CN114474917A - 一种复合板材结构及其制造方法 - Google Patents
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Abstract
本发明公开了一种复合板材结构及其制造方法,复合板材结构包括有PC层,所述PC层的顶部设有PMMA层,所述PMMA层的顶部淋涂有底涂层,所述底涂层的顶部打印形成有打印层。在制造过程中,先在复合板的亚克力层淋涂底涂层,然后再实施打印。相比现有技术而言,本发明在亚克力面上先增加淋涂底涂胶水做载体,然后再打印在底涂层上,有效保证了对打印层的附着力,既能满足手机后盖的外观需求,也较好地满足了产品的性能需求。
Description
技术领域
本发明涉及复合板材,尤其涉及一种应用于手机后盖的复合板材结构及该复合板材的制造方法。
背景技术
现有技术中,对于制作手机后盖的复合板材,其分层结构请参见图1所示,主要包括由下至上依次设置的PC层10、PMMA层11以及打印层12,此类结构中,复合板材表面为亚克力层(PMMA层),该材质特性为达因值低与打印胶水结合力差,仅可用于展览设施等场合,无法应用于手机后盖产品中。
发明内容
本发明要解决的技术问题在于,针对现有技术的不足,提供一种能显著提高对打印层的附着力,进而满足手机后盖的外观需求和性能需求的复合板材结构及其制造方法。
为解决上述技术问题,本发明采用如下技术方案。
一种复合板材结构,其包括有PC层,所述PC层的顶部设有PMMA层,所述PMMA层的顶部淋涂有底涂层,所述底涂层的顶部打印形成有打印层。
优选地,所述底涂层由底涂胶淋涂而成,所述底涂胶包括丙烯酸酯和引发剂的混合物。
优选地,所述底涂胶内混合有流平剂。
优选地,所述流平剂占所述底涂胶总量的0.03%~0.05%。
一种复合板材的制造方法,其包括如下步骤:步骤S1,准备复合板基材,所述复合板基材包括有PC层以及设于所述PC层顶部设的PMMA层;步骤S2,在所述PMMA层的顶部淋涂底涂胶并形成底涂层;步骤S3,在所述底涂层的顶部打印并形成打印层。
优选地,所述步骤S2中,所述底涂胶包括丙烯酸酯和引发剂的混合物。
优选地,所述步骤S2中,所述底涂胶内混合有流平剂。
优选地,所述步骤S2中,所述流平剂占所述底涂胶总量的0.03%~0.05%。
本发明公开的复合板材结构及其制造方法,在制造过程中,先在复合板的亚克力层淋涂底涂层,然后再实施打印。相比现有技术而言,本发明在亚克力面上先增加淋涂底涂胶水做载体,然后再打印在底涂层上,有效保证了对打印层的附着力,既能满足手机后盖的外观需求,也较好地满足了产品的性能需求。
附图说明
图1为现有复合板材的层级结构示意图;
图2为本发明复合板材的层级结构示意图;
图3为底涂胶的固化特性曲线。
具体实施方式
下面结合附图和实施例对本发明作更加详细的描述。
本发明公开了一种复合板材结构,请参见图2,其包括有PC层1,所述PC层1的顶部设有PMMA层2,所述PMMA层2的顶部淋涂有底涂层3,所述底涂层3的顶部打印形成有打印层4。
上述结构在制造过程中,先在复合板的亚克力层淋涂底涂层,然后再实施打印。相比现有技术而言,本发明在亚克力面上先增加淋涂底涂胶水做载体,然后再打印在底涂层上,有效保证了对打印层的附着力,既能满足手机后盖的外观需求,也较好地满足了产品的性能需求。
本实施例中,所述底涂层3由底涂胶淋涂而成,所述底涂胶包括丙烯酸酯和引发剂的混合物。
作为一种优选方式,所述底涂胶内混合有流平剂。进一步地,所述流平剂占所述底涂胶总量的0.03%~0.05%。实际应用中,根据反复试验发现,当正常的底涂胶使用在复合板上时,会出现流平不良,对此,本发明通过添加流平剂和调整底涂胶成分配比,调整底涂胶的流平性,但当流平剂后比例超过0.05%后流平性OK的情况下出现附着力不稳定,流平剂低于0.03%时外观流平不良起不到改善作用,经过验证,最终以0.03%-0.05%流平剂混合底涂胶作为PMMA层与打印层的中间载体层,从而满足手机后盖的外观需求以及性能需求。
基于上述板材结构,本发明还提供了一种复合板材的制造方法,该方法包括如下步骤:
步骤S1,准备复合板基材,所述复合板基材包括有PC层1以及设于所述PC层1顶部设的PMMA层2;
步骤S2,在所述PMMA层2的顶部淋涂底涂胶并形成底涂层3;
步骤S3,在所述底涂层3的顶部打印并形成打印层4。
具体地,所述步骤S2中,所述底涂胶包括丙烯酸酯和引发剂的混合物。本实施例中,底涂胶是一种单组份以改性丙烯酸酯为主要成份的紫外线转印胶,胶水固化后有很好的耐温性能,胶层硬度高,透明度高,耐水煮100℃/4H,2*2钢丝绒耐磨能达到1000G/1000次,主要特性及成份组成如下:
化学类型:丙烯酸酯,单液型;组份:树脂占比75%,醋酸乙烯单体占比21.5%,丙烯聚合链引发剂占比3.5%;粘度:低;固化方式:紫外线(UV)固化,固化特性曲线图请参见图3所示,在40mW/cm2紫外线照射下,粘结强度随固化时间变化的关系图。
其中,固化物特性(2000mJ/cm2固化能量)如下:外观:透明固体;铅笔硬度:3H;:表面爽滑度:高;耐磨:1000次钢丝绒摩擦无划伤;水煮百格(100℃/4H):5B。
本实施例的工艺方法中,所述底涂胶内混合有流平剂,所述步骤S2中,所述流平剂占所述底涂胶总量的0.03%~0.05%。
实际应用中,搭配该底涂胶的特性淋涂工艺参数锁定如下,硬化线:IR:55、65、60℃;线速:V=36-40HZ;UV能量:380-480mj/cm2。
本发明公开的复合板材结构及其制造方法,其在亚克力面上先增加淋涂底涂胶水做载体,然后再打印在底涂层上,有效保证了对打印层的附着力,既能满足手机后盖的外观需求,也较好地满足了产品的性能需求。利用本发明复合板材制成的手机后盖,能够更好地融合打印工艺,为手机后盖提供了丰富的设计效果。
以上所述只是本发明较佳的实施例,并不用于限制本发明,凡在本发明的技术范围内所做的修改、等同替换或者改进等,均应包含在本发明所保护的范围内。
Claims (8)
1.一种复合板材结构,其特征在于,包括有PC层(1),所述PC层(1)的顶部设有PMMA层(2),所述PMMA层(2)的顶部淋涂有底涂层(3),所述底涂层(3)的顶部打印形成有打印层(4)。
2.如权利要求1所述的复合板材结构,其特征在于,所述底涂层(3)由底涂胶淋涂而成,所述底涂胶包括丙烯酸酯和引发剂的混合物。
3.如权利要求2所述的复合板材结构,其特征在于,所述底涂胶内混合有流平剂。
4.如权利要求3所述的复合板材结构,其特征在于,所述流平剂占所述底涂胶总量的0.03%~0.05%。
5.一种复合板材的制造方法,其特征在于,包括如下步骤:
步骤S1,准备复合板基材,所述复合板基材包括有PC层(1)以及设于所述PC层(1)顶部设的PMMA层(2);
步骤S2,在所述PMMA层(2)的顶部淋涂底涂胶并形成底涂层(3);
步骤S3,在所述底涂层(3)的顶部打印并形成打印层(4)。
6.如权利要求5所述的复合板材的制造方法,其特征在于,所述步骤S2中,所述底涂胶包括丙烯酸酯和引发剂的混合物。
7.如权利要求6所述的复合板材的制造方法,其特征在于,所述步骤S2中,所述底涂胶内混合有流平剂。
8.如权利要求7所述的复合板材的制造方法,其特征在于,所述步骤S2中,所述流平剂占所述底涂胶总量的0.03%~0.05%。
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