CN114479676A - Low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass and preparation method thereof - Google Patents
Low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass and preparation method thereof Download PDFInfo
- Publication number
- CN114479676A CN114479676A CN202210227198.1A CN202210227198A CN114479676A CN 114479676 A CN114479676 A CN 114479676A CN 202210227198 A CN202210227198 A CN 202210227198A CN 114479676 A CN114479676 A CN 114479676A
- Authority
- CN
- China
- Prior art keywords
- abrasive
- content
- nano
- polishing solution
- optical glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass, which comprises the following components in percentage by weight: the method comprises the following steps of (1) adjusting the pH of polishing slurry to 6-7 by using a nano abrasive, a dispersing agent, a synergist, a suspending agent, a defoaming agent and distilled water; the nano abrasive comprises one or more of cerium oxide, lanthanum oxide and zirconium oxide, and when the nano abrasive is one, the nano abrasive is cerium oxide; according to the mass percentage, the content of cerium oxide in the nano abrasive is 2.5-4%, the content of lanthanum oxide is 0-0.5%, the content of zirconium oxide is 0-0.3%, and the particle size range is 100nm-500 nm. The invention reduces the use of rare earth oxide and organic matter, and has the characteristics of green water-based environment protection and low economic cost.
Description
Technical Field
The invention relates to the field of precision processing of optical glass. More specifically, the invention relates to a low-abrasive-content and weakly acidic polishing solution for ultraprecision processing of optical glass and a preparation method thereof.
Background
The precision optical glass is widely applied to the fields of aerospace, deep space exploration, nuclear energy industry, precision electronic instruments and the like. The optical glass material has high brittleness and low fracture toughness, and is generally manufactured by the procedures of ultra-precise grinding processing, ultra-precise polishing processing and the like, and finally the surface shape precision is better than 0.1 mu m, the surface roughness Ra is better than 10nm, and the surface flaw and the subsurface damage are very little.
The chemical mechanical polishing solution for the optical glass processing technology mainly comprises the following components: SiO 22Polishing solution and CeO2Polishing liquid and Al2O3And (4) polishing solution. SiO 22The polishing solution is a metal ion type polishing solution, is mainly applied to high-precision polishing of silicon wafers, precise optical elements, compound crystals and the like, and adopts colloidal particles with larger granularity, SiO with larger concentration and pH value within the range of 10.5-11.52The polishing liquid has good polishing effect. Al (Al)2O3The polishing solution is widely used in the precise polishing field of microcrystalline glass substrates, optical lenses and the like, but Al2O3High hardness of (2) easily causes damage to the surface of a workpiece to be machined, and Al2O3The high surface energy of the particles tends to agglomerate them and to cause defects in the surface of the work piece being processed, often requiring surface modification. CeO (CeO)2The polishing solution has high selectivity, can effectively improve the surface quality of a processed workpiece by reasonably matching with the processes of rough polishing and fine polishing, and becomes a common abrasive for polishing optical glass. However, the existing polishing solution is usually prepared by using a slightly alkaline solution system (CN201110228844.8, CN200510078963.4) to improve the dispersibility of micro-or nano-particles, and the polishing slurry is prepared by using an abrasive with a large specific gravity (CN 201811081283.1, CN201510995356.8) to improve the surface removal efficiency. Because the alkaline solution is easy to generate chemical erosion on the precision optical glass, the high-component abrasive is also easy to damage the surface of the optical glass, the use cost of the polishing solution is increased, and the chemical polishing solution which is a slightly acidic system and has low abrasive and high polishing performance is developed and is more suitable for the requirements of the reliability and the precision processing performance of the optical glass.
Disclosure of Invention
The invention aims to provide a low-abrasive-content and weak-acid polishing solution for ultraprecise processing of optical glass and a preparation method thereof, which can reduce the use of rare earth oxides and organic matters and have the characteristics of water-based environmental protection and low economic cost.
The technical scheme adopted by the invention for solving the technical problem is as follows: a low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass comprises: the method comprises the following steps of (1) adjusting the pH of polishing slurry to 6-7 by using a nano abrasive, a dispersing agent, a synergist, a suspending agent, a defoaming agent and distilled water;
the nano abrasive comprises one or more of cerium oxide, lanthanum oxide and zirconium oxide, and when the nano abrasive is one, the nano abrasive is cerium oxide; according to the mass percentage, the content of cerium oxide in the nano abrasive is 2.5-4%, the content of lanthanum oxide is 0-0.5%, the content of zirconium oxide is 0-0.3%, and the particle size range is 100nm-500 nm.
Preferably, the nano abrasive is prepared by mixing nano-particle abrasives with single particle size or nano-particle abrasives with compound particle size.
Preferably, when mixing with a compounded size of the nanoparticle abrasive, the size scales are kept at a certain difference, for example, 200nm and 500 nm.
Preferably, the purity of the nano cerium oxide is 65-99.99%.
Preferably, the purity of the nano cerium oxide is 99.9%.
Preferably, the dispersant comprises one or more of 0.5% to 1.5% polyethylene glycol, 8% to 12% polyacrylic acid, 2% to 5% sodium hexametaphosphate.
Preferably, the polyethylene glycol has a molecular weight of 2000, and polyacrylic acid having a molecular weight of 300 ten thousand accounts for 30% of the total mass of the polyacrylic acid.
Preferably, the synergist comprises 0.5% to 1% sodium chloride and 0.5% to 1% sodium fluoride.
Preferably, the suspending agent comprises one or more of sodium polyacrylate in an amount of 0.1% to 0.3%, polyacrylamide in an amount of 0.1% to 0.3%.
Preferably, the pH adjuster is sodium hydroxide.
Preferably, the polishing solution comprises the following components in percentage by mass:
the nano abrasive is one or more of 2.5-4% of cerium oxide, 0-0.5% of lanthanum oxide and 0-0.3% of zirconium oxide;
the dispersant is one or more of 0.5 to 1.5 percent of polyethylene glycol, 8 to 12 percent of polyacrylic acid and 2 to 5 percent of sodium hexametaphosphate;
the synergist is 0.5-1% of sodium chloride and 0.5-1% of sodium fluoride;
the suspending agent is one or more of 0.1-0.3% of sodium polyacrylate and 0.1-0.3% of polyacrylamide;
the defoaming agent is 0.1-0.3% of alkylphenol polyoxyethylene ether;
the balance of distilled water.
The invention also provides a preparation method of the low-abrasive-content and weak-acidic polishing solution for the ultraprecise processing of the optical glass, which comprises the following steps: adding part of distilled water into the container A filled with the dispersing agent, and stirring by magnetic force until the dispersing agent is completely dissolved; then adding the nano abrasive, the synergist, the suspending agent and the defoaming agent into the container A in sequence, and adding the balance of distilled water while stirring; slowly adding a small amount of sodium hydroxide to dissolve in the solution, and adjusting the pH value of the whole polishing slurry to be within the range of 6-7; and then transferring the container A into a device B with an ultrasonic dispersion function to stir for 2 to 5 hours, and controlling the water temperature in the device B to be not more than 45 ℃. Preferably, the longer the ultrasonic time and the mechanical stirring action time, the better the dispersibility, the smaller the measured dispersion particle size of the polishing solution, and the optimal ultrasonic stirring dispersion time is 3 hours as verified by experiments.
The invention at least comprises the following beneficial effects: the invention strictly screens the size, purity and addition of the nano abrasive by investigating the comprehensive properties of the polishing solution such as dispersion average particle size, Zeta potential, rotational viscosity, suspension property, pH and the like, prepares the polishing solution with a weak acid system and low abrasive material and high polishing performance, is suitable for improving the requirements of the chemical and mechanical polishing reliability and precision processing performance of the surface of optical glass, meets the requirements of reducing the residual surface appearance, the sub-surface layer and the process defects of an optical element, and improves the smooth and clean effect of the surface. The polishing solution reduces the use of rare earth oxides and organic matters, and has the characteristics of green water-based environment protection, low economic cost and utilization.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
FIG. 1 is a graph showing the dispersion of a polishing solution prepared by using 65% pure nano-cerium oxide in accordance with example 1 of the present invention as a function of ultrasonic stirring time;
FIG. 2 is a graph showing the relationship between the dispersibility of the polishing solution prepared by using nano cerium oxide having a purity of 99.9% and the ultrasonic stirring time according to the present invention;
FIG. 3 is a graph showing the relationship between the dispersibility of the polishing solution prepared by using nano cerium oxide having a purity of 99.99% and the ultrasonic stirring time according to the present invention;
FIG. 4 is a graph showing the relationship between the dispersion and the preparation of polishing solutions using cerium oxides of different nano-sizes according to the present invention;
FIG. 5 is a scanning electron micrograph of a polishing material according to example 1 of the present invention;
FIG. 6 is a graph showing the energy spectrum of the polishing slurry of example 1 of the present invention;
FIG. 7 is a diagram showing the elemental composition of the polishing material in example 1 of the present invention;
FIG. 8 is a scanning electron micrograph of a polishing material according to example 2 of the present invention;
FIG. 9 is a graph of the energy spectrum of the polishing slurry of example 2 of the present invention;
FIG. 10 is a diagram showing the elemental composition of the polishing material in example 2 of the present invention;
FIG. 11 is a scanning electron micrograph of a polishing material according to comparative example 1 of the present invention;
FIG. 12 is an energy spectrum of a polishing material of comparative example 1 of the present invention;
FIG. 13 is a diagram showing the elemental composition of the polishing material of comparative example 1 of the present invention;
Detailed Description
The present invention will be described in detail and fully with reference to the following examples. Those skilled in the art will be able to practice the invention based on these descriptions. Before the present invention is described with reference to the following examples, it should be noted that: the technical solutions and features provided in the present invention in the respective sections including the following description may be combined with each other without conflict.
Moreover, the embodiments of the present invention described in the following description are generally only some embodiments of the present invention, and not all embodiments. Therefore, all other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative effort shall fall within the protection scope of the present invention.
Example 1
The polishing solution is composed of 4% by mass of cerium oxide (cerium oxide powder with the purity of 65% is selected, and the particle size of the cerium oxide powder is 500nm), 0.2% of lanthanum oxide, 0.5% of polyethylene glycol, 8% of polyacrylic acid and 2% of sodium hexametaphosphate; 0.5% -sodium chloride, 0.5% sodium fluoride, 0.3% sodium polyacrylate, 0.3% polyacrylamide, 0.1% alkylphenol polyoxyethylene, and the balance of water, as shown in fig. 5-7, which are a scanning electron microscope image, an energy spectrum image and an element composition image of the polishing solution.
Example 2
The polishing solution is composed of one or more of 1.5% by mass of cerium oxide (cerium oxide powder with the purity of 99.9% is selected, and the particle size of the cerium oxide powder is 200nm), 2.5% by mass of cerium oxide (cerium oxide powder with the purity of 99.9% is selected, and the particle size of the cerium oxide powder is 500nm), 0.5% by mass of lanthanum oxide, and 0.3% by mass of zirconium oxide; the polishing solution comprises 1% of polyethylene glycol, 10% of polyacrylic acid, 5% of sodium hexametaphosphate, 0.5% of sodium chloride, 0.5% of sodium fluoride, 0.2% of sodium polyacrylate, 0.2% of polyacrylamide, 0.1% of alkylphenol polyoxyethylene, and the balance of water, and is shown in figures 8-10, which are a scanning electron microscope image, an energy spectrum image and an element composition image of the polishing solution. Example 3
The polishing solution is composed of 3% by mass of cerium oxide (cerium oxide powder with purity of 99.99% is selected, and the particle size of the cerium oxide powder is 500nm), 0.5% of lanthanum oxide and 0.5% of zirconium oxide; 0.5% of polyethylene glycol, 8% of polyacrylic acid, 2% of sodium hexametaphosphate, 1% of sodium chloride and 0.5% of sodium fluoride; 0.3 percent of sodium polyacrylate, 0.3 percent of polyacrylamide, 0.3 percent of alkylphenol polyoxyethylene, and the balance of water.
The polishing solution of example 4 comprises 4 wt% of cerium oxide (cerium oxide powder with a purity of 99.9% is selected, and the particle size is 200-500nm), 0.2 wt% of lanthanum oxide, 0.5 wt% of polyethylene glycol, 8 wt% of polyacrylic acid, and 2 wt% of sodium hexametaphosphate; 0.5 percent of sodium chloride, 0.5 percent of sodium fluoride, 0.3 percent of sodium polyacrylate, 0.3 percent of polyacrylamide, 0.1 percent of alkylphenol polyoxyethylene ether and the balance of water.
Test detection
1. Relation between nano cerium oxide dispersibility and ultrasonic stirring dispersion time
In the preparation process of the polishing solution of example 1, part of distilled water is added into a container A containing a dispersing agent, and the mixture is stirred by magnetic force until the mixture is completely dissolved; then adding the nano abrasive, the synergist, the suspending agent and the defoaming agent into the container A in sequence, and adding the balance of distilled water while stirring; slowly adding a small amount of sodium hydroxide to dissolve in the solution, and adjusting the pH value of the whole polishing slurry to be within the range of 6-7; and then transferring the container A into a device B with an ultrasonic dispersion function for stirring, controlling the water temperature in the device B to be not more than 45 ℃, and performing detection on dispersion degree and dispersion particle size by the device B with the ultrasonic dispersion function when the time is 1h, 1.5h, 2h, 2.5h, 3h and 3.5h, wherein the dispersion proportion (namely the dispersion degree) is approximately increased along with the increase of the dispersion time, the agglomeration amount is reduced, and the particle size is approximately decreased as shown in figure 1. The method is caused by the action of long-time ultrasonic and mechanical stirring, and after 3.5 hours of stirring, the dispersion degree is better to be more than 90 percent in 3 hours, the size of the dispersed particle size reaches about 230nm, the agglomeration amount is less than 10 percent, and the particle size of the powder is reduced and the agglomeration amount is increased due to overlong time.
2. Relation between purity and dispersibility of nano cerium oxide
Polishing solution of the polishing solution of example 2 in the preparation process, part of distilled water was added to the container a containing the dispersant, and stirred by magnetic force until it was completely dissolved; then adding the nano abrasive, the synergist, the suspending agent and the defoaming agent into the container A in sequence, and adding the balance of distilled water while stirring; slowly adding a small amount of sodium hydroxide to dissolve in the solution, and adjusting the pH value of the whole polishing slurry to be within the range of 6-7; and then transferring the container A into a device B with an ultrasonic dispersion function for stirring, controlling the water temperature in the device B to be not more than 45 ℃, and stirring by the device B with the ultrasonic dispersion function for detecting the dispersion degree and the dispersed particle size within 1h, 1.5h, 2h, 2.5h and 3h, wherein the purity of the selected nano cerium oxide is 99.9%, the particle size is 500 nanometers, the powder content is 3%, and the ultrasonic time is 3h, so that the particle size is reduced and the dispersion degree is increased along with the increase of the time as shown in figure 2. After three hours of dispersion, the dispersion degree reaches 80 percent, the agglomeration degree is 20 percent, and the particle size is about 250 nm.
Polishing solution of the polishing solution of example 3 in the preparation process, part of distilled water was added to the container a containing the dispersant and stirred by magnetic force until it was completely dissolved; then adding the nano abrasive, the synergist, the suspending agent and the defoaming agent into the container A in sequence, and adding the balance of distilled water while stirring; slowly adding a small amount of sodium hydroxide to dissolve in the solution, and adjusting the pH value of the whole polishing slurry to be within the range of 6-7; and then transferring the container A into a device B with an ultrasonic dispersion function for stirring, controlling the water temperature in the device B to be not more than 45 ℃, and stirring by the device B with the ultrasonic dispersion function for 1 hour, 1.5 hours, 2 hours, 2.5 hours and 3 hours to detect the dispersion degree and the dispersion particle size, wherein the result is shown in figure 3, and cerium oxide powder with the particle size of 500nm and the purity of 99.99 percent is selected, and the powder content is 3 percent. The dispersion degree is gradually increased along with the increase of the dispersion time, the agglomeration amount is reduced, and the particle size is gradually reduced. The method is caused by the action of long-time ultrasonic and mechanical stirring, and the dispersion degree reaches over 70 percent, the size of the dispersed particle size reaches about 290nm and the agglomeration amount is 30 percent after stirring for three hours.
3. Relation between size and dispersibility of cerium oxide powder
Example 4 cerium oxide powder in the polishing solution was selected to have particle sizes of 200nm, 300nm, 400nm, and 500nm for testing, and the detection result is shown in fig. 4, where the cerium oxide powder has a purity of 99.99% and a content of 3%, and the dispersion time is 3 hours, the dispersion amount gradually increases with the increase of the particle size of the powder, the dispersion particle size gradually increases, and the dispersion amount reaches 80% in the case of particle sizes of 300nm and 500nm, the dispersion effect is good, and the dispersion particle sizes are 220nm and 320nm, respectively.
4. The performance index test of the optical glass polishing solution was carried out by using the polishing solution A as example 1, B as example 2 and C as comparative example (the main alkaline polishing solution in the market), as shown in Table 1.
5. FIGS. 11 to 13 show a commercially available polishing solution corresponding to comparative example 1, which mainly comprises 30% by mass of cerium oxide (purity: 65%), 5% by mass of lanthanum oxide, 5% by mass of zirconium oxide, and 3% by mass of aluminum oxide, wherein the ratio of the weight of cerium oxide to the weight of a dispersant is 26.7 to 40.0 or 53.8 to 80, and water, and has a pH of 9 to 13.
6. The polishing solution prepared in the embodiment 1-4 of the invention is used for polishing aspheric optical fused quartz glass, the surface roughness of the glass can reach 1-5 microns through the early-stage grinding process, and the removal efficiency is 0.1-30 mm by matching with the airbag type polishing technology3Min, surface roughness of 1-10 nm.
While embodiments of the invention have been described above, it is not intended to be limited to the details shown, particular embodiments, but rather to those skilled in the art, and it is to be understood that the invention is capable of numerous modifications and that various changes may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (10)
1. A low-abrasive content and weak-acidic polishing solution for ultraprecise processing of optical glass is characterized by comprising the following components in percentage by weight: the polishing slurry comprises a nano abrasive, a dispersing agent, a synergist, a suspending agent, a defoaming agent and distilled water, and the pH of the polishing slurry is adjusted to 6-7;
the nano abrasive comprises one or more of cerium oxide, lanthanum oxide and zirconium oxide, and when the nano abrasive is one, the nano abrasive is cerium oxide; according to the mass percentage, the content of cerium oxide in the nano abrasive is 2.5-4%, the content of lanthanum oxide is 0-0.5%, the content of zirconium oxide is 0-0.3%, and the particle size range is 100nm-500 nm.
2. The low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass according to claim 1, wherein the nano abrasive is prepared by mixing nano-particle abrasives of a single particle size or nano-particle abrasives of a compound particle size.
3. The low abrasive content and weakly acidic polishing solution for ultraprecision processing of optical glass according to claim 1, wherein the purity of the nano cerium oxide is 65% to 99.99%.
4. The low abrasive content and weakly acidic polishing solution for ultraprecision processing of optical glass according to claim 3, wherein the purity of the nano cerium oxide is 99.9%.
5. The low abrasive content and weakly acidic polishing solution for ultraprecise processing of optical glass according to claim 1, wherein the dispersant comprises one or more of 0.5% to 1.5% of polyethylene glycol, 8% to 12% of polyacrylic acid, and 2% to 5% of sodium hexametaphosphate.
6. The low abrasive content and weakly acidic polishing solution for ultraprecision processing of optical glass according to claim 1, wherein the synergist comprises 0.5% to 1% of sodium chloride and 0.5% to 1% of sodium fluoride.
7. The low abrasive content and weakly acidic polishing solution for ultraprecision processing of optical glass according to claim 1, wherein the suspending agent comprises one or more of 0.1% to 0.3% of sodium polyacrylate and 0.1% to 0.3% of polyacrylamide.
8. The low abrasive content and weakly acidic polishing solution for ultraprecision processing of optical glass according to claim 1, wherein the pH adjustor is sodium hydroxide.
9. The low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass according to claim 1, wherein the polishing solution comprises the following components in percentage by mass:
the nano abrasive is one or more of 2.5-4% of cerium oxide, 0-0.5% of lanthanum oxide and 0-0.3% of zirconium oxide;
the dispersant is one or more of 0.5 to 1.5 percent of polyethylene glycol, 8 to 12 percent of polyacrylic acid and 2 to 5 percent of sodium hexametaphosphate;
the synergist is 0.5-1% of sodium chloride and 0.5-1% of sodium fluoride;
the suspending agent is one or more of 0.1-0.3% of sodium polyacrylate and 0.1-0.3% of polyacrylamide;
the defoaming agent is 0.1-0.3% of alkylphenol polyoxyethylene ether;
the balance of distilled water.
10. A method for preparing the low abrasive content and weakly acidic polishing solution for the ultra-precision machining of optical glass according to any one of claims 1 to 9, comprising: adding part of distilled water into the container A filled with the dispersing agent, and stirring by magnetic force until the dispersing agent is completely dissolved; then adding the nano abrasive, the synergist, the suspending agent and the defoaming agent into the container A in sequence, and adding the balance of distilled water while stirring; slowly adding a small amount of sodium hydroxide to dissolve in the solution, and adjusting the pH of the whole polishing slurry to be within the range of 6-7; and then transferring the container A into a device B with an ultrasonic dispersion function to stir for 2 to 5 hours, and controlling the water temperature in the device B to be not more than 45 ℃.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210227198.1A CN114479676B (en) | 2022-03-08 | 2022-03-08 | Low-abrasive content and weak-acidity polishing solution for ultra-precise processing of optical glass and preparation method thereof |
| PCT/CN2022/086480 WO2023168780A1 (en) | 2022-03-08 | 2022-04-13 | Polishing solution having low abrasive material content and weak acidity for ultra-precise machining of optical glass, preparation method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210227198.1A CN114479676B (en) | 2022-03-08 | 2022-03-08 | Low-abrasive content and weak-acidity polishing solution for ultra-precise processing of optical glass and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114479676A true CN114479676A (en) | 2022-05-13 |
| CN114479676B CN114479676B (en) | 2023-04-21 |
Family
ID=81485903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210227198.1A Active CN114479676B (en) | 2022-03-08 | 2022-03-08 | Low-abrasive content and weak-acidity polishing solution for ultra-precise processing of optical glass and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114479676B (en) |
| WO (1) | WO2023168780A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115627153A (en) * | 2022-10-19 | 2023-01-20 | 中国兵器科学研究院宁波分院 | Water-based grinding fluid for boron carbide ceramic balls and preparation method thereof |
| CN116042098A (en) * | 2023-02-08 | 2023-05-02 | 广东粤港澳大湾区黄埔材料研究院 | Nano alumina polishing solution and application thereof in polishing of infrared chalcogenide glass |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070099427A1 (en) * | 2005-10-14 | 2007-05-03 | Lg Chem, Ltd. | Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same |
| TW200846430A (en) * | 2007-05-16 | 2008-12-01 | Cabot Microelectronics Corp | Glass polishing compositions and methods |
| CN106479371A (en) * | 2016-08-15 | 2017-03-08 | 惠州市米特仑科技有限公司 | A kind of high precision composite polishing liquid and preparation method thereof |
| CN107353833A (en) * | 2017-07-24 | 2017-11-17 | 包头天骄清美稀土抛光粉有限公司 | High selectivity shallow-trench isolation chemical mechanical polishing slurry and its preparation technology |
| CN110358453A (en) * | 2018-04-10 | 2019-10-22 | 蓝思科技（长沙）有限公司 | A kind of glass polishing nano-cerium oxide polishing fluid and preparation method thereof |
| CN110524315A (en) * | 2019-08-07 | 2019-12-03 | 大连理工大学 | A kind of green economy environment protection chemical mechanical polishing method of optical quartz glass |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030119316A1 (en) * | 2001-12-21 | 2003-06-26 | Micron Technology, Inc. | Methods for planarization of group VIII metal-containing surfaces using oxidizing agents |
| US7056192B2 (en) * | 2004-09-14 | 2006-06-06 | International Business Machines Corporation | Ceria-based polish processes, and ceria-based slurries |
| CN101608097B (en) * | 2009-07-14 | 2011-12-21 | 上海华明高纳稀土新材料有限公司 | Nano cerium oxide seriflux for chemical mechanical polishing and preparation method |
| CN102504705B (en) * | 2011-10-17 | 2014-07-09 | 河南省化工研究所有限责任公司 | Polishing solution used for precision machining of optical communication ZrO2 ceramic stub and preparation method thereof |
| CN107629701B (en) * | 2017-11-02 | 2021-04-13 | 东旭光电科技股份有限公司 | Polishing solution and preparation method thereof |
-
2022
- 2022-03-08 CN CN202210227198.1A patent/CN114479676B/en active Active
- 2022-04-13 WO PCT/CN2022/086480 patent/WO2023168780A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070099427A1 (en) * | 2005-10-14 | 2007-05-03 | Lg Chem, Ltd. | Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same |
| TW200846430A (en) * | 2007-05-16 | 2008-12-01 | Cabot Microelectronics Corp | Glass polishing compositions and methods |
| CN106479371A (en) * | 2016-08-15 | 2017-03-08 | 惠州市米特仑科技有限公司 | A kind of high precision composite polishing liquid and preparation method thereof |
| CN107353833A (en) * | 2017-07-24 | 2017-11-17 | 包头天骄清美稀土抛光粉有限公司 | High selectivity shallow-trench isolation chemical mechanical polishing slurry and its preparation technology |
| CN110358453A (en) * | 2018-04-10 | 2019-10-22 | 蓝思科技（长沙）有限公司 | A kind of glass polishing nano-cerium oxide polishing fluid and preparation method thereof |
| CN110524315A (en) * | 2019-08-07 | 2019-12-03 | 大连理工大学 | A kind of green economy environment protection chemical mechanical polishing method of optical quartz glass |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115627153A (en) * | 2022-10-19 | 2023-01-20 | 中国兵器科学研究院宁波分院 | Water-based grinding fluid for boron carbide ceramic balls and preparation method thereof |
| CN116042098A (en) * | 2023-02-08 | 2023-05-02 | 广东粤港澳大湾区黄埔材料研究院 | Nano alumina polishing solution and application thereof in polishing of infrared chalcogenide glass |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114479676B (en) | 2023-04-21 |
| WO2023168780A1 (en) | 2023-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114479676A (en) | Low-abrasive-content and weakly acidic polishing solution for ultraprecise processing of optical glass and preparation method thereof | |
| CN108239484B (en) | Alumina polishing solution for sapphire polishing and preparation method thereof | |
| CN1074035C (en) | Chemical mechanical polishing slurry for metal layers | |
| US6413441B1 (en) | Magnetic polishing fluids | |
| JP3437900B2 (en) | Abrasive | |
| US20080131571A1 (en) | Sol of spinous inorganic oxide particles, method of producing the sol, and polishing agent containing the sol | |
| JP2011211178A (en) | Polishing composition | |
| JP2003502255A (en) | Improved ceria powder | |
| JPH08512357A (en) | Activated polishing composition | |
| JP6223786B2 (en) | Polishing liquid composition for hard and brittle materials | |
| CN111040640A (en) | Composite abrasive chemical mechanical polishing slurry for silicon wafer substrate and preparation method thereof | |
| TW201348168A (en) | Manufacture of synthetic quartz glass substrate | |
| CN114456716B (en) | Aluminum oxide polishing solution for polishing sapphire and preparation method thereof | |
| Zhao et al. | Control of the micro-defects on the surface of silicon wafer in chemical mechanical polishing | |
| JP2007061989A (en) | Polishing composite-oxide particle and slurry abrasive | |
| CN109913133B (en) | Efficient high-quality chemical mechanical polishing solution for yttrium aluminum garnet crystals | |
| JPH06330025A (en) | Polishing material for glass | |
| WO2007018376A1 (en) | Producing method for cerium-based glass polishing material and method for using the same | |
| CN113563803A (en) | Polishing solution containing alumina-boron carbide hybrid particles and preparation method thereof | |
| CN110577823B (en) | Nano abrasive, polishing solution, preparation method and application | |
| CN113621313A (en) | Monocrystalline silicon chemical mechanical polishing solution and preparation method thereof | |
| CN110938378B (en) | Polishing solution for polishing oxygen surface of zinc oxide crystal and preparation method thereof | |
| Li et al. | Study on the Mechanism of Micro-Defect Reduction during Si Final Polishing with Water-Soluble Polymers | |
| JP2000087010A (en) | Polishing composition | |
| CN115461427B (en) | Cerium-based polishing material slurry stock solution, method for producing same, and polishing liquid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |