the other end of the optical system, and the mirror surfaces of the light splitting sheet correspond to the first high-speed camera and the second high-speed camera respectively; a first narrow-band filter and a second narrow-band filter are respectively arranged in front of the first high-speed camera and the second high-speed camera; the first high-speed camera, the second high-speed camera and the spectrograph are connected with the data processing system through data lines; the front end of the spectrometer is connected with a glass optical fiber;
the data processing system obtains the temperature measurement by adopting the following temperature measurement formula:
wherein T is the thermodynamic temperature of the target, C 2 Is Planck second radiation constant, lambda 1 And lambda (lambda) 2 Is the center wavelength g of the first narrow-band filter and the second narrow-band filter 1 And g 2 Respectively, the gray values of the images shot by the two high-speed cameras, s 1 Sum s 2 The spectral sensitivity of the lens/narrow-band filter/sensor combination in different high-speed cameras is respectively; epsilon 1 And epsilon 2 Emissivity of the high-temperature target corresponding to two center wavelengths; in this formula, planck constant C 2 Narrow band wavelength lambda 1 And lambda (lambda) 2 Is known to the system, and the corresponding image gray value g 1 And g 2 Or can be obtained by shooting with a camera; s is(s) 1 Sum s 2 Is a combined parameter of the camera, epsilon 1 And epsilon 2 Is the emissivity.
Further, the emissivity ε 1 And epsilon 2 Obtained by the following steps: according to the average temperature of the temperature image and the corresponding lightAnd comparing the spectrum of the spectrometer with the emission spectrum of the blackbody furnace at the same temperature, calculating the corresponding emissivity according to the comparison result of the two spectrums, fitting the corresponding emissivity according to the temperature relation, and obtaining the law of the emissivity along with the temperature change.
Further, the bandwidths of the first narrow-band filter and the second narrow-band filter are 10nm, the central wavelength of the first narrow-band filter is 695nm, and the central wavelength of the second narrow-band filter is 800nm.
Further, the minimum exposure time of the first high-speed camera and the second high-speed camera is 1.2903us.
Further, the high-speed camera is shaped as FASTCAM-SA5, and the spectrometer model is shaped as ocean-FX.
Compared with the prior art, the invention has the following beneficial effects:
1. the high-transient high-temperature plasma temperature measuring system can iteratively solve the emissivity of the plasma and accurately measure the high-transient temperature of the plasma. In patent CN201811463395.3, the time resolution of the camera is 10 -5 Second, the time resolution of the invention is 1.2903×10 -6 The highest response speed of the invention is 5-10 times faster than CN 201811463395.3. In addition, the change rule of the plasma emissivity is summarized, and the temperature measurement accuracy is improved by more than 10%. The reason for this is that in the invention patent CN201811463395.3, the influence of the emissivity on the temperature measurement accuracy is not considered, that is, the ratio of the default emissivity is 1, whereas according to the related literature, the relative change of the emissivity can reach 20% in different temperature ranges, and according to the temperature measurement formula, the temperature and the emissivity are in an exponential relationship. Therefore, the influence of the emissivity on the temperature measurement precision is at least more than 10 percent. Therefore, compared with the patent CN201811463395.3, the invention improves the temperature measurement precision by more than 10 percent at least.
2. The invention can be widely applied to the industrial environment, and other objects which are not easy to contact, such as high-temperature gas, high-temperature liquid, liquid molten steel, a nuclear fusion device, gunpowder explosion and other high-temperature measurements.
3. The high transient temperature measuring device quantitatively analyzes and corrects the relation between the temperature and the gray value of the image under the condition of a certain exposure time; the whole temperature measuring system is controlled by a data processing system. The temperature and emissivity of plasmas generated by different environmental devices and different raw materials can be measured and analyzed, and after multiple measurement calibration is carried out, a measuring system suitable for the current plasmas can be determined.
Drawings
FIG. 1 is a schematic diagram of a measurement system according to the present invention;
FIG. 2 is a graph of the relationship between gray scale values and temperature for two high speed camera images according to the present invention;
FIG. 3 is a schematic diagram of an iterative process of emissivity of the plasma of the present invention;
fig. 4 is a temperature distribution image of the high transient state high temperature plasma of the present invention.
Detailed Description
In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described with reference to specific examples, but the embodiments of the present invention are not limited thereto.
The high-transient high-temperature plasma measuring device mainly comprises two high-speed cameras (model is FASTCAM-SA 5), an optical system, two narrow-band filters, a beam splitter, a quartz lens, a spectrometer (model is ocean-FX), a glass optical fiber, a data processing system and a protective shell.
As shown in fig. 1, a high-transient high-temperature plasma temperature measurement system comprises an optical system, a high-speed camera, a spectrometer and a data processing system; a quartz lens 9 is arranged at the temperature measuring end of the optical system 8, a light splitting sheet 7 with a 45-degree angle is arranged at the other end of the optical system, and the mirror surfaces of the light splitting sheet 7 correspond to the first high-speed camera 2 and the second high-speed camera 4 respectively; a first narrow-band filter 3 and a second narrow-band filter 6 are respectively arranged in front of the first high-speed camera 2 and the second high-speed camera 4; the first high-speed camera 2, the second high-speed camera 4 and the spectrometer 5 are connected with a data processing system through data wires; the front end of the spectrometer system is connected with a glass optical fiber 10; the whole system is installed in a protective housing 1.
The data processing system obtains the temperature measurement by adopting the following temperature measurement formula:
wherein T is the thermodynamic temperature of the target, C 2 Is Planck second radiation constant, lambda 1 And lambda (lambda) 2 Is the center wavelength g of the narrow band filters 1 and 2 1 And g 2 Respectively, the gray values of the images shot by the two high-speed cameras, s 1 Sum s 2 The spectral sensitivities of the lens/narrowband filter/sensor combinations in the different high speed cameras, respectively. Epsilon 1 And epsilon 2 Is the emissivity of the high temperature target corresponding to the two center wavelengths. In this formula, planck constant C 2 Narrow band wavelength lambda 1 And lambda (lambda) 2 Is known to the system, and the corresponding image gray value g 1 And g 2 Or can be obtained by shooting with a camera. s is(s) 1 Sum s 2 Is a combined parameter of the camera, epsilon 1 And epsilon 2 Is the emissivity.
The working mode of the whole system during measurement is as follows: after the plasma 11 (e.g. explosion, nuclear fusion, plasma engine) emits a high temperature, the data processing system 12 sends a trigger signal to the first high speed camera 2, the second high speed camera 4 and the spectrometer 5 simultaneously, and then the measurement system starts to operate. The route of optical transmission is: the incident light of the plasma 11 firstly passes through the quartz lens 9, the quartz lens 9 filters stray light, the light splitting sheet 7 makes the incident light incident into the first narrow-band filter 3 and the second narrow-band filter 6 according to the proportion of 1:1, and then the light respectively forms two identical images with different wavelengths in the first high-speed camera 2 and the second high-speed camera 4. The function of the narrow band filter is to allow the optical signal to pass through in a specific wavelength band, while the optical signals on both sides deviating from the wavelength band are blocked. The bandwidth of the narrow-band filter used in the invention is 10nm, the central wavelength of the narrow-band filter 3 is 695nm, and the central wavelength of the narrow-band filter 6 is 800nm. The exposure time of the high-speed camera may be set to a minimum of 1.2903 mus. At the same time, the incident light is transmitted into the spectrometer 5 through the glass optical fiber 10. The data of the spectrometer 5 and the high-speed camera are simultaneously transferred to the data processing system 12, and a high-temperature image is calculated and displayed in the data processing system 12.
The data processing system 12 iteratively solves the relationship between the gray level value and the temperature of the image and the emissivity at high transient exposure time according to a temperature measurement formula. The combination parameters of the camera can be obtained through blackbody furnace calibration and manufacturing processes of lenses, narrow-band filters and sensors. However, in a general measurement system, the ratio of the target ash is assumed, i.eThis can greatly affect the accuracy of the temperature measurement.
Therefore, the invention analyzes the exposure time and system parameters of the high-transient high-temperature measuring system, determines a high-transient high-temperature plasma measuring device and provides a high-temperature plasma emissivity measuring method.
Firstly, calibrating through a blackbody furnace:
(1) The initial parameter exposure time t=1.2903 us, focal length f=75 mm, aperture f=16 is set.
(2) The target temperature of the blackbody furnace was set to 1000k and maintained for 10 minutes, ensuring temperature stability.
(3) 100 images of a uniform surface light source were captured consecutively. The average temperature image and variance are calculated.
(4) And then increased by 100k each time to 3000 k.
Through the steps, the relation between the gray values of the images of the two high-speed cameras and the temperature is fitted under the exposure time, and finally the effect shown in fig. 2 is achieved. To ensure that the temperature of the high transient target can be accurately measured at an emissivity of 1.
Fig. 3 shows an iterative process of emissivity of the plasma: when the measurement is started, the spectrometer 5 and the high-speed camera are triggered simultaneously:
firstly, shooting by a high-speed camera, and calculating a temperature image of a target when the emissivity is 1 according to a temperature measurement formula; meanwhile, according to the average temperature of the temperature image and the spectrum of the spectrometer corresponding to the average temperature, the average temperature is compared with the emission spectrum of the blackbody furnace at the same temperature, then the corresponding emissivity is calculated according to the comparison result of the two spectrums, and the corresponding emissivity is fitted according to the temperature relation, so that the law of the emissivity along with the temperature change is obtained.
And secondly, the emissivity calculated at this time is brought into a temperature measurement formula, and the result is output.
Then, the second shooting is started, the main purpose of the second shooting is to calculate the temperature according to the emissivity result obtained by the first fitting, and meanwhile, the comparison and judgment are carried out according to the relation between the temperature of the second shooting and the emissivity, and the emissivity value and the corresponding fitting relation are updated again.
And finally, obtaining the correct fitting relation of the temperature and the emissivity through repeated updating iteration. Finally, a temperature distribution image of the high-transient high-temperature plasma can be accurately shot, as shown in fig. 4.
The high transient temperature measuring device quantitatively analyzes and corrects the relation between the temperature and the gray value of the image under the condition of a certain exposure time; the whole temperature measuring system is controlled by a data processing system. The temperature and emissivity of plasmas generated by different environmental devices and different raw materials can be measured and analyzed, and after multiple measurement calibration is carried out, a measuring system suitable for the current plasmas can be determined.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the technical solution, and those skilled in the art should understand that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the present invention, and all such modifications and equivalents are included in the scope of the claims.
Claims (2)
1. The high-transient high-temperature plasma temperature measurement system is characterized by comprising an optical system, a high-speed camera, a spectrometer and a data processing system; a quartz lens (9) is arranged at the temperature measuring end of the optical system (8), a light splitting sheet (7) with an angle of 45 degrees is arranged at the other end of the optical system, and the mirror surfaces of the light splitting sheet (7) correspond to the first high-speed camera (2) and the second high-speed camera (4) respectively; a first narrow-band filter (3) and a second narrow-band filter (6) are respectively arranged in front of the first high-speed camera (2) and the second high-speed camera (4); the first high-speed camera (2), the second high-speed camera (4) and the spectrometer (5) are connected with the data processing system through data lines; the front end of the spectrometer is connected with a glass optical fiber (10);
the data processing system obtains the temperature measurement by adopting the following temperature measurement formula:
wherein T is the thermodynamic temperature of the target, C 2 Is Planck second radiation constant, lambda 1 And lambda (lambda) 2 Is the center wavelength g of the first narrow-band filter and the second narrow-band filter 1 And g 2 Respectively, the gray values of the images shot by the two high-speed cameras, s 1 Sum s 2 The spectral sensitivity of the lens/narrow-band filter/sensor combination in different high-speed cameras is respectively; epsilon 1 And epsilon 2 Emissivity of the high-temperature target corresponding to two center wavelengths; in this formula, planck constant C 2 Narrow band wavelength lambda 1 And lambda (lambda) 2 Is known to the system, and the corresponding image gray value g 1 And g 2 Or can be obtained by shooting with a camera; s is(s) 1 Sum s 2 Is a combined parameter of the camera, epsilon 1 And epsilon 2 Is emissivity;
the emissivity epsilon 1 And epsilon 2 Obtained by the following steps: comparing the average temperature of the temperature image and the spectrum of the spectrometer corresponding to the average temperature with the emission spectrum of the blackbody furnace at the same temperature, calculating corresponding emissivity according to the comparison result of the two spectrums, fitting the corresponding emissivity according to the temperature relation, and obtaining the law of the emissivity along with the temperature change;
the bandwidths of the first narrow-band filter (3) and the second narrow-band filter (6) are 10nm, the central wavelength of the first narrow-band filter (3) is 695nm, and the central wavelength of the second narrow-band filter (6) is 800nm;
the minimum exposure time of the first high-speed camera (2) and the second high-speed camera (4) is 1.2903us.
2. The Gao Shuntai high temperature plasma thermometry system of claim 1, wherein the high speed camera is fastbam-SA 5, spectrometer model number ocean-FX.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210100935.1A CN114509166B (en) | 2022-01-27 | 2022-01-27 | High-transient high-temperature plasma temperature measurement system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210100935.1A CN114509166B (en) | 2022-01-27 | 2022-01-27 | High-transient high-temperature plasma temperature measurement system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114509166A CN114509166A (en) | 2022-05-17 |
| CN114509166B true CN114509166B (en) | 2024-02-23 |
Family
ID=81549268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210100935.1A Active CN114509166B (en) | 2022-01-27 | 2022-01-27 | High-transient high-temperature plasma temperature measurement system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114509166B (en) |
Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3262006A (en) * | 1963-12-27 | 1966-07-19 | Welding Research Inc | Welding control system |
| GB1129989A (en) * | 1964-12-21 | 1968-10-09 | Euratom | Process and device used for measuring very high temperatures |
| US3972615A (en) * | 1975-01-17 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Determination of semi opaque plasma temperatures |
| US5235399A (en) * | 1990-09-06 | 1993-08-10 | Hitachi, Ltd. | Temperature measuring apparatus utilizing radiation |
| WO1999028715A1 (en) * | 1997-12-01 | 1999-06-10 | On-Line Technologies, Inc. | Thermal imaging for semiconductor process monitoring |
| JP2003315159A (en) * | 2002-04-19 | 2003-11-06 | Yamaguchi Technology Licensing Organization Ltd | Radiation temperature measuring device |
| CN103630249A (en) * | 2013-11-29 | 2014-03-12 | 西北核技术研究所 | Self-calibration device and method for emission rate coefficient of multi-spectrum radiation temperature measuring system |
| SI24410A (en) * | 2014-06-18 | 2014-12-31 | Benjamin Bizjan | System and method for contactless temperature measuring with a cameraworking in the visible part of the light spectrum |
| CN104316202A (en) * | 2014-11-17 | 2015-01-28 | 西华大学 | Device capable of being used for high temperature three-dimensional measurement and measuring method of device |
| KR20150058946A (en) * | 2013-11-21 | 2015-05-29 | 한국과학기술원 | Apparatus and method for measuring plasma electronic temperature using image sensor |
| CN105258802A (en) * | 2015-11-03 | 2016-01-20 | 南京理工大学 | Unstable environment transient-state temperature measuring device based on coarse and fine two-stage light splitting structure |
| CN105674886A (en) * | 2016-01-15 | 2016-06-15 | 重庆大学 | Nuclear fuel pellet end face dimension measuring method and device |
| CN105784184A (en) * | 2016-03-16 | 2016-07-20 | 重庆大学 | Temperature-strain integrated measuring method in high-temperature tension test |
| CN106644854A (en) * | 2016-11-14 | 2017-05-10 | 西安交通大学 | On-line measurement device and method for flying parameters of particles during plasma spraying |
| CN107271392A (en) * | 2017-06-12 | 2017-10-20 | 重庆大学 | One kind is based on gas differential absorption cross-section pattern measurement low concentration SO2Method |
| CN108195473A (en) * | 2017-12-26 | 2018-06-22 | 中国工程物理研究院上海激光等离子体研究所 | A kind of multichannel impact temperature diagnostic method for shock-wave experiment |
| CN108398191A (en) * | 2018-01-29 | 2018-08-14 | 南京理工大学 | High-precision colour temperature measurement method and system based on fiber spectrometer |
| CN109425434A (en) * | 2017-09-04 | 2019-03-05 | 南京理工大学 | A kind of plasma three dimensional temperature field measurement device for eliminating emissivity error |
| CN109506782A (en) * | 2018-12-03 | 2019-03-22 | 南京理工大学 | Transient state temperature field test method and its test macro based on high-speed imaging technology |
| WO2020080368A1 (en) * | 2018-10-16 | 2020-04-23 | 古河電気工業株式会社 | Temperature measuring system, temperature measuring method, and laser processing device |
| CN112067132A (en) * | 2020-07-13 | 2020-12-11 | 北京化工大学 | Flame high-temperature measurement calibration method based on random consistency sampling technology |
| CN112414561A (en) * | 2020-09-22 | 2021-02-26 | 菲兹克光电(长春)有限公司 | High-temperature high-speed thermometer based on colorimetric method |
| CN113865717A (en) * | 2021-09-24 | 2021-12-31 | 重庆大学 | Transient high-temperature colorimetric temperature measuring device based on high-speed camera |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8096704B2 (en) * | 2008-05-27 | 2012-01-17 | Nusensors, Inc. | Extreme temperature robust optical sensor designs and fault-tolerant signal processing |
| GB2511840B (en) * | 2013-03-15 | 2017-07-05 | Thermo Electron Mfg Ltd | Method and apparatus for control of a plasma for spectrometry |
| KR101832640B1 (en) * | 2013-11-01 | 2018-02-26 | 도쿄엘렉트론가부시키가이샤 | Spatially resolved emission spectrospy in plasma processing |
| US11874176B2 (en) * | 2019-11-08 | 2024-01-16 | University of Pittsburgh—of the Commonwealth System of Higher Education | Systems and methods of adaptive two-wavelength single-camera imaging thermography (ATSIT) for accurate and smart in-situ process temperature measurement during metal additive manufacturing |
-
2022
- 2022-01-27 CN CN202210100935.1A patent/CN114509166B/en active Active
Patent Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3262006A (en) * | 1963-12-27 | 1966-07-19 | Welding Research Inc | Welding control system |
| GB1129989A (en) * | 1964-12-21 | 1968-10-09 | Euratom | Process and device used for measuring very high temperatures |
| US3972615A (en) * | 1975-01-17 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Determination of semi opaque plasma temperatures |
| US5235399A (en) * | 1990-09-06 | 1993-08-10 | Hitachi, Ltd. | Temperature measuring apparatus utilizing radiation |
| WO1999028715A1 (en) * | 1997-12-01 | 1999-06-10 | On-Line Technologies, Inc. | Thermal imaging for semiconductor process monitoring |
| JP2003315159A (en) * | 2002-04-19 | 2003-11-06 | Yamaguchi Technology Licensing Organization Ltd | Radiation temperature measuring device |
| KR20150058946A (en) * | 2013-11-21 | 2015-05-29 | 한국과학기술원 | Apparatus and method for measuring plasma electronic temperature using image sensor |
| CN103630249A (en) * | 2013-11-29 | 2014-03-12 | 西北核技术研究所 | Self-calibration device and method for emission rate coefficient of multi-spectrum radiation temperature measuring system |
| SI24410A (en) * | 2014-06-18 | 2014-12-31 | Benjamin Bizjan | System and method for contactless temperature measuring with a cameraworking in the visible part of the light spectrum |
| CN104316202A (en) * | 2014-11-17 | 2015-01-28 | 西华大学 | Device capable of being used for high temperature three-dimensional measurement and measuring method of device |
| CN105258802A (en) * | 2015-11-03 | 2016-01-20 | 南京理工大学 | Unstable environment transient-state temperature measuring device based on coarse and fine two-stage light splitting structure |
| CN105674886A (en) * | 2016-01-15 | 2016-06-15 | 重庆大学 | Nuclear fuel pellet end face dimension measuring method and device |
| CN105784184A (en) * | 2016-03-16 | 2016-07-20 | 重庆大学 | Temperature-strain integrated measuring method in high-temperature tension test |
| CN106644854A (en) * | 2016-11-14 | 2017-05-10 | 西安交通大学 | On-line measurement device and method for flying parameters of particles during plasma spraying |
| CN107271392A (en) * | 2017-06-12 | 2017-10-20 | 重庆大学 | One kind is based on gas differential absorption cross-section pattern measurement low concentration SO2Method |
| CN109425434A (en) * | 2017-09-04 | 2019-03-05 | 南京理工大学 | A kind of plasma three dimensional temperature field measurement device for eliminating emissivity error |
| CN108195473A (en) * | 2017-12-26 | 2018-06-22 | 中国工程物理研究院上海激光等离子体研究所 | A kind of multichannel impact temperature diagnostic method for shock-wave experiment |
| CN108398191A (en) * | 2018-01-29 | 2018-08-14 | 南京理工大学 | High-precision colour temperature measurement method and system based on fiber spectrometer |
| WO2020080368A1 (en) * | 2018-10-16 | 2020-04-23 | 古河電気工業株式会社 | Temperature measuring system, temperature measuring method, and laser processing device |
| CN109506782A (en) * | 2018-12-03 | 2019-03-22 | 南京理工大学 | Transient state temperature field test method and its test macro based on high-speed imaging technology |
| CN112067132A (en) * | 2020-07-13 | 2020-12-11 | 北京化工大学 | Flame high-temperature measurement calibration method based on random consistency sampling technology |
| CN112414561A (en) * | 2020-09-22 | 2021-02-26 | 菲兹克光电(长春)有限公司 | High-temperature high-speed thermometer based on colorimetric method |
| CN113865717A (en) * | 2021-09-24 | 2021-12-31 | 重庆大学 | Transient high-temperature colorimetric temperature measuring device based on high-speed camera |
Non-Patent Citations (6)
| Title |
|---|
| "VIS-NIR multispectral synchronous imaging pyrometer for high-temperature measurements";Tairan Fu 等;《Review of Scientific Instruments》;第88卷;全文 * |
| "基于多光谱法测量等离子体场温度的算法研究";朱泽忠;《中国优秀硕士学位论文全文数据库 基础科学辑 (月刊)》(第7期);全文 * |
| "激光支持等离子体爆轰波温度的实验测量";鲁建英 等;《高压物理学报》;第23卷(第2期);全文 * |
| "火焰传感器复合参数校准系统";张宸 等;《中国仪器仪表》(第9期);全文 * |
| 多光谱辐射瞬态高温测温计的研制;翟洋;沈华;朱日宏;马锁冬;李健欣;陈磊;顾金良;;光谱学与光谱分析(第11期);全文 * |
| 瞬时高温的测量;谭显祥;爆炸与冲击(第03期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114509166A (en) | 2022-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Liang et al. | Development of a new fiber-optic multi-target multispectral pyrometer for achievable true temperature measurement of the solid rocket motor plume | |
| CN109655161B (en) | Target infrared integral radiation intensity testing method and device based on thermal infrared imager | |
| CN110487134B (en) | Device and method for measuring combustion speed and temperature of explosion flame | |
| Lee et al. | Calibration of a mid-IR optical emission spectrometer with a 256-array PbSe detector and an absolute spectral analysis of IR signatures | |
| US6379038B1 (en) | Temperature determining device and process | |
| CN110470406A (en) | A kind of measurement method of thermal infrared spectrum instrument stray radiation | |
| CN110207830A (en) | A kind of the imaging sensor caliberating device and scaling method in nonblackbody radiation source | |
| CN114777931A (en) | Object surface temperature distribution measuring method and system based on correlated imaging | |
| CN104864977A (en) | Rocket engine gas temperature testing method in consideration of multi-wavelength spectral radiation | |
| CN112964365B (en) | Turbine blade three-wavelength radiation temperature measuring device and method | |
| Sankaranarayanan et al. | Investigation of sooting flames by color-ratio pyrometry with a consumer-grade DSLR camera | |
| CN114623932A (en) | MPD cathode temperature monitoring system and method based on infrared radiation imaging | |
| CN114509166B (en) | High-transient high-temperature plasma temperature measurement system | |
| CN113758573A (en) | Three-wavelength colorimetric infrared temperature measurement system, method and device based on emissivity iteration | |
| CN105806491A (en) | Three-wavelength two-dimensional temperature field measuring device and method | |
| CN111649830B (en) | Color CCD self-calibration temperature measurement device and method based on radiation spectrum | |
| CN201892573U (en) | Near-infrared radiation thermometer | |
| Keyvan et al. | Blackbody-based calibration for temperature calculations in the visible and near-IR spectral ranges using a spectrometer | |
| CN116046182A (en) | Spectrum radiometer absolute radiation calibration device based on high-temperature blackbody | |
| CN113008389B (en) | Method for measuring temperature of divertor target plate of tokamak device based on single-wave filtering | |
| Bonefačić et al. | Two-color temperature measurement method using BPW34 PIN photodiodes | |
| Wang et al. | Analysis of infrared temperature measurement for flue gas shielding metal surface using Source Multi-Flux method | |
| CN115493702A (en) | Turbine blade radiation temperature measuring device and temperature measuring method thereof | |
| Zhang et al. | High temperature imaging dynamic measurement techniques under harsh experimental environment | |
| RU2727340C1 (en) | Method of measuring actual temperature and spectral emissivity of an object |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Jinlong Inventor after: Guo Yongcai Inventor after: Gao Chao Inventor after: Chao Hongxiao Inventor after: Wang Dongying Inventor after: Li Shili Inventor before: Gao Chao Inventor before: Chen Jinlong Inventor before: Guo Yongcai Inventor before: Chao Hongxiao Inventor before: Wang Dongying Inventor before: Li Shili |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |