CN114481117A - External efficient heat dissipation coating for mobile phone and preparation method thereof - Google Patents

External efficient heat dissipation coating for mobile phone and preparation method thereof Download PDF

Info

Publication number
CN114481117A
CN114481117A CN202111533251.2A CN202111533251A CN114481117A CN 114481117 A CN114481117 A CN 114481117A CN 202111533251 A CN202111533251 A CN 202111533251A CN 114481117 A CN114481117 A CN 114481117A
Authority
CN
China
Prior art keywords
coating
powder
mobile phone
pressure
porosity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111533251.2A
Other languages
Chinese (zh)
Inventor
谢冬柏
李强
姜卫国
郭辉
董海荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weifang University of Science and Technology
Original Assignee
Weifang University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weifang University of Science and Technology filed Critical Weifang University of Science and Technology
Priority to CN202111533251.2A priority Critical patent/CN114481117A/en
Publication of CN114481117A publication Critical patent/CN114481117A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/106—Coating with metal alloys or metal elements only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/10—Alloys based on aluminium with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/12—Alloys based on aluminium with copper as the next major constituent
    • C22C21/18—Alloys based on aluminium with copper as the next major constituent with zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An external high-efficiency heat dissipation coating of a mobile phone; which is arranged on a metal base; the porosity of the external efficient heat dissipation coating of the mobile phone is 5-60%; the thickness is 50-1000 μm; the component of the alloy is one or the combination of three elements of Al, Cu and Zn. The invention also relates to a preparation method of the external efficient heat dissipation coating of the mobile phone, which comprises the steps of firstly, placing single element or mixture metal powder used as a raw material on the surface of a base material for manufacturing a heat radiator, and then combining the metal powder and the surface of the base material by heating and pressurizing under the environment of vacuum pumping or protective atmosphere to form the heat dissipation coating. The invention has low production cost, good heat dissipation effect and adjustable mechanical property and surface state; the comprehensive technical effect is good, and the predictable huge economic value and social value are achieved.

Description

External efficient heat dissipation coating for mobile phone and preparation method thereof
Technical Field
The invention belongs to the technical field of mechanical manufacturing, material processing and system thermal management, and particularly relates to an external efficient heat dissipation coating for a mobile phone and a preparation method thereof.
Background
At present, due to the appearance of large-screen smart phones and the popularity of large-scale 3D (three-dimensional) mobile games, the performance of the mobile phones is continuously improved, the power is continuously increased, the size is gradually reduced, the heat productivity is large when the mobile phones operate, and the temperature rise is fast. High temperatures can have a detrimental effect on the performance of electronic devices, shortening the useful life of semiconductor components in the handset. Research shows that the temperature of a semiconductor element is increased by 10 ℃, the reliability is reduced by 50%, how to effectively improve the heat dissipation efficiency of a mobile phone becomes a problem which needs to be solved by mobile phone manufacturers, and the use of an external heat dissipation measure is a scheme for conveniently and effectively solving the problem.
At present, the most applied cooling modes at home and abroad are mainly air cooling and liquid cooling. The equipment with higher requirement on temperature rise generally needs forced air cooling, and air convection between the equipment and the external environment is accelerated through a fan. The technology is simple and practical, high in reliability, convenient to maintain and low in use cost, is a cooling mode widely used at present, but air cooling is used, the speed and distribution of air are difficult to control, noise is obvious during working, and the volume of the system is large. The liquid cooling has the characteristics of high heat exchange efficiency and good temperature uniformity, and is the heat dissipation mode with the highest efficiency at present. The liquid cooling plate is a main part for liquid cooling heat dissipation of the electronic element, the electronic element conducts heat with the liquid cooling plate during working, the temperature of cooling liquid can be gradually increased along a channel, in order to meet the cooling requirement, on one hand, enough flow of the cooling liquid is adopted so as to take out the heat generated by the element, and on the other hand, the uniformity of the temperature of each part of the element is ensured by designing a complex cooling liquid flow channel structure. Such as a liquid cooled plate with an array of fins, and the angle and width of the fins are optimized for better heat transfer performance. The rapid increase in heat flow in electronic components and the need for superior cooling performance have prompted the development of microchannel heat sinks. This technique, originally proposed by Tuckerman and Pease in 1981, is to increase heat dissipation by further reducing the geometry of the internal cooling channels of the heat sink. Compared with the traditional rectangular straight-through micro-channel heat exchanger, the heat exchanger has better cooling performance. The key of the technology is to process the radiator with more accurate and complex internal microstructure, thereby greatly enhancing the heat dissipation capability under the condition of unchanged or smaller integral volume. In order to improve the heat dissipation capability of the liquid cooling plate, the flow rate needs to be increased, which not only makes it difficult to achieve the light weight requirement of the cooling system, but also increases the manufacturing cost and energy consumption of the heat dissipation system due to the complex flow channel design. Meanwhile, the traditional liquid cooling technology needs an additional cooling and heat exchange system, and has low reliability relative to air cooling and high cost.
To deal with the heat dissipation problem of electronic products, two-phase flow heat transfer technology is widely used, heat pipes and temperature-equalizing plates developed on the basis of the technology are provided, a capillary structure is the core of the heat dissipation device, and 202010195467.1 provides a method for processing the capillary structure of the heat dissipation device. Capillary structures are distributed on the inner wall of the heat pipe, and condensate which is easy to evaporate is sealed in the pipeline. One end of the heat pipe close to a heating source (such as a processor) is heated, the internal liquid evaporates and absorbs heat, diffuses to the other end of the heat pipe to condense and release heat (steam-liquid flows back to the heating end by utilizing capillary action to circulate, and the liquid state is converted into the steam state to absorb a large amount of heat, so that the heat conduction efficiency of the heat pipe can be improved by more than ten times compared with a heat dissipation plate with the same area, the internal space of the mobile phone is limited, the length and the thickness of the heat pipe which can be accommodated are limited, a soaking plate is generated, the soaking plate is a large-sheet-shaped heat pipe, patent 201922146157.6 provides an inflatable aluminum soaking plate with a capillary structure, the inner wall of the soaking plate is provided with a vacuum copper cavity which is provided with a fine structure and is filled with cooling liquid, the principle of the soaking plate is continuously circulated by means of evaporation-condensation of the cooling liquid heating source, the soaking plate can transfer heat to a plurality of horizontal directions, the condensation efficiency is higher, and the contact area between the heat source and the heat dissipation medium is larger, the hot spots can be reduced better, the isothermal performance of the chip can be realized, and the thickness of the chip can be thinner than that of a heat pipe. The heat dissipation capillary structure widely used at present, such as metal powder sintering, fiber, foam metal, metal wire mesh, etc., is often limited by many factors, such as application scenarios, installation structures, production processes, production costs, etc., so that the application of the capillary structure in the interior of an electronic device is limited. According to the existing theoretical method, aiming at the problem that how to improve the heat dissipation capability of the produced mobile phone through an additional device is also an important problem, the invention improves the efficiency of the heat sink by preparing the heat sink coating for the mobile phone, which is cheap, efficient and easy to process, and the method has good application prospect.
Disclosure of Invention
Regardless of the mobile phone using the graphite patch, the heat pipe or the vapor chamber, the production cost of the mobile phone is increased, the product is redesigned, and the design can only conduct the temperature generated by the mobile phone from one point to one surface, but if the mobile phone continuously uses heat, the heat will be continuously generated and always exceeds the upper limit of the threshold value of the whole set of heat dissipation system, and the problem of overheating will occur in the using process. Then, a turbofan in a notebook computer cooling system is used for cooling the mobile phone, and heat of the heat pipe and the vapor chamber is exhausted out of the mobile phone through the fan, so that a positive feedback is formed, the cooling efficiency is higher than that of a product without the fan, but a new requirement is provided for the design of the mobile phone.
The invention aims to provide a preparation method of an external efficient heat dissipation coating of a mobile phone aiming at the defects and shortcomings of the technology, the method is based on a two-phase flow heat transfer technology, the capillary structure of the coating is the core of the heat dissipation device, and a processing method capable of controlling the formation of the capillary structure in the heat dissipation coating is provided. Because the capillary structure is distributed in the coating, the cooling liquid which is easy to evaporate is heated at one end close to a heating source (such as a processor) of the mobile phone body, the liquid in the coating evaporates and absorbs heat, the liquid diffuses to the other end in the coating to be condensed and release heat, then flows back to the heating end at the side of the mobile phone body by utilizing the capillary action, and is circulated and reciprocated, and a large amount of heat can be absorbed when the liquid state is changed into the vapor state, so that the heat conduction efficiency of the coating is greatly improved, and the heat conduction efficiency can be improved by more than ten times compared with a heat dissipation plate with the same area.
The coating has wide range of selectable materials, large controllable range of pore distribution and adjustable pore structure. The obtained coating is of a porous structure, and a layer of mutually communicated pores with different shapes are formed on the common smooth surface. The porous surface has many recesses and tunnels, and the tunnels randomly connect the recesses, the porous structure of the surface can easily trap gas or steam, meanwhile, the porous heat exchange surface of the surface has a large number of pores to provide a high-density vaporization core, so that a heat transfer medium can generate a large number of bubbles under the working condition of small superheat degree to strengthen the evaporation heat exchange process, and a liquid working medium is easy to vaporize on the porous surface compared with the common surface, thereby improving the cooling efficiency.
The external efficient heat dissipation coating for the mobile phone can be prepared by using common metal or alloy powder, has few limitations on base materials, low cost, good heat dissipation effect of the coating, and adjustable mechanical properties and surface state. The comprehensive technical effect is good, and the predictable huge economic value and social value are achieved.
The general technical idea of the invention is as follows: according to different working environments of the mobile phone, the heat transfer by the porous coating is mainly carried out in three modes of convection heat transfer between a liquid film and a wall surface in a tunnel, film evaporation and overall convection, and the heat transfer device is particularly suitable for working under low heat flow density of the mobile phone. Air or liquid cooling may be used. The liquid cooling mode is that the liquid cooling mode utilizes the capillary phenomenon principle to enable the liquid cooling to move upwards along the interior of the heat dissipation coating, the liquid level can automatically rise to a certain height along the coating along with the reduction of capillary force and stop, the liquid cooling can also exchange heat with the base body to generate phase change while rising, the heat is transferred and exchanged to the outside of the system through the condensation process of evaporation, and the latent heat of phase change evaporation is far larger than the heat exchanged through the traditional transfer. The heat dissipation coating not only can obviously improve the heat dissipation area of the liquid cooling radiator and enhance the heat exchange capacity, but also utilizes the capillary phenomenon of liquid to uniformly distribute the cooling liquid on the surface of the capillary structure without additional energy.
The heat dissipation coating is prepared on the surface of the base material by a heating and pressurizing method, and the capillary structure coating with a certain thickness and structure not only improves the heat dissipation capability of the base material, but also solves the problem that the porous material has poor mechanical property and can not be directly used for manufacturing a radiator. By controlling the size of the metal powder, the heating temperature and the pressure, the particles are prepared into the porous coating under the condition of surface micro-melting or partial melting. The coating realizes connection among particles through partial melting of the semi-molten particles, and holes are formed at the parts which are not contacted among the particles. The porosity and structure of the coating can be adjusted by adjusting the particle size of the powder, the heating temperature, the pressure and the like. The heat dissipation performance of the porous heat dissipation coating is better than that of a fin type radiator, the requirement of light structure is easier to realize, the occupied space size is smaller, and the advantages of reducing material cost and processing technology are obvious.
The heat dissipation coating is prepared by firstly placing single element or mixture metal powder used as raw materials on the surface of a base material (Al, Cu and Zn or other simple substances or available alloy materials) for manufacturing a heat radiator, and then heating and pressurizing to combine the metal powder with the surface of the base material to form the heat dissipation coating. The final coating thickness is 1.5-4 times the thickness of the metal powder during preparation, the required porosity is related, the heating temperature is about 0.5-0.6 times the melting point of the metal powder during preparation, and the applied pressure is 10-50MPa during preparation. The coating is prepared in the atmosphere or under the protection of argon with the purity of not less than 90 percent after being heated and pressurized during preparation, or in a vacuum environment with the purity of not more than 0.01 Pa. When the coating is prepared, the pressurizing speed is less than 10 MPa/min when the heating temperature is lower than 500 ℃, and the heat preservation time is not less than 2 min after the required pressure intensity and temperature are reached; the pressurizing speed is less than 5 MPa/min when the heating temperature is more than or equal to 500 ℃ during the coating preparation, and the heat preservation time is not less than 2 minutes after the required pressure intensity and temperature are reached. The prepared coating is discharged after the temperature is lower than 100 ℃, and air or argon flow with the purity not lower than 90 percent is used for cooling, or the cooling is carried out in a vacuum environment with the pressure not higher than 0.01 Pa.
The invention mainly relates to an external efficient heat dissipation coating of a mobile phone, which is arranged on a metal substrate and is characterized in that:
the porosity of the external efficient heat dissipation coating of the mobile phone is 5-60%; the thickness is 50-1000 μm; the component of the alloy is one or the combination of three elements of Al, Cu and Zn.
The invention relates to an external high-efficiency heat dissipation coating for a mobile phone, which preferably comprises the following technologies:
wherein the weight percentage content of Zn is not higher than 50%, and the coating composition meets one of the following requirements:
firstly, when the weight percentage content of Al in the coating component is more than 90%, the rest components are Cu or Zn or the combination of the Cu and the Zn; when the weight percentage content of Cu is more than 90%, the rest components are Al or Zn or the combination of the Al and the Zn; the heat conduction coefficient of the coating is 100-300W/mK;
secondly, when the weight percentage content of Al in the coating components is 50-90%, the rest components are Cu or Zn or the combination of the Cu and the Zn; when the weight percentage content of Cu is 50-90%, the rest components are Al or Zn or the combination of the Al and the Zn; the thermal conductivity of the coating is 100-300W/mK.
The external efficient heat dissipation coating for the mobile phone also meets one of the following requirements:
firstly, the porosity of the coating is 5-20%, the porosity is continuously improved along the depth direction after cooling water enters so as to accommodate more cooling media, and meanwhile, more cooling media are contacted with a high-temperature part; the porous coating is particularly suitable for the external radiating coating of the mobile phone with water as the cooling medium because of low porosity;
secondly, the porosity of the coating is 20-40%, the porosity of the cooling oil is continuously improved along the depth direction after entering so as to accommodate more cooling media, and meanwhile, more cooling media are contacted with high-temperature parts; the porosity is moderate, so that the coating is particularly suitable for an external heat dissipation coating of a mobile phone with oil as a cooling medium;
thirdly, the porosity of the coating is 40-60%, the porosity of the coating is continuously improved along the depth direction after air enters the external environment so as to accommodate more cooling media, and meanwhile, more cooling media are contacted with high-temperature parts; the porosity is high, the air fluidity is good, and the coating is particularly suitable for the external heat dissipation coating of the mobile phone with the air as the cooling medium.
The external efficient heat dissipation coating for the mobile phone meets one of the following requirements:
firstly, the substrate is an aluminum substrate with the thickness of 1mm, and the component of the external efficient heat dissipation coating of the mobile phone is Al; using Al powder with a nominal diameter of 40 μm, the total thickness of the powder before coating preparation was 150 μm; preparing a coating with the total thickness of 60 mu m, wherein the porosity of the coating is 10-13%, and the heat conduction coefficient is 120-200W/mK;
secondly, the substrate is a copper substrate with the thickness of 0.2mm, and the component of the external efficient heat dissipation coating of the mobile phone is Al; al powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m; preparing a coating with the total thickness of 80 mu m; the porosity of the coating is 30-36%, and the heat conduction coefficient is 100-;
thirdly, the substrate is an iron substrate with the thickness of 0.2mm, and the external efficient heat dissipation coating of the mobile phone contains Al; al powder with a nominal diameter of 60 μm was used; the total thickness of the powder before the coating is prepared is 300 mu m; preparing a coating with the total thickness of 100 mu m; the porosity of the coating is 45-52%, and the heat conduction coefficient is 100-;
fourthly, the substrate is an aluminum substrate with the thickness of 1mm, and the component of the external efficient heat dissipation coating of the mobile phone is Cu; cu powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m; preparing a coating with the total thickness of 70 mu m; the porosity of the coating is 8-11%, and the heat conduction coefficient is 100-;
fifthly, the substrate is an aluminum substrate with the thickness of 1mm, and the components of the external efficient heat dissipation coating of the mobile phone are Cu and Al; cu powder with a nominal diameter of 40 μm and Zn powder with a nominal diameter of 40 μm were used in a ratio of 1: 1 by mass ratio; the total thickness of the powder before the coating is prepared is 150 mu m; preparing the obtained coating with the total thickness of 50 mu m; the porosity of the coating is 13-19%, and the heat conduction coefficient is 200-;
sixthly, the components of the external efficient heat dissipation coating of the mobile phone are Cu and Zn; cu and Zn powders with a nominal diameter of 40 μm were used in a ratio of 1.2: 1, the total thickness of the powder before coating preparation is 150 mu m; preparing a coating with the thickness of 60 mu m, wherein the porosity of the coating is 25-30%, and the heat conduction coefficient is 200-300W/mK;
seventhly, the external efficient heat dissipation coating of the mobile phone comprises Al; the coating with the thickness of 80 mu m is prepared by using Al powder with the nominal diameter of 50 mu m and the total thickness of 300 mu m; the porosity of the coating is 6-10%, and the heat conduction coefficient is 100-;
the mobile phone external high-efficiency heat dissipation coating comprises Zn; zn powder with the nominal diameter of 80 mu m is used, the total thickness of the powder before coating is 500 mu m, and the obtained coating with the thickness of 200 mu m is prepared; the porosity of the coating is 25-30%, and the heat conduction coefficient is 50-100W/mK;
the component of the external efficient heat dissipation coating of the mobile phone is Al; the method comprises the steps of preparing a coating with the thickness of 60 mu m by using Al powder with the nominal diameter of 40 mu m and the total thickness of the powder before coating is 200 mu m; the porosity of the coating is 45-50%, and the heat conduction coefficient is 100-150W/mK;
the mobile phone external efficient heat dissipation coating comprises Al; the Al powder with the nominal diameter of 50 mu m is used, and the total powder thickness before coating preparation is 3400 mu m; preparing the obtained 950-micron thick coating; the porosity of the coating is 45-50%, and the heat conduction coefficient is 100-;
eleven, the external efficient heat dissipation coating of the mobile phone comprises Al; the Al powder with the nominal diameter of 40 mu m is used, and the total thickness of the powder before coating preparation is 150 mu m; preparing the obtained coating with the thickness of 60 mu m; the porosity of the coating is 5-10%, and the heat conduction coefficient is 150-;
twelfth, the external efficient heat dissipation coating of the mobile phone comprises Cu; cu powder with the nominal diameter of 80 mu m is used, and the total thickness of the powder before coating is prepared is 600 mu m; preparing the obtained coating with the thickness of 210 mu m; the porosity of the coating is 22% -25%, and the heat conduction coefficient is 200-.
The invention also relates to a preparation method of the external efficient heat dissipation coating of the mobile phone, which is characterized by comprising the following steps: the coating is prepared from metal powder which is one or a combination of the following elements: al, Cu, Zn; the nominal particle size of the metal powder used is 20-300 μm;
the preparation method of the external efficient heat dissipation coating for the mobile phone comprises the following steps:
firstly, single element or mixture metal powder as raw material is placed on the surface of base material for manufacturing heat radiator, then the metal powder is combined with the surface of base material by heating and pressurizing under vacuum or protective atmosphere environment to form heat radiation coating.
The preparation method of the external efficient heat dissipation coating for the mobile phone preferably requires the following technical contents: the preparation method of the external efficient heat dissipation coating for the mobile phone also meets one or the combination of the following requirements:
firstly, the heating temperature of the mixed metal powder is 400-450 ℃ for Al powder, 600-650 ℃ for Cu powder, and the heating temperature of other mixed metal powder is the melting point temperature T of the highest melting point metal in the mixed metal powderFusion furnaceBased on the selection of 0.5TFusion furnaceAt the temperature of +50 ℃, the pressure intensity is 10-50MPa during preparation;
secondly, when the external efficient heat dissipation coating of the mobile phone is prepared, the components of the metal powder added in the coating can be single components of Al, Cu and Zn or the combination of the single components; when it is a certain combination of Al, Cu, Zn: the nominal diameters of the powder at the bottom layer, the middle layer and the outermost layer can be adjusted, and the highest heating temperature in the three layers is selected as the heating temperature;
thirdly, argon with the purity not lower than 90 percent is used for protection during heating, or the preparation is carried out in a vacuum environment with the pressure not higher than 0.01 Pa;
fourthly, when the coating is prepared, the pressurizing speed is less than 10 MPa/min when the heating temperature is lower than 500 ℃, and the heat preservation time is not less than 2 minutes after the required pressure intensity and temperature are reached; when the coating is prepared, the pressurizing speed is less than 5 MPa/min when the heating temperature is more than or equal to 500 ℃, and the heat preservation time is not less than 2 min after the required pressure intensity and temperature are reached;
fifthly, in the preparation process, the coating is taken out of the furnace after the temperature is lower than 100 ℃, and air or argon flow with the purity not lower than 90 percent is used during cooling or the coating is carried out in a vacuum environment with the pressure not higher than 0.01 Pa.
The preparation method of the external efficient heat dissipation coating for the mobile phone also meets one of the following requirements:
firstly, the substrate is an aluminum substrate with the thickness of 1mm, and the component of the external efficient heat dissipation coating of the mobile phone is Al; using Al powder with a nominal diameter of 40 μm, the total thickness of the powder before coating preparation was 150 μm;
when the vacuum pressure is 0.01Pa, the temperature is kept constant at 400 ℃ by using electric heating, the external pressure is 20MPa, and the pressurizing speed is 8 MPa/min; after the holding time is 3 minutes, the pressure is released, and the deposition is realized on the surface of the matrix to form an Al coating; cooling to 80 ℃ along with the furnace, discharging; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 10-13 percent and the heat conduction coefficient of 100-200W/mK;
secondly, the substrate is a copper substrate with the thickness of 0.2mm, and the external efficient heat dissipation coating of the mobile phone contains Al; al powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 80 mu m, the porosity of 30-36 percent and the heat conduction coefficient of 100-150W/mK;
thirdly, the substrate is an iron substrate with the thickness of 0.2 mm; the external efficient heat dissipation coating of the mobile phone comprises Al; al powder with a nominal diameter of 60 μm was used; the total thickness of the powder before the coating is prepared is 300 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 100 mu m, the porosity of 45-52 percent and the heat conduction coefficient of 100-200W/mK;
fourthly, the substrate is an aluminum substrate with the thickness of 1 mm; the component of the external efficient heat dissipation coating of the mobile phone is Cu; cu powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure at 30MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 70 mu m, the porosity of 8-11 percent and the heat conduction coefficient of 100-200W/mK;
fifthly, the substrate is an aluminum substrate with the thickness of 1 mm; the components of the external efficient heat dissipation coating of the mobile phone are Cu and Al; specifically, the method comprises the following steps: cu powder with a nominal diameter of 40 μm and Zn powder with a nominal diameter of 40 μm were used in a ratio of 1: 1 by mass ratio; the total thickness of the powder before the coating is prepared is 150 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure of 25MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form a Cu-Zn coating; finally obtaining a coating with the total thickness of 50 mu m, the porosity of 13-19 percent and the heat conduction coefficient of 150-300W/mK;
sixthly, coating mixed powder with a total thickness of 150 μm on an aluminum substrate with a thickness of 1 mm: cu and Zn powders with a nominal diameter of 40 μm were mixed in a ratio of 1.2: 1 by mass ratio;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 3 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form a Cu-Zn coating; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 25-30 percent and the heat conduction coefficient of 150-200W/mK;
seventhly, coating Al powder with the nominal diameter of 50 microns and the total thickness of 300 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 40MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 80 mu m, the porosity of 6-10 percent and the heat conduction coefficient of 100-200W/mK;
eighthly, coating Zn powder with the thickness of 500 microns and the nominal diameter of 80 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 250 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 10MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form a Zn coating; finally obtaining a coating with the total thickness of 200 mu m, the porosity of 25-30 percent and the heat conduction coefficient of 50-100W/mK;
coating 200-micron-thick Al powder with the nominal diameter of 40 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 10MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 45-50 percent and the heat conduction coefficient of 100-150W/mK;
coating 3400 mu m thick Al powder with the nominal diameter of 100 mu m on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, externally applying the pressure of 10MPa, pressurizing at the speed of 8 MPa/min, keeping the temperature for 3 min, then releasing the pressure, cooling to 80 ℃ along with the furnace, and discharging the aluminum substrate; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 950 mu m, the porosity of 45-50 percent and the heat conduction coefficient of 100-150W/mK;
eleven, coating 150 mu m thick Al powder with the nominal diameter of 20 mu m on an aluminum substrate with the thickness of 1mm, introducing argon with the purity of 95 percent, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 5-10 percent and the heat conduction coefficient of 100-200W/mK;
twelfth, coating 600 μm thick Cu powder with a nominal diameter of 80 μm on an aluminum substrate with a thickness of 1mm, introducing argon with a purity of 95%, keeping the temperature constant at 600 ℃ by using electric heating, applying a pressure of 30MPa, pressurizing at a rate of 4 MPa/min, maintaining for 4 min, then releasing the pressure, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally, the coating with the total thickness of 210 μm, the porosity of 22% -25%, and the heat conduction coefficient of 200-300W/mK is obtained.
The invention can use general metal or alloy powder to prepare coating with good performance, has little restriction on base material, low cost, good heat dissipation effect of the coating, and adjustable mechanical property and surface state; the comprehensive technical effect is good, and the predictable huge economic value and social value are achieved.
Drawings
The invention is described in further detail below with reference to the following figures and embodiments:
FIG. 1 is a photograph of a nominal metallic Cu powder morphology in accordance with the practice of the present invention;
FIG. 2 is a photograph of the morphology of metallic Al powders according to the present invention;
FIG. 3 is a photograph of the morphology of metallic Zn powder in accordance with the practice of the present invention;
FIG. 4 is a photograph of the morphology of a metallic Cu50-Zn50 alloy powder according to the invention;
FIG. 5 is one of the surfaces of a heat-dissipating coating made of metallic Cu powder;
FIG. 6 is one of the sections of a heat-dissipating coating made of metallic Cu powder;
FIG. 7 is one of the surfaces of a heat-dissipating coating made of metallic Al powder;
FIG. 8 is one of the sections of a heat-dissipating coating made of metallic Al powder;
FIG. 9 is one of the surfaces of a heat-dissipating coating made of metallic Cu-Zn powder;
FIG. 10 is one of the sections of a heat-dissipating coating made of metallic Cu-Zn powder;
FIG. 11 is a photograph of the surface of a heat-dissipating coating made of metallic Zn powder having a nominal diameter of 50 μm;
FIG. 12 is a photograph of the surface of a heat-dissipating coating made from a metal Al powder having a nominal diameter of 100 μm;
FIG. 13 is a photograph of the surface of a heat-dissipating coating prepared from a metal Cu powder having a nominal diameter of 100 μm;
FIG. 14 is a photograph of the surface of a heat-dissipating coating prepared from a metallic Zn powder having a nominal diameter of 200 μm;
FIG. 15 is a schematic diagram of a capillary force test using the dynamic height method;
fig. 16 shows the surface temperature of the mobile phone without using an external heat sink for the "fish tank test";
fig. 17 shows the surface temperature of a mobile phone using an external heat sink for the "fish tank test";
FIG. 18 shows the surface temperature of a mobile phone without an external heat sink for "game testing";
fig. 19 shows the surface temperature of a mobile phone using an external heat sink for "game testing".
Detailed Description
Explanation regarding the drawings:
fig. 15 is a schematic diagram of a capillary force test using the dynamic height method, and the related principle is explained as follows: after the coating is immersed in the cooling liquid, the cooling liquid can overcome the gravity and rise along the inner gap of the coating under the action of surface tension until the capillary force is balanced with the self gravity of the cooling liquid, and the rising is stopped.
The so-called "fish tank test" of fig. 16 and 17 refers to: running Microsoft fish tank test software, and keeping a screen normally bright for 30 minutes; respectively obtaining thermal imaging pictures;
the so-called "game test" of fig. 18 and 19 refers to: and (4) operating the top-quality galloping: heat tracing game 30 minutes later; the thermographic pictures obtained separately.
The following contents are embodiments of various external high-efficiency heat dissipation coatings of mobile phones and preparation methods of various external high-efficiency heat dissipation coatings of mobile phones:
example 1
The substrate is an aluminum substrate with the thickness of 1mm, and the external efficient heat dissipation coating of the mobile phone is Al; using Al powder with a nominal diameter of 40 μm, the total thickness of the powder before coating preparation was 150 μm;
when the vacuum pressure is 0.01Pa, the temperature is kept constant at 400 ℃ by using electric heating, the external pressure is 20MPa, and the pressurizing speed is 8 MPa/min; after the holding time is 3 minutes, the pressure is released, and the deposition is realized on the surface of the matrix to form an Al coating; cooling to 80 ℃ along with the furnace, discharging; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 10 percent and the heat conduction coefficient of 420W/mK;
an Oppo Find7 external mobile phone radiator is prepared by using the heat dissipation coating, and deionized water is used as a heat dissipation agent. In order to increase the load of the tester as much as possible, Microsoft fish tank test software is selected, fish tank test pages are opened respectively for mobile phones using and not using an external mobile phone radiator, the screen is kept constantly bright for 30 minutes, and then a thermal imaging picture is shot respectively by an FLIR MR265 infrared thermal imager. It can be seen that the temperature in the region under the earpiece in the front of the fuselage exceeds 40 c and the core of heat build-up reaches even 47 c. The functional keypad below the screen also exceeds 42 deg.c. The mobile phone using the heat dissipation coating device has the highest temperature of 31.5 ℃ no matter the front temperature is maintained at about 30 ℃, and does not obviously influence the running speed and the comfort of the mobile phone. The surface temperature of the mobile phone without using the external heat radiator and with using the external heat radiator is shown in fig. 16 and 17;
the mobile phone is used for operating 'best quality galloping': heat trace ", 30 minutes play time. The temperature in the area around the front earpiece of the fuselage approaches 40 c and the functional keypad exceeds 36 c. The mobile phone using the heat dissipation coating device has the highest temperature of 30.4 ℃ no matter the front temperature is maintained at about 30 ℃, and the operation speed and the comfort of the mobile phone are not obviously influenced. The surface temperature of the mobile phone without the external heat sink and with the external heat sink is shown in fig. 18 and fig. 19.
Example 2
The substrate is a copper substrate with a thickness of 0.2mm, using Al powder with a nominal diameter of 50 μm; the total thickness of the powder before the coating is prepared is 250 mu m; when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally, the coating with the total thickness of 80 mu m, the porosity of 36 percent and the heat conduction coefficient of 450W/mK is obtained.
Example 3
The substrate is an iron substrate with the thickness of 0.2 mm; the external efficient heat dissipation coating of the mobile phone comprises Al; al powder with a nominal diameter of 60 μm was used; the total thickness of the powder before the coating is prepared is 300 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally, a coating with a total thickness of 100 μm, a porosity of 50% and a thermal conductivity of 480W/mK is obtained.
Example 4
The substrate is an aluminum substrate with the thickness of 1 mm; cu powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure at 30MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally, a coating having a total thickness of 70 μm, a porosity of 11% and a thermal conductivity of 450W/mK is obtained.
Example 5
The substrate is an aluminum substrate with the thickness of 1 mm; the components of the external efficient heat dissipation coating of the mobile phone are Cu and Al; specifically, the method comprises the following steps: cu powder with a nominal diameter of 40 μm and Zn powder with a nominal diameter of 40 μm were used in a ratio of 1: 1 by mass ratio; the total thickness of the powder before the coating is prepared is 150 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure of 25MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form a Cu-Zn coating; finally, a coating having a total thickness of 50 μm, a porosity of 19% and a thermal conductivity of 400W/mK was obtained.
Example 6
The mixed powder was coated to a total thickness of 150 μm on a 1mm thick aluminum substrate: cu powder with nominal diameter of 20-40 μm and Zn powder with nominal diameter of 20-40 μm are mixed according to the weight ratio of 1.2: 1, specifically: cu and Zn powders with a nominal diameter of 40 μm were used in a ratio of 1.2: 1 by mass ratio;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 3 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form a Cu-Zn coating; finally, a coating with a total thickness of 60 μm, a porosity of 30% and a thermal conductivity of 420W/mK is obtained.
Example 7
Coating Al powder with the nominal diameter of 50 microns and the total thickness of 300 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 40MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with a furnace to be discharged; depositing on the surface of the substrate to form an Al coating; finally, a coating having a total thickness of 80 μm, a porosity of 8% and a thermal conductivity of 470W/mK is obtained.
Example 8
Coating Zn powder with the nominal diameter of 80 microns and the thickness of 500 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 250 ℃ by using electric heating when the vacuum pressure is 0.01Pa, externally applying the pressure of 10MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 minutes, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form a Zn coating; finally, a coating with a total thickness of 200 μm, a porosity of 28% and a thermal conductivity of 200W/mK is obtained.
Example 9
Coating Al powder with the nominal diameter of 20 microns and the thickness of 200 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 10MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with a furnace to be discharged; depositing on the surface of the substrate to form an Al coating; finally, a coating with a total thickness of 60 μm, a porosity of 48% and a thermal conductivity of 460W/mK is obtained.
Example 10
Coating 3400 mu m thick Al powder with the nominal diameter of 100 mu m on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, externally applying the pressure of 10MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping the temperature for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally, a coating with a total thickness of 950 μm, a porosity of 45% and a thermal conductivity of 430W/mK is obtained.
Example 11
Coating Al powder with the thickness of 150 microns and the nominal diameter of 20 microns on an aluminum substrate with the thickness of 1mm, introducing argon with the purity of 95 percent, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, relieving the pressure after keeping for 3 minutes, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally, the coating with the total thickness of 60 mu m, the porosity of 10 percent and the thermal conductivity of 420W/mK is obtained.
Example 12
Coating 600-micron-thick Cu powder with the nominal diameter of 80 microns on an aluminum substrate with the thickness of 1mm, introducing argon with the purity of 95%, keeping the temperature constant at 600 ℃ by using electric heating, applying the pressure at 30MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally, a coating with a total thickness of 210 μm, a porosity of 23% and a thermal conductivity of 450W/mK is obtained.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. The utility model provides an external high-efficient heat dissipation coating of cell-phone, its arranges on metal matrix which characterized in that:
the porosity of the external efficient heat dissipation coating of the mobile phone is 5-60%; the thickness is 50-1000 μm; the component of the alloy is one or the combination of three elements of Al, Cu and Zn.
2. The external high-efficiency heat-dissipation coating for the mobile phone as recited in claim 1, wherein: wherein the content of Zn by weight percent is not higher than 50 percent; the coating composition meets one of the following requirements:
firstly, when the weight percentage content of Al in the coating component is more than 90%, the rest components are Cu or Zn or the combination of the Cu and the Zn; when the weight percentage content of Cu is more than 90%, the rest components are Al or Zn or the combination of the Al and the Zn; the heat conduction coefficient of the coating is 100-300W/mK;
secondly, when the weight percentage content of Al in the coating components is 50-90%, the rest components are Cu or Zn or the combination of the Cu and the Zn; when the weight percentage content of Cu is 50-90%, the rest components are Al or Zn or the combination of the Al and the Zn; the thermal conductivity of the coating is 100-300W/mK.
3. The external high-efficiency heat-dissipation coating for the mobile phone according to claim 1 or 2, which is characterized in that: the external efficient heat dissipation coating for the mobile phone also meets one of the following requirements:
firstly, the porosity of the coating is 5-20%, the porosity is continuously improved along the depth direction after cooling water enters so as to accommodate more cooling media, and meanwhile, more cooling media are contacted with high-temperature parts; the porous coating is particularly suitable for the external radiating coating of the mobile phone with water as the cooling medium because of low porosity;
secondly, the porosity of the coating is 20-40%, the porosity of the cooling oil is continuously improved along the depth direction after entering so as to accommodate more cooling media, and meanwhile, more cooling media are contacted with high-temperature parts; the porosity is moderate, so that the coating is particularly suitable for an external heat dissipation coating of a mobile phone with oil as a cooling medium;
thirdly, the porosity of the coating is 40-60%, the porosity of the coating is continuously improved along the depth direction after air enters the external environment so as to accommodate more cooling media, and meanwhile, more cooling media are contacted with high-temperature parts; the porosity is high, the air fluidity is good, and the coating is particularly suitable for the external heat dissipation coating of the mobile phone with the air as the cooling medium.
4. The external high-efficiency heat-dissipation coating for the mobile phone as recited in claim 3, wherein: the external efficient heat dissipation coating for the mobile phone meets one of the following requirements:
firstly, the substrate is an aluminum substrate with the thickness of 1mm, and the component of the external efficient heat dissipation coating of the mobile phone is Al; using Al powder with a nominal diameter of 40 μm, the total thickness of the powder before coating preparation was 150 μm; preparing a coating with the total thickness of 60 mu m, wherein the porosity of the coating is 10-13%, and the heat conduction coefficient is 120-200W/mK;
secondly, the substrate is a copper substrate with the thickness of 0.2mm, and the component of the external efficient heat dissipation coating of the mobile phone is Al; al powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m; preparing a coating with the total thickness of 80 mu m; the porosity of the coating is 30-36%, and the heat conduction coefficient is 100-200W/mK;
thirdly, the substrate is an iron substrate with the thickness of 0.2mm, and the external efficient heat dissipation coating of the mobile phone contains Al; al powder with a nominal diameter of 60 μm was used; the total thickness of the powder before the coating is prepared is 300 mu m; preparing a coating with the total thickness of 100 mu m; the porosity of the coating is 45-52%, and the heat conduction coefficient is 100-;
fourthly, the substrate is an aluminum substrate with the thickness of 1mm, and the component of the external efficient heat dissipation coating of the mobile phone is Cu; cu powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m; preparing a coating with the total thickness of 70 mu m; the porosity of the coating is 8-11%, and the heat conduction coefficient is 100-;
fifthly, the substrate is an aluminum substrate with the thickness of 1mm, and the components of the high-efficiency heat dissipation coating arranged outside the mobile phone are Cu and Al; cu powder with a nominal diameter of 40 μm and Zn powder with a nominal diameter of 40 μm were used in a ratio of 1: 1 by mass ratio; the total thickness of the powder before the coating is prepared is 150 mu m; the prepared coating with the total thickness of 50 mu m; the porosity of the coating is 13-19%, and the heat conduction coefficient is 200-;
sixthly, the external efficient heat dissipation coating of the mobile phone comprises Cu and Zn; cu and Zn powders with a nominal diameter of 40 μm were used in a ratio of 1.2: 1, the total thickness of the powder before coating preparation is 150 mu m; preparing a coating with the thickness of 60 mu m, wherein the porosity of the coating is 25-30%, and the heat conduction coefficient is 200-300W/mK;
seventhly, the external efficient heat dissipation coating of the mobile phone comprises Al; the coating with the thickness of 80 mu m is prepared by using Al powder with the nominal diameter of 50 mu m and the total thickness of 300 mu m; the porosity of the coating is 6-10%, and the heat conduction coefficient is 100-;
the mobile phone external high-efficiency heat dissipation coating comprises Zn; zn powder with the nominal diameter of 80 mu m is used, the total thickness of the powder before coating is 500 mu m, and the obtained coating with the thickness of 200 mu m is prepared; the porosity of the coating is 25-30%, and the heat conduction coefficient is 50-100W/mK;
the component of the external efficient heat dissipation coating of the mobile phone is Al; the method comprises the steps of preparing a coating with the thickness of 60 mu m by using Al powder with the nominal diameter of 40 mu m and the total thickness of the powder before coating is 200 mu m; the porosity of the coating is 45-50%, and the heat conduction coefficient is 100-;
the mobile phone external efficient heat dissipation coating comprises Al; the Al powder with the nominal diameter of 50 mu m is used, and the total powder thickness before coating preparation is 3400 mu m; preparing the obtained 950-micron thick coating; the porosity of the coating is 45-50%, and the heat conduction coefficient is 100-;
eleven, the external efficient heat dissipation coating of the mobile phone comprises Al; the Al powder with the nominal diameter of 40 mu m is used, and the total thickness of the powder before coating preparation is 150 mu m; preparing the obtained coating with the thickness of 60 mu m; the porosity of the coating is 5-10%, and the heat conduction coefficient is 150-;
twelfth, the external efficient heat dissipation coating of the mobile phone comprises Cu; cu powder with the nominal diameter of 80 mu m is used, and the total thickness of the powder before coating is prepared is 600 mu m; preparing the obtained coating with the thickness of 210 mu m; the porosity of the coating is 22% -25%, and the heat conduction coefficient is 200-.
5. A preparation method of an external efficient heat dissipation coating of a mobile phone is characterized by comprising the following steps: the coating is prepared from metal powder which is one or a combination of the following elements: al, Cu, Zn; the nominal particle size of the metal powder used is 20-300 μm;
the preparation method of the external efficient heat dissipation coating for the mobile phone comprises the following steps: firstly, single element or mixture metal powder as raw material is placed on the surface of base material for manufacturing heat radiator, then the metal powder is combined with the surface of base material by heating and pressurizing under vacuum or protective atmosphere environment to form heat radiation coating.
6. The preparation method of the external high-efficiency heat dissipation coating for the mobile phone according to claim 5, characterized in that: the preparation method of the external efficient heat dissipation coating for the mobile phone also meets one or the combination of the following requirements:
firstly, the heating temperature of the mixed metal powder is 400-450 ℃ for Al powder, 600-650 ℃ for Cu powder, and the heating temperature of other mixed metal powder is the melting point temperature T of the highest melting point metal in the mixed metal powderFusion furnaceBased on the selection of 0.5TFusion furnaceAt the temperature of +50 ℃, the pressure intensity is 10-50MPa during preparation;
secondly, when the external efficient heat dissipation coating of the mobile phone is prepared, the components of the metal powder added in the coating can be single components of Al, Cu and Zn or the combination of the single components; when it is a certain combination of Al, Cu, Zn: the nominal diameters of the powder at the bottom layer, the middle layer and the outermost layer can be adjusted, and the highest heating temperature in the three layers is selected as the heating temperature;
thirdly, argon with the purity not lower than 90 percent is used for protection during heating, or the preparation is carried out in a vacuum environment with the pressure not higher than 0.01 Pa;
fourthly, when the coating is prepared, the pressurizing speed is less than 10 MPa/min when the heating temperature is lower than 500 ℃, and the heat preservation time is not less than 2 minutes after the required pressure intensity and temperature are reached; when the coating is prepared, the pressurizing speed is less than 5 MPa/min when the heating temperature is more than or equal to 500 ℃, and the heat preservation time is not less than 2 min after the required pressure intensity and temperature are reached;
fifthly, in the preparation process, the coating is taken out of the furnace after the temperature is lower than 100 ℃, and air or argon flow with the purity not lower than 90 percent is used during cooling or the coating is carried out in a vacuum environment with the pressure not higher than 0.01 Pa.
7. The preparation method of the external high-efficiency heat-dissipation coating for the mobile phone according to claim 5 or 6, characterized by comprising the following steps: the preparation method of the external efficient heat dissipation coating for the mobile phone also meets one of the following requirements:
firstly, the substrate is an aluminum substrate with the thickness of 1mm, and the component of the external efficient heat dissipation coating of the mobile phone is Al; using Al powder with a nominal diameter of 40 μm, the total thickness of the powder before coating preparation was 150 μm;
when the vacuum pressure is 0.01Pa, the temperature is kept constant at 400 ℃ by using electric heating, the external pressure is 20MPa, and the pressurizing speed is 8 MPa/min; after the holding time is 3 minutes, the pressure is released, and the deposition is realized on the surface of the matrix to form an Al coating; cooling to 80 ℃ along with the furnace, discharging; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 10-13 percent and the heat conduction coefficient of 100-200W/mK;
secondly, the substrate is a copper substrate with the thickness of 0.2mm, and the external efficient heat dissipation coating of the mobile phone contains Al; al powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 80 mu m, the porosity of 30-36 percent and the heat conduction coefficient of 100-150W/mK;
thirdly, the substrate is an iron substrate with the thickness of 0.2 mm; the external efficient heat dissipation coating of the mobile phone comprises Al; al powder with a nominal diameter of 60 μm was used; the total thickness of the powder before the coating is prepared is 300 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 100 mu m, the porosity of 45-52 percent and the heat conduction coefficient of 100-200W/mK;
fourthly, the substrate is an aluminum substrate with the thickness of 1 mm; the component of the external efficient heat dissipation coating of the mobile phone is Cu; cu powder with a nominal diameter of 50 μm was used; the total thickness of the powder before the coating is prepared is 250 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure at 30MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 70 mu m, the porosity of 8-11 percent and the heat conduction coefficient of 100-200W/mK;
fifthly, the substrate is an aluminum substrate with the thickness of 1 mm; the components of the external efficient heat dissipation coating of the mobile phone are Cu and Al; specifically, the method comprises the following steps: cu powder with a nominal diameter of 40 μm and Zn powder with a nominal diameter of 40 μm were used in a ratio of 1: 1 by mass ratio; the total thickness of the powder before the coating is prepared is 150 mu m;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure of 25MPa, pressurizing at the speed of 4 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form a Cu-Zn coating; finally obtaining a coating with the total thickness of 50 mu m, the porosity of 13-19 percent and the heat conduction coefficient of 150-300W/mK;
sixthly, coating mixed powder with a total thickness of 150 μm on an aluminum substrate with a thickness of 1 mm: cu and Zn powders with a nominal diameter of 40 μm were mixed in a ratio of 1.2: 1 by mass ratio;
when the vacuumizing pressure is 0.01Pa, keeping the temperature constant at 600 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 3 MPa/min, releasing the pressure after keeping for 4 min, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form a Cu-Zn coating; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 25-30 percent and the heat conduction coefficient of 150-200W/mK;
seventhly, coating Al powder with the nominal diameter of 50 microns and the total thickness of 300 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 40MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 80 mu m, the porosity of 6-10 percent and the heat conduction coefficient of 100-200W/mK;
eighthly, coating Zn powder with the thickness of 500 microns and the nominal diameter of 80 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 250 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 10MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form a Zn coating; finally obtaining a coating with the total thickness of 200 mu m, the porosity of 25-30 percent and the heat conduction coefficient of 50-100W/mK;
coating 200-micron-thick Al powder with the nominal diameter of 40 microns on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, keeping the external pressure at 10MPa, pressurizing at the speed of 8 MPa/min, releasing pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 45-50 percent and the heat conduction coefficient of 100-150W/mK;
coating 3400 mu m thick Al powder with the nominal diameter of 100 mu m on an aluminum substrate with the thickness of 1mm, keeping the temperature constant at 400 ℃ by using electric heating when the vacuum pressure is 0.01Pa, externally applying the pressure of 10MPa, pressurizing at the speed of 8 MPa/min, keeping the temperature for 3 min, then releasing the pressure, cooling to 80 ℃ along with the furnace, and discharging the aluminum substrate; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 950 mu m, the porosity of 45-50 percent and the heat conduction coefficient of 100-150W/mK;
eleven, coating 150 mu m thick Al powder with the nominal diameter of 20 mu m on an aluminum substrate with the thickness of 1mm, introducing argon with the purity of 95 percent, keeping the temperature constant at 400 ℃ by using electric heating, externally applying the pressure of 20MPa, pressurizing at the speed of 8 MPa/min, releasing the pressure after keeping for 3 min, and cooling to 80 ℃ along with the furnace to discharge; depositing on the surface of the substrate to form an Al coating; finally obtaining a coating with the total thickness of 60 mu m, the porosity of 5-10 percent and the heat conduction coefficient of 100-200W/mK;
twelfth, coating 600 μm thick Cu powder with a nominal diameter of 80 μm on an aluminum substrate with a thickness of 1mm, introducing argon with a purity of 95%, keeping the temperature constant at 600 ℃ by using electric heating, applying a pressure of 30MPa, pressurizing at a rate of 4 MPa/min, maintaining for 4 min, then releasing the pressure, cooling to 80 ℃ along with the furnace, and discharging; depositing on the surface of the substrate to form an Al coating; finally obtaining the coating with the total thickness of 210 μm, the porosity of 22-25 percent and the heat conduction coefficient of 200-300W/mK.
CN202111533251.2A 2021-12-15 2021-12-15 External efficient heat dissipation coating for mobile phone and preparation method thereof Pending CN114481117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111533251.2A CN114481117A (en) 2021-12-15 2021-12-15 External efficient heat dissipation coating for mobile phone and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111533251.2A CN114481117A (en) 2021-12-15 2021-12-15 External efficient heat dissipation coating for mobile phone and preparation method thereof

Publications (1)

Publication Number Publication Date
CN114481117A true CN114481117A (en) 2022-05-13

Family

ID=81494131

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111533251.2A Pending CN114481117A (en) 2021-12-15 2021-12-15 External efficient heat dissipation coating for mobile phone and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114481117A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11304381A (en) * 1998-04-23 1999-11-05 Fujikura Ltd Heat pipe
JP2009079766A (en) * 2008-10-27 2009-04-16 Ntn Corp Multilayer bearing manufacturing method
CN107197612A (en) * 2017-07-10 2017-09-22 广州华钻电子科技有限公司 A kind of Superhydrophilic soaking plate
CN112846194A (en) * 2021-01-20 2021-05-28 南昌欧菲显示科技有限公司 Surface treatment of vapor chamber, method of processing vapor chamber, and electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11304381A (en) * 1998-04-23 1999-11-05 Fujikura Ltd Heat pipe
JP2009079766A (en) * 2008-10-27 2009-04-16 Ntn Corp Multilayer bearing manufacturing method
CN107197612A (en) * 2017-07-10 2017-09-22 广州华钻电子科技有限公司 A kind of Superhydrophilic soaking plate
CN112846194A (en) * 2021-01-20 2021-05-28 南昌欧菲显示科技有限公司 Surface treatment of vapor chamber, method of processing vapor chamber, and electronic device

Similar Documents

Publication Publication Date Title
TWI818134B (en) Phase change heat sink
CN107649688B (en) A kind of the diamond heat-conducting composite material and preparation method and application of easy processing
US20070089860A1 (en) Heat pipe with sintered powder wick
WO1998019859A9 (en) Super conducting heat transfer medium
EP2296908A2 (en) Porous structured thermal transfer article
CN104630527B (en) A kind of method preparing copper base diamond composite
CN104776740A (en) Method for preparing high-efficiency micro heat tube by combining copper powder with copper oxide powder
CN107892576B (en) Silicon carbide ceramic and preparation method thereof, and radiating fin and application thereof
CN108925108A (en) The conductive structure and its manufacturing method of aluminium alloy are inlayed in a kind of graphene-based composite substrate
CN110804735B (en) Heat conduction radiation heat dissipation composite coating suitable for titanium alloy
WO2018218943A1 (en) Method for enhancing boiling performance of chip surface
CN105400977A (en) Preparing method for aluminum base silicon carbide
CN109959288A (en) A kind of compound soaking plate of phase-change thermal storage and preparation method thereof
CN104625077A (en) High-heat-conduction diamond/copper composite material and manufacturing method of high-heat-conduction diamond/copper composite material
CN113758325B (en) VC radiator with built-in copper/diamond sintered liquid suction core and preparation method thereof
CN203719484U (en) Soaking plate based on artificial graphite film
CN100453953C (en) Heat pipe and its making process
CN113441718A (en) Preparation method of capillary core of aluminum VC vapor chamber
TWI743945B (en) Thin vapor chamber wick structure element and manufacturing method thereof
CN1869574B (en) Radiator
CN114481117A (en) External efficient heat dissipation coating for mobile phone and preparation method thereof
TW201350781A (en) High efficiency vapor chamber
CN206061407U (en) Liquid-cooled heat-pipe radiator
CN105263297B (en) Laser heat-proof device
CN103344141A (en) Heat pipe heating device, heat pipe heat dissipation method and superconduction liquid

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination