CN107649688A - A kind of diamond heat-conducting composite of easy processing and its preparation method and application - Google Patents
A kind of diamond heat-conducting composite of easy processing and its preparation method and application Download PDFInfo
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- CN107649688A CN107649688A CN201710719298.5A CN201710719298A CN107649688A CN 107649688 A CN107649688 A CN 107649688A CN 201710719298 A CN201710719298 A CN 201710719298A CN 107649688 A CN107649688 A CN 107649688A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
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- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The present invention relates to diamond heat-conducting composite of a kind of easy processing and its preparation method and application.Described composite includes sheet metal matrix and is distributed in the diamond particles on inside described matrix and/or surface, and which part or whole diamond particles are incorporated into the metallic matrix by diamond surface carborundum silicon boron composite coating.The preparation method is simple, is particularly suitable for large-scale promotion.Preparing composite using this method has the thermal conductivity of superelevation and good working ability, and composite property homogeneity, stability are good.
Description
Technical field
The invention belongs to diamond techniques field, a kind of diamond heat-conducting composite more particularly, to easy processing and its
Preparation method and application.
Background technology
The stable operation of the current domestic high-power high hot-fluid device of Military and civil fields all suffers from package substrate material heat-sinking capability
The problem of insufficient, it largely have impact on the performances such as the reliability, efficiency, life-span of electronic component.As electronic component is run
Power is increasing, and thermal technology's management becomes particularly important, or even the bottleneck problem as high-power electronic device development.It is and current
The material such as general aluminium, copper, Al/SiC, Cu/W can not meet the needs of high-power electronic device.
The thermal conductivity of high-quality single-crystal diamond not only can reach 2000W/mK, and also have that dielectric constant is low, thermal expansion
Low series of advantages of coefficient etc., but diamond and its composite are restricted at this stage in the fast-developing master in highly heat-conductive material field
Reason is wanted to be that diamond and its composite processing cost are high, and existing diamond-metallic composite technique is difficult to protect
Demonstrate,prove the homogeneity and stability of large dimond-metal-base composites performance.
The diamond heat-conducting composite for preparing easy processing is that the difficult point of high heat-conductive diamond-metallic composite mainly exists
In：The wetability extreme difference of diamond and copper, with easily reacting generation this deliquescent brittlement phases of Al4C3 under aluminium high temperature.At this stage
Although improve the combination of diamond and metal at high temperature by introducing alloy or the processing of diamond powder surface in a metal
Intensity, but for caused heat conductivity Changeement is not deep enough during the two bond strength is improved and lacks
Stable process for producing.The processing of other high heat-conductive diamond-metallic composite is also to hinder the composite industry
An important factor for changing application, relatively high processing cost seriously constrains the commercialization process of the composite.And with list
The production cost of diamond constantly reduces, and the size and quality of diamond constantly raise, diamond-metal-base composites
Manufacturing cost also constantly reduces, and what unique needs overcame is the difficult processing characteristics of diamond composite.Therefore, this area is badly in need of
Develop a kind of easy processing, high uniformly dispersed high heat-conductive diamond heat-conductive composite material.
At present, the preparation technology of high heat-conductive diamond-metal-base composites mainly uses powder metallurgy or Pressure Infiltration
Technique, be absorbed in heat conductivity raising and thermal coefficient of expansion it is controllable, but to composite subsequent machining technology close
Note less, and composite prepared by powder metallurgy and Pressure Infiltration technique is when size requires larger, the uniformity of material
With stability it is difficult to ensure that.
Diamond-metal-base composites is the study hotspot of electronic package material of new generation, and core is both at home and abroad at present
The heat conductivility of material is improved, main Research Thinking is to increase diamond particle content and improve the compound of diamond particles/copper
Interface, achieve preferable effect.However, the diamond particles in such a composite construction（Thermal conductivity 1800-2200W/mK）
Just as many by metal（ Cu：398W/mK ；Al：220W/mK）The heat conduction isolated island of connection, had both added two-phase interface quantity,
The raw synergy of difficult labour, the heat conductivility for making diamond excellent are difficult to give full play to again.
CN 105779805A, from foam metal or foamed ceramics or foam carbon skeleton easily prepared and be seamlessly connected
As substrate, high heat-conductive diamond film layer is prepared on its surface using chemical vapour deposition technique, constructs high heat-conductive diamond
Three-dimensional network skeleton, then it is compound with metallic matrix, high heat-conductive diamond is formed doubly-linked with metal and lead to three-dimensional network IPN
Structure, enhancing phase and matrix phase is all kept continuously distributed in space, form continuous passage of heat, produce parallel heat conduction,
So as to weaken negative effect of the compound interface to material thermal property, enhancing can be made mutually to give full play to heat conduction as an entirety
Efficiency, and the good plasticity and toughness of metallic matrix in the composite are not reduced.High thermal conductive diamond stone flour, stone can also be added simultaneously
One or more in high heat-conducting ceramic particle such as SiC, AlN of black alkene, CNT or reduction thermal coefficient of expansion, realize heat
Learn the further lifting with mechanical property.
CN105818476 discloses a kind of surface modified 3 D network carbon fibre reinforced composite and preparation method, root
According to the three-dimensional carbon fiber reinforcement of demand establishment different pore size, received after surface preparation by chemical vapour deposition diamond, carbon
Mitron, graphene, then compound with matrix material, matrix material is metal or polymer, and acquisition carries three-dimensional netted skeleton knot
The carbon fiber reinforced metal base or polymer matrix composite of structure.Surface-modified three-dimensional netlike carbon fiber is in the composite
Three-dimensional continuous passage of heat is formd, drastically increases the heat conductivility of composite, at the same time, carbon fiber is in matrix material
Spatial distribution in material can also play the mechanical property for improving composite, reduce its density and the function of thermal coefficient of expansion.Together
When can also regulate and control its thermal coefficient of expansion and mechanics, thermal property by adding zero dimension reinforced particulate.
CN105112754B, the thermal conductivity of composite, CN are improved using the three-dimensional UNICOM's network structure for forming diamond
105220049B improves the thermal conductivity of composite using the connection of diamond lamella is formed.
The sandwich structure that CN105774130A forms metal/non-metal complex/metal improves the airtight of Heat Conduction Material
Property.
In terms of the emphasis of above-mentioned patent all concentrates on the material properties such as the thermal conductivity for improving composite, air-tightness, and it is right
The machinability concern of follow-up composite is less, the performance uniformity of large-sized composite material sample is also paid close attention to it is less, it is right
High-heat-conductive composite material properties of sample it is repeatable under also concern it is inadequate.
The content of the invention
The present invention is in view of the above-mentioned problems, propose to prepare with regard to the method for consideration processing technology at the beginning of prepared by composite
Heat conductivity is high, easy processing and when composite gauge is larger, the uniform performance of composite is guaranteed, from
And the stability of its performance is also readily obtained guarantee.The present invention mainly on the premise of superelevation thermal conductivity is ensured, ensures composite wood
Repeatability in the excellent processability of material, the uniformity of sample and production preparation process.
Technical solution of the present invention is：
A kind of diamond heat-conducting composite of easy processing, described composite include metallic matrix and are distributed in the base
The diamond particles in internal portion and/or surface, which part or all diamond particles by diamond surface carborundum-
Silicon boron composite coating is incorporated into the metallic matrix；
The thermal conductivity of the composite is 600 ~ 1800W/mK；Thermal coefficient of expansion is≤15ppm/K；Described composite is easy
Processing.The diamond heat-conducting composite of easy processing be diamond-metallic composite have easy processing, it is high it is uniformly dispersed,
And higher thermal conductivity
Preferably, the metallic matrix includes copper or aluminium or its alloy.
It is further preferred that described diamond particles are graininess single-crystal diamond, on the direction of diamond at least two
Size is >=500 μm；Described diamond particles are platy-monocrystal diamond, and diamond size is long and is wider than 1mm.
A kind of preparation method of the diamond heat-conducting composite of easy processing, the described method comprises the following steps：
（1）Diamond particle surfaces coating treatment：Diamond particle surfaces growth in situ carborundum-silicon boron composite coating, so as to
Form diamond-silicon carbide-silicon boron complex；
（2）It is prepared by diamond-metal matrix composite materials：Hole and groove are processed on metallic matrix, in described groove
Position be selectively put into the metal base alloy powder of channel volume 1/3, then paved with scraper, inject alcohol, then
Will be through step 1）Obtained diamond-silicon carbide-silicon boron complex is put into hole；Above metallic matrix after the treatment
The wire netting in 1.5 times or so apertures of metal base alloy powder size is placed, the metal base for continuing to be sprinkled with channel volume 1/6 closes
Bronze body so that metal base alloy powder keeps being put into corresponding agglomerating plant together with mould after being uniformly distributed and prepared, and obtains
Final diamond-metal-base composites；
The hole necessarily arranged is processed in sheet metal, certain gap is left between hole and hole, in the gap
Certain groove is processed, its Hole is mainly used in the placement of follow-up diamond-silicon carbide-silicon boron complex, and groove is follow-up
Metal alloy powder can be added, more obvious processing channel is formed after sintering, to utilize following process；
（3）To the step（2）Obtain diamond-metal-base composites and carry out high temperature insostatic pressing (HIP)；Improve the relative of composite
Density；
Complete the preparation of the diamond heat-conducting composite of easy processing.
It is further preferred that the coating layer thickness of described carborundum-silicon boron is 0.01-5 μm.
Preferably, the step 1）Specifically include following steps：
（1.1）According to thermal conductivity demand, select the diamond of suitable dimension size, and select comprising diamond particles, silica flour,
The mixture of boron amorphous powder and calcium chloride；
（1.2）In a vacuum or in hydrogen, the reducing atmosphere of argon gas or its combination gas or inert atmosphere, by step
（1.1）Mixture carry out heating response, so as to form diamond-silicon carbide-silicon boron complex.
It is further preferred that described step（1.2）Heating response condition is：1100 ~ 1350 DEG C of temperature, pressure ＜ 10- 1Pa, 30 ~ 180 minutes time.
It is further preferred that when when diamond-metal matrix composite materials, metallic matrix material is aluminium, the step
（1.2）Heating condition be：1100 ~ 1150 DEG C of temperature, pressure ＜ 10-1Pa, 30 ~ 90 minutes time.
It is further preferred that preferably, when when diamond-metal matrix composite materials, metallic matrix material is copper,
The step（1.2）Heating condition be：1150 ~ 1350 DEG C of temperature, pressure ＜ 10-1Pa, 30 ~ 180 minutes time.
It is further preferred that the step（1.1）In, the mixture includes the following components according to weight meter：Gold
30 ~ 50 parts of hard rock；30 ~ 50 parts of calcium chloride；10 ~ 20 parts of silica flour；1 ~ 10 part of boron amorphous powder.
Most preferably, the mixture includes the following components according to weight meter：40 ~ 45 parts of diamond；Calcium chloride 40 ~ 45
Part；10 ~ 15 parts of silica flour；1 ~ 5 part of boron amorphous powder.
Preferably, the step（2）Hole size is the 1.1 ~ 1.5 times big of diamond-silicon carbide-silicon boron complex size
It is small.
Preferably, the step（2）In prepared by diamond-metal matrix composite materials, when metal is aluminium, diamond-aluminium
The preparation condition of composite is：550 ~ 750 DEG C of temperature, 10 ~ 100MPa of pressure；
The step（2）In prepared by diamond-metal matrix composite materials, when metal is copper, the system of diamond-copper composite material
It is for condition：950 ~ 1200 DEG C of temperature, 10 ~ 100MPa of pressure.After metal-powder, diamond, wire netting being placed in metallic matrix,
Sintering can be laminated, prepares final diamond-metal matrix composite materials.Wire netting material includes copper or aluminium or its conjunction
Gold.
Preferably, the step（2）In, by the gross weight meter of diamond-silicon carbide-silicon silicon boron complex and metallic matrix
Calculate, the mass fraction of metallic matrix is 10 ~ 90wt%；Preferably 30 ~ 80wt% or 50 ~ 80wt%；
Preferably, the step（3）The heat and other static pressuring processes parameter of diamond-aluminium composite material is：600 ~ 640 DEG C of temperature, pressure
80 ~ 120MPa of power；
The heat and other static pressuring processes parameter of described diamond-copper composite material is：960 ~ 1020 DEG C of temperature, 80 ~ 120MPa of pressure.
A kind of product, including easy processing prepared by the diamond heat-conducting composite of described easy processing or described method
Diamond heat-conducting composite.
The diamond heat-conducting of easy processing prepared by the diamond heat-conducting composite of described easy processing or described method
Composite is used for high-heat-conductive composite material and expands hot plate or packaging heat sink use.
Beneficial effect of the present invention：
1st, the technology of the present invention has stayed machining position in advance using the position for designing diamond particles placement on sheet metal in advance
Put, diamond-metal matrix composite materials are prepared using the diamond after coating.It is compound with existing diamond-metallic matrix
Material and production technology, which are compared, to be had the following advantages that：
（1）Pre-designed diamond particles, which are placed, can be good at ensureing diamond in a metal uniformly dispersed, greatly
The big homogeneity for improving large dimond enhancing metal matrix composite materials performance；Pre-designed Working position, makes
Subsequent machining technology it is simple, equipment is simple, and processing cost is low, efficiency high；
（2）Using diamond powder surface plating carborundum and silicon-boron coating, face coat thickness can be effectively avoided to increase band
Diamond-metallic composite interface thermal conductivity the feature jumpy come, effectively reduces powder surface coating layer thickness pair
The influence degree of heat conductivity.
（3）The diamond heat-conducting composite of the easy processing prepared using this method is diamond-metallic matrix composite wood
Continuity of the metal on three-dimensional is apparent from material, and the mechanical property and heat conductivity of composite has been effectively ensured
Energy；Additionally, due to metallic continuity, cause good under diamond and its near zone high temperature only need to be ensured in preparation process
Close characteristic, composite can obtain very high consistency, and required impressed pressure is not required to too high during being prepared, very
Pressureless sintering can extremely be realized.
（4）Because impressed pressure is without too high, the diamond-metal matrix composite materials prepared using the present invention are to hot pressing
During requirement in terms of equipment pressure it is smaller, manufacturing equipment cost substantially reduces.Simultaneously as the requirement to pressure is smaller, one
As under the conditions of can with or large-size composite sample.
2nd, diamond particles are by surface coated treatment step, and diamond particle surfaces generate carborundum and silicon boron is compound
Coating, not only increases the bond strength between diamond and copper, and interface thermal conductivity also dramatically increases.It is mainly reflected in carborundum
The thermal conductivity of this carbide is higher than in general carbide（Such as boron carbide）, on the other hand, in general diamond surface is carbonized
Silicon and silicon coating thickness each diamond surface coating layer thickness in salt bath process are difficult to be consistent, and the addition of boron element first can
The effectively thickness of control diamond surface silicon coating, and during subsequently diamond-copper composite material is prepared, boron copper high temperature
Under less mutual solubility can prevent diamond surface element silicon with copper dissolving each other under long period high temperature, so as to prevent gold
The peeling of hard rock surface carborundum-silicon coating, it is effectively guaranteed the interface cohesion integrality of composite.
The diamond heat-conducting composite of easy processing of the present invention has high thermal conductivity, and it has, and diamond distribution is uniform,
Composite characteristic easy to process.This composite include metallic matrix body and be distributed in inside the extraction and/or
The diamond particles on surface, wherein at least partly or entirely the diamond is incorporated into the gold by surface carborundum and silicon boron
Belong to matrix, and the distribution of diamond and follow-up Working position have designed determination before composite preparation so that should
Composite has the advantages that high heat conductance, area uniformity, easy processing.
And had been surprisingly found that during plating process is studied, on the one hand the addition of boron amorphous powder can substantially reduce salt bath plated
The heterogeneity of diamond powder surface thickness of coating in journey, the addition of another aspect boron amorphous powder is to follow-up diamond and metal
The interface bond strength and diamond-copper composite material thermal conductivity of copper significantly improve.The third aspect, preparing diamond-aluminium
During with diamond-copper composite material, the temperature of diamond particle surfaces coating treatment has different, main reason is that actual
In processing procedure, higher than 1100 DEG C after silicon and boron begin with certain solid solution, but solid solubility is not high, can be neglected, and boron mainly rises point
Every the effect of silicon and diamond, meet the effect that interfacial thickness is relatively thin between diamond and aluminium；When temperature is higher than 1150 DEG C, boron
Lifted with the solid solubility of silicon, reached the effect of the less dissolving silicon at high temperature of interface copper between diamond and copper again.
3rd, the density difference of diamond and copper is too big, during large-sized diamond-copper composite material is prepared, in general
Preparation method such as conventional powder metallurgical, pressure infiltration are difficult the diamond-copper composite material for preparing stable homogeneous, and pass through gold
Belong to the design of copper coin material reserving hole, distribution of the diamond in metallic copper can be controlled well.
4th, because the hardness of diamond is larger in diamond-copper composite material sample, it is difficult in follow-up sample processing
Solved with general mechanical processing toolses, processing technology is complicated at this stage, processing cost is larger；And by being reserved in sheet metal
The design of Working position, the technique for processing copper material at this stage can be used to process the composite, processing cost substantially reduces, and adds
Work technique is simple.
5th, it is also equipped with while the diamond-copper composite material thermal conductivity prepared using this technique may be up to 1800W/mK
Certain intensity and mechanical property.
6th, the invention provides a kind of diamond-metallic composite, heat conductivity height, thermal coefficient of expansion can
Control, compactness is good, uniformity is good and easy processing, and manufacture is low with processing cost.Have in terms of radiating and electronic component exploitation
It is widely applied prospect.
7th, present invention also offers a kind of preparation method of the diamond heat-conducting composite of easy processing, the letter of this method technique
It is single, conveniently, financial cost it is low, be adapted to industrialization.
Brief description of the drawings
Fig. 1 is the schematic diagram of composite prepared by the present invention, it can be seen that diamond distribution is in the position being previously set
Put and be the Working position of subsequent reservation.
Fig. 2 is the shape 1 that the composite prepared using the present invention may finally be processed comparatively fast；
Fig. 3 is the shape 2 that the composite prepared using the present invention may finally be processed comparatively fast.
Fig. 4 is the actual machining shape of the composite prepared using the present invention.
Embodiment
With reference to embodiment, the invention will be further described, but the scope of protection of present invention is not limited to implement
The scope of example statement.
The diamond heat-conducting composite of easy processing of the present invention has high thermal conductivity, and it has, and diamond distribution is uniform,
Composite characteristic easy to process.This composite includes metallic matrix and is distributed in the extraction inside and/or table
The diamond particles in face, wherein at least partly or entirely the diamond is incorporated into the metal by surface carborundum and silicon boron
Matrix, and the distribution of diamond and follow-up Working position have designed determination before composite preparation so that this is multiple
Condensation material has the advantages that high heat conductance, area uniformity, easy processing.
And had been surprisingly found that during plating process is studied, on the one hand the addition of boron amorphous powder can substantially reduce salt bath plated
The heterogeneity of diamond powder surface thickness of coating in journey, the addition of another aspect boron amorphous powder is to follow-up diamond and metal
The interface bond strength and diamond-copper composite material thermal conductivity of copper significantly improve.The third aspect, preparing diamond-aluminium
During with diamond-copper composite material, the temperature of diamond particle surfaces coating treatment has different, main reason is that actual
In processing procedure, higher than 1100 DEG C after silicon and boron begin with certain solid solution, but solid solubility is not high, can be neglected, and boron mainly rises point
Every the effect of silicon and diamond, meet the effect that interfacial thickness is relatively thin between diamond and aluminium；When temperature is higher than 1150 DEG C, boron
Lifted with the solid solubility of silicon, reached the effect of the less dissolving silicon at high temperature of interface copper between diamond and copper again.
Metallic matrix
As used herein, described metallic matrix includes：The higher metallic matrix of the thermal conductivities such as Copper substrate, aluminum substrate or its conjunction
Gold.And it is distributed with metallic matrix sheet material and realizes the blind hole hole processed and groove.
Metal-powder
As used herein, described metallic matrix includes：The higher metal-powder of the thermal conductivities such as Copper substrate, aluminum substrate or its conjunction
Gold.
Diamond-silicon carbide-silicon boron complex
The diamond-silicon carbide-silicon complex of the present invention includes diamond particles and combination（Pass through chemical bonds）In institute
State the carborundum and silicon boron composite coating of diamond particle surfaces.
Carborundum-silicon boron composite coating
As used herein, diamond surface coating of the invention includes：Carborundum and silicon boron composite coating.
Preferably, diamond surface coating of the invention has following feature：（1）1 ~ 10000nm of face coat thickness（Compared with
It is 200 ~ 2000nm goodly；More preferably it is 200 ~ 1000nm）.
Diamond particles
Diamond particles used in the present invention are to provide the substrate of carborundum and silicon boron composite coating growth of the present invention, are also simultaneously
Highly thermally conductive reinforcement.
The diamond particles of the present invention, which have, to be clearly required.Described diamond particles are graininess single crystal diamond
Stone, diamond particle diameter are >=500 μm；Or be platy-monocrystal diamond, diamond size to the youthful and the elderly and it is wider than 1mm；
Diamond-metal matrix composite materials
Diamond-metallic composite of the present invention, wherein, described composite includes metallic matrix and is distributed in described
Inside metallic matrix and/or surface presets the diamond particles of good position, the wherein at least part or all of diamond
Particle is incorporated into the metallic matrix by carborundum and silicon boron composite coating.
Preferably, the diamond-metal matrix composite materials have following one or more features：（a）Thermal conductivity is
600~1800W/mK（Preferably 1000 ~ 1600W/mK；More preferably it is 1200 ~ 1500W/mK）；
（b）Thermal coefficient of expansion is≤15ppm/K（Preferably 4 ~ 12ppm/K；More preferably it is 6 ~ 8ppm/K）；（c）Easy processing；
（d）Diamond distribution is uniform.
Preferably, by taking sheet diamond-aluminium composite material as an example, described diamond surface passes through carborundum and silicon boron
After composite coating, aluminum substrate is chemically bonded in.General diamond surface compound coat thickness is answered diamond reinforced metal-base
Condensation material calorifics and Effect on Mechanical Properties are larger, but pass through in theoretical calculation and actual fabrication process it was found that diamond powder
It is smaller therefore diamond intensified that the change of surface carborundum and silicon boron composite coating thickness influences amplitude to heat conductivity
Select diamond powder surface coating silicon carbide and silicon boron composite coating compound to improve in strong aluminum matrix composite preparation process
Material interface bond strength.In addition, corresponding 1 ~ 1.5 times of sheet diamond is reserved with pre-designed metallic aluminium sheet material
The hole and processing groove of size, substantially increase the distributing homogeneity of diamond lamella and reduce following process difficulty.
Preparation method
The invention provides a kind of preparation method of the diamond heat-conducting composite of easy processing, preferably methods described is included such as
Lower step：
（1）Diamond particle surfaces coating treatment step：
Carborundum and silicon-boron coating are grown in diamond particle surfaces, so as to form diamond-silicon carbide-silicon boron complex；
Preferably, the step（1）Including：
（1.1）According to thermal conductivity demand, select the diamond of suitable dimension size, and provide comprising diamond particles, silica flour,
The mixture of boron amorphous powder and calcium chloride；
（1.2）In a vacuum or in hydrogen, the reducing atmosphere of argon gas or its combination gas or inert atmosphere, by step
（1.1）Mixture carry out heating response, so as to form diamond-silicon carbide-silicon boron complex.
In above-mentioned heating response, described heating response is preferably carried out at 1100 ~ 1350 DEG C；Described heating is anti-
Should be 10 preferably in pressure-1Below Pa carry out；The described heating response time is preferably at 30 ~ 180 minutes；
In another preference, the step（1.1）In, calculated by total weight of the mixture, the mass fraction of diamond for 30 ~
50wt%；Preferably 40 ~ 45wt%；
In another preference, the step（1.1）In, calculated by total weight of the mixture, the mass fraction of calcium chloride for 30 ~
50wt%；Preferably 40 ~ 45wt%；
In another preference, the step（1.1）In, calculated by total weight of the mixture, the mass fraction of silica flour for 10 ~
20wt%；Preferably 10 ~ 15wt%；
In another preference, the step（1.1）In, calculated by total weight of the mixture, the mass fraction of boron amorphous powder for 1 ~
10wt%；Preferably 1 ~ 5wt%.
(1) diamond-metallic composite preparation process：
（2.1）Certain hole and groove are processed on sheet metal；
（2.2）In step（2.1）Described hole and the position of groove are selectively put into a certain amount of metal-powder, then
Paved with scraper, inject alcohol, then the diamond lamellar body after coating is put into square hole；Copper coin after the treatment
The wire netting of certain pore size is placed above material, continues to be sprinkled with certain metal-powder so that metal-powder keeps being uniformly distributed；Will
Above-mentioned diamond powder, sheet material are put into corresponding mould together with mould and prepared, and obtain final diamond-metallic matrix composite wood
Material.
Preferably, the step（2.1）Hole size is 1.1 ~ 1.5 times of sizes of diamond size；
Preferably, the step（2.2）In, the preparation temperature of diamond-aluminium composite material is 550 ~ 750 DEG C, pressure 10 ~
100MPa；The preparation temperature of diamond-copper composite material is 950 ~ 1200 DEG C, and pressure is in 10 ~ 100MPa；
Preferably, in the step（2.2）In, by the gross weight meter of diamond-silicon carbide-silicon silicon boron complex and metallic matrix
Calculate, the mass fraction of metallic matrix is 10 ~ 90wt%；Preferably 30 ~ 80wt% or 50 ~ 80wt%；
Capital equipment used in this method is cheap, is easy to get, using in general hot-press equipment or Pressure Infiltration equipment, example
Such as：Hot pressing furnace, discharge plasma sintering furnace etc..
The preparation method of the diamond heat-conducting composite of easy processing provided by the invention is by sheet metal preprocessing, Buddha's warrior attendant
Stone flour surface modification is prepared with super-high heat-conductive composite to be combined, and is distributed by adjusting hole on sheet metal, Buddha's warrior attendant
Stone granular size, diamond particle surfaces coating composition, the thermal conductivity of diamond reinforced metal-base composite material is significantly improved,
And obtained composite processing difficulty is small.
Now by taking diamond-copper composite material as an example, illustrating the preparation method of the present invention mainly includes following advantage：
（1）For diamond particles by surface coated treatment step, diamond particle surfaces generate carborundum and the compound painting of silicon boron
Layer, not only increases the bond strength between diamond and copper, interface thermal conductivity also dramatically increases.Be mainly reflected in carborundum this
The thermal conductivity of kind carbide is higher than in general carbide（Such as boron carbide）, on the other hand, in general diamond surface carborundum
Each diamond surface coating layer thickness is difficult to be consistent in salt bath process with silicon coating thickness, and the addition of boron element can have first
The thickness of effect control diamond surface silicon coating, and during subsequently diamond-copper composite material is prepared, under boron copper high temperature
Less mutual solubility can prevent diamond surface element silicon with copper dissolving each other under long period high temperature, so as to prevent Buddha's warrior attendant
The peeling of stone surface carborundum-silicon coating, it is effectively guaranteed the interface cohesion integrality of composite.
（2）The density difference of diamond and copper is too big, during large-sized diamond-copper composite material is prepared,
In general preparation method such as conventional powder metallurgical, pressure infiltration are difficult the diamond-copper composite material for preparing stable homogeneous, and
By the design of metallic copper sheet material reserving hole, distribution of the diamond in metallic copper can be controlled well.
（3）Hardness in diamond-copper composite material sample due to diamond is larger, is difficult in follow-up sample processing
Solved with general mechanical processing toolses, processing technology is complicated at this stage, processing cost is larger；And by being reserved in sheet metal
The design of Working position, the technique for processing copper material at this stage can be used to process the composite, processing cost substantially reduces, and adds
Work technique is simple.
（4）The diamond-copper composite material thermal conductivity prepared using this technique is also had while may being up to 1800W/mK
Standby certain intensity and mechanical property.
Using
Diamond-metallic composite excellent performance of the present invention, expand the neck such as hot plate or packaging heat sink in high-heat-conductive composite material
Domain has good application prospect, such as encapsulation base material, fin etc..
The preparation of the diamond-copper composite material 1 of embodiment 1
The pretreatment of 1.1 diamond particles：By 2mm*2mm*1.3mm platy-monocrystal diamond, calcium chloride powder, 1 ~ 5 μm of grain
Silicon powder, the boron amorphous powder in mass ratio 10 in footpath：10：4：1 dispensing.Then calcium chloride powder is mixed with silicon powder, with height
The two is well mixed by fast batch mixer, and then load weighted boron powder is joined, is well mixed with high speed mixer.Will be mixed
Close uniform powder blend and diamond chip is installed with graphite crucible, be put into vacuum carbon tube furnace, vacuumize, carry out pressure ＜
10-1Pa, 1300 DEG C of high-temperature process 2 hours.After carbon shirt-circuiting furnace is cooled to room temperature, blending powder is taken out, with the leaching of hot water repeatedly
Bubble is rinsed and is ultrasonically treated, and removes unnecessary calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out unnecessary silica flour and
Boron powder, back and forth rinse and be ultrasonically treated using hot-water soak.Then after rinsing powder repeatedly with absolute ethyl alcohol, it is put into vacuum drying
Thoroughly dried in case.
Prepare diamond-copper composite material：（1）Four 2.5mm* are processed in 10mm*10mm*4mm red copper sheet materials
2.5mm*3mm hole, spacing 2mm between hole and hole；（2）Then described hole and position are put into the body of hole 1/3
Long-pending copper alloy powder, is then paved with scraper, is injected alcohol, is then put into the diamond lamellar body after above-mentioned 1.1 floating coat
In hole；（3）The copper mesh of 30 purposes is laid in above-mentioned copper plate surface, continues to be sprinkled with the powder filled copper mesh gap of copper alloy,
So that copper alloy powder keeps being uniformly distributed；（3）Above-mentioned diamond powder, sheet material are put into corresponding mould together with mould, risen
To 1100 DEG C, Stress control is incubated 1 hour and carries out hot pressed sintering in 40MPa temperature, after the completion of sintering, with after pressure head pressurize with stove
Room temperature is cooled to, the demoulding obtains diamond-copper composite material.Then it is quiet described diamond-copper composite material to be subjected to heat etc.
Pressure, technological parameter are 980 DEG C, time 100min；Pressure is 120MPa；The thermal conductivity of gained composite is 1010W/m
K。
The diamond-copper composite material 2 of embodiment 2
With embodiment 1, difference is：Diamond size is 3.0mm*3.0mm*1.5mm, in 10mm*10mm*4mm red copper sheet materials
On process four 3.5mm*3.5mm*3mm hole, spacing 1mm between hole and hole.
The thermal conductivity of the gained composite 2 of embodiment 2 is 1286W/mK.
The diamond-copper composite material 2 of embodiment 3
With embodiment 1, difference is：Diamond size is 8.0mm*8.0mm*1.5mm, in 10mm*10mm*3mm red copper sheet materials
On process 1 8.5mm*8.5mm*2mm hole.
The thermal conductivity of the gained composite 3 of embodiment 3 is 1806W/mK.
The preparation of the diamond-copper composite material 4 of embodiment 4
The pretreatment of 4.1 diamond particles：By 2mm*2mm*1.5mm platy-monocrystal diamond, calcium chloride powder, 1 ~ 5 μm of grain
Silicon powder, the boron amorphous powder in mass ratio 12 in footpath：12：5：1 dispensing.Then calcium chloride powder is mixed with silicon powder, with height
The two is well mixed by fast batch mixer, and then load weighted boron powder is joined, is well mixed with high speed mixer.Will be mixed
Close uniform powder blend and diamond chip is installed with graphite crucible, be put into vacuum carbon tube furnace, vacuumize, carry out 1350 DEG C
High-temperature process 2.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, blending powder is taken out, with the soaking flushing of hot water repeatedly and surpassed
Sonication, unnecessary calcium chloride is removed, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out unnecessary silica flour and boron powder, toward second mining
Rinsed and be ultrasonically treated with hot-water soak.Then after rinsing powder repeatedly with absolute ethyl alcohol, it is put into vacuum drying chamber and thoroughly dries
It is dry.
Prepare diamond-copper composite material：（1）256 3mm* will be processed in 80mm*80mm*4mm red copper sheet materials
3mm*3mm hole, spacing 2mm between hole and hole；（2）Then described hole and position are put into the volume of hole 1/3
Metal-powder, then paved with scraper, inject alcohol, the diamond lamellar body after above-mentioned 1.1 floating coat is then put into hole
In；（3）The copper mesh of 60 purposes is laid in above-mentioned copper plate surface, continues to be sprinkled with the powder filled copper mesh gap of copper alloy, make
Metal-powder is obtained to keep being uniformly distributed；（3）After the above-mentioned copper coin material filled with diamond powder, copper alloy powder is laminated, even
It is put into mould in corresponding mould, is warming up to 1100 DEG C, Stress control carries out hot pressed sintering, sintering for 2 hours in 50MPa, insulation
After the completion of, with room temperature is cooled to after pressure head pressurize with the furnace, the demoulding obtains diamond-copper composite material.Then by described Buddha's warrior attendant
Stone-carbon/carbon-copper composite material carries out high temperature insostatic pressing (HIP), and technological parameter is 960 DEG C, time 120min；Pressure is 100MPa, is made after processing
The thermal conductivity of the composite obtained is 885W/mK, tensile strength 352MPa.
The preparation of the diamond-copper composite material 5 of embodiment 5
The pretreatment of 5.1 diamond particles：By particle size 1.8mm single-crystal diamond powder, calcium chloride powder, 1 ~ 5 μm
Silicon powder, the boron amorphous powder in mass ratio 12 of particle diameter：12：5：1 dispensing.Then calcium chloride powder is mixed with silicon powder, used
The two is well mixed by high speed mixer, and then load weighted diamond powder, boron powder are joined, use high speed mixer
It is well mixed.Well mixed powder blend is installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes, is carried out
1250 DEG C of high-temperature process 2.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, blending powder is taken out, rushed with the immersion of hot water repeatedly
Wash and be ultrasonically treated, remove unnecessary calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out unnecessary silica flour and boron powder,
Back and forth rinse and be ultrasonically treated using hot-water soak.Then after rinsing powder repeatedly with absolute ethyl alcohol, it is put into vacuum drying chamber
Thoroughly drying.
Prepare diamond-copper composite material：（1）256 2mm* will be processed in 80mm*80mm*4mm red copper sheet materials
2mm*3mm hole；（2）Then described hole and position are put into a certain amount of metal-powder, then paved with scraper,
Alcohol is injected, then the diamond powder after above-mentioned 5.1 floating coat is put into hole；（3）The copper mesh of 60 purposes is laid in
Above-mentioned copper plate surface, continue to be sprinkled with certain metal-powder so that metal-powder keeps being uniformly distributed；（3）By above-mentioned filling
After the copper coin material stacking for having diamond powder, metal-powder, it is put into together with mould in corresponding mould, is warming up to 1100 DEG C, pressure
Control in 50MPa, be incubated 2 hours and carry out hot pressed sintering, after the completion of sintering, with room temperature is cooled to the furnace after pressure head pressurize, be stripped
Obtain diamond-copper composite material.Then described diamond-copper composite material is subjected to high temperature insostatic pressing (HIP), technological parameter is
1000 DEG C, time 100min；Pressure is 100MPa, and the thermal conductivity of obtained composite is 781W/mK after processing, tension
Intensity is 396MPa.
The preparation of 6 diamonds of embodiment-aluminium composite material 6
The pretreatment of 6.1 diamond particles：By 2mm*2mm*1.5mm platy-monocrystal diamond, calcium chloride powder, 1 ~ 5 μm of grain
Silicon powder, the boron amorphous powder in mass ratio 12 in footpath：12：5：1 dispensing.Then calcium chloride powder is mixed with silicon powder, with height
The two is well mixed by fast batch mixer, and then load weighted boron powder is joined, is well mixed with high speed mixer.Will be mixed
Close uniform powder blend and diamond chip is installed with graphite crucible, be put into vacuum carbon tube furnace, vacuumize, carry out 1100 DEG C
High-temperature process 1.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, blending powder is taken out, with the soaking flushing of hot water repeatedly and surpassed
Sonication, unnecessary calcium chloride is removed, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out unnecessary silica flour and boron powder, toward second mining
Rinsed and be ultrasonically treated with hot-water soak.Then after rinsing powder repeatedly with absolute ethyl alcohol, it is put into vacuum drying chamber and thoroughly dries
It is dry.
Prepare diamond-aluminium composite material：（1）256 3mm*3mm* will be processed on 80mm*80mm*4mm aluminium plates
3mm hole, spacing 2mm between hole and hole；（2）Then described hole and position are put into a certain amount of metal powder
Body, then paved with scraper, inject alcohol, then the diamond lamellar body after above-mentioned 1.1 floating coat is put into hole；（3）Will
The aluminium net of 60 purposes is laid in above-mentioned aluminium plate surface, continues to be sprinkled with certain aluminium alloy powder so that aluminium alloy powder is kept
It is uniformly distributed；（3）After the above-mentioned aluminium plate filled with diamond powder, metal-powder is laminated, respective mode is put into together with mould
In tool, 620 DEG C are warming up to, Stress control is incubated 2 hours and carries out hot pressed sintering, after the completion of sintering, with pressure head pressurize in 50MPa
After cool to room temperature with the furnace, the demoulding obtains diamond-aluminium composite material.Then described diamond-aluminium composite material is carried out
High temperature insostatic pressing (HIP), technological parameter are 640 DEG C, time 100min；Pressure is 120MPa；The thermal conductivity of obtained composite after processing
Rate is 795W/mK, tensile strength 302MPa.
7 diamonds of embodiment-aluminium composite material 7
With embodiment 6, difference is：Diamond size is 8.0mm*8.0mm*1.5mm, on 10mm*10mm*3mm aluminium plates
Process 1 8.5mm*8.5mm*2mm hole.
The thermal conductivity of the gained composite 3 of embodiment 3 is 1785W/mK.
The preparation of 8 diamonds of embodiment-aluminium composite material 8
The pretreatment of 8.1 diamond particles：By particle size 1.8mm single-crystal diamond powder, calcium chloride powder, 1 ~ 5 μm
Silicon powder, the boron amorphous powder in mass ratio 12 of particle diameter：12：5：1 dispensing.Then calcium chloride powder is mixed with silicon powder, used
The two is well mixed by high speed mixer, and then load weighted diamond powder, boron powder are joined, use high speed mixer
It is well mixed.Well mixed powder blend is installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes, is carried out
1150 DEG C of high-temperature process 1.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, blending powder is taken out, rushed with the immersion of hot water repeatedly
Wash and be ultrasonically treated, remove unnecessary calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out unnecessary silica flour and boron powder,
Back and forth rinse and be ultrasonically treated using hot-water soak.Then after rinsing powder repeatedly with absolute ethyl alcohol, it is put into vacuum drying chamber
Thoroughly drying.
Prepare diamond-aluminium composite material：（1）256 2mm*2mm* will be processed on 80mm*80mm*2mm aluminium plates
2mm hole, then this is merged with via aperture aluminium plate with 80mm*80mm*2mm；（2）Then will be above-mentioned
Diamond powder after 9.1 floating coats is put into hole；（3）The aluminium net of 60 purposes is laid in above-mentioned aluminium plate surface, continued
It is sprinkled with certain aluminium alloy powder so that metal-powder keeps being uniformly distributed；（3）By above-mentioned filled with diamond powder, metal
After the aluminium plate stacking of powder, it is put into together with mould in corresponding mould, is warming up to 630 DEG C, Stress control is small in 50MPa, insulation 1
Shi Jinhang hot pressed sinterings, after the completion of sintering, with room temperature is cooled to after pressure head pressurize with the furnace, the demoulding obtains diamond-aluminium composite wood
Material.Then described diamond-aluminium composite material is subjected to high temperature insostatic pressing (HIP), technological parameter is 600 DEG C, time 100min；Pressure
Power is 100MPa；The thermal conductivity of obtained composite is 682W/mK, tensile strength 398MPa after processing.
The preparation of 9 diamonds of embodiment-aluminium composite material 8
The pretreatment of 9.1 diamond particles：By particle size 1.8mm single-crystal diamond powder, calcium chloride powder, 1 ~ 5 μm
Silicon powder, the boron amorphous powder in mass ratio 12 of particle diameter：12：5：1 dispensing.Then calcium chloride powder is mixed with silicon powder, used
The two is well mixed by high speed mixer, and then load weighted diamond powder, boron powder are joined, use high speed mixer
It is well mixed.Well mixed powder blend is installed with graphite crucible, is put into vacuum carbon tube furnace, vacuumizes, is carried out
1150 DEG C of high-temperature process 1.5 hours.After carbon shirt-circuiting furnace is cooled to room temperature, blending powder is taken out, rushed with the immersion of hot water repeatedly
Wash and be ultrasonically treated, remove unnecessary calcium chloride, and mixture is crossed into 80 mesh, 30 mesh sieve, screen out unnecessary silica flour and boron powder,
Back and forth rinse and be ultrasonically treated using hot-water soak.Then after rinsing powder repeatedly with absolute ethyl alcohol, it is put into vacuum drying chamber
Thoroughly drying.
Prepare diamond-aluminium composite material：（1）256 2mm*2mm* will be processed on 80mm*80mm*4mm aluminium plates
3mm hole；（2）Then described hole and position are put into a certain amount of aluminium alloy powder, then paved with scraper, noted
Enter alcohol, then the diamond powder after above-mentioned 9.1 floating coat is put into hole；（3）The aluminium net of 60 purposes is laid in
Aluminium plate surface is stated, continues to be sprinkled with certain aluminium alloy powder so that metal-powder keeps being uniformly distributed；（3）By above-mentioned filling
After the aluminium plate stacking for having diamond powder, metal-powder, it is put into together with mould in corresponding mould, is warming up to 630 DEG C, pressure control
Make in 50MPa, be incubated 1 hour and carry out hot pressed sintering, after the completion of sintering, with room temperature is cooled to the furnace after pressure head pressurize, be stripped
To diamond-copper composite material.Then described diamond-aluminium composite material is subjected to high temperature insostatic pressing (HIP), technological parameter 600
DEG C, time 100min；Pressure is 100MPa；The thermal conductivity of obtained composite is 701W/mK after processing, tensile strength
For 416MPa.
10 diamonds of embodiment-aluminium composite material 10
With embodiment 8, difference is：When preparing diamond-aluminium composite material, the size of aluminium plate is changed into Φ 300mm*2mm, and
The hole 1500 that the size of certain order arrangement is Φ 2.5mm is gone out on aluminium plate, this is then carried into via aperture aluminium
Sheet material merges with Φ 300mm*2mm；Then sintering when by Stress control in 60MPa.The gained composite wood of embodiment 10
The thermal conductivity of material 10 is 615W/mK, tensile strength 432MPa.
The above embodiments are only the preferred technical solution of the present invention, and are not construed as the limitation for the present invention, this Shen
Please in embodiment and embodiment in feature in the case where not conflicting, can mutually be combined.The protection model of the present invention
Enclose the equivalent substitution side of technical characteristic in the technical scheme that should be recorded with claim, including the technical scheme of claim record
Case is protection domain.Equivalent substitution i.e. within this range is improved, also within protection scope of the present invention.
Claims (10)
- A kind of 1. diamond heat-conducting composite of easy processing, it is characterised in that：Described composite include metallic matrix with And the diamond particles on inside described matrix and/or surface are distributed in, which part or whole diamond particles pass through gold Hard rock surface carborundum-silicon boron composite coating is incorporated into the metallic matrix；The thermal conductivity of the composite is 600 ~ 1800W/mK；Thermal coefficient of expansion is≤15ppm/K；Described composite is easy Processing.
- 2. the diamond heat-conducting composite of easy processing according to claim 1, it is characterised in that：The metallic matrix material Matter includes copper or aluminium or its alloy.
- 3. the diamond heat-conducting composite of easy processing according to claim 2, it is characterised in that：Described diamond particles are graininess single-crystal diamond, and size is >=500 μm on the direction of diamond at least two；Described diamond particles are platy-monocrystal diamond, and diamond size is long and is wider than 1mm.
- A kind of 4. preparation method of the diamond heat-conducting composite of easy processing, it is characterised in that：Methods described includes following step Suddenly：（1）Diamond particle surfaces coating treatment：Diamond particle surfaces growth in situ carborundum-silicon boron composite coating, so as to Form diamond-silicon carbide-silicon boron complex；（2）It is prepared by diamond-metal matrix composite materials：Hole and groove are processed on metallic matrix, in described groove Position be selectively put into channel volume 1/3-1/2 metal base alloy powder, paved with scraper, inject alcohol, then Will be through step 1）Obtained diamond-silicon carbide-silicon boron complex is put into hole；Above metallic matrix after the treatment The wire netting in 1.5-2 times of aperture of metal base alloy powder size is placed, continues to be sprinkled with channel volume 1/6-1/5 metal base Alloy powder so that metal base alloy powder keeps being put into corresponding agglomerating plant together with mould after being uniformly distributed and prepared, and obtains To final diamond-metal-base composites；（3）To the step（2）Obtain diamond-metal matrix composite materials and carry out high temperature insostatic pressing (HIP)；Complete the preparation of the diamond heat-conducting composite of easy processing.
- 5. according to the method for claim 4, it is characterised in that：The step 1）Specifically include following steps：（1.1）According to thermal conductivity demand, select the diamond of suitable dimension size, and select comprising diamond particles, silica flour, The mixture of boron amorphous powder and calcium chloride；（1.2）In a vacuum or in hydrogen, the reducing atmosphere of argon gas or its combination gas or inert atmosphere, by step （1.1）Mixture carry out heating response, so as to form diamond-silicon carbide-silicon boron complex.
- 6. according to the method for claim 5, it is characterised in that：The step（1.1）In, the mixture is included according to weight The following components of gauge：30 ~ 50 parts of diamond；30 ~ 50 parts of calcium chloride；10 ~ 20 parts of silica flour；1 ~ 10 part of boron amorphous powder；Described step（1.2）Heating response condition is：1100 ~ 1350 DEG C of temperature, pressure ＜ 10-1Pa, 30 ~ 180 minutes time.
- 7. according to the method for claim 4, it is characterised in that：The step（2）Hole size be diamond-silicon carbide- 1.1 ~ 1.5 times of sizes of silicon boron complex size；The step（2）In prepared by diamond-metal matrix composite materials, when metal is aluminium, the system of diamond-aluminium composite material It is for condition：550 ~ 750 DEG C of temperature, 10 ~ 100MPa of pressure；The step（2）In prepared by diamond-metal matrix composite materials, when metal is copper, the system of diamond-copper composite material It is for condition：950 ~ 1200 DEG C of temperature, 10 ~ 100MPa of pressure；The step（2）In, calculated by the gross weight of diamond-silicon carbide-silicon silicon boron complex and metallic matrix, metallic matrix Shared mass fraction is 10 ~ 90wt%.
- 8. according to the method for claim 4, it is characterised in that：The step（3）The heat and other static pressuring processes parameter of diamond-aluminium composite material is：600 ~ 640 DEG C of temperature, pressure 80 ~ 120MPa；The heat and other static pressuring processes parameter of described diamond-copper composite material is：960 ~ 1020 DEG C of temperature, 80 ~ 120MPa of pressure.
- 9. a kind of product, it is characterised in that the diamond heat-conducting including the easy processing described in claim 1-3 any one is compound The diamond heat-conducting composite of easy processing prepared by the method described in material or the claim 4-8 any one.
- 10. the diamond heat-conducting composite of the easy processing described in claim 1-3 any one or the claim 4-8 appoint The diamond heat-conducting composite of easy processing prepared by the method described in meaning one is used for high-heat-conductive composite material and expands hot plate or envelope Fill heat sink use.
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| CN114437498A (en) * | 2022-01-27 | 2022-05-06 | 山野控制阀集团有限公司 | Diamond composite material and valve made of diamond composite material |
| CN117004925A (en) * | 2023-08-07 | 2023-11-07 | 深圳市博源碳晶科技有限公司 | Diamond aluminum nitride based composite material and preparation method thereof |
| CN117020209A (en) * | 2023-10-09 | 2023-11-10 | 赣州金顺科技有限公司 | Heat dissipation substrate and preparation method thereof |
| CN117020209B (en) * | 2023-10-09 | 2024-01-26 | 赣州金顺科技有限公司 | Heat dissipation substrate and preparation method thereof |
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