CN105624505A - Metal based superhard composite and preparation method thereof - Google Patents
Metal based superhard composite and preparation method thereof Download PDFInfo
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
- C22C1/051—Making hard metals based on borides, carbides, nitrides, oxides or silicides; Preparation of the powder mixture used as the starting material therefor
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C21/00—Alloys based on aluminium
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- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0068—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only nitrides
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/003—Cubic boron nitrides only
Abstract
The invention discloses a metal based superhard composite and belongs to the field of superhard composites. The metal based superhard composite is prepared from the following raw materials in percentage by weight: 20-68.8 percent of nano metal powder, 30-75 percent of coated diamond or/and coated cubic boron nitride powder and 0.2-5 percent of a wetting agent. The invention also discloses a preparation method of the metal based superhard composite. The preparation method comprises the following steps: mixing the nano metal powder, the superhard material powder and the wetting agent, and cold pressing to form a green body; and placing the green body in a vacuum or reducing atmosphere, and sintering, wherein the sintering temperature is higher than the melting point of the nano metal powder and lower than the inactive temperature of the superhard material. According to the metal based superhard composite prepared by the preparation method, the size proportion of the superhard material and metal can be accurately controlled, and thus thermophysical characteristic of the prepared metal based superhard composite can be accurately controlled, the production process is rapid, and equipment is simple; and meanwhile, the diamond or cBN breaking rate is lowered by adopting the coated superhard material.
Description
Technical field
The invention belongs to super-hard compound material field, the preparation method being specifically related to a kind of Metal Substrate super-hard compound material.
Background technology
Development along with China's electronic technology, requirement for electronic package material improves constantly, superhard material powder body as a new generation's electronic package material strengthens metal-base composites owing to possessing the thermophysical property of excellence and good mechanical performance, of great interest.
The application of electronic package material needs to consider two big Essential Performance Requirements, is first high thermal conductivity, it is achieved quickly transmitting of heat, it is ensured that chip can under desirable temperature conditions steady operation; Meanwhile, encapsulating material needs have regulatable thermal coefficient of expansion, thus keeping mating with chip and encapsulating material at different levels, reduces the harmful effect of thermal stress. Metal class wrapper material is good because having higher thermal conductivity, relatively low thermal coefficient of expansion and machining property, and is taken as most widely used core material, all has great importance in each period of electronic package material development. But along with high thermal conductivity material extensive uses industrially such as the development of nanometer technique and diamond, and the development of electronic package material starts to be developed to the direction of the superhard material compounds such as metal and diamond by metal material.
The fusing point of diamond is 3550 DEG C, and the fusing point of cBN is about 3300 DEG C. The graphitization of diamond starts from 1600 DEG C-1700 DEG C (invalid temperatures) in a vacuum, and the heat stability of cBN is (invalid temperature) up to 1550-1800 DEG C. Existing complex technique generally adopt infiltration method composite diamond in a metal prepare metal-base composites, the method has the disadvantage in that first diamond and wetting metal extreme difference, it is difficult to directly to prepare the composite of densification, also brings the problems such as impurity at high temperature causes that diamond breaks in the graphitization of diamond and diamond simultaneously; Secondly, infiltration method is affected by factors such as granular size, infiltration temperature and times, and production process is slow, and equipment is complicated; Additionally, adopt gas pressure infiltration there is also, the pressure of applying is less, impurity at high temperature causes diamond to break thus degradation problem under high hot thermal conductivity in diamond.
Therefore, work out a kind of metal class wrapper material with superior function of can preparing and there is huge economic implications.
Summary of the invention
It is an object of the invention to provide a kind of Metal Substrate super-hard compound material, it is provided that the preparation method of this Metal Substrate super-hard compound material is then another object of the present invention.
Based on above-mentioned purpose, the present invention by the following technical solutions: a kind of Metal Substrate super-hard compound material, the raw material of following percentage by weight be prepared from: Nano metal powder 20%-68.8%, superhard material powder body 30%-75% and wetting agent 0.2%-5%.
Preferably, described Nano metal powder is one or more the mixture in Al, Cu or Ag nano-powder, and granularity is 50nm-200nm.
Preferably, the granularity of described plated with gold hard rock and plating cubic boron nitride is 50nm-300 ��m.
Preferably, the coating of described superhard material powder body is nickel, copper, titanium or tungsten, and thickness of coating is 50nm-2 ��m.
Preferably, described wetting agent is one or more the mixture of Si, Ti, Mg, Fe, B, Cr, Mo or W.
The preparation method of described Metal Substrate super-hard compound material, comprises the steps: to be cold-pressed into idiosome after the mixing of Nano metal powder, superhard material powder body and wetting agent ball milling; Idiosome is placed in vacuum or reducing atmosphere and sinters, the sintering temperature fusing point higher than Nano metal powder, the invalid temperature lower than superhard material powder body.
Further, described Nano metal powder is Al powder, and sintering temperature is 680-950 DEG C, sintering time 1-3h.
Further, described Nano metal powder is Cu powder, and sintering temperature is 1100-1300 DEG C, sintering time 1-3h.
Further, described Nano metal powder is Ag powder, and sintering temperature is 980-1200 DEG C, sintering time 1-3h.
Further, cold pressing step adopts two-way compacting, and temperature is 15-35 DEG C, and pressure is 100-500MPa, pressurize 5-30s.
Diamond thermal conductivity up to 700-2000W/(m K), and thermal coefficient of expansion and density only have 1.0 �� 10-6K-1And 3.52g/cm3; CBN(cubic boron nitride) thermal conductivity be only second to diamond, up to 1300W/(m K), be 4-5 times of Cu and Ag, linear expansion coefficient is about 4.7 �� 10-6K-1. If diamond or cBN and metal dust compound being fully able to the requirement improving its thermal conductivity, low bulk.
Al, Cu and Ag fusing point respectively 660 DEG C, 1083 DEG C, 962 DEG C, thermal conductivity respectively 238,109,429W/(m K).
Compared with prior art, the invention have the advantages that
(1) present invention adopts diamond or the cBN of plating, after diamond or cBN surface carry out plating, stable enhanced primary treatment can be formed with parent metal or wetting agent by this layer of metal, improve the wettability of diamond or cBN and metal, thus the interface binding power improved between superhard material and metal, and then improve the thermal conductivity of material.
(2) carry out plating at diamond surface and can reduce the oxidized and graphited degree of diamond; Carry out plating on cBN surface and can reduce the oxidation under cBN high temperature and reversionization.
(3) compared with pressure infiltration method, the composite prepared by method provided by the invention can be accurately controlled the volume proportion of superhard material and metal, thus being accurately controlled the thermophysical property of the Metal Substrate super-hard compound material prepared, production process is fast, equipment is simple, adopts the superhard material of plating to reduce diamond or cBN rupture rate.
(4) with the addition of wetting agent in the present invention, the chemical bond that wetting agent is good with the biphase formation of composite, thus improving the interfacial structure of composite. Can also directly control the thickness of coating, structure by regulation and control plating parameter and become parameters such as being grouped into simultaneously, thus purposively optimizing composite material interface; And thickness of coating is beyond after 2 ��m, coating then can cause the hydraulic performance decline of superhard material, is unfavorable for improving the thermal conductivity meeting material.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in detail.
Comparative example 1
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: the granularity of 50% be the Cu nano-powder of 100nm, 49.5% the Si powder that granularity is 50 ��m of bortz powders (without coating) and 0.5%.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Cu nano-powder, bortz powder (without coating) and Si are mixed 4h by (1) in ball grinder, 15 DEG C, 250Mpa when two-way compacting 20s, make idiosome;
(2) idiosome is placed in after drying in 1100 DEG C of vacuum or reducing atmosphere and sinters 3h, obtain the composite of Cu base diamond.
The thermal conductivity of the composite of the Cu base diamond of comparative example 1 preparation is 425W/(m K after testing), thermal coefficient of expansion is 6.2 �� 10-6K-1��
Embodiment 1
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: the granularity of 50% be the Cu nano-powder of 100nm, 49.5% the Si powder that granularity is 50 ��m of plating Cu bortz powders and 0.5%, wherein thickness of coating is 80nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, comprises the steps: that (1) is by Cu nano-powder, plating Cu diamond with after Si mixes 4h in ball grinder, 15 DEG C, 250Mpa when two-way compacting 20s, make idiosome;
(2) idiosome is placed in after drying in 1100 DEG C of vacuum or reducing atmosphere and sinters 3h, obtain the composite of Cu base diamond.
The thermal conductivity of the composite of the Cu base diamond of embodiment 1 preparation is 535W/(m K after testing), thermal coefficient of expansion is 5.6 �� 10-6K-1, and add without compared with the diamond particles of coating, adding the thermal conductivity plating the composite prepared by Cu diamond and improve 110W/(m K nearly compared with comparative example 1), thermal coefficient of expansion reduces 0.4 �� 10-6K-1��
Embodiment 2
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of volumes below percentage ratio: 40% granularity be the Al nano-powder of 80nm, 59% the plating Ti bortz powder that granularity is 150 ��m and 1% Mg powder, wherein thickness of coating is 200nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Al nano-powder, plating Ti bortz powder and Mg powder are mixed 3h by (1) in ball grinder, at 35 DEG C, when 100MPa, two-way compacting 30s, makes idiosome;
(2) idiosome is placed in after drying in 680 DEG C of vacuum or reducing atmosphere and sinters 2h, obtain the composite of Al base diamond.
Embodiment 2 prepares the heat conductivity of Al base diamond after testing is 635W/(m K), thermal coefficient of expansion is 6.7 �� 10-6K-1. With add without compared with the diamond particles of coating, the thermal conductivity adding the composite prepared by diamond plating Ni improves 210W/(m K nearly compared with comparative example 1).
Embodiment 3
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: the granularity of 50% be the Ag nano-powder of 60nm, 49.8% granularity be the 100nm Si powder plating Ni bortz powder and 0.2%, wherein thickness of coating is 300nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Ag nano-powder, plating Ni bortz powder and Si powder are mixed 3h by (1) in ball grinder, at 20 DEG C, when 500Mpa, two-way compacting 10s, makes idiosome;
(2) idiosome is placed in after drying in 1000 DEG C of vacuum or reducing atmosphere and sinters 3h, obtain the composite of Ag base diamond.
Embodiment 3 prepares the heat conductivity of Ag base diamond after testing is 647W/(m K), thermal coefficient of expansion is 5.6 �� 10-6K-1. With add without compared with the diamond particles of coating, adding the thermal conductivity plating the composite prepared by Ni diamond and increase 220W/(m K nearly compared with comparative example 1), thermal coefficient of expansion reduces 0.6 �� 10-6K-1��
Embodiment 4
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: the granularity of 30% be the Cu nano-powder of 50nm, 69.8% the Si powder that granularity is 100 ��m of plating Ti bortz powders and 0.2%, wherein thickness of coating is 100nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, comprises the steps: that (1) is by Cu nano-powder, plating Ti diamond with after Si mixes 4h in ball grinder, 20 DEG C, 300Mpa when two-way compacting 10s, make idiosome;
(2) idiosome is placed in after drying in 1300 DEG C of vacuum or reducing atmosphere and sinters 1h, obtain the composite of Cu base diamond.
The thermal conductivity of the composite of the Cu base diamond of embodiment 4 preparation is 620W/(m K after testing), thermal coefficient of expansion is 5.1 �� 10-6K-1, and add without compared with the diamond particles of coating, the thermal conductivity adding plating composite prepared by Ti diamond adds about 200W/(m K compared with comparative example 1), thermal coefficient of expansion reduction about 1.0 �� 10-6K-1��
Embodiment 5
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: 20% granularity be the Al nano-powder of 200nm, 75% the plating Ni bortz powder that granularity is 100nm and 5% Mg powder, wherein thickness of coating is 50nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Al nano-powder, plating Ni bortz powder and Mg powder are mixed 3h by (1) in ball grinder, at 35 DEG C, when 100MPa, two-way compacting 30s, makes idiosome;
(2) idiosome is placed in after drying in 800 DEG C of vacuum or reducing atmosphere and sinters 2h, obtain the composite of Al base diamond.
Embodiment 5 prepares the heat conductivity of Al base diamond after testing is 524W/(m K), thermal coefficient of expansion is 6.5 �� 10-6K-1. With add without compared with the diamond particles of coating, the thermal conductivity adding the composite prepared by diamond plating Ni promotes about 100W/(m K compared with comparative example 1).
Embodiment 6
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: 40% granularity be the Cu nano-powder of 200nm, 59.5% the cBN powder of the plating Wu that granularity is 150 ��m and 0.5% Fe powder, wherein thickness of coating is 100nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Cu nano-powder, plating WucBN powder and Fe powder are mixed 3h by (1) in ball grinder, at 35 DEG C, when 100MPa, two-way compacting 30s, makes idiosome;
(2) idiosome is placed in after drying in 1300 DEG C of vacuum or reducing atmosphere and sinters 1.5h, obtain the composite of Cu base cBN.
The heat conductivity of the Cu base cBN of embodiment 6 preparation is 496W/(m K after testing), thermal coefficient of expansion is 5.9 �� 10-6K-1��
Embodiment 7
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: 45% granularity be the Al nano-powder of 100nm, the plating cBN powder of Ti that granularity is 50nm of 54.4%, the B powder of 0.3% and 0.3% Mo powder, wherein thickness of coating is 500nm.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Al nano-powder, plating TicBN powder and B+Mo powder are mixed 3h by (1) in ball grinder, at 20 DEG C, when 300MPa, two-way compacting 20s, makes idiosome;
(2) idiosome is placed in after drying in 950 DEG C of vacuum or reducing atmosphere and sinters 3h, obtain the composite of Al base cBN.
Embodiment 7 prepares the heat conductivity of Al base cBN after testing is 615W/(m K), thermal coefficient of expansion is 7.0 �� 10-6K-1��
Embodiment 8
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: 68.8% granularity be the Ag nano-powder of 60nm, 30% the cBN powder of the plating Cu that granularity is 300 ��m and 0.2% Ni powder, wherein thickness of coating is 1.5 ��m.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Ag nano-powder, the cBN powder plating Cu and Ni powder are mixed 3h by (1) in ball grinder, at 35 DEG C, when 100MPa, two-way compacting 30s, makes idiosome;
(2) idiosome is placed in after drying in 980 DEG C of vacuum or reducing atmosphere and sinters 3h, obtain the composite of Ag base cBN.
Embodiment 8 prepares the heat conductivity of Ag base cBN after testing is 465W/(m K), thermal coefficient of expansion is 5.4 �� 10-6K-1��
Embodiment 9
A kind of Metal Substrate super-hard compound material, be prepared from by the raw material of following percentage by weight: 25% granularity is the Ag nano-powder of 80nm, 25% granularity be the Cu nano-powder of 80nm, 49.5% the cBN powder of the plating Ni that granularity is 500nm and 0.2% Ti+Ni powder, wherein thickness of coating is 500m.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Ag nano-powder, Cu nano-powder, the cBN powder plating Ni and Ti+Ni powder are mixed 3h by (1) in ball grinder, at 35 DEG C, when 100MPa, two-way compacting 30s, makes idiosome;
(2) idiosome is placed in after drying in 650 DEG C of vacuum or reducing atmosphere and sinters 3h, obtain the composite of Ag/Cu base cBN.
Embodiment 9 prepares the heat conductivity of Ag/Cu base cBN after testing is 582W/(m K), thermal coefficient of expansion is 5.2 �� 10-6K-1��
Embodiment 10
A kind of Metal Substrate super-hard compound material, is prepared from by the raw material of following percentage by weight: 60% granularity be the Ag nano-powder of 150nm, 39.8% the cBN powder of the plating Ni that granularity is 800nm and 0.2% Cr+Wu powder, wherein thickness of coating is 2 ��m.
The preparation method of above-mentioned Metal Substrate super-hard compound material, after comprising the steps: that Ag nano-powder, the cBN powder plating Ni and Cr+Wu powder are mixed 3h by (1) in ball grinder, at 35 DEG C, when 200MPa, two-way compacting 30s, makes idiosome;
(2) idiosome is placed in after drying in 1200 DEG C of vacuum or reducing atmosphere and sinters 2h, obtain the composite of Ag base cBN.
Embodiment 10 prepares the heat conductivity of Ag base cBN after testing is 625W/(m K), thermal coefficient of expansion is 5.5 �� 10-6K-1��
From the result of embodiment 1-10, although the thermal conductivity of cBN is slightly below diamond, but cBN heat-resisting quantity and chemical inertness are superior to diamond, therefore when there being use high-heat-conductive composite material under the hot environment contacted with ferrous material, it is possible to select and do, with cBN, the composite that compound system is standby.
Claims (10)
1. a Metal Substrate super-hard compound material, it is characterised in that be prepared from by the raw material of following percentage by weight: Nano metal powder 20%-68.8%, plated with gold hard rock are or/and plating cubic boron nitride powder body 30%-75% and wetting agent 0.2%-5%.
2. Metal Substrate super-hard compound material according to claim 1, it is characterised in that described Nano metal powder is one or more the mixture in Al, Cu or Ag nano-powder, and granularity is 50nm-200nm.
3. Metal Substrate super-hard compound material according to claim 1 and 2, it is characterised in that the granularity of described plated with gold hard rock and plating cubic boron nitride is 50nm-300 ��m.
4. Metal Substrate super-hard compound material according to claim 3, it is characterised in that the coating of described superhard material powder body is nickel, copper, titanium or tungsten, and thickness of coating is 50nm-2 ��m.
5. Metal Substrate super-hard compound material according to claim 1, it is characterised in that described wetting agent is one or more the mixture of Si, Ti, Mg, Fe, B, Cr, Mo or W.
6. the preparation method of the arbitrary described Metal Substrate super-hard compound material of claim 1-5, it is characterised in that comprise the steps: to be cold-pressed into idiosome after the mixing of Nano metal powder, superhard material powder body and wetting agent ball milling; Idiosome is placed in vacuum or reducing atmosphere and sinters, the sintering temperature fusing point higher than Nano metal powder, the invalid temperature lower than superhard material powder body.
7. the preparation method of Metal Substrate super-hard compound material according to claim 6, it is characterised in that described Nano metal powder is Al powder, and sintering temperature is 680-950 DEG C, sintering time 1-3h.
8. the preparation method of Metal Substrate super-hard compound material according to claim 6, it is characterised in that described Nano metal powder is Cu powder, and sintering temperature is 1100-1300 DEG C, sintering time 1-3h.
9. the preparation method of Metal Substrate super-hard compound material according to claim 6, it is characterised in that described Nano metal powder is Ag powder, and sintering temperature is 980-1200 DEG C, sintering time 1-3h.
10. the preparation method of Metal Substrate super-hard compound material according to claim 6, it is characterised in that cold pressing step adopts two-way compacting, and temperature is 15-35 DEG C, and pressure is 100-500MPa, pressurize 5-30s.
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| CN106086760A (en) * | 2016-08-19 | 2016-11-09 | 富耐克超硬材料股份有限公司 | Wear-resisting composite coating and its preparation method and application |
| CN106119763A (en) * | 2016-08-19 | 2016-11-16 | 富耐克超硬材料股份有限公司 | Superhard composite coating layer cutter and preparation method thereof |
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| CN107761025A (en) * | 2017-11-04 | 2018-03-06 | 柏涛涛 | A kind of sheet material of high intensity and preparation method thereof |
| CN110280756A (en) * | 2019-07-15 | 2019-09-27 | 石家庄海川工具有限公司 | Add the diamond engineering thin-walled drill and its preparation process of cubic boron nitride |
| CN112159231A (en) * | 2020-10-09 | 2021-01-01 | 武汉理工大学 | Rapid preparation method of super-hard light diamond-B4C-SiC ternary composite ceramic |
| CN115427599A (en) * | 2020-03-24 | 2022-12-02 | 住友电气工业株式会社 | Composite material and heat dissipation member |
| CN117409898A (en) * | 2023-10-24 | 2024-01-16 | 延边大学 | Composite polycrystalline superhard material and preparation method thereof |
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| CN112159231A (en) * | 2020-10-09 | 2021-01-01 | 武汉理工大学 | Rapid preparation method of super-hard light diamond-B4C-SiC ternary composite ceramic |
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