CN107649688B - A kind of the diamond heat-conducting composite material and preparation method and application of easy processing - Google Patents
A kind of the diamond heat-conducting composite material and preparation method and application of easy processing Download PDFInfo
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- CN107649688B CN107649688B CN201710719298.5A CN201710719298A CN107649688B CN 107649688 B CN107649688 B CN 107649688B CN 201710719298 A CN201710719298 A CN 201710719298A CN 107649688 B CN107649688 B CN 107649688B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
Abstract
The present invention relates to a kind of diamond heat-conducting composite material and preparation method of easy processing and applications.The composite material includes sheet metal matrix and the diamond particles for being distributed in described matrix inside and/or surface, and part of or whole diamond particles are incorporated into the metallic matrix by diamond surface silicon carbide-silicon boron composite coating.The preparation method is simple, is particularly suitable for large-scale promotion.The thermal conductivity and good working ability that composite material has superelevation are prepared using this method, and composite property homogeneity, stability are good.
Description
Technical field
The invention belongs to diamond techniques fields, a kind of diamond heat-conducting composite material more particularly, to easy processing and its
Preparation method and application.
Background technique
The stable operation of the high-power high hot-fluid device of country's Military and civil fields all suffers from package substrate material heat-sinking capability at present
Insufficient problem, largely affects the performances such as the reliability, efficiency, service life of electronic component.As electronic component is run
Power is increasing, and thermal technology's management becomes particularly important, or even as the bottleneck problem of high-power electronic device development.And it is current
The materials such as general aluminium, copper, Al/SiC, Cu/W are no longer satisfied the demand of high-power electronic device.
The thermal conductivity of high-quality single-crystal diamond not only can reach 2000W/mK, and the also low, thermal expansion with dielectric constant
Low series of advantages of coefficient etc., but diamond and its composite material are restricted at this stage in the master of highly heat-conductive material field fast development
Reason is wanted to be that diamond and its composite processing are at high cost, and existing diamond-metallic composite technique is difficult to protect
Demonstrate,prove large dimond-metal-base composites performance homogeneity and stability.
Diamond heat-conducting composite material, that is, high heat-conductive diamond-metallic composite difficult point of preparation easy processing mainly exists
In: the wetability of diamond and copper is very poor, generates this deliquescent brittlement phase of Al4C3 with easily reacting under aluminium high temperature.At this stage
Although improving the combination of diamond and metal at high temperature by introducing alloy or bortz powder body surface surface treatment in a metal
Intensity, but for caused heat conductivity Changeement is not deep enough during improving the two bond strength and lacks
Stable process for producing.In addition the processing of high heat-conductive diamond-metallic composite is also to hinder the composite material industry
An important factor for changing application, relatively high processing cost seriously constrains the commercialization process of the composite material.And with list
The production cost of diamond constantly reduces, and the size and quality of diamond constantly increase, diamond-metal-base composites
Manufacturing cost also constantly reduces, and what unique needs overcame is the difficult processing characteristics of diamond composite.Therefore, this field is badly in need of
Develop a kind of easy processing, high uniformly dispersed high heat-conductive diamond heat-conductive composite material.
Currently, high heat-conductive diamond-metal-base composites preparation process mainly uses powder metallurgy or Pressure Infiltration
Technique, be absorbed in heat conductivity raising and thermal expansion coefficient it is controllable, but to composite material subsequent machining technology close
Infuse it is less, and powder metallurgy and Pressure Infiltration technique preparation composite material when size require it is larger when, the uniformity of material
With stability it is difficult to ensure that.
Diamond-metal-base composites is the research hotspot of electronic package material of new generation, and core is both at home and abroad at present
The heating conduction of material is improved, main Research Thinking is that increase diamond particle content and improvement diamond particles/copper are compound
Interface achieves preferable effect.However, the diamond particles (thermal conductivity 1800-2200W/mK) in such composite construction
Like many by metal (Cu:398W/mK；Al:220W/mK) the thermally conductive isolated island connected, had both increased two-phase interface quantity,
The raw synergistic effect of difficult labour, the heating conduction for keeping diamond excellent are difficult to give full play to again.
CN 105779805A selects easily prepared and seamless connection foam metal or foamed ceramics or foam carbon skeleton
As substrate, high heat-conductive diamond film layer is prepared on its surface using chemical vapour deposition technique, constructs high heat-conductive diamond
Three-dimensional network skeleton, then it is compound with metallic matrix, so that high heat-conductive diamond and metal is formed doubly-linked and leads to three-dimensional network interpenetrating
Structure makes reinforced phase mutually all keep continuously distributed in space with matrix, constitutes continuous passage of heat, and generation is parallel thermally conductive,
To weaken negative effect of the compound interface to material thermal property, reinforced phase can be made to give full play to as a whole thermally conductive
Efficiency, and the good plasticity and toughness of metallic matrix in the composite are not reduced.High thermal conductive diamond mountain flour, stone can also be added simultaneously
One of high heat-conducting ceramic particle such as SiC, AlN of black alkene, carbon nanotube or reduction thermal expansion coefficient etc. or a variety of, realize heat
Learn the further promotion with mechanical property.
CN105818476 discloses a kind of surface modified 3 D network carbon fibre reinforced composite and preparation method, root
According to the three-dimensional carbon fiber skeleton of demand establishment different pore size, received after surface preparation by chemical vapour deposition diamond, carbon
Mitron, graphene, then compound with basis material, basis material is metal or polymer, obtains and has three-dimensional netted skeleton knot
The carbon fiber reinforced metal base or polymer matrix composite of structure.Surface-modified three-dimensional netlike carbon fiber is in the composite
Three-dimensional continuous passage of heat is formd, greatly improves the heating conduction of composite material, at the same time, carbon fiber is in matrix material
Spatial distribution in material can also play the mechanical property for improving composite material, reduce the function of its density and thermal expansion coefficient.Together
When can also by be added zero dimension reinforced particulate regulate and control its thermal expansion coefficient and mechanics, thermal property.
CN105112754B improves the thermal conductivity of composite material, CN using the three-dimensional connection network structure for forming diamond
105220049B improves the thermal conductivity of composite material using the connection of diamond lamella is formed.
CN105774130A forms metal/non-metal complex/metal sandwich structure and improves the airtight of Heat Conduction Material
Property.
The emphasis of above-mentioned patent all concentrates in terms of improving the material properties such as thermal conductivity, the air-tightness of composite material, and right
Subsequent composite material machinability concern it is less, the performance uniformity of large-sized composite material sample is also paid close attention to it is less, it is right
High-heat-conductive composite material properties of sample it is repeatable under also concern it is inadequate.
Summary of the invention
The present invention is in view of the above-mentioned problems, propose to prepare at the beginning of prepared by composite material with regard to the method for consideration processing technology
Heat conductivity is high, easy processing and when composite gauge is larger, the uniform performance of composite material is guaranteed, from
And the stability of its performance is also easy to get guarantee.The present invention mainly under the premise of guaranteeing superelevation thermal conductivity, guarantees composite wood
Repeatability in the excellent processability of material, the uniformity of sample and production preparation process.
Technical solution of the present invention are as follows:
A kind of diamond heat-conducting composite material of easy processing, the composite material include metallic matrix and are distributed in institute
The diamond particles on intrinsic silicon and/or surface are stated, part of or whole diamond particles pass through diamond surface carbon
SiClx-silicon boron composite coating is incorporated into the metallic matrix；
The thermal conductivity of the composite material is 600 ~ 1800W/mK；Thermal expansion coefficient is≤15ppm/K；The composite wood
Expect easy processing.Diamond heat-conducting composite material, that is, diamond-metallic composite of easy processing has easy processing, height evenly dispersed
Property and higher thermal conductivity
Preferably, the metallic matrix includes copper or aluminium or its alloy.
It is further preferred that the diamond particles are graininess single-crystal diamond, at least two direction of diamond
Size is >=500 μm；The diamond particles are platy-monocrystal diamond, and diamond size is long and is wider than 1mm.
A kind of preparation method of the diamond heat-conducting composite material of easy processing, the described method comprises the following steps:
(1) diamond particle surfaces coating treatment: diamond particle surfaces growth in situ silicon carbide-silicon boron composite coating,
To form diamond-silicon carbide-silicon boron complex；
(2) diamond-metal matrix composite materials preparation: hole and groove are processed on metallic matrix, described
The position of groove is selectively put into the metal base alloy powder of channel volume 1/3, is then paved with scraper, injects alcohol,
Then the diamond-silicon carbide-silicon boron complex obtained through step 1) is put into hole；Metallic matrix after the treatment
The metal mesh in 1.5 times or so apertures of metal base alloy powder size is placed in top, continues the Metal Substrate for being sprinkled with channel volume 1/6
Material alloy powder is prepared so that the holding of metal base alloy powder is put into corresponding agglomerating plant after being uniformly distributed together with mold,
Obtain final diamond-metal-base composites；
The hole centainly arranged is processed in sheet metal, certain gap is left between hole and hole, at this
Certain groove is processed in gap, Hole is mainly used for the placement of subsequent diamond-silicon carbide-silicon boron complex, groove
It is subsequent that metal alloy powder can be added, more apparent processing channel is formed after sintering, to utilize following process；
(3) diamond-metal-base composites is obtained to the step (2) and carries out hot isostatic pressing；Improve composite material
Relative density；
Complete the preparation of the diamond heat-conducting composite material of easy processing.
It is further preferred that the silicon carbide-silicon boron coating layer thickness is 0.01-5 μm.
Preferably, the step 1) specifically includes the following steps:
(1.1) according to thermal conductivity demand, the diamond of suitable dimension size is selected, and selects to include diamond particles, silicon
The mixture of powder, boron amorphous powder and calcium chloride；
(1.2) in a vacuum or in the reducing atmosphere of hydrogen or the reproducibility gas of the combination gas of hydrogen and argon gas
In atmosphere, in inert atmosphere, the mixture of step (1.1) is subjected to heating reaction, so that it is multiple to form diamond-silicon carbide-silicon boron
It is fit.
It is further preferred that the step (1.2) heats reaction condition are as follows: 1100 ~ 1350 DEG C of temperature, pressure < 10- 1Pa, the time 30 ~ 180 minutes.
It is further preferred that when diamond-metal matrix composite materials, metallic matrix material is aluminium, the step
(1.2) heating condition are as follows: 1100 ~ 1150 DEG C of temperature, pressure < 10-1Pa, the time 30 ~ 90 minutes.
It is further preferred that preferably, when diamond-metal matrix composite materials, metallic matrix material is copper,
The heating condition of the step (1.2) are as follows: 1150 ~ 1350 DEG C of temperature, pressure < 10-1Pa, the time 30 ~ 180 minutes.
It is further preferred that the mixture includes the following components according to poidometer in the step (1.1): gold
30 ~ 50 parts of hard rock；30 ~ 50 parts of calcium chloride；10 ~ 20 parts of silicon powder；1 ~ 10 part of boron amorphous powder.
Most preferably, the mixture includes the following components according to poidometer: 40 ~ 45 parts of diamond；Calcium chloride 40 ~ 45
Part；10 ~ 15 parts of silicon powder；1 ~ 5 part of boron amorphous powder.
Preferably, step (2) hole size is 1.1 ~ 1.5 times of diamond-silicon carbide-silicon boron complex size big
It is small.
Preferably, in step (2) diamond-metal matrix composite materials preparation, when metal is aluminium, diamond-aluminium
The preparation condition of composite material are as follows: 550 ~ 750 DEG C of temperature, 10 ~ 100MPa of pressure；
In step (2) diamond-metal matrix composite materials preparation, when metal is copper, diamond-copper composite material
Preparation condition are as follows: 950 ~ 1200 DEG C of temperature, 10 ~ 100MPa of pressure.Metal-powder, diamond, metal are placed in metallic matrix
After net, sintering can be laminated, prepare final diamond-metal matrix composite materials.Metal mesh material includes copper or aluminium.
Preferably, in the step (2), by the total weight of diamond-silicon carbide-silicon silicon boron complex and metallic matrix
It calculates, the mass fraction of metallic matrix is 10 ~ 90wt%；Preferably 30 ~ 80wt% or 50 ~ 80wt%；
Preferably, in step (3) diamond-metal matrix composite materials preparation, when metal is aluminium, hot isostatic pressing work
Skill parameter are as follows: 600 ~ 640 DEG C of temperature, 80 ~ 120MPa of pressure；
In step (3) diamond-metal matrix composite materials preparation, when metal is copper, heat and other static pressuring processes parameter
Are as follows: 960 ~ 1020 DEG C of temperature, 80 ~ 120MPa of pressure.
A kind of product, the product are the diamond heat-conducting composite materials of the easy processing prepared by the method.
The diamond heat-conducting of the diamond heat-conducting composite material of the easy processing or the easy processing of method preparation
Composite material expands hot plate for high-heat-conductive composite material or packaging heat sink uses.
The invention has the advantages that:
1, the technology of the present invention is stayed in advance and is added using the position for designing diamond particles placement on sheet metal in advance
Station is set, and prepares diamond-metal matrix composite materials using the diamond after coating.With existing diamond-metallic matrix
Composite material material and production technology, which are compared, to be had the advantages that
(1) pre-designed diamond particles, which are placed, can be good at guaranteeing diamond in a metal evenly dispersed
Property, substantially increase the homogeneity of large dimond enhancing metal matrix composite materials performance；Pre-designed machining position
It sets, so that subsequent machining technology is simple, equipment is simple, and processing cost is low, high-efficient；
(2) diamond powder surface plating silicon carbide and silicon-boron coating are used, surface covering thickness can effectively be avoided to increase
Add bring diamond-metallic composite interface thermal conductivity feature jumpy, effectively reduces powder surface and apply thickness
Spend the influence degree to heat conductivity.
(3) using diamond heat-conducting composite material, that is, diamond-metallic matrix composite wood of the easy processing of this method preparation
Continuity of the metal on three-dimensional is apparent in material, and the mechanical property and heat conductivity of composite material has been effectively ensured
Energy；Additionally, due to metallic continuity, it need to only guarantee good cause under diamond and its near zone high temperature during the preparation process
Close characteristic, composite material can be obtained very high consistency, and required impressed pressure is not required to too high during being prepared, very
To pressureless sintering may be implemented.
(4) since impressed pressure is without too high, using diamond-metal matrix composite materials prepared by the present invention to hot pressing
Requirement in the process in terms of equipment pressure is smaller, and manufacturing equipment cost substantially reduces.Simultaneously as the requirement to pressure is smaller, one
As under the conditions of can with or larger size composite sample.
2, diamond particles are by surface coated treatment step, and diamond particle surfaces generate silicon carbide and silicon boron is compound
Coating, not only increases the bond strength between diamond and copper, and interface thermal conductivity also dramatically increases.It is mainly reflected in silicon carbide
The thermal conductivity of this carbide is higher than general carbide (such as boron carbide), and on the other hand, in general diamond surface is carbonized
Each diamond surface coating layer thickness in salt bath process is difficult to keep consistent to silicon with silicon coating thickness, and the addition of boron element first can
Effectively control diamond surface silicon coating thickness, and it is subsequent prepare diamond-copper composite material during, boron copper high temperature
Under lesser mutual solubility can prevent diamond surface element silicon and copper dissolving each other under long period high temperature, to prevent gold
The peeling of hard rock surface carborundum-silicon coating, is effectively guaranteed the interface cohesion integrality of composite material.
The diamond heat-conducting composite material of easy processing of the present invention has high thermal conductivity, uniform with diamond distribution,
Composite material characteristic easy to process.This composite material include metallic matrix body and be distributed in inside the extraction and/or
The diamond particles on surface, the wherein at least part or all of diamond are incorporated into the gold by surface carborundum and silicon boron
Belong to matrix, and the distribution of diamond and subsequent Working position have designed determination before composite material preparation, so that should
Composite material has many advantages, such as high heat conductance, area uniformity, easy processing.
And had been surprisingly found that during studying plating process, on the one hand the addition of boron amorphous powder can substantially reduce salt bath plated
The heterogeneity of diamond powder surface thickness of coating in journey, the addition of another aspect boron amorphous powder is to subsequent diamond and metal
The interface bond strength and diamond-copper composite material thermal conductivity of copper significantly improve.The third aspect is preparing diamond-aluminium
When with diamond-copper composite material, the temperature of diamond particle surfaces coating treatment has different, main reason is that practical
In treatment process, higher than 1100 DEG C after silicon and boron begin with certain solid solution, but solid solubility is not high, can be ignored, and boron mainly rises point
Every the effect of silicon and diamond, meet the relatively thin effect of interfacial thickness between diamond and aluminium；When temperature is higher than 1150 DEG C, boron
It is promoted with the solid solubility of silicon, and achievees the effect that between diamond and copper interface copper less dissolution silicon at high temperature.
3, the density difference of diamond and copper is too big, during preparing large-sized diamond-copper composite material, one
As preparation method such as conventional powder metallurgical, pressure infiltration be difficult to prepare the diamond-copper composite material of stable homogeneous, and lead to
The design of metallic copper plate reserving hole is crossed, distribution of the diamond in metallic copper can be controlled well.
4, since the hardness of diamond is larger in diamond-copper composite material sample, it is difficult in the processing of subsequent sample
It is solved with general mechanical processing tools, processing technology is complicated at this stage, processing cost is larger；And by being reserved in sheet metal
The design of Working position can process the composite material using the technique for processing copper material at this stage, and processing cost substantially reduces, and adds
Work simple process.
5, it is also equipped with while 1800W/mK may being up to using diamond-copper composite material thermal conductivity prepared by this technique
Certain intensity and mechanical property.
6, the present invention provides a kind of diamond-metallic composites, and heat conductivity height, thermal expansion coefficient can
Control, compactness is good, uniformity is good and easy processing, manufactures low with processing cost.Have in terms of heat dissipation and electronic component exploitation
Broad application prospect.
7, the present invention also provides a kind of preparation method of the diamond heat-conducting composite material of easy processing, this method technique letters
It is single, conveniently, economic cost it is low, be suitble to industrialization.
Detailed description of the invention
Fig. 1 is the schematic diagram of composite material prepared by the present invention, it can be seen that diamond distribution is in the position being previously set
Set and for subsequent reservation Working position.
Fig. 2 is the shape 1 that may finally be comparatively fast processed using composite material prepared by the present invention；
Fig. 3 is the shape 2 that may finally be comparatively fast processed using composite material prepared by the present invention.
Fig. 4 is using the actual machining shape of composite material prepared by the present invention.
Specific embodiment
Below with reference to embodiment, the invention will be further described, but the scope of protection of present invention is not limited to implement
The range of example statement.
The diamond heat-conducting composite material of easy processing of the present invention has high thermal conductivity, uniform with diamond distribution,
Composite material characteristic easy to process.This composite material includes metallic matrix and is distributed in inside the extraction and/or table
The diamond particles in face, the wherein at least part or all of diamond are incorporated into the metal by surface carborundum and silicon boron
Matrix, and the distribution of diamond and subsequent Working position have designed determination before composite material preparation, so that this is multiple
Condensation material has many advantages, such as high heat conductance, area uniformity, easy processing.
And had been surprisingly found that during studying plating process, on the one hand the addition of boron amorphous powder can substantially reduce salt bath plated
The heterogeneity of diamond powder surface thickness of coating in journey, the addition of another aspect boron amorphous powder is to subsequent diamond and metal
The interface bond strength and diamond-copper composite material thermal conductivity of copper significantly improve.The third aspect is preparing diamond-aluminium
When with diamond-copper composite material, the temperature of diamond particle surfaces coating treatment has different, main reason is that practical
In treatment process, higher than 1100 DEG C after silicon and boron begin with certain solid solution, but solid solubility is not high, can be ignored, and boron mainly rises point
Every the effect of silicon and diamond, meet the relatively thin effect of interfacial thickness between diamond and aluminium；When temperature is higher than 1150 DEG C, boron
It is promoted with the solid solubility of silicon, and achievees the effect that between diamond and copper interface copper less dissolution silicon at high temperature.
Metallic matrix
As used herein, the metallic matrix include: the higher metallic matrix of the thermal conductivities such as Copper substrate, aluminum substrate or its
Alloy.And it is distributed on metallic matrix plate and realizes the blind hole hole processed and groove.
Metal-powder
As used herein, the metallic matrix include: the higher metal-powder of the thermal conductivities such as Copper substrate, aluminum substrate or its
Alloy.
Diamond-silicon carbide-silicon boron complex
Diamond-silicon carbide-silicon complex of the invention includes diamond particles and combines (passing through chemical bonds)
In the silicon carbide and silicon boron composite coating of the diamond particle surfaces.
Silicon carbide-silicon boron composite coating
As used herein, diamond surface coating of the invention includes: silicon carbide and silicon boron composite coating.
Preferably, diamond surface coating of the invention have the feature that (1) 1 ~ 10000nm(of surface covering thickness compared with
It goodly is 200 ~ 2000nm；It is more preferably 200 ~ 1000nm).
Diamond particles
Diamond particles used in the present invention are to provide the substrate of silicon carbide and silicon boron composite coating growth of the present invention, simultaneously
It is also highly thermally conductive reinforcement.
Diamond particles of the invention, which have, to be clearly required.The diamond particles are graininess single crystal diamond
Stone, diamond partial size are >=500 μm；Or be platy-monocrystal diamond, diamond size to the youthful and the elderly and it is wider than 1mm；
Diamond-metal matrix composite materials
Diamond-metallic composite of the invention, wherein the composite material includes metallic matrix and is distributed in
Inside the metallic matrix and/or surface presets the diamond particles of good position, the wherein at least part or all of gold
Hard rock particle is incorporated into the metallic matrix by silicon carbide and silicon boron composite coating.
Preferably, the diamond-metal matrix composite materials have following one or more features :(a) thermal conductivity is
600 ~ 1800W/mK(is preferably 1000 ~ 1600W/mK；It is more preferably 1200 ~ 1500W/mK)；
(b) thermal expansion coefficient be≤15ppm/K(is preferably 4 ~ 12ppm/K；It is more preferably 6 ~ 8ppm/K)；(c) easily add
Work；(d) diamond distribution is uniform.
Preferably, by taking sheet diamond-aluminium composite material as an example, the diamond surface passes through silicon carbide and silicon boron
After composite coating, it is chemically bonded in aluminum substrate.General diamond surface compound coat thickness is multiple to diamond reinforced metal-base
Condensation material calorifics and Effect on Mechanical Properties are larger, but pass through in theoretical calculation and actual fabrication process it was found that diamond powder
It is smaller therefore diamond intensified that the variation of surface carborundum and silicon boron composite coating thickness influences amplitude to heat conductivity
Select diamond powder surface coating silicon carbide and silicon boron composite coating compound to improve in strong aluminum matrix composite preparation process
Material interface bond strength.In addition, being reserved with 1 ~ 1.5 times of corresponding sheet diamond in pre-designed metallic aluminium plate
The hole and processing groove of size, substantially increase the distributing homogeneity of diamond lamella and reduce following process difficulty.
Preparation method
The present invention provides a kind of preparation methods of the diamond heat-conducting composite material of easy processing, preferably the method packet
Include following steps:
(1) diamond particle surfaces coating treatment step:
Silicon carbide and silicon-boron coating are grown in diamond particle surfaces, so that it is compound to form diamond-silicon carbide-silicon boron
Body；
Preferably, the step (1) includes:
(1.1) according to thermal conductivity demand, the diamond of suitable dimension size is selected, and providing includes diamond particles, silicon
The mixture of powder, boron amorphous powder and calcium chloride；
(1.2) in a vacuum or hydrogen, argon gas, or combinations thereof gas reducing atmosphere or inert atmosphere in, will walk
Suddenly the mixture of (1.1) carries out heating reaction, to form diamond-silicon carbide-silicon boron complex.
In above-mentioned heating reaction, the heating reaction is preferably carried out at 1100 ~ 1350 DEG C；The heating is anti-
It should be preferably 10 in pressure-1Pa or less carry out；The heating reaction time is preferably at 30 ~ 180 minutes；
In another preferred example, it in the step (1.1), is calculated by total weight of the mixture, the mass fraction of diamond is
30~50wt%；Preferably 40 ~ 45wt%；
In another preferred example, it in the step (1.1), is calculated by total weight of the mixture, the mass fraction of calcium chloride is
30~50wt%；Preferably 40 ~ 45wt%；
In another preferred example, it in the step (1.1), being calculated by total weight of the mixture, the mass fraction of silicon powder is 10 ~
20wt%；Preferably 10 ~ 15wt%；
In another preferred example, it in the step (1.1), is calculated by total weight of the mixture, the mass fraction of boron amorphous powder
For 1 ~ 10wt%；Preferably 1 ~ 5wt%.
(1) diamond-metallic composite preparation step:
(2.1) certain hole and groove are processed on sheet metal；
(2.2) position of the hole described in step (2.1) and groove is selectively put into a certain amount of metal-powder,
Then it is paved with scraper, injects alcohol, then the diamond sheet body after coating is put into rectangular hole；After the treatment
The metal mesh that certain pore size is placed above copper sheet material, continues to be sprinkled with certain metal-powder, so that metal-powder keeps uniformly dividing
Cloth；Above-mentioned diamond powder, plate are put into corresponding mould together with mold and are prepared, final diamond-metallic matrix is obtained
Composite material.
Preferably, step (2.1) the Hole size is 1.1 ~ 1.5 times of sizes of diamond size；
Preferably, in the step (2.2), diamond-aluminium composite material preparation temperature is 550 ~ 750 DEG C, and pressure exists
10~100MPa；The preparation temperature of diamond-copper composite material is 950 ~ 1200 DEG C, and pressure is in 10 ~ 100MPa；
Preferably, in the step (2.2), by the total weight of diamond-silicon carbide-silicon silicon boron complex and metallic matrix
It calculates, the mass fraction of metallic matrix is 10 ~ 90wt%；Preferably 30 ~ 80wt% or 50 ~ 80wt%；
Capital equipment used in this method is cheap, is easy to get, using general hot-press equipment or Pressure Infiltration equipment,
Such as: hot pressing furnace, discharge plasma sintering furnace etc..
The preparation method of the diamond heat-conducting composite material of easy processing provided by the invention is by sheet metal preprocessing, Buddha's warrior attendant
Mountain flour surface modification combines with the preparation of super-high heat-conductive composite material, by adjusting hole distribution, Buddha's warrior attendant on sheet metal
Stone granular size, diamond particle surfaces coating composition, significantly improve the thermal conductivity of diamond reinforced metal-base composite material,
And composite processing difficulty obtained is small.
Now by taking diamond-copper composite material as an example, illustrating preparation method of the invention mainly includes following advantage:
(1) diamond particles are by surface coated treatment step, and diamond particle surfaces generate silicon carbide and silicon boron is multiple
Coating is closed, not only increases the bond strength between diamond and copper, interface thermal conductivity also dramatically increases.It is mainly reflected in carbonization
The thermal conductivity of this carbide of silicon is higher than general carbide (such as boron carbide), another aspect, in general diamond surface carbon
Each diamond surface coating layer thickness in salt bath process is difficult to keep consistent to SiClx with silicon coating thickness, and the addition of boron element is first
Can be effectively controlled the thickness of diamond surface silicon coating, and it is subsequent prepare diamond-copper composite material during, boron copper is high
Lesser mutual solubility can prevent diamond surface element silicon and copper dissolving each other under long period high temperature under temperature, to prevent
The peeling of diamond surface silicon carbide-silicon coating, is effectively guaranteed the interface cohesion integrality of composite material.
(2) density difference of diamond and copper is too big, during preparing large-sized diamond-copper composite material,
General preparation method such as conventional powder metallurgical, pressure infiltration are difficult to prepare the diamond-copper composite material of stable homogeneous, and
By the design of metallic copper plate reserving hole, distribution of the diamond in metallic copper can be controlled well.
(3) since the hardness of diamond is larger in diamond-copper composite material sample, it is difficult in the processing of subsequent sample
It is solved with general mechanical processing tools, processing technology is complicated at this stage, processing cost is larger；And by being reserved in sheet metal
The design of Working position can process the composite material using the technique for processing copper material at this stage, and processing cost substantially reduces, and adds
Work simple process.
(4) also have while 1800W/mK may being up to using the diamond-copper composite material thermal conductivity of this technique preparation
Standby certain intensity and mechanical property.
Using
Diamond-metallic composite of the invention is had excellent performance, and expands hot plate or packaging heat sink in high-heat-conductive composite material
Equal fields have a good application prospect, such as encapsulation base material, cooling fin etc..
The preparation of 1 diamond-copper composite material 1 of embodiment
The pretreatment of 1.1 diamond particles: by the platy-monocrystal diamond of 2mm*2mm*1.3mm, calcium chloride powder, 1 ~ 5
The silicon powder of μm partial size, boron amorphous powder 10:10:4:1 ingredient in mass ratio.Then calcium chloride powder is mixed with silicon powder,
The two is uniformly mixed with high speed mixer, then load weighted boron powder is joined, is uniformly mixed with high speed mixer.
Uniformly mixed powder blend and diamond chip are installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes, pressed
Power < 10-1Pa, 1300 DEG C high-temperature process 2 hours.After carbon shirt-circuiting furnace is cooled to room temperature, powder will be blended and take out, repeatedly with hot water
Soaking flushing and ultrasonic treatment, remove extra calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out extra silicon
Powder and boron powder are back and forth rinsed and are ultrasonically treated using hot-water soak.Then with after dehydrated alcohol repeated flushing powder, it is put into vacuum
It is thoroughly dried in drying box.
It prepares diamond-copper composite material: (1) processing four 2.5mm* in 10mm*10mm*4mm red copper sheet material
The hole of 2.5mm*3mm, spacing 2mm between hole and hole；(2) hole and position are then put into 1/3 body of hole
Long-pending copper alloy powder, is then paved with scraper, is injected alcohol, is then put into the diamond sheet body after above-mentioned 1.1 floating coat
In hole；(3) copper mesh of 30 purposes is laid in above-mentioned copper plate surface, continues to be sprinkled with the powder filled copper mesh gap of copper alloy,
So that the holding of copper alloy powder is uniformly distributed；(3) above-mentioned diamond powder, plate are put into corresponding mould together with mold, are risen
To 1100 DEG C, pressure is controlled in 40MPa temperature, keeps the temperature 1 hour progress hot pressed sintering, after the completion of sintering, with after pressure head pressure maintaining with furnace
It is cooled to room temperature, demoulding obtains diamond-copper composite material.Then it is quiet the diamond-copper composite material to be subjected to heat etc.
Pressure, technological parameter are 980 DEG C, time 100min；Pressure is 120MPa；The thermal conductivity of gained composite material is 1010W/m
K。
2 diamond-copper composite material 2 of embodiment
With embodiment 1, difference is: diamond size 3.0mm*3.0mm*1.5mm, in 10mm*10mm*4mm red copper
The hole that four 3.5mm*3.5mm*3mm are processed on plate, spacing 1mm between hole and hole.
The thermal conductivity of 2 gained composite material 2 of embodiment is 1286W/mK.
3 diamond-copper composite material 2 of embodiment
With embodiment 1, difference is: diamond size 8.0mm*8.0mm*1.5mm, in 10mm*10mm*3mm red copper
The hole of 1 8.5mm*8.5mm*2mm is processed on plate.
The thermal conductivity of 3 gained composite material 3 of embodiment is 1806W/mK.
The preparation of 4 diamond-copper composite material 4 of embodiment
The pretreatment of 4.1 diamond particles: by the platy-monocrystal diamond of 2mm*2mm*1.5mm, calcium chloride powder, 1 ~ 5
The silicon powder of μm partial size, boron amorphous powder 12:12:5:1 ingredient in mass ratio.Then calcium chloride powder is mixed with silicon powder,
The two is uniformly mixed with high speed mixer, then load weighted boron powder is joined, is uniformly mixed with high speed mixer.
Uniformly mixed powder blend and diamond chip are installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes, is carried out
1350 DEG C high-temperature process 2.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, powder will be blended and take out, rushed with the immersion of hot water repeatedly
It washes and is ultrasonically treated, remove extra calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out extra silicon powder and boron powder,
Back and forth rinses and be ultrasonically treated using hot-water soak.Then it with after dehydrated alcohol repeated flushing powder, is put into vacuum oven
Thoroughly drying.
It prepares diamond-copper composite material: (1) 256 3mm* will be processed in 80mm*80mm*4mm red copper sheet material
The hole of 3mm*3mm, spacing 2mm between hole and hole；(2) hole and position are then put into 1/3 volume of hole
Metal-powder, then paved with scraper, inject alcohol, the diamond sheet body after above-mentioned 1.1 floating coat is then put into hole
In；(3) copper mesh of 60 purposes is laid in above-mentioned copper plate surface, continues to be sprinkled with the powder filled copper mesh gap of copper alloy, make
Metal-powder holding is obtained to be uniformly distributed；(3) after the above-mentioned copper sheet material filled with diamond powder, copper alloy powder being laminated, even
It is put into corresponding mould with mold, is warming up to 1100 DEG C, pressure is controlled in 50MPa, keeps the temperature 2 hours progress hot pressed sinterings, is sintered
After the completion, with room temperature is cooled to after pressure head pressure maintaining with the furnace, demoulding obtains diamond-copper composite material.Then by the Buddha's warrior attendant
Stone-carbon/carbon-copper composite material carries out hot isostatic pressing, and technological parameter is 960 DEG C, time 120min；Pressure is 100MPa, is made after processing
The thermal conductivity of the composite material obtained is 885W/mK, tensile strength 352MPa.
The preparation of 5 diamond-copper composite material 5 of embodiment
The pretreatment of 5.1 diamond particles: single-crystal diamond powder, calcium chloride powder, 1 by particle size in 1.8mm
The silicon powder of ~ 5 μm of partial sizes, boron amorphous powder 12:12:5:1 ingredient in mass ratio.Then calcium chloride powder is mixed with silicon powder
It closes, the two is uniformly mixed with high speed mixer, then load weighted diamond powder, boron powder are joined, with high speed
Batch mixer is uniformly mixed.Uniformly mixed powder blend is installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes,
Carry out 1250 DEG C of high-temperature process 2.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, powder will be blended and take out, with the leaching of hot water repeatedly
Bubble rinses and ultrasonic treatment, removes extra calcium chloride, and mixture is crossed 80 mesh, 30 mesh sieve, screen out extra silicon powder and
Boron powder is back and forth rinsed and is ultrasonically treated using hot-water soak.Then with after dehydrated alcohol repeated flushing powder, it is put into vacuum drying
It is thoroughly dried in case.
It prepares diamond-copper composite material: (1) 256 2mm* will be processed in 80mm*80mm*4mm red copper sheet material
The hole of 2mm*3mm；(2) hole and position are then put into a certain amount of metal-powder, are then paved with scraper,
Alcohol is injected, then the diamond powder after above-mentioned 5.1 floating coat is put into hole；(3) copper mesh of 60 purposes is laid in
Above-mentioned copper plate surface continues to be sprinkled with certain metal-powder, so that metal-powder holding is uniformly distributed；(3) by above-mentioned filling
After the copper sheet material stacking for having diamond powder, metal-powder, it is put into corresponding mould together with mold, is warming up to 1100 DEG C, pressure
Control keeps the temperature 2 hours progress hot pressed sinterings in 50MPa, after the completion of sintering, with room temperature is cooled to the furnace after pressure head pressure maintaining, demoulds
Obtain diamond-copper composite material.Then the diamond-copper composite material is subjected to hot isostatic pressing, technological parameter is
1000 DEG C, time 100min；Pressure is 100MPa, and the thermal conductivity of composite material obtained is 781W/mK, tension after processing
Intensity is 396MPa.
The preparation of 6 diamonds of embodiment-aluminium composite material 6
The pretreatment of 6.1 diamond particles: by the platy-monocrystal diamond of 2mm*2mm*1.5mm, calcium chloride powder, 1 ~ 5
The silicon powder of μm partial size, boron amorphous powder 12:12:5:1 ingredient in mass ratio.Then calcium chloride powder is mixed with silicon powder,
The two is uniformly mixed with high speed mixer, then load weighted boron powder is joined, is uniformly mixed with high speed mixer.
Uniformly mixed powder blend and diamond chip are installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes, is carried out
1100 DEG C high-temperature process 1.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, powder will be blended and take out, rushed with the immersion of hot water repeatedly
It washes and is ultrasonically treated, remove extra calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out extra silicon powder and boron powder,
Back and forth rinses and be ultrasonically treated using hot-water soak.Then it with after dehydrated alcohol repeated flushing powder, is put into vacuum oven
Thoroughly drying.
It prepares diamond-aluminium composite material: (1) 256 3mm*3mm* will be processed on 80mm*80mm*4mm aluminium plate
The hole of 3mm, spacing 2mm between hole and hole；(2) hole and position are then put into a certain amount of metal powder
Then body is paved with scraper, inject alcohol, then the diamond sheet body after above-mentioned 1.1 floating coat is put into hole；(3) will
The aluminium net of 60 purposes is laid in above-mentioned aluminium plate surface, continues to be sprinkled with certain aluminium alloy powder, so that aluminium alloy powder is kept
It is uniformly distributed；(3) after the above-mentioned aluminium plate filled with diamond powder, metal-powder being laminated, respective mode is put into together with mold
In tool, 620 DEG C are warming up to, pressure is controlled in 50MPa, 2 hours progress hot pressed sinterings is kept the temperature, after the completion of sintering, with pressure head pressure maintaining
After cool to room temperature with the furnace, demoulding obtains diamond-aluminium composite material.Then the diamond-aluminium composite material is carried out
Hot isostatic pressing, technological parameter are 640 DEG C, time 100min；Pressure is 120MPa；The thermal conductivity of composite material obtained after processing
Rate is 795W/mK, tensile strength 302MPa.
7 diamonds of embodiment-aluminium composite material 7
With embodiment 6, difference is: diamond size 8.0mm*8.0mm*1.5mm, in 10mm*10mm*3mm aluminium sheet
The hole of 1 8.5mm*8.5mm*2mm is processed on material.
The thermal conductivity of 3 gained composite material 3 of embodiment is 1785W/mK.
The preparation of 8 diamonds of embodiment-aluminium composite material 8
The pretreatment of 8.1 diamond particles: single-crystal diamond powder, calcium chloride powder, 1 by particle size in 1.8mm
The silicon powder of ~ 5 μm of partial sizes, boron amorphous powder 12:12:5:1 ingredient in mass ratio.Then calcium chloride powder is mixed with silicon powder
It closes, the two is uniformly mixed with high speed mixer, then load weighted diamond powder, boron powder are joined, with high speed
Batch mixer is uniformly mixed.Uniformly mixed powder blend is installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes,
Carry out 1150 DEG C of high-temperature process 1.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, powder will be blended and take out, with the leaching of hot water repeatedly
Bubble rinses and ultrasonic treatment, removes extra calcium chloride, and mixture is crossed 80 mesh, 30 mesh sieve, screen out extra silicon powder and
Boron powder is back and forth rinsed and is ultrasonically treated using hot-water soak.Then with after dehydrated alcohol repeated flushing powder, it is put into vacuum drying
It is thoroughly dried in case.
It prepares diamond-aluminium composite material: (1) 256 2mm*2mm* will be processed on 80mm*80mm*2mm aluminium plate
Then the hole of 2mm merges this with via aperture aluminium plate with 80mm*80mm*2mm；It (2) then will be above-mentioned
Diamond powder after 9.1 floating coats is put into hole；(3) aluminium net of 60 purposes is laid in above-mentioned aluminium plate surface, continued
It is sprinkled with certain aluminium alloy powder, so that metal-powder holding is uniformly distributed；(3) diamond powder, metal are filled with by above-mentioned
It after the aluminium plate stacking of powder, is put into corresponding mould together with mold, is warming up to 630 DEG C, in 50MPa, heat preservation 1 is small for pressure control
Shi Jinhang hot pressed sintering, after the completion of sintering, with room temperature is cooled to after pressure head pressure maintaining with the furnace, demoulding obtains diamond-aluminium composite wood
Material.Then the diamond-aluminium composite material is subjected to hot isostatic pressing, technological parameter is 600 DEG C, time 100min；Pressure
Power is 100MPa；The thermal conductivity of composite material obtained is 682W/mK, tensile strength 398MPa after processing.
The preparation of 9 diamonds of embodiment-aluminium composite material 8
The pretreatment of 9.1 diamond particles: single-crystal diamond powder, calcium chloride powder, 1 by particle size in 1.8mm
The silicon powder of ~ 5 μm of partial sizes, boron amorphous powder 12:12:5:1 ingredient in mass ratio.Then calcium chloride powder is mixed with silicon powder
It closes, the two is uniformly mixed with high speed mixer, then load weighted diamond powder, boron powder are joined, with high speed
Batch mixer is uniformly mixed.Uniformly mixed powder blend is installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes,
Carry out 1150 DEG C of high-temperature process 1.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, powder will be blended and take out, with the leaching of hot water repeatedly
Bubble rinses and ultrasonic treatment, removes extra calcium chloride, and mixture is crossed 80 mesh, 30 mesh sieve, screen out extra silicon powder and
Boron powder is back and forth rinsed and is ultrasonically treated using hot-water soak.Then with after dehydrated alcohol repeated flushing powder, it is put into vacuum drying
It is thoroughly dried in case.
It prepares diamond-aluminium composite material: (1) 256 2mm*2mm* will be processed on 80mm*80mm*4mm aluminium plate
The hole of 3mm；(2) hole and position are then put into a certain amount of aluminium alloy powder, are then paved with scraper, infused
Enter alcohol, then the diamond powder after above-mentioned 9.1 floating coat is put into hole；(3) aluminium net of 60 purposes is laid in
Aluminium plate surface is stated, continues to be sprinkled with certain aluminium alloy powder, so that metal-powder holding is uniformly distributed；(3) by above-mentioned filling
After the aluminium plate stacking for having diamond powder, metal-powder, it is put into corresponding mould together with mold, is warming up to 630 DEG C, pressure control
System keeps the temperature 1 hour progress hot pressed sintering, after the completion of sintering, with room temperature is cooled to the furnace after pressure head pressure maintaining, demoulds in 50MPa
To diamond-copper composite material.Then the diamond-aluminium composite material is subjected to hot isostatic pressing, technological parameter 600
DEG C, time 100min；Pressure is 100MPa；The thermal conductivity of composite material obtained is 701W/mK, tensile strength after processing
For 416MPa.
10 diamonds of embodiment-aluminium composite material 10
With embodiment 8, difference is: when preparing diamond-aluminium composite material, the size of aluminium plate becomes Φ 300mm*
2mm, and going out the size of certain order arrangement on aluminium plate is hole 1500 of Φ 2.5mm, this is then had through-hole
Hole aluminium plate is merged with Φ 300mm*2mm；Then pressure is controlled in 60MPa in sintering.10 gained of embodiment
The thermal conductivity of composite material 10 is 615W/mK, tensile strength 432MPa.
The above embodiments are only the preferred technical solution of the present invention, and are not construed as limitation of the invention, this Shen
Please in embodiment and embodiment in feature in the absence of conflict, can mutual any combination.Protection model of the invention
The technical solution that should be recorded with claim is enclosed, the equivalent replacement side of technical characteristic in the technical solution recorded including claim
Case is protection scope.Equivalent replacement i.e. within this range is improved, also within protection scope of the present invention.
Claims (10)
1. a kind of preparation method of the diamond heat-conducting composite material of easy processing, it is characterised in that: the method includes following steps
It is rapid:
(1) diamond particle surfaces coating treatment: diamond particle surfaces growth in situ silicon carbide-silicon boron composite coating, thus
Form diamond-silicon carbide-silicon boron complex；
(2) diamond-metal matrix composite materials preparation: hole and groove are processed on metallic matrix, in the groove
Position be selectively put into the metallic matrix alloy powder of channel volume 1/3-1/2, paved with scraper, inject alcohol, then
The diamond-silicon carbide-silicon boron complex obtained through step (1) is put into hole；On metallic matrix after the treatment
The metal mesh in 1.5-2 times of aperture of metallic matrix alloy powder size is placed by side, continues the Metal Substrate for being sprinkled with channel volume 1/6-1/5
Body alloy powder is prepared so that the holding of metallic matrix alloy powder is put into corresponding agglomerating plant after being uniformly distributed together with mold,
Obtain final diamond-metal matrix composite materials；
(3) diamond-metal matrix composite materials are obtained to the step (2) and carries out hot isostatic pressing；
Complete the preparation of the diamond heat-conducting composite material of easy processing.
2. according to the method described in claim 1, it is characterized by: the step (1) specifically includes the following steps:
(1.1) according to thermal conductivity demand, select the diamond of suitable dimension size, and select comprising diamond particles, silicon powder,
The mixture of boron amorphous powder and calcium chloride；
(1.2) in a vacuum or in the reducing atmosphere of hydrogen or in the reducing atmosphere of the combination gas of hydrogen and argon gas,
Or in inert atmosphere, the mixture of step (1.1) is subjected to heating reaction, so that it is compound to form diamond-silicon carbide-silicon boron
Body.
3. according to the method described in claim 2, it is characterized by: the mixture includes according to weight in the step (1.1)
The following components of meter: 30 ~ 50 parts of diamond；30 ~ 50 parts of calcium chloride；10 ~ 20 parts of silicon powder；1 ~ 10 part of boron amorphous powder；
The step (1.2) heats reaction condition are as follows: and 1100 ~ 1350 DEG C of temperature, pressure < 10-1Pa, the time 30 ~ 180 minutes.
4. according to the method described in claim 1, it is characterized by: the step (2) hole size is diamond-silicon carbide-
1.1 ~ 1.5 times of sizes of silicon boron complex size；
In step (2) diamond-metal matrix composite materials preparation, when metal is aluminium, diamond-aluminium composite material system
Standby condition are as follows: 550 ~ 750 DEG C of temperature, 10 ~ 100MPa of pressure；
In step (2) diamond-metal matrix composite materials preparation, when metal is copper, the system of diamond-copper composite material
Standby condition are as follows: 950 ~ 1200 DEG C of temperature, 10 ~ 100MPa of pressure；
In the step (2), calculated by the total weight of diamond-silicon carbide-silicon silicon boron complex and metallic matrix, metallic matrix
Shared mass fraction is 10 ~ 90wt%.
5. according to the method described in claim 1, it is characterized by: the step (3) diamond-metal matrix composite materials system
In standby, when metal is aluminium, heat and other static pressuring processes parameter are as follows: 600 ~ 640 DEG C of temperature, 80 ~ 120MPa of pressure；
In step (3) diamond-metal matrix composite materials preparation, when metal is copper, heat and other static pressuring processes parameter are as follows: temperature
960 ~ 1020 DEG C of degree, 80 ~ 120MPa of pressure.
6. a kind of product, which is characterized in that the product is that the easy of the preparation of the method as described in claim 1-5 any one adds
The diamond heat-conducting composite material of work.
7. the diamond heat-conducting composite material of the easy processing of the preparation of method described in claim 1-5 any one is used for high thermal conductivity
Composite material expands hot plate or packaging heat sink uses.
8. method according to claim 1 or 3 or 4 or 5, it is characterised in that: the Buddha's warrior attendant of the easy processing of the method preparation
Stone heat-conductive composite material includes metallic matrix and the diamond particles for being distributed in described matrix inside and/or surface, middle part
Point or all the diamond particles by diamond surface silicon carbide-silicon boron composite coating are incorporated into the metallic matrix；Institute
The thermal conductivity for stating composite material is 600 ~ 1800W/mK；Thermal expansion coefficient is≤15ppm/K；The composite material easy processing.
9. according to the method described in claim 8, it is characterized by: the metallic matrix material includes copper or aluminium.
10. according to the method described in claim 9, it is characterized by: the diamond particles be graininess single-crystal diamond,
Size >=500 μm at least two direction of diamond；The diamond particles are platy-monocrystal diamond, and diamond size is long
Be wider than 1mm.
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| CN108326289A (en) * | 2018-04-20 | 2018-07-27 | 佛山市金纳新材料科技有限公司 | A kind of method of modifying and Nano metal powder modification diamond of diamond |
| CN108941541A (en) * | 2018-07-25 | 2018-12-07 | 芜湖昌菱金刚石工具有限公司 | A kind of method that diamond surface forms high-temperature stable coating |
| CN109652672B (en) * | 2019-02-28 | 2020-10-16 | 哈尔滨工业大学 | Anti-perovskite manganese nitrogen compound/aluminum double-communication-structure composite material and preparation method thereof |
| CN111804919B (en) * | 2019-04-10 | 2022-06-17 | 中国科学院宁波材料技术与工程研究所 | High-thermal-conductivity graphite-metal composite material and preparation method thereof |
| CN110576176A (en) * | 2019-09-29 | 2019-12-17 | 河南工业大学 | Preparation method of high-performance diamond tool |
| CN112159231B (en) * | 2020-10-09 | 2021-06-01 | 武汉理工大学 | Rapid preparation method of super-hard light diamond-B4C-SiC ternary composite ceramic |
| CN113547101B (en) * | 2021-07-21 | 2022-10-21 | 长飞光纤光缆股份有限公司 | Preparation method and product of high-thermal-conductivity diamond-aluminum-based composite material |
| CN117020209B (en) * | 2023-10-09 | 2024-01-26 | 赣州金顺科技有限公司 | Heat dissipation substrate and preparation method thereof |
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